JP3077556B2 - Temperature sensor and temperature measurement structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature sensor and a temperature measuring structure, and more particularly to a temperature sensor suitable for measuring the temperature of a viscous fluid or a resin molded product, and an improvement of the temperature measuring structure using the same.

[0002]

2. Description of the Related Art Conventionally, as a temperature sensor of this kind,
There are a thermal expansion type, a thermocouple type, a resistance type, a heat radiation type and the like, but a thermocouple type or a resistance type is frequently used because of its simple structure and low cost. Figure 11
It is shown as below. In this configuration, a thermocouple wire 3 is inserted into a thin protective tube 1 made of stainless steel whose end is closed, and its distal end 5 is connected to the inside of the distal end of the protective tube 1. This protective tube 1 is made of metal. It is supported by a molding die 7 (only part of which is shown) and its tip is formed in a cavity 9 of the molding die 7.
The thermocouple wire 3 receives the heat from the molten resin 11 through the protective tube 1 and the molten resin 1 with respect to the thermocouple wire 3.
This is a so-called sheath type in which the temperature is detected while preventing the load pressure and fluid from being mixed with the protection tube 1 with the protection tube 1.

However, in this configuration, since the protective tube 1 having a large thermal conductivity is supported by the molding die 7, the amount of heat leaking to the molding die 7 through the protective tube 1 is large, and the temperature can be accurately measured. In order to achieve this, the protection tube 1
In this case, it is necessary to increase the outer diameter of the protection tube 1 or make the protection tube 1 protrude longer to increase the contact area between the molten resin 11 and the protection tube 1.

For example, when the protective tube 1 having an outer diameter of about 1 mm is used, it is necessary to protrude the protective tube 1 by at least 10 mm from the molding die 7. Therefore, the protective tube 1 is easily bent by the resin pressure of the molten resin 11, and the molding die 7 for molding a sheet-like thin molded product has a flat cavity 9 so that the tip of the protective tube 1 faces the molding die. 7 may not be able to be used due to bumping,
There are drawbacks such as traces of holes becoming holes and easy to remain.

[0005] In order to solve such a disadvantage, FIG.
A temperature sensor as shown in FIG. That is, a heat receiving plate 15 made of stainless steel is mounted on the open end of the thin protective tube 13, and the thermocouple wire 17 inserted into the protective tube 13 is used.
Is connected to the back surface of the heat receiving plate 15, and the heat receiving plate 15
The protection tube 13 is fixed to the molding die 21 together with the heat receiving plate 15 so that the outer surface of the protective tube 13 is evenly aligned with the cavity surface 23 of the molding die 21 (only part of which is shown).
3 is made flat and the heat receiving area is not reduced.

[0006]

However, in the configuration of FIG. 12 described above, the periphery of the heat receiving plate 15 is
However, it still has the disadvantage that the amount of leaked heat is large. In particular, it is difficult to accurately measure the temperature of a liquid (not shown in FIG. 12) such as a molten resin or oil having a small heat capacity and a rapid temperature change. It was difficult.

The present invention has been made to solve such a drawback, and a flat contact surface can be obtained with a temperature measuring object such as a molten resin. It is an object of the present invention to provide an improved temperature sensor and a temperature measurement structure using the same.

[0008]

In order to solve the above-mentioned problems, a temperature sensor according to the present invention comprises a heat-receiving plate having an outer surface in contact with a body to be measured, and a heat-resistant material having a heat conductivity smaller than that of the heat-receiving plate. And a first holder that supports the heat receiving plate so as to close the insertion hole and aligns the contact surface with the temperature measuring object with the contact surface of the heat receiving plate, and the heat receiving plate. A second holder having a through-hole made of a heat-resistant material having a smaller thermal conductivity, supported in the insertion hole, and receiving the back surface of the heat-receiving plate; and a second holder arranged so as not to be exposed from the outer surface of the heat-receiving plate. A first temperature measuring element led out through the hole, a second temperature measuring element placed below the through hole and drawn out through the insertion hole, and placed on the outer periphery of the second holder And a third temperature sensor led out through the insertion hole.

