JP3068399B2 - Socket for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for electronic components used for mounting electronic components such as a multi-chip module (hereinafter referred to as a unit MCM) on a substrate.

[0002]

2. Description of the Related Art Conventionally, a socket used for mounting an electronic component on a substrate is known as a ZIF (Zero Intertion F / O).
orce). This mechanism is configured to move the moving member, on which the electronic component is temporarily held, in parallel with the socket body along the substrate surface, and to engage the contact pins of the electronic component with the contacts of the socket body. That is, when the electronic component is attached to and detached from the socket, no frictional force acts on the contact pin, so that attachment and detachment can be easily performed. This type of socket will be described with reference to FIGS.

FIG. 8 is a perspective view showing a conventional electronic component socket disclosed in Japanese Utility Model Laid-Open No. 63-69496, FIG. 9 is a perspective view showing a driving lever, and FIG. 10 is an enlarged view of a part of the socket. FIG. 2A shows a state in which the socket is connected, and FIG. 2B shows a state in which the socket is not connected.

In these figures, reference numeral 1 denotes an insulating housing as a socket body, and 2 denotes an insulating cover as a moving member. The socket body 1 has a built-in contact into which a contact pin of an electronic component (not shown) is engaged, and is mounted on a board (not shown) and supported by the board.
The insulating cover 2 has a large number of guide holes 2a for inserting the contact pins and holding the electronic components, and is attached to the socket body 1 so as to be able to move in parallel along the substrate surface.

[0005] A lever 3 is provided between the socket body 1 and the insulating cover 2.
By rotating the lever 3, the insulating cover 2 is configured to move parallel to the socket body 1. The lever 3 is formed in an L-shape by a metal rod, and is attached with one side of the L-shaped inserted between the socket body 1 and the insulating cover 2 and the other side projected out of the socket.

In the moving mechanism using the lever 3, as shown in FIG. 9, a part of the lever 3 is formed flat to provide an oval-shaped portion 4, and the oval-shaped portion 4 is provided.
Are fitted into the grooves 5 of the socket body 1 and the grooves 6 of the insulating cover 2 as shown in FIG. That is, by turning the oval-shaped portion 4 of the lever 3 clockwise from the position shown in FIG.
6 is urged by the oval-shaped portion 4 to move the insulating cover 2 to the right side in the figure with respect to the socket body 1 as shown in FIG. Also, by turning the oval-shaped portion 4 counterclockwise from the position shown in FIG.
Moves to the left with respect to the socket body 1 and returns to the initial position.

In a conventional socket having a ZIF mechanism, a single lever 3 is used to move the insulating cover 2 in parallel with respect to the socket body 1 so that the contacts of the electronic components inserted into the guide holes 2a of the insulating cover 2 are provided. Pin the socket body 1
The structure was such that it could be engaged or disengaged from the contacts inside.

[0008]

However, the conventional electronic component socket configured as described above has the following problem when the number of contact pins of the electronic component to be used is extremely large (for example, 500 pins or more). Problems arise.

That is, since the socket body 1 and the insulating cover 2 are integrally formed, the contact pin insertion holes (contact receiving holes) of the socket body 1 and the insulating cover 2 are formed in accordance with the number of contact pins. It is necessary to form more guide holes 2a, and the structure of a mold for molding them becomes complicated, and it becomes expensive.

Further, since a large number of contact pins are engaged with the contacts of the socket body at one time, a large force is required to translate the insulating cover 2 in parallel when engaging the contact pins (500 terminals). About 30 kg). For this reason, the lever 3 formed by bending the metal bar into an L-shape and forming the oval-shaped portion 4 is deformed and cannot engage the contact pin.
This is because when turning the oval-shaped portion 4, a force can be applied only from one end thereof. In addition, the oval-shaped portion 4 is thinner than other portions, and in addition, a force is applied to both the front and back surfaces, so that this portion is easily fatigued.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. The present invention has been made to reduce the cost of using an electronic component having an extremely large number of contact pins, and to securely connect the contact pins to the contacts. The purpose is to be able to.

