JP3078115U - Electronic component mounting structure - Google Patents

Abstract

(57) [Summary] Even when some electronic components are arranged on the solder surface side of a substrate, the electronic components can be soldered by the same soldering process of the electronic components arranged on the component surface of the substrate. It is possible to easily carry out the work of mounting the electronic component on the substrate. In a mounting structure of an electronic component, a lead wire (8) of an electronic component (7) is inserted from a component surface (5a) side of a substrate (5) to a solder surface (5b) and soldered on the solder surface (5b) side of the substrate (5). By bending the lead wire 8d to move the main body from the component surface 5a side of the substrate 5 to the solder surface 5b side, some of the electronic components 7d are arranged on the solder surface 5b side of the substrate 5.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to an electronic component mounting structure in which electronic components are mounted on a substrate.

[0002]

[Prior art]

 In recent years, double-sided mounting of printed circuit boards using chip-type electronic components has become widespread, and if it is necessary to mount components on the solder surface, it is possible to use chip-type electronic components in a single soldering process. It is common to

[0003]

[Problems to be solved by the invention]

 However, when there is no space for arranging tall electronic components on the printed circuit board, it is necessary to arrange tall electronic components on the lower surface (solder surface) side of the printed circuit board. Since the electronic components mounted on the surface are immersed directly in the solder when soldering, they cannot be immersed in solder with low heat resistance, such as electrolytic capacitors and film capacitors, so after the first soldering process, An additional process of manually soldering the electronic components was required, and the work of mounting the electronic components on the printed circuit board became very troublesome.

In view of the above problems, the present invention solders electronic components by the same soldering process of the electronic components arranged on the component surface of the substrate even when some electronic components are arranged on the solder surface side of the substrate. This makes it possible to easily mount electronic components on a substrate.

[0005]

[Means for Solving the Problems]

 The technical means of the present invention for solving this technical problem is that the lead wire 8 of the electronic component 7 is inserted from the component surface 5a side of the substrate 5 to the solder surface 5b side, and the soldering is performed on the solder surface 5b side of the substrate 5. In the mounting structure of the attached electronic component, the lead wire 8d is bent so as to move the component body from the component surface 5a side of the substrate 5 to the solder surface 5b side. The point is that it is arranged on the surface 5b side.

Another technical measure of the present invention is that the lead wire 8d of the part of the electronic component 7d is bent so as to pass outside the edge of the substrate 5, so that the part of the electronic component 7d is The point is that it is arranged on the solder surface 5b side of the substrate 5. Another technical measure of the present invention is that the length l of the lead wire 8d of the part of the electronic component 7d from the component body to the component surface 5a of the printed circuit board 5 is changed from the base of the lead wire 8d to the board. 5 is formed to be larger than the sum of the dimension d up to the edge and the thickness t of the substrate 5.

Another technical means of the present invention is that the substrate 5 is provided with a notch 10 extending from the edge of the substrate 5 to the vicinity of the base of the lead wire 8d of the partial electronic component 7a. The point is that the lead wire 8d is bent so as to pass through the cutout portion 10, and the above-mentioned part of the electronic component 7a is arranged on the solder surface 5b side of the substrate 5. Another technical means of the present invention is that the width M of the cutout portion 10 is formed to be larger than the width m of the electronic components 7d. Another technical measure of the present invention is that the length 1 of the lead wire 8d of the part of the electronic component 7d from the component body to the component surface 5a of the board 5 is set at the base of the lead wire 8d. The point is that it is formed larger than the sum of the dimension d up to the notch 10 and the thickness t of the substrate 5.

[0008]

[Embodiment of the invention]

 1 to 5 show an embodiment of the present invention. 1 and 2, reference numeral 1 denotes a product storage case, on which a panel surface 2 is provided and a display window 3 is provided. Reference numeral 5 denotes a printed circuit board whose upper surface is a component surface 5a and whose lower surface is a solder surface 5b. The printed circuit board 5 is stored in the upper part of the storage case 1 and is arranged parallel to the panel surface 2 of the storage case 1.

The printed board 5 has mounted thereon a display LED 7a as an electronic component, electronic components 7b and 7c such as a resistor and a capacitor, and an electrolytic capacitor 7d as a tall electronic component. On the component surface 5a side of the printed circuit board 5, electronic components 7b and 7c such as a display LED 7a, a resistor, and a capacitor are arranged. The display LED 7a is arranged at a position corresponding to the display window 3 of the storage case 1. As described above, since the upper surface of the display LED 7a becomes the panel surface 2 of the storage case 1, the height of the electronic component disposed on the component surface 5a side of the printed circuit board 5 has an allowable dimension of about 3 to 4 mm. . For this reason, the tall electrolytic capacitor 7d cannot be disposed on the component surface 5a side, and the electrolytic capacitor 7d, which is a tall electronic component, is disposed on the solder surface 5b side of the printed circuit board 5 as described later. I have.