Further, the temperature measuring structure of the present invention comprises a contact base with which a temperature measuring object comes into contact, a heat receiving plate having an outer surface in contact with the temperature measuring object, and a heat-resistant material having a thermal conductivity smaller than that of the heat receiving plate. And a first holder having an insertion hole, supported by the contact base, supporting the heat receiving plate so as to close the insertion hole, and aligning the contact surface with the temperature measuring object with the contact surface of the heat receiving plate. A second holder having a through-hole made of a heat-resistant material having a thermal conductivity smaller than that of the heat-receiving plate, having a through-hole supported by the insertion hole, and receiving the back surface of the heat-receiving plate, and disposed so as not to be exposed from the outer surface of the heat-receiving plate. And a first temperature measuring element led out through the insertion hole, a second temperature measuring element disposed below the through hole and drawn out through the insertion hole, and an outer periphery of the second holder. And a third temperature measuring element disposed through the insertion hole and led out through the insertion hole. Contact body against temperature sensing element, and align each contact surface of the heat receiving plate and the first holder.

In the temperature sensor and the temperature measuring structure, a plurality of holes are provided in the second holder, the holes being formed on the back side of the heat receiving plate, and the heat receiving plate is provided with a plurality of projecting portions projecting from the back side of the heat receiving plate. First holder or first,
A configuration in which the heat receiving plate is supported by being fitted between the second holders is also possible. Further, the second holder is brought into contact with the inner wall of the insertion hole of the first holder via the projection formed on the outer periphery, and the third temperature measuring element is directly or indirectly attached to the projection. Or at least partially abut the heat receiving plate from the second holder via a plurality of heat-resistant small balls, or at least partially
It is also possible to adopt a configuration in which a heat receiving plate is abutted between the holders via a heat insulating sheet.

[0011]

In the temperature sensor and the temperature measuring structure according to the present invention provided with such means, the heat receiving plate is supported by the first and second holders formed of a heat-resistant material having a smaller heat conductivity than the heat receiving plate. In addition, since the holder is located around the heat receiving plate, the amount of heat leaking from the heat receiving plate to the contact base through the holder, for example, can be suppressed, while the temperature change of the temperature measuring object is accurately described above. It is transmitted to the thermometer.

Further, while the contact surface with the temperature measuring object becomes flat, the second and third distances from the heat receiving plate with respect to the temperature measured from the first temperature measuring element close to the temperature measuring object. The amount of leaked heat can be compensated by the measured temperature from the temperature measuring element. And in those temperature sensors and temperature measurement structures,
In the configuration in which the plurality of holes that are opened on the back surface side of the heat receiving plate are provided in the second holder, the amount of heat leak to the second holder side can be further suppressed, and the protrusion that protrudes from the back surface side of the heat receiving plate can be provided. In the configuration in which the heat receiving plate is supported by fitting the portion between the first holder or the first and second holders, the heat receiving plate is positioned at a predetermined position.

Further, the second holder is brought into contact with the inner wall of the insertion hole of the first holder via the projection, and the third temperature measuring element is fixed directly or indirectly to the projection. This facilitates the arrangement of the third temperature measuring element. Further, the heat receiving plate is at least partially brought into contact with the second holder via a plurality of heat-resistant small balls, or the heat receiving plate is at least partially interposed between the second holders via a heat insulating sheet. , The amount of heat leakage to the second holder side can be greatly suppressed.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing an embodiment of a temperature sensor and a temperature measuring structure according to the present invention. For convenience, the temperature measuring structure will be described together with the temperature sensor in the process of explaining the temperature measuring structure. In FIG. 1, a first holder 27 is connected to a support 25 formed in a cylindrical shape from a heat-resistant metal material, for example, a stainless steel material, by a heat-resistant screw rod 29 in a rod shape.

That is, the inside of the column 25 has a small-diameter insertion hole 25b on the tip side (upper side in FIG. 1) of the middle of the large-diameter insertion hole 25a, and the inside of the first holder 27 also has a large diameter. Through the hole 25a and the small-diameter insertion hole 27b, and into a thread groove (not shown) formed in the support 25 and the inner wall of the small-diameter insertion hole 25b of the first holder 27. The screw rod 29 of the mold is screwed and connected,
The support 25 supports the first holder 27 via the screw rod 29. In addition, the insertion holes 25a, 25b of the support 25,
The insertion holes 27a and 27b of the first holder 27 and the hollow portion 29a of the screw rod 29 have a coaxial positional relationship.

The first holder 27 is formed into a cylindrical shape by molding an inorganic insulating material or a heat-resistant organic insulating material. A large-diameter insertion hole 27a is formed from the same material as the first holder 27. The processed second holder 31 is inserted and supported. The second holder 31 is a cylindrical body having an outer diameter slightly smaller than the inner diameter of the insertion hole 27a of the first holder 27 and having a vertical dimension slightly shorter than the depth of the insertion hole 27a, as shown in FIG. As shown in the figure, a through hole 31a is provided at the center of the cylindrical body, and a plurality of blind holes 31b are provided around the through hole 31a so as to surround the through hole 31a.
A plurality of through holes 31c are provided in the vertical direction around b to surround it.