[0012]

According to the present invention, there is provided a socket for an electronic component, wherein a moving member and a socket body are separately formed into a plurality of pieces and fitted into a frame, and the frame into which each moving member is fitted is attached to each socket. The main body is supported so as to be able to move in parallel to the frame into which it is fitted, and is connected via a moving mechanism that changes the turning operation of the lever to the operation along the contact pin engaging and disengaging direction. A cylindrical body rotatably supported by the moving member frame with the direction perpendicular to and parallel to the substrate surface as an axial direction, and an engaging portion formed at a different portion in the axial direction on an outer peripheral portion of the cylindrical body. A notch for removal and removal, and an engagement counterpart formed in a portion of the socket body frame body on a rear side in the contact pin engagement direction with respect to the cylindrical member and corresponding to the engagement notch. Power walls and A detachment reaction force wall formed at the front side of the cylindrical body in the contact pin engaging direction with respect to the cylindrical body and corresponding to the disconnection notch, and at both ends of the cylindrical body. The notch for engagement and the notch for disengagement are formed by the fixed handle, and the notch for engagement and the notch for disengagement are engaged with the engagement reaction force wall and the disengagement reaction force wall by rotating the cylindrical body, and the moving member frame is formed. The cam is configured to move the body in parallel along the contact pin engaging / disengaging direction, and the cam moves the handle in a state where the moving member frame moves in a direction perpendicular to the substrate surface. It is configured so that the directions match.

[0013]

[0014]

According to the present invention, a mold for molding each moving member and each socket body has a structure having a small number of contact pins. In addition, when the handle is swung, the force is applied to both ends of the cylindrical body, and the cylindrical body turns, the notch for engagement engages with the engagement reaction force wall when the contact pin is engaged, and when the contact pin is disengaged. The escape notch engages the escape reaction wall. In other words, 2
A force is applied via two transmission paths, and a force is applied to this cylindrical body at a portion different in the axial direction between when the contact pin is engaged and when the contact pin is removed. In addition, since the moving member frame can be urged in the contact pin engaging direction or in the opposite direction by using a part of the operating force applied to the handle, the cam can be engaged with the engaging reaction wall or the disengagement. The pressing force when pressing the reaction wall can be reduced by the urging force.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. 1 is a plan view of an electronic component socket according to the present invention, FIG. 2 is a front view of the same, FIG. 3 is a side view, and FIG.
FIG. 2B shows a state when the contact pin is removed. FIG.
Is a perspective view of the base housing and the cover housing, FIG.
6 is a perspective view showing a moving mechanism according to the present invention, FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 1, FIG. 6A shows a state when contact pins are detached, and FIG. The state at the time of engagement is shown. FIG. 7 is a sectional view taken along the line VII-VII in FIG. 1, and FIG.
FIG. 3B shows a state when the contact pins are engaged.

In these figures, reference numeral 11 denotes an electronic component socket according to the present invention. This socket is configured to mount an MCM having an extremely large number of contact pins on a substrate (not shown). Numeral 12 denotes a cover housing as a separately formed moving member. In this embodiment, 11 cover housings 12 are mounted side by side as shown in FIG. As shown in FIG. 4, the cover housing 12 is integrally formed of a synthetic resin, and has a plurality of contact pin guide holes 13 formed therein. In FIG. 4, a member indicated by reference numeral 14 below the cover housing 12 is a base housing as a separately formed socket main body.

The base housing 14 is formed to have the same width as the cover housing 12, and a large number of contact storage angle grooves 15 are formed in the cover housing 12 at positions corresponding to the contact pin guide openings 13. Have been. The MCM contacts 16 as the contacts according to the present invention are loaded in the insides of the contact storage angle grooves 15, respectively. The MCM contact 16 has a structure in which the MCM contact 16 is press-fitted and fixed in a through hole of a printed board (not shown) and is electrically connected to a circuit pattern. That is, the base housing 14
The contact 16 fixes the printed circuit board.

