JP3074773B2 - Solid-state imaging device - Google Patents
Solid-state imaging deviceInfo
- Publication number
- JP3074773B2 JP3074773B2 JP03110076A JP11007691A JP3074773B2 JP 3074773 B2 JP3074773 B2 JP 3074773B2 JP 03110076 A JP03110076 A JP 03110076A JP 11007691 A JP11007691 A JP 11007691A JP 3074773 B2 JP3074773 B2 JP 3074773B2
- Authority
- JP
- Japan
- Prior art keywords
- cap glass
- solid
- package
- cap
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
【０００１】[0001]
【産業上の利用分野】本発明は固体撮像素子に関し、特
にそのパッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device, and more particularly to a package thereof.
【０００２】[0002]
【従来の技術】固体撮像素子のパッケージは、固体撮像
素子チップに（以下チップと略記する）に光を入射させ
るため、セラミックパッケージと、光学的に平面なキャ
ップを用いるのが一般的となっている。図３はこの一例
の部分断面図であり、セラミックパッケージ５の中央に
チップ６を取り付け、チップ６と内部リードとを接続し
た後、キャップガラス２をセラミックパッケージ５の最
外周部のキャップガラス接着部４にのせ、あらかじめキ
ャップガラス２またはセラミックパッケージ５のキャッ
プガラス接着部４に付着させていた接着樹脂３を溶か
し、その後冷却してキャップガラス２とキャップガラス
接着部４を接着するようになっている。2. Description of the Related Art In general, a solid-state image pickup device package uses a ceramic package and an optically flat cap in order to make light incident on a solid-state image pickup device chip (hereinafter simply referred to as a chip). I have. FIG. 3 is a partial cross-sectional view of this example. After attaching a chip 6 to the center of the ceramic package 5 and connecting the chip 6 and the internal lead, the cap glass 2 is attached to the outermost peripheral portion of the ceramic package 5. 4, the adhesive resin 3 previously attached to the cap glass 2 or the cap glass bonding portion 4 of the ceramic package 5 is melted, and then cooled to bond the cap glass 2 and the cap glass bonding portion 4. .
【０００３】[0003]
【発明が解決しようとする課題】上述したようなパッケ
ージの構造では、キャップガラス２をセラミックパッケ
ージのキャップガラス接着部４に接着するとき、図３に
示すように、接着樹脂３がキャップガラス２の裏面をパ
ッケージの内側に向って広がり、チップ６の有効画素領
域を覆うことがある。これによって、映像信号出力画面
の端の部分に影が生じるという欠点がある。また、キャ
ップガラス２をセラミックパッケージ５にセットすると
き、強度の弱い樹脂セラミックパッケージ５と接触する
と、はがれてゴミとなり、それがチップ６上に付着した
場合は黒キズとなる等の問題点がある。In the package structure as described above, when the cap glass 2 is bonded to the cap glass bonding portion 4 of the ceramic package, as shown in FIG. The back surface may extend toward the inside of the package and cover the effective pixel area of the chip 6. As a result, there is a drawback that a shadow is generated at an end portion of the video signal output screen. In addition, when the cap glass 2 is set in the ceramic package 5, if the cap glass 2 comes into contact with the resin ceramic package 5 having low strength, the cap glass 2 comes off and becomes dust, and if it adheres to the chip 6, there is a problem that it becomes black. .