An annular convex portion 31d is protruded from the outer periphery of the second holder 31 in the middle in the vertical direction, and this convex portion 31d comes into contact with the inner wall of the insertion hole 27a. Are supported by the first holder 27. Therefore, a gap is formed between the outer periphery of the second holder 31 and the inner wall of the insertion hole 27a of the first holder 27, corresponding to the protrusion of the projection 31d.

Returning to FIG. 1, in the first holder 27, the opening end of the insertion hole 27a expands stepwise, and a support portion 27c of a heat receiving plate 33 described later is formed. The heat receiving plate 33 is formed by forming a stainless steel plate into a disk shape, and as shown in FIG. 3, has a ring-shaped projecting portion 33a protruded integrally or by welding or the like on the back surface side. The projection 33a is fitted into the gap between the first holder 27 and the second holder 31, and the supporting portion 27c of the first holder 27 and the upper end surface of the second holder 31 are attached by a heat-resistant adhesive (not shown). While being fixed, the end face of the first holder 27 and the outer surface of the heat receiving plate 33 are aligned and flat.

That is, the insertion hole 2 of the first holder 27
7a, insert the second holder 31 into the first holder 2
When the heat receiving plate 33 is supported by the support portion 27c of the
Of the first holder 27 and the outer surface of the heat receiving plate 33 are arranged in a dimension and a positional relationship. However, heat receiving plate 3
The shape of the first holder 2 is arbitrary, and for example, as shown in FIG.
7, and supported by being fitted into a concave groove 27d formed in the support portion 27c, or as shown in FIG. 5, the peripheral edge protruding portion 33b of the cup-shaped heat receiving plate 33 is connected to the first and second holders 27 and 31. It is also possible to adopt a configuration in which the end face of the first holder 27 and the outer surface of the heat receiving plate 33 are aligned with each other by press-fitting into the gap between the first holder 27 and the inner wall of the insertion hole 27a.

As described above, the protruding portion 33 b protruding from the back surface side of the heat receiving plate 33 is formed into the concave groove 27 d of the first holder 27.
Pressing into the gap between the first and second holders 27 and 31 simplifies the positioning of the heat receiving plate 33 and also allows the heat receiving plate 3
3 is hard to peel off. Moreover, the heat receiving plate 33 is made of a material that is not easily deformed or worn by a load pressure of the molten resin 51 described later. For example, a metal material having a good thermal conductivity and sensitively transmitting a temperature change, for example, 0.1
mm-0.3mm thickness and Rockwell hardness (H
(RC) It is formed by forming a stainless steel plate or a steel plate having a hardness of about 60 into a disk shape, and serves as a lid for preventing the molten resin 51 from being mixed into the insertion hole 27a.

The first and second holders 27 and 31 supporting the heat receiving plate 33 are easier to machine than the heat receiving plate 33 and have a thermal conductivity of at least 0.01 (cal / cm · sec · ° C.) or less. Materials, such as machineable ceramics,
Inorganic insulating materials such as zirconia, glass or quartz, polybenzimidazole (PBI), polyetheretherketone (PEEK), liquid crystal polyester (LCP), polyimide (PI), polyphenylsalefide (PP
It is formed by molding a heat-resistant organic insulating material such as S). For example, polyimide (PI) has a thermal conductivity of 0.0
There is also one with about 009 (cal / cm · sec · ° C.).

That is, the first and second holders 2
7 and 31 have thermal conductivity 1/4 to 1 of that of the heat receiving plate 33.
It is much smaller, like about / 5. The adhesive for fixing the heat receiving plate 33 is made of, for example, a liquid or fluid heat-resistant inorganic material which is turned into a ceramic at 150 ° C. or higher.
Is filled between the holder 31 and the heat receiving plate 33 so as not to generate a gap, and does not protrude from the support portion 27c to the end face side. First, second, and third thermocouple wires 35, 37, and 3 serving as temperature measuring members are provided in a hollow portion 29a of the screw rod 29.
9 is inserted.

The first thermocouple wire 35 is connected to the second holder 31
The front end extends to the center of the rear surface of the heat receiving plate 33 and is connected to the center of the rear surface of the heat receiving plate 33 by welding or the like. The first thermocouple wire 35 is connected to the through hole 3.
1c may be inserted, and the insertion hole 27a includes through holes 31a and 31c as a lead-out path for the thermocouple wires 35 to 39.