The base housing 14 overlaps the cover housing 12 with its upper part facing the recess 12a of the cover housing 12. The opening width of the recess 12a in the longitudinal direction is formed to be longer than the longitudinal dimension of the base housing 14 by a predetermined dimension. The predetermined size is a moving size of a moving mechanism described later.

The cover housing 12 and the base housing 14 are fitted in a frame shown in FIG. 5, and the contact pin guide port 13 and the contact storage angle groove 15 are positioned with respect to each other. The 11 cover housings 12 are all fitted into and supported by a drive frame indicated by reference numeral 17 in FIG. The drive frame 17 constitutes the moving member frame according to the present invention. A fitting portion between the cover housing 12 and the drive frame 17 is indicated by reference numeral 18 in FIGS.

On the other hand, the eleven base housings 14
It is fitted in a lever force receiving frame indicated by reference numeral 19 in FIG. The lever force receiving frame 19 constitutes the socket body frame according to the present invention. The lever receiving frame 19 is screwed to a structure (not shown) across the printed board by a fixing screw (not shown) inserted into the fixing screw hole 20. That is, the base housing 14 is
It is fixed to the printed circuit board by the contact 16 and is fitted to and supported by the lever force receiving frame 19. A fitting portion between the base housing 14 and the lever receiving frame 19 is indicated by reference numeral 21 in FIGS.

The drive frame 17 is laid on the lever receiving frame 19 such that the cover housing 12 is laid on the base housing 14, and is slid along the board surface by the locking plate 22 (FIG. 1). They are freely connected.
The locking plate 22 is screwed to the lever receiving frame 19. The direction in which the drive frame 17 can move is the vertical direction in FIG. That is, when the drive frame 17 is moved parallel to the lever force receiving frame 19 in the up-down direction in FIG. 1, the plurality of cover housings 12 are all moved at the same time with respect to the respective base housings 14. .

The parallel movement is performed by a moving mechanism 23 provided on the drive frame 17 and the lever force receiving frame 19. The moving mechanism 23 includes a cylindrical body 24 rotatably attached to the drive frame 17, an engaging notch 25 and an uncutting notch 26 formed on the outer periphery of the cylindrical body 24, and a lever force. It is formed by an engagement reaction wall 27 and a removal reaction wall 28 formed in the receiving frame 19, and handles 29 fixed to both ends of the cylindrical body 24.

The cylindrical body 24 has its axial direction set in a direction parallel to the substrate surface and perpendicular to the moving direction of the drive frame 17, and both ends are supported by the drive frame 17, respectively. The notch 25 for engagement and the notch 26 for removal are formed by partially flattening the outer peripheral portion of the columnar body 24, and the notch 25 for engagement is formed at the center in the longitudinal direction of the columnar body 24. The notch 26 for disengagement is provided with the notch 2 for engagement.
5 are arranged on both sides. That is, both notches 25,
Reference numeral 26 is formed at different portions in the axial direction on the outer peripheral portion of the cylindrical body 24.

The engagement reaction wall 27 and the removal reaction wall 28
Are formed integrally with the lever force receiving frame 19, and are configured to be convex walls protruding toward the drive frame 17 side, respectively. The engagement reaction force wall 27 is provided on the cylindrical body 24 as shown in FIG.
Is disposed at a position on the upper side facing the engagement notch 25, and the removal reaction force wall 28 is located on the lower side of the cylindrical body 24 and faces the removal notch 26. It is arranged in. A portion corresponding to the fixing screw hole 20 is cut out in the engagement reaction force wall 27.