【０００４】[0004]
【課題を解決するための手段】本発明の固体撮像素子
は、パッケージのチップ取り付け部分とキャップガラス
接着部の間にキャップガラス接着部より高さが高い突起
部を設けることを特徴としている。また、キャップガラ
スの最外周部分を下方向へ突出させ、その突出部をパッ
ケージの突起部の外側のキャップガス接着部に接着する
ことを特徴としている。The solid-state imaging device according to the present invention is characterized in that a projection having a height higher than that of the cap glass bonding portion is provided between the chip mounting portion of the package and the cap glass bonding portion. Further, the outermost peripheral portion of the cap glass is projected downward, and the projected portion is bonded to the cap gas bonding portion outside the projected portion of the package.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。図１は、本発明の一実施例の固体撮像素子のキャッ
プガラス接着部付近の断面図である。パッケージの最外
周部のキャップガラス接着部４とセラミックパッケージ
５の中央のチップ６との間に突起部１が設けてあり、突
起部１とキャップガラス接着部４との間には溝７が構成
されている。キャップガラス２を接着するとき、まず、
キャップガラス２を突起部１の上にのせ、高温状態にし
て接着樹脂３を溶かす。接着樹脂３はキャップガラス２
の裏面をパッケージの内側方向に広がるが、突起部１が
障害となるため、突起部１とキャップガラス２との境界
部分を封止する形で止まり、チップ６上まで広がること
はできない。したがって、接着樹脂の影による画面の端
の欠を陥を防止することができる。またこの突起部１を
設けたことにより、接着樹脂のはがれによって発生した
ゴミが、チップ６上へ移動するのを防ぐことができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of the vicinity of a cap glass bonding portion of a solid-state imaging device according to an embodiment of the present invention. The protrusion 1 is provided between the cap glass bonding portion 4 at the outermost periphery of the package and the chip 6 at the center of the ceramic package 5, and the groove 7 is formed between the protrusion 1 and the cap glass bonding portion 4. Have been. When bonding the cap glass 2, first,
The cap glass 2 is placed on the projection 1, and is brought to a high temperature state to melt the adhesive resin 3. Adhesive resin 3 is cap glass 2
Is spread inwardly of the package, but the protrusion 1 becomes an obstacle. Therefore, the protrusion stops at the sealing portion of the boundary between the protrusion 1 and the cap glass 2 and cannot spread over the chip 6. Therefore, it is possible to prevent the edge of the screen from being broken due to the shadow of the adhesive resin. In addition, the provision of the projections 1 prevents dust generated due to peeling of the adhesive resin from moving onto the chip 6.
【０００６】図２は参考例の固体撮像素子の接着付近の
断面図である。キャップガラス２の突起部１との接触面
より外側に、突起部１との間を形成するように、下方向
への突起部８を設けている。このとき突起部１の高さは
キャップガラスの突起部８の高さより高くなっている。
キャップガラス２を接着するとき、接着樹脂３は、突起
部１の根元と、キャップガラスの突起部８とを封止する
形で止まりセラミックパッケージ５の内部に固着したチ
ップ６上まで広がることができない。したがって接着樹
脂３の影による画面の端の欠陥を防止することができ
る。またこの参考例ではキャップガラス２をセットした
後のキャップガラス２のずれが、突起部１とキャップガ
ラスの突起部７によって制限されるため、キャップガラ
ス２が大きくずれることがなくなりキャップガラス２の
セットが容易になる。FIG. 2 is a sectional view of the vicinity of the solid-state image sensor of the reference example in the vicinity of adhesion. On the outer side of the contact surface of the cap glass 2 with the projection 1, a downward projection 8 is provided so as to form a space between the projection 1 and the cap 8. At this time, the height of the projection 1 is higher than the height of the projection 8 of the cap glass.
When bonding the cap glass 2, the adhesive resin 3 stops in a form that seals the base of the protrusion 1 and the protrusion 8 of the cap glass, and cannot spread onto the chip 6 fixed inside the ceramic package 5. . Therefore, it is possible to prevent the edge of the screen from being defective due to the shadow of the adhesive resin 3. The displacement of the cap glass 2 After setting the key Yappugarasu 2 in this reference example, since it is limited by the protrusions 1 and the cap glass protrusions 7, a set of cap glass 2 prevents the cap glass 2 large shift Becomes easier.
【０００７】[0007]
【発明の効果】以上説明したように、本発明は固体撮像
素子のパッケージのチップの取り付け部分とキャップガ
ラス接着部との間にキャップガラス接着部に比べて高さ
が高い突起部を設け、キャップガラス接着時に接着樹脂
がパッケージ内部に広がってチップの有効画素を覆うの
を防ぐ構造としたので、画面出力の端の欠陥を防止する
という効果がある。また、キャップガラスの最外周部分
に、下方向への突起部を設けたので、パッケージの突起
部の高さを高く取れ、接着樹脂のパッケージ内部への侵
入がさらに困難となる。またキャップガラスのずれがキ
ャップガラスの突起部とパッケージの突起部によって制
限されるためキャップガラスが大きくずれることがなく
なり、キャップガラスのセットが容易になる。As described above, according to the present invention, a projection having a height higher than that of the cap glass bonding portion is provided between the chip mounting portion of the package of the solid-state imaging device and the cap glass bonding portion. Since the structure is such that the adhesive resin does not spread inside the package during glass bonding and covers the effective pixels of the chip, there is an effect of preventing defects at the edges of the screen output. In addition, since a downwardly projecting portion is provided on the outermost peripheral portion of the cap glass, the height of the projecting portion of the package can be increased, making it more difficult for the adhesive resin to enter the inside of the package. In addition, since the displacement of the cap glass is limited by the protrusion of the cap glass and the protrusion of the package, the cap glass does not largely shift, and the setting of the cap glass is facilitated.