The second thermocouple wire 37 has a tip portion extending below the through hole 31a of the second holder 31, and is fixed by the above-mentioned adhesive. However, the second thermocouple wire 37
Can be disposed below the through hole 31a, for example, at a position below the through hole 31a of the second holder 31. Further, the tip of the third thermocouple wire 39 extends from between the screw rod 29 and the lower end surface of the second holder 31 to the outer periphery of the second holder 31, and the second holder 31
From the lower side (screw rod 29 side) and the projection 3
It is fixed to the stainless steel ring 41 positioned at 1d with the above-mentioned adhesive.

The first to third thermocouple wires 35 to 39
May be fixed by solidifying an insulating material, such as magnesium oxide or alumina powder, filled in the through holes 31a, 27a. However, a hollow space is preferable between the first and second thermocouple wires 35 and 37 from the viewpoint of reducing the thermal conductivity. As the first to third thermocouple wires 35 to 39, a minute resistor or a thin film resistor can be used in addition to the thermocouple wires 35 to 39, and they are connected to a converter, a temperature controller, and the like (not shown). The functions of these thermocouple wires 35 to 39 will be described later.

The first holder 27 is inserted through and supported by a movable mold plate 45 forming the cavity 43, and has an upper end face on the inner side surface of the movable mold plate 45, that is, a cavity surface 47.
It is arranged so as to be aligned. This movable side mold plate 45 is
It is formed of a conventionally known metal material for a mold, for example, S45C steel or the like, and the upper surface in the figure is located on the same plane as the above-described distal end surface of the first holder 27 and the outer surface of the heat receiving plate 33. The fixed side mold plate 49 formed of a suitable metal material or the like is overlapped with the resin molding cavity 4.
3 are formed. However, the tip surface of the first holder 27 and the outer surface of the heat receiving plate 33 together with the movable mold plate 45 also form the cavity surface 47.

Next, an example of the use of the first to third thermocouple wires 35 to 39 in the temperature measuring structure having the structure shown in FIG. 1 will be described. The temperature measured by the first thermocouple wire 35 (the heat receiving plate 33
The temperature measured by the second thermocouple wire 37 (measured temperature below the second holder 31) is T0.
Is defined as T1 and the temperature measured by the third thermocouple wire 39 (the side wall temperature between the first and second holders 27 and 31) is defined as T2.
Assuming that the temperature of the body to be measured is T, the amount of heat flowing into the heat receiving plate 33 is Q, the heat transfer coefficient is A, and the heat flowing out of the heat receiving plate 33 to the measurement point side of the second thermocouple wire 37. The amount of heat to go is Q1
The heat transfer coefficient is represented by A1, and the amount of heat flowing out of the heat receiving plate 33 to the measurement point side of the third thermocouple wire 39 is represented by Q2.
Assuming that this heat transfer coefficient is A2, the amount of heat escaping Q to Q2
Is represented by the following equation.

Q = Q1 + Q2 (1) Q = (T−T0) A (2) Q1 = (T0−T1) A1 (3) Q2 = (T0−T2) A2 (4) where (4) Substituting equations (2) to (4) into equation (1), (T-T0) A = (T0-T1) A1 + (T0-T2) A2 T = T0 + (T0-T1) A1 / A + (T0) −T2) A2 / A (5)

In the equation (5), the second thermocouple wire 3
Calorie Q flowing out of the heat receiving plate 33 to the measurement point side 7
Assuming that the correction coefficient for A1 is A1 / A = K1 and the correction coefficient for the heat quantity Q2 flowing out of the heat receiving plate 33 to the measurement point side of the third thermocouple wire 39 is A2 / A = K2, Become. T = T0 + (T0-T1) K1 + (T0-T2) K2 (6) Therefore, if the operation of the expression (6) is performed by a converter, a temperature controller, or the like, it escapes below the heat receiving plate 33. Heat and heat receiving plate 33
Compensating for the heat that escapes from the first holder 27 to the side of the first holder 27, accurate temperature measurement calculation can be performed, and the compensation response speed increases.
That is, the second and third thermocouple wires 37 and 39 can function as compensating elements.

Of course, in the converter and the temperature controller, the correction coefficients K1 and K2 can be changed according to the type of the temperature measuring object and the measuring condition. Then, in the temperature measurement structure having such a configuration, when the molten resin 51 as a temperature measuring object is poured into the cavity 43, the molten resin 51 is formed into an outer shape according to the shape of the cavity 43.