On the solder surface 5 b side of the printed board 5, a large number of copper foils for wiring the electronic components 7 are arranged, and the lead wires 8 of the various electronic components 7 are connected to the solder surface of the printed board 5. 5b side is connected to the copper foil by solder. Each lead wire 8 (lead wire 8a, 8b, 8c, 8d) of the electronic component 7 (electronic component 7b, 7c such as display LED 7a, resistor, capacitor, etc. and electrolytic capacitor 7d) is connected to the component surface 5a side of the printed circuit board 5. Then, the lead wires 8 (8a, 8b, 8c, 8d) of the electronic components 7 (7a, 7b, 7c, 7d) are soldered to the solder surface 5b of the printed circuit board 5 by soldering.

The printed circuit board 5 is provided with a notch 10 extending from the edge to the vicinity of the base of the lead wire 8d of the electrolytic capacitor 7d. The width M of the notch 10 is formed larger than the width m of the electrolytic capacitor 7d. As shown in FIG. 5, the length l of the lead wire 8d of the electrolytic capacitor 7d from the component body to the component surface 5a of the printed circuit board 5 is the dimension from the base of the lead wire 8d to the cutout portion 10. It is formed larger than the sum (d + t) of d and the thickness t of the printed circuit board 5.

The main body (component main body) of the electrolytic capacitor 7 d, which is a part of the electronic components 7 mounted on the printed circuit board 5, is inserted into the cutout portion 10 from the state shown in FIGS. Then, the lead wire 8d of the electrolytic capacitor 7d is bent so as to pass through the cutout portion 10 as shown in FIG. 3 so that the lead wire 8d moves from the component surface 5a side of the substrate 5 to the solder surface 5b side. As shown in FIGS. 1 and 4, an electrolytic capacitor 7 d is arranged on the solder surface 5 b side of the printed board 5. Next, an operation of mounting the electronic component 7 on the printed circuit board 5 will be described. First, as shown in FIG. 2, a display LED 7a, electronic components 7b and 7c such as resistors and capacitors, and an electrolytic capacitor 7d are arranged on the component surface 5a side of the printed circuit board 5, and the display LED 7a The lead wires 8a, 8b, 8c, 8d of the components 7b, 7c and the electrolytic capacitor 7d are inserted from the component surface 5a of the printed circuit board 5 to the solder surface 5b. Further, as shown in FIG. 2, a notch 10 is provided on the printed circuit board 5.

The display LED 7 a, the electronic components 7 b, 7 c such as a resistor and a capacitor, and the lead wires 8 a, 8 b, 8 c, 8 d of the electrolytic capacitor 7 d are soldered on the solder surface 5 b of the printed circuit board 5. At this time, the electrolytic capacitor 7d is soldered (solder dipped) together with the display LED 7a and the electronic components 7b and 7c by automatic mounting. Then, the lead wire 8d of the electrolytic capacitor 7d, which is a part of the electronic components 7a, 7b, 7c, 7d mounted on the printed circuit board 5, is cut as shown in FIGS. The electronic capacitor 7d, which is a part of the electronic component, is bent through the notch 10 and disposed on the solder surface 5b side of the printed circuit board 5 through the notch 10. At this time, the lead wire 8d of the electrolytic capacitor 7d can be easily bent at 90 degrees by using the corner A of the cutout end face of the cutout portion 10 of the printed circuit board 5, and the lead wire 8d is previously bent to be bent. There is no need to perform homing, and the lead wire 8d can be easily bent.

Therefore, when an electronic component having low heat resistance is mounted on the solder surface 5b side, conventionally, a process of additionally mounting the electronic component having low heat resistance (manual soldering) after the soldering step is required. However, the electrolytic capacitor 7d disposed on the solder surface 5b side of the printed circuit board 5 can be soldered (solder dip) together with the other electronic components 7a, 7b, 7c, so that the The work step of post-installing the electrolytic capacitor 7d to be arranged can be omitted, the mounting of the electronic components on the printed circuit board 5 can be completed in one soldering step, and the manufacturing cost can be reduced.

If the electronic component mounted on the solder surface 5b is located too far from the end surface of the printed circuit board 5, the electronic component must be bent down to move the component body to the solder surface 5b. Although the length of the lead wire becomes too long, the length of the lead wire 8d of the electrolytic capacitor 7d can be minimized by providing the cutout portion 10 in the printed circuit board 5. 6 and 7 show another embodiment, in which the notch 10 is omitted in the printed circuit board 5 and an electrolytic capacitor 7d which is a part of the electronic components 7 mounted on the printed circuit board 5 is shown. Lead wire 8d is inserted from the component surface 5a side to the solder surface 5b side near the outer end of the printed circuit board 5, and the lead wire of the electronic components 7a, 7b, 7c is inserted on the solder surface 5b side of the printed circuit board 5. 8a, 8b, and 8c are soldered together with solder dip.