The notch 25 for engagement and the notch 26 for removal are engaged with the engagement reaction force wall 27 and the removal reaction force wall 28 by the rotation of the cylindrical body 24, and the drive frame 17 is engaged. In FIG. 1 is configured as a cam that translates up and down. In other words, the cam is configured such that the direction in which the drive frame 17 moves and the direction in which the handle 29 moves when viewed from a direction perpendicular to the substrate surface, as shown in FIG. I have. Therefore, when the handle 29 is swung in the direction indicated by arrow A in FIG. 5, the drive frame 17 moves in parallel in the direction indicated by arrow C in FIG. This state is a contact pin engagement state. Then, when the handle 29 is swung in the opposite direction (the direction of arrow B) from this state, the drive frame 17 moves in parallel in the direction indicated by arrow D and returns to the original position.

In FIG. 1, reference numeral 30 denotes an MCM.
Guide guide for guiding the base 31 to the proper fitting position, 3
2 is an MCM31 when the socket 11 is vertically mounted.
Is a fall-prevention spring that prevents the natural fall-off.

Next, the operation of the socket 11 configured as described above will be described. To assemble the socket 11, first, the MCM contact 16 is press-fitted and fixed in a through hole of a printed circuit board to make an electrical connection.
The base housing 14 is attached, and the cover housing 12 is further attached and assembled. That is, the lever receiving frame 19 is fitted to the base housing 14 and fixed to the printed circuit board side. Further, the cover housing 12 is overlaid on the base housing 14 and the drive frame 17 is fitted to the cover housing 12. Finally, the drive frame 17 is connected to the locking plate 2.
2 to the lever force receiving frame 19.

To mount the MCM 31 on the printed circuit board via the socket 11, first, the handle 29 is
As shown in FIG. Then, as shown in FIG.
3 is a contact pin guide port 13 of the cover housing 12.
And the MCM 31 is temporarily held in the cover housing 12. In this state, the contact pins 33 are located outside the MCM contacts 16 of the base housing 14 and are not connected.

Next, the handle 29 is swung in the direction of arrow A in FIG. 6A, the cylindrical body 24 in FIG. 6A rotates counterclockwise, and the flat surface of the engagement notch 25 comes into contact with the engagement reaction force wall 27. Then, as the cylindrical body 24 continues to rotate, the engagement notch 25 and the engagement reaction force wall 27 compete with each other, and the drive frame 17, the cover housing 12, and the MCM 31 move to the left in FIG. 6A. This movement is continued until the engagement notch 25 stops engaging with the engagement reaction force wall 27 as shown in FIG. On the other hand, by swinging the handle 29 as described above, a part of the operating force applied to the handle 29 acts on the drive frame 17 via the cylindrical body 24. That is, since the drive frame 17 is urged in the contact pin engagement direction by a part of the operation force, the pressing force when the engagement notch 25 presses the engagement reaction force wall 27 is equal to the urging force ( (A part of the operating force). As shown in FIG. 3B, the engagement notch 25 is formed by the engagement reaction force wall 2.
7, the contact pin 33 of the MCM 31 becomes M
It is engaged in the middle of the CM contact 16 and is electrically connected thereto.

That is, by operating the handle, all the cover housings 12 are simultaneously moved, and all the contact pins 33 of the MCM 31 are engaged with the MCM contacts 16.

In order to remove the MCM 31 mounted on the printed circuit board via the socket 11 as described above, the handle 29 is raised from the state shown in FIG. 6B as shown in FIG. At this time, the cylindrical body 24 shown in FIG. 7B rotates clockwise, and the notch 26 for removal comes into contact with the reaction wall 28 for removal, and the drive frame 17 and the cover housing 12, The MCM 31 moves rightward in FIG. Then, when the handle 29 reaches the upright position, as shown in FIG.
Stops engaging with the disengagement reaction force wall 28, and the movement stops. That is, the dimension S shown in FIG. 7B becomes smaller after the end of the movement as shown as the dimension S in FIG. 7A. Also during this removal operation, the drive frame 17 is urged by a part of the operating force applied to the handle 29, so that the pressing force when the removal notch 26 presses the removal reaction force wall 28 is It is reduced by the power. Notch 26 for removal
Is no longer engaged with the removal reaction force wall 28, the contact pin 33 of the MCM 31 is positioned outside the MCM contact 16, and the MCM 31 can be removed upward in the figure.