According to the present invention, the heat receiving plate 3 made of metal is used.
3 is a first holder 2 having a significantly lower thermal conductivity.
7, surrounding the periphery thereof, the first and second holders 27, 31
And the outer surface of the heat receiving plate 33 and the end surface of the first holder 27 are made flat, so that the heat received by the heat receiving plate 33 can be suppressed from leaking to the surrounding members, and the heat receiving A large area can be maintained, the external shape of the molded product is not hindered, and the structure is simple.

Further, a first thermocouple wire 35 connected to the back surface of the heat receiving plate 33 and a second thermocouple wire 35 near the lower portion of the second holder 31 are provided.
And the third thermocouple wire 39 between the first and second holders 31 and 39, the temperature signal from the heat receiving plate 33 close to the molten resin 51 is transmitted to the first thermocouple wire 35. And the heat escaping below the heat receiving plate 33 is measured by the second thermocouple wire 37, and the heat escaping from the heat receiving plate 33 to the second and first holders 31 and 27 is transferred to the third thermocouple wire 39.
It is possible to compensate for the leak temperature by measuring at
The temperature measurement characteristics are improved.

For example, the temperature sensor shown in the embodiment of FIG. 1 is fixed to a relatively large pseudo mold (not shown), and the inside of the pseudo mold is filled with oil at about 150 ° C. When another temperature sensor (not shown) was placed in the pseudo mold so as not to make contact with it, and the oil temperature near the heat receiving plate 33 was measured, the result was as shown in FIG.

According to FIG. 6, the temperature of the oil within at least several mm from the heat receiving plate 33 is deprived of heat by the pseudo mold around the temperature sensor, and the temperature drops rapidly. Show similar changes, and the first to third
Temperature T0, T1, T2 measured by thermocouple wires 35-39
It can be seen that the change in temperature and the change in temperature when compensated using the above-described arithmetic expression are extremely stable (when K1 = K2 = 1). In FIG. 6, the horizontal axis represents time, and the vertical axis represents the measured temperature. The solid line represents the compensated synthetic temperature change, the broken line represents the change in measured temperature T0, the dashed line represents the change in measured temperature T1, and the two-dot chain line represents the measured temperature. This is a change in T2.

The first and second holders 27, 3
From the viewpoint of keeping the amount of heat leaked through 1 small,
The thermal conductivity of the first and second holders 27 and 31 is as follows:
As described above, the heat receiving plate 33 is 1/4 to 1 /
It would be better to select a material that is about 5 smaller, more preferably 1/8, and more preferably less than about 1/10. In the present invention, using the temperature sensor described above,
Since the cavity surface 47 of the movable mold plate 45 is also aligned with the contact surfaces of the heat receiving plate 33 and the first and second holders 27 and 31 with the molten resin 51, the temperature measurement structure is configured. At 45, the cavity surface 47 becomes flat, and accurate temperature measurement can be performed in a state where the external shape quality of the molded product is kept high.

Further, the first and second holders 27, 31
The space between the first and second holders 27 and the heat receiving plate 33 are fixed with a heat-resistant adhesive.
Even if the space between the first holder 31 and the periphery of the second holder 31 and the periphery of the heat receiving plate 33 are buried, the cavity is formed so as to be a flat cavity surface 47 with respect to the molten resin 51. In addition, the external quality of the molded product can be further improved. Moreover, the adhesive made of an inorganic material has a high adhesiveness, a low thermal conductivity, a high heat resistance temperature as high as about 1000 ° C., a thermal expansion coefficient close to that of a metal material, and good abrasion resistance. Even when a peeling force of a resin or the like acts on the adhesive when the molded article is taken out, the adhesive is hardly peeled off, the amount of leak heat can be reduced, and a molding material containing glass such as PPS (polyphenylene sulfide) is included. When the molten resin 51 is molded, the adhesive is not easily removed by the molten resin 51.

It is sufficient that the adhesive has good heat resistance, and if it has a heat resistance of about 300 ° C., it is practically possible to use an organic adhesive such as an epoxy adhesive in addition to the heat-resistant inorganic material. It is. Further, if the tip of the first holder 27 is formed using machineable ceramics, it is possible to maintain sufficient strength even when the molten resin 51 comes into contact.

Since the second holder 31 is formed with a blind hole 31b and a through hole 31c surrounding the through hole 31a in the center, in addition to the through hole 31a at the center, the second holder 31
Has the advantage that the amount of heat escaping from the heat receiving plate 33 via the second holder 31 is suppressed, and the compensated measurement temperature becomes accurate. However, from the viewpoint of reducing the heat capacity, all the through holes may be formed. However, in order to secure the mechanical strength of the second holder 31, the blind holes 3 are appropriately formed.
It is often preferable to dispose 1b.