The length 1 of the lead wire 8 d of the electrolytic capacitor 7 d from the component body to the component surface of the printed board 5 is equal to the dimension d from the base of the lead wire 8 d to the edge of the printed board 5, and the length d of the printed board 5. It is formed larger than the sum (d + t) with the thickness t. The lead wire 8d of the electrolytic capacitor 7d is bent so as to pass outside the printed circuit board 5, and the electrolytic capacitor 7d is arranged on the solder surface 5b side of the printed circuit board 5. The other points are the same as those in the above embodiment. Also in this case, similarly to the above-described embodiment, the electrolytic capacitor 7d disposed on the solder surface 5b side of the printed circuit board 5 is soldered (soldering dip) together with the other electronic components 7a, 7b, 7c. This makes it possible to omit the work step of retrofitting the electrolytic capacitor 7d disposed on the solder surface 5b side, and complete the mounting of the electronic components on the printed circuit board 5 in one soldering process. Manufacturing costs can be reduced.

In the above embodiment, the present invention is described on a single-sided board. However, the present invention can be similarly applied to a double-sided through-hole board on which chip components are mounted. In the above-described embodiment, the printed board 5 is used as the board. However, the board on which the electronic components are mounted is not limited to the printed board 5, and any other board can be used as long as each electronic component can be wired. May be used.

[0018]

[Effect of the invention]

 According to the present invention, even when some of the electronic components 7d are arranged on the solder surface 5b side of the substrate 5, the electronic components 7d are soldered by the same soldering process as the electronic components arranged on the component surface 5a of the substrate 5. The electronic component can be easily attached to the substrate 5.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view of a printed circuit board on which the electronic component is mounted.

FIG. 3 is a perspective view of a printed circuit board showing a process of mounting the electronic component.

FIG. 4 is a perspective view of a printed circuit board showing a process of mounting the electronic component.

FIG. 5 is a front sectional view of the printed circuit board showing a state before bending a lead wire of the electronic component.

FIG. 6 is a front view of a printed circuit board according to another embodiment.

FIG. 7 is a front view of the printed circuit board in a state before a lead wire of the electronic component is bent.

[Explanation of symbols]

 5 Printed circuit board 7a Display LED (electronic component) 7b Electronic component 7c Electronic component 7d Electrolytic capacitor (electronic component) 8a Lead wire 8b Lead wire 8c Lead wire 8d Lead wire 10 Notch

Claims (6)

[Utility model registration claims] 1. A lead wire (8) of an electronic component (7) is inserted from a component surface (5a) side of a substrate (5) to a solder surface (5b) side to form a solder surface (5b) of the substrate (5). In the mounting structure of the electronic component soldered on the side, the lead wire (8d) is bent to move the component body from the component surface (5a) side of the substrate (5) to the solder surface (5b) side, A mounting structure of an electronic component, wherein a part of the electronic component (7d) is arranged on a solder surface (5b) side of a substrate (5). 2. A lead wire (8d) of the electronic component (7d) is bent so as to pass outside the edge of the substrate (5), and the electronic component (7d) is bent The electronic component mounting structure according to claim 1, wherein the electronic component mounting structure is arranged on the solder surface (5b) side of (5). 3. The length l of the lead wire (8d) of the part of the electronic component (7d) from the component body to the component surface (5a) of the printed circuit board (5) is equal to the length of the lead wire (8d). Dimension d from base to edge of substrate (5) and thickness t of substrate (5)
The electronic component mounting structure according to claim 2, wherein the electronic component mounting structure is formed to be larger than the sum of 4. A notch (10) extending from an edge of the substrate (5) to a position near a base of a lead wire (8d) of the part of the electronic component (7a) is provided. 8
The electronic component (7a) is arranged on the side of the solder surface (5b) of the substrate (5), wherein d) is bent so as to pass through the notch (10). 1
The mounting structure of the electronic component according to 1. 5. The electronic component according to claim 4, wherein a width M of the notch (10) is formed to be larger than a width m of the part of the electronic component (7d). Mounting structure. 6. The component wire (8d) of the part of the electronic component (7d) to the component surface (5a) of the substrate (5) from the component body.
The length l is larger than the sum of the dimension d from the base of the lead wire (8d) to the notch (10) and the thickness t of the substrate (5). The electronic component mounting structure according to claim 4.