Therefore, since a plurality of cover housings 12 and a plurality of base housings 14 are formed and positioned by the drive frame 17 and the lever force receiving frame 19, even when the number of the contact pins 33 is extremely large as the MCM 31, The mold for molding the cover housing 12 and the base housing 14 has a structure with a small number of contact pins.

When the handle 29 is swung, the force is applied to both ends of the cylindrical body 24, and the cylindrical body 24 rotates.
At the time of contact pin engagement, the engagement notch 25 engages the engagement reaction force wall 27, and at the time of contact pin removal, the removal notch 26 engages with the removal reaction force wall 28. That is, a force is applied from the handle 29 to the cylindrical body 24 via two transmission paths passing through both ends of the cylindrical body 24. The cylindrical body 24 exerts a force on different portions in the axial direction when the contact pin is engaged and when the contact pin is removed. Will be added. In addition, since the drive frame 17 can be urged in the contact pin engagement direction or the opposite direction by utilizing a part of the operation force applied to the handle 29, the cam can be engaged with the engagement reaction force wall 27 or the disengagement. The pressing force when pressing the reaction wall 28 can be reduced by the urging force.

[0034]

As described above, in the electronic component socket according to the first aspect of the present invention, the moving member and the socket main body are separately formed into a plurality of pieces and fitted into the frame, and the frame into which each moving member fits. , Are supported by a frame body into which each socket body fits so as to be able to move in parallel, and are connected via a moving mechanism for changing the turning operation of the lever to the operation along the contact pin engaging / disengaging direction. A cylindrical body rotatably supported by the moving member frame with a direction perpendicular to the detaching direction and a direction parallel to the substrate surface as an axial direction, and formed at different axially different portions on the outer peripheral portion of the cylindrical body. The notch for engagement and the notch for disengagement are formed in a portion of the socket body frame body on the rear side in the contact pin engagement direction with respect to the cylindrical body and corresponding to the engagement notch. Engagement A wall, a detachment reaction force wall formed at a position on the front side of the cylindrical body of the socket body frame in the contact pin engaging direction and corresponding to the disconnection notch, The notch for engagement and the notch for disengagement are formed by handles fixed to both ends, and the notch for engagement and the notch for disengagement are moved by engaging the engagement reaction force wall and the disengagement reaction force wall by rotating the cylindrical body. The member frame is configured as a cam that moves in parallel along the contact pin engaging and disengaging direction, and the cam is formed in a state where the moving member frame moves and the substrate surface is viewed from a direction perpendicular to the substrate surface. Since the moving direction of the handle is configured to coincide with the moving direction of the handle, the mold for molding each moving member and each socket body has a structure with a small number of contact pins.

Therefore, the manufacturing cost of the mold can be reduced, and a socket that can use an electronic component having a large number of contact pins can be obtained at low cost. In addition, when the handle is swung, the force is applied to both ends of the cylindrical body, and the cylindrical body turns, the notch for engagement engages with the engagement reaction force wall when the contact pin is engaged, and when the contact pin is disengaged. The escape notch engages the escape reaction wall. In other words, 2
A force is applied via two transmission paths, and a force is applied to this cylindrical body at a portion different in the axial direction between when the contact pin is engaged and when the contact pin is removed. For this reason, a force for rotating the column is applied from two places, and the column is reliably rotated. Further, since no force is applied to the same portion of the cylindrical body when the contact pin is engaged and when the contact pin is removed, fatigue is unlikely. Therefore, even if an electronic component having a large number of contact pins is used, the contact pins can be reliably engaged with and disengaged from the contacts. Furthermore, since the moving member frame can be urged in the contact pin engaging direction or in the opposite direction by using a part of the operating force applied to the handle, the cam can be disengaged by the engaging reaction wall. The pressing force when pressing the reaction wall can be reduced by the urging force. Therefore, even though the load at the time of engagement is increased by setting a large number of contact pins, a portion for forming a cylindrical cam (an engagement notch and a notch for removal), Wear of the power wall, the removal reaction force wall, and the like can be minimized.