Further, since an annular projection 31d is provided on the outer periphery of the second holder 31 to form a gap between the second holder 31 and the first holder 27, the projections 33a,
If the 3b is inserted into the space, the positioning of the heat receiving plate 33 is simplified, and the third temperature measuring body 39 is easily arranged. In addition, in a configuration in which the ring 41 is fitted into the gap between the second holder 31 and the first holder 27, the ring 41 is directly formed on the outer periphery of the second holder 31, the projection 31d, or the inner wall of the insertion hole 27a of the first holder 27. Since the third temperature measuring element 39 is easily arranged at a desired position on the ring 41 as compared with the configuration in which the ring 41 is fixed, the assembly is simple and the temperature compensation characteristics are stable.

Next, another embodiment of the temperature sensor and the temperature measuring structure according to the present invention will be described with reference to FIGS. Parts similar to those in FIG. 1 are denoted by the same reference numerals. In FIG. 7, the first holder 53 is formed of the same material as that of the above-described first holder 27, and a large-diameter insertion hole 53a that expands in a funnel shape from the vicinity of the small-diameter insertion hole 53b has a distal end. , And the supporting portion 53c is formed at the opening. The lower portion of the insertion hole 53a is funnel-shaped, and the above-described second portion is formed.
Holder 5 made of the same material as the holder 31 of FIG.
5 is inserted and supported, and a through hole 55 a is formed in the center of the second holder 55.

The second holder 55 has a storage recess 55b at a position facing the heat receiving plate 33, and a plurality of beads 57 made of an inorganic material or a heat-resistant organic material are stored in the storage recess 55b. As a result, the heat receiving plate 33 uniformly hits the rear surface, and the end surface of the first holder 53 and the outer surface of the heat receiving plate 33 are evenly aligned. For convenience, the second holder 55
Although only the central through hole 55a is shown in FIG. 1, it is optional to form another through hole or blind hole as shown in FIG. 1, and the first to third thermocouples 35 to Reference numeral 39 indicates only the tip (the same applies hereinafter).

Also in this configuration, the heat receiving plate 33 is supported by the first holder 53 and is in contact with and supported by the second holder 55 via a plurality of beads 57. In the temperature sensor having such a configuration, since the heat receiving plate 33 is supported by the second holder 55 in a substantially point contact state by the plurality of beads 57, the amount of leak heat escaping from the heat receiving plate 33 to the second holder 55 side is small. And the temperature measurement characteristics are improved.

In the configuration shown in FIG. 8, the heat insulating sheet 59 is stored in the storage recess 55c of the second holder 55,
The heat receiving plate 33 is partially received via the heat insulating sheet 59, and the end face of the first holder 53 and the outer surface of the heat receiving plate 33 are arranged to be flat. The heat insulating sheet 59 is preferably a sheet obtained by solidifying silica-based fine particle resin to form a sheet, and some have a lower thermal conductivity than the atmosphere. Also in this configuration, the heat receiving plate 33 is supported by the first holder 53 and abuts on the second holder 55 in a state of being in partial surface contact with the heat insulating sheet 59. The amount of leaked heat escaping to the side of the second holder 55 is reduced, and the temperature measurement characteristics are improved.

9 and 10, the distal end of the first thermocouple wire 35 is housed in a concave portion 61 formed on the outer surface side of the heat receiving plate 33, and a wire is formed on the rear surface side (FIG. 9). (Not shown.) 35a is led out, and the outer surface of the heat receiving plate 33 is coated with a heat-resistant ceramic material coating layer 6 having relatively good heat conductivity.
3 is formed and flattened with the end face of the first holder 53.

As described above, in the temperature sensor and the temperature measurement structure of the present invention, the position of the first thermocouple 35 is not limited to the rear surface side of the heat receiving plate 33 but may be the outer surface side. It is necessary to devise not to do it. Further, in the configuration of FIGS. 7 to 9, the second holder 55
Are supported by the inclined surface of the insertion hole 53a of the holder 53, and even if a large pressure is applied to the heat receiving plate 33 or the second holder 55, they are hardly damaged. It is needless to say that the configurations of FIGS. 7 to 9 can be combined with the configuration of FIG. 1 described above.

In the above-described embodiment, the temperature sensor of the present invention is incorporated in the movable mold plate 45 to form a temperature measuring structure. However, the present invention is not limited to this. Although not shown, for example, it is also possible to arrange the temperature sensor of the present invention in a cylinder part of an extruder to form a temperature measurement structure. The point is that the temperature sensor holder is fixed to the contact base that contacts the molding resin, the contact surface between the heat receiving plate and the molding resin, the contact surface of the holder that supports the heat receiving plate and contacts the molding resin around it, and the contact The contact surface of the base with the resin may be located on the same surface.