【図１】本発明の一実施例の固体撮像素子のキャップガ
ラス接着部付近の断面図。FIG. 1 is a sectional view showing the vicinity of a cap glass bonding portion of a solid-state imaging device according to an embodiment of the present invention.
【図２】本発明の参考例の固体撮像素子のキャップガラ
ス接着部付近の断面図。FIG. 2 is a cross-sectional view of the vicinity of a cap glass bonding portion of the solid-state imaging device according to the reference example of the present invention.
【図３】従来の固体撮像素子のキャップガラス接着部付
近の断面図。FIG. 3 is a cross-sectional view showing the vicinity of a cap glass bonding portion of a conventional solid-state imaging device.
１ パッケージの突起部 ２ キャップガラス ３ 接着樹脂 ４ キャップガラス接着部 ５ パッケージ ６ チップ ７ 溝 ８ キャップガラスの突起部 DESCRIPTION OF SYMBOLS 1 Package protrusion 2 Cap glass 3 Adhesive resin 4 Cap glass adhesion part 5 Package 6 Chip 7 Groove 8 Cap glass protrusion
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 27/14 H01L 23/02 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 27/14 H01L 23/02
Claims (1)
像素子チップを固着し、前記セラミックパッケージ上部
にキャップガラスを接着して成る固体撮像素子におい
て、前記セラミックパッケージのキャップガラス接着部
と、前記セラミックパッケージのチップの取り付け部分
との間に、前記キャップガラス接着部より高さが高い突
起部を設け、前記突起部と前記キャップガラス接着部と
の間に溝を設けたことを特徴とする固体撮像素子。1. A solid-state image pickup device comprising a solid-state image pickup device chip fixed to a center portion of a ceramic package and a cap glass bonded to an upper portion of the ceramic package, wherein a cap glass adhesion portion of the ceramic package and a chip of the ceramic package are provided. Between the mounting portion of the cap glass adhesive portion is provided with a projection higher than the cap glass adhesive portion , the projection portion and the cap glass adhesive portion
A solid-state imaging device , wherein a groove is provided between them .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03110076A JP3074773B2 (en) | 1991-05-15 | 1991-05-15 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03110076A JP3074773B2 (en) | 1991-05-15 | 1991-05-15 | Solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04337668A JPH04337668A (en) | 1992-11-25 |
| JP3074773B2 true JP3074773B2 (en) | 2000-08-07 |
Family
ID=14526429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03110076A Expired - Fee Related JP3074773B2 (en) | 1991-05-15 | 1991-05-15 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3074773B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4519424B2 (en) | 2003-06-26 | 2010-08-04 | ルネサスエレクトロニクス株式会社 | Resin mold type semiconductor device |
| JP3838572B2 (en) | 2003-09-03 | 2006-10-25 | 松下電器産業株式会社 | Solid-state imaging device and manufacturing method thereof |
| JP5155352B2 (en) | 2010-03-25 | 2013-03-06 | 日本電波工業株式会社 | Piezoelectric device |
| JP5134045B2 (en) * | 2010-06-23 | 2013-01-30 | 日本電波工業株式会社 | Piezoelectric device and manufacturing method thereof |
| JP5982972B2 (en) * | 2012-04-10 | 2016-08-31 | 日本電気株式会社 | Vacuum package, sensor, and manufacturing method of vacuum package |
| JP5185459B2 (en) * | 2012-07-12 | 2013-04-17 | シャープ株式会社 | Electronic element and electronic information device |
| WO2017061296A1 (en) * | 2015-10-09 | 2017-04-13 | ソニー株式会社 | Solid-state imaging element package, manufacturing method therefor, and electronic device |
| FR3065318B1 (en) * | 2017-04-18 | 2021-09-10 | E2V Semiconductors | HERMETIC ELECTRONIC COMPONENT BOX, ESPECIALLY FOR IMAGE SENSOR |
-
1991
- 1991-05-15 JP JP03110076A patent/JP3074773B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04337668A (en) | 1992-11-25 |
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