[0036]

[0037]

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component socket according to the present invention.

FIG. 2 is a front view of the electronic component socket according to the present invention.

FIG. 3 is a side view of the electronic component socket according to the present invention,
FIG. 7A shows a state when the contact pin is engaged, and FIG. 7B shows a state when the contact pin is removed.

FIG. 4 is a perspective view of a base housing and a cover housing.

FIG. 5 is a perspective view showing a moving mechanism according to the present invention.

FIGS. 6A and 6B are cross-sectional views taken along the line VI-VI in FIG. 1. FIG. 6A shows a state when contact pins are removed, and FIG. 6B shows a state when contact pins are engaged.

FIG. 7 is a sectional view taken along the line VII-VII in FIG.
Shows a state when the contact pin is removed, and FIG. 4B shows a state when the contact pin is engaged.

FIG. 8 is a perspective view showing a conventional electronic component socket.

FIG. 9 is a perspective view showing a driving lever of a conventional socket.

FIG. 10 is an enlarged sectional view showing a part of a conventional socket, and FIG. 10 (a) shows a state where the socket is connected;
FIG. 4B shows a state where the socket is not connected.

DESCRIPTION OF SYMBOLS 11 Socket 12 Cover housing 14 Base housing 16 MCM contact 17 Drive frame 19 Lever force receiving frame 23 Moving mechanism 24 Cylindrical body 25 Engagement notch 26 Ejection notch 27 Engagement reaction force wall 28 Detachment Reaction force wall 29 Handle 31 MCM 33 Contact pin

Continuing from the front page (72) Inventor Toru Kishimoto Nippon Telegraph and Telephone Corporation, 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo (72) Inventor Shinichi Sasaki 1-16-1 Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Stock In-company (72) Inventor Mitsuhiko Kawachi 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (56) References JP-A-3-1303074 (JP, A) JP-A-2-262285 (JP) , A) Japanese Utility Model Showa 60-162391 (JP, U) Japanese Utility Model Showa 56-101657 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 33/76 H01R 24/06 H01R 24/10

Claims (1)

(57) [Claims] 1. A moving mechanism for moving a moving member holding an electronic component through a plurality of contact pins erected on the electronic component along a board surface by a moving mechanism with respect to a socket body fixed to the board. by the in electronic component socket for a contact pin or to disengaged or is engaged into contacts of the socket body, divided form to the moving member and the socket body into a plurality in a direction parallel to the substrate surface, respectively The frame into which each moving member fits is supported by the frame into which each socket body fits so as to be movable in parallel along the engaging and disengaging direction of the contact pin. This movement mechanism is connected via a movement mechanism that changes to an operation along the
In the direction orthogonal to the contact pin
The axis parallel to the axis
And the outer peripheral part of the cylindrical body
Engagement notches and projections formed at different axial locations
Notch for extraction, and the cylindrical body in the socket body frame
To the contact pin engagement direction and
An engagement reaction wall formed at a portion corresponding to the input notch,
The cylindrical body in the socket body frame is contoured.
On the front side in the direction in which the cut pins are engaged with the cutout notches.
A detachment reaction force wall formed at a corresponding portion;
Formed by a handle fixed to the end,
That the cylinder rotates.
The moving member frame is engaged with the engaging reaction wall and the
To move the body parallel to the contact pin
This cam is used to move the moving member frame.
Direction when viewed from a direction perpendicular to the substrate surface.
It is configured so that the moving direction of the handle
Electronic component socket, characterized in that that.