Further, the movable mold plate 45 and the fixed mold plate 49 shown in FIG. 1 can be implemented by exchanging the movable mold and the fixed mold. Furthermore, in practicing the present invention,
The present invention can be applied not only to the molten resin but also to various types of fluids, and further to temperature measurement of a temperature measuring object such as a solid.

[0048]

As described above, the temperature sensor according to the present invention has a heat receiving plate which is in contact with a temperature measuring object and a heat-resistant material having a thermal conductivity smaller than that of the heat receiving plate, and has an insertion hole formed therein. A first holder that supports the plate and aligns the contact surface with the temperature measuring object with the contact surface of the heat receiving plate, and is formed of a heat-resistant material having a thermal conductivity smaller than that of the heat receiving plate and is supported in the insertion hole. And a second holder for receiving the back surface of the heat receiving plate, a first temperature measuring member disposed on the heat receiving plate, a second temperature measuring member disposed below the through hole, and a second With the third temperature measuring element disposed on the outer periphery of the holder, the amount of heat leaked from the heat receiving plate is small, and the temperature change is quickly transmitted to the first temperature measuring element, and the temperature of the temperature measuring object is reduced. Improve the temperature measurement characteristics against changes and maintain the external surface quality of the temperature measurement object. It can heat receiving area can be maintained large. In addition, a third temperature sensor disposed below the heat receiving plate or a third temperature sensor disposed on the first holder side with respect to the temperature measured from the first side temperature sensor close to the temperature measuring object. Compensation for the amount of heat leaked can be made by the temperature measured from the warm body, and extremely accurate temperature measurement becomes possible. In addition, while supporting and fixing the first holder of the temperature sensor with the contact base,
Since the heat receiving plate, the holder, and the contact surface of the contact base with the temperature measuring object are arranged on the same plane to constitute the temperature measurement structure, in addition to the above-described effects, the outer shape of the temperature measuring object in the contact base, for example, a molding die Accurate temperature measurement can be performed while maintaining surface quality. In the temperature sensor and the temperature measurement structure, in the configuration in which the plurality of holes opened on the back surface side of the heat receiving plate are provided in the second holder, the amount of heat leak to the second holder side is significantly suppressed, and Accurate temperature measurement is possible, and the heat receiving plate is supported by fitting a projecting portion projecting from the back side of the heat receiving plate between the first holder or the first and second holders. In this case, since the heat receiving plate is positioned at a predetermined position, the assembly is simple and the temperature measurement characteristics are stable. Also, a configuration in which the second holder is brought into contact with the inner wall of the insertion hole of the first holder via an outer peripheral convex portion, and the third temperature measuring element is directly or indirectly fixed to the convex portion. Then
The third temperature measuring element can be easily arranged, can be accurately arranged at a desired position, and the temperature measurement characteristics are also stable from this point. further,
In a configuration in which the heat receiving plate is brought into contact with the second holder through a plurality of heat-resistant small balls or the heat receiving plate is brought into contact with the second holder through a heat insulating sheet,
The amount of heat leak to the holder side is greatly suppressed, and more accurate temperature measurement becomes possible.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of a temperature sensor and a temperature measuring structure according to the present invention.

FIG. 2 is a plan view A and a vertical cross-sectional view B (cross section taken along bb in A) of the second holder in FIG. 1;

FIG. 3 is a longitudinal sectional view of the heat receiving plate in FIG.

FIG. 4 is a schematic longitudinal sectional view showing another example of the first and second holders and the heat receiving plate in FIG.

FIG. 5 is a schematic longitudinal sectional view showing still another example of the first and second holders and the heat receiving plate in FIG.

FIG. 6 is a diagram showing measured temperature characteristics in the temperature measuring structure of FIG. 1;

FIG. 7 is a longitudinal sectional view of a main part showing another embodiment of the temperature sensor and the temperature measuring structure according to the present invention.

FIG. 8 is a vertical sectional view of a main part showing another embodiment of the temperature sensor and the temperature measuring structure according to the present invention.

FIG. 9 is a longitudinal sectional view of a main part showing another embodiment of the temperature sensor and the temperature measuring structure according to the present invention.

FIG. 10 is a plan view showing a temperature sensor and a heat receiving plate of the temperature measurement structure shown in FIG. 9;

FIG. 11 is a sectional view showing a conventional temperature sensor.

FIG. 12 is a cross-sectional view showing another configuration of the conventional temperature sensor.

[Explanation of symbols]

1, 13 Protective tube 3, 17 Thermocouple wire 5, 19 Tip 7, 21, Mold 9, 43 Cavity 11, 51 Molten resin (temperature measurement object) 15, 33 Heat receiving plate 23, 47 Cavity surface 25 Support 25a , 25b, 27a, 27b, 53a, 53b Insertion hole 27, 53 First holder 27c, 53c Supporting part 27d Groove 29 Screw rod 29a Hollow part 31, 55 Second holder 31a, 31c, 55a Through hole 31b Blind hole 31d Projecting portions 33a, 33b Projecting portion 35 First thermocouple wire (first temperature measuring element) 35a Element 37 Second thermocouple wire (second temperature measuring element) 39 Third thermocouple wire (second temperature measuring element) 3 Temperature measuring element) 41 Ring 45 Movable mold plate (contact base) 47 Cavity surface 49 Fixed mold plate (contact base) 55b, 55c Storage recess 57 Bead (small ball) 59 Thermal insulating sheet 6 Recess 63 coating layer

Claims (12)

(57) [Claims] 1. A heat receiving plate having an outer surface in contact with a temperature measuring object, and an insertion hole made of a heat-resistant material having a thermal conductivity smaller than that of the heat reception plate, and the heat receiving plate is formed so as to cover the insertion hole. And a first holder having a contact surface with the temperature measurement object aligned with a contact surface of the heat receiving plate, and a through-hole made of a heat-resistant material having a heat conductivity smaller than that of the heat receiving plate. A second holder supported in the hole and receiving the back surface of the heat receiving plate; and a first temperature measuring element disposed so as not to be exposed from an outer surface of the heat receiving plate and led out through the insertion hole. A second temperature sensor disposed below the through hole and led out through the insertion hole; and a third temperature detector disposed on the outer periphery of the second holder and led out through the insertion hole. A temperature sensor, comprising: a temperature sensor; 2. The temperature sensor according to claim 1, wherein the second holder has a plurality of holes opened on the back side of the heat receiving plate. 3. The heat receiving plate is supported such that a projecting portion projecting from a back surface side of the heat receiving plate is fitted between the first holder or the first and second holders. 2. The temperature sensor according to 2. 4. The second holder is in contact with an inner wall of the insertion hole via a convex portion formed on the outer periphery, and the third temperature measuring element is directly or indirectly contacted with the convex portion. The temperature sensor according to claim 1, wherein the temperature sensor is fixed. 5. The temperature sensor according to claim 1, wherein the heat receiving plate is at least partially abutted from the second holder via a plurality of heat-resistant small balls. 6. The temperature sensor according to claim 1, wherein the heat receiving plate is at least partially in contact with the second holder via a heat insulating sheet. 7. A contact base with which a temperature measuring object comes into contact, a heat receiving plate whose outer surface is in contact with said temperature measuring object, and an insertion hole made of a heat-resistant material having a thermal conductivity smaller than that of said heat receiving plate. A first holder that is supported by the temperature measuring element, supports the heat receiving plate so as to close the insertion hole, and aligns a contact surface with the temperature measuring object with a contact surface of the heat receiving plate; and the heat receiving plate. A second holder having a through-hole made of a heat-resistant material having a smaller thermal conductivity and supported in the insertion hole and receiving the back surface of the heat-receiving plate, disposed so as not to be exposed from the outer surface of the heat-receiving plate; A first temperature measuring element drawn out through the insertion hole, a second temperature measuring element placed below the through hole and drawn out through the insertion hole, and the second holder A third temperature measuring element disposed on the outer periphery of the device and led out through the insertion hole; And the contact base, the heat receiving plate, and the first
The temperature measurement structure characterized in that the contact surfaces of the holders are aligned. 8. The temperature measuring structure according to claim 7, wherein said second holder has a plurality of holes opened on the back side of said heat receiving plate. 9. The heat receiving plate is supported such that a projecting portion projecting from the back surface side of the heat receiving plate is fitted between the first holder or the first and second holders. 8. The temperature measurement structure according to 8. 10. The second holder is in contact with an inner wall of the insertion hole via a projection formed on the outer periphery,
The temperature measuring structure according to any one of claims 7 to 9, wherein the third temperature measuring element is directly or indirectly fixed to the convex portion. 11. The temperature measuring structure according to claim 7, wherein the heat receiving plate is at least partially abutted from the second holder via a plurality of heat-resistant small balls. 12. The temperature measurement structure according to claim 7, wherein the heat receiving plate is at least partially abutted between the second holders via a heat insulating sheet.