JP3067385B2 - Wiring structure of multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring structure of a multilayer printed wiring board, and more particularly, to a wiring structure of a wiring pattern derived from a through hole for connecting a group of terminal pins in two rows.

For example, an electronic exchange unit in which a plurality of electronic circuit packages are arranged and accommodated has a back board on the back surface for connecting the electronic circuit packages to a connector. The backboard mounts a main connector for connecting a communication line introduced from an external terminal at a side end, and branches and wires in a wiring pattern from this main connector to each sub-connector for connecting an electronic circuit package. .

However, in recent years, electronic exchange units have been required to be miniaturized and densely mounted. As the number of electronic circuit packages has increased, the number of sub-connectors and the number of terminal pins of the main connector have both increased. The area occupied by the wiring pattern leading out from the through hole connecting the terminal pins of the connector to the sub-connector tends to increase, and from the viewpoint of reducing the size of the derived wiring pattern on the backboard and the unit itself and achieving high-density mounting There is a demand for efficient derivation without taking up space in terms of space.

[0004]

2. Description of the Related Art As shown in a perspective view of a main part of FIG.
A through-hole 11a having a diameter of 1 mm for connecting a terminal pin group of a two-row configuration of the main connector 20 indicated by a dashed-dotted line (terminal pins of the row B direction is 2.54 mm, one row and seven pins × two rows), and the through-hole land 11a-1a (1.4 mm square) to a plurality of wiring patterns (surface layer patterns) 11b connected to a sub-connector (not shown).

Since each wiring pattern 11b requires a high withstand voltage and a large current capacity, a line width (0.7 mm) suitable for the wiring pattern is drawn out from the through hole 11a. That is, the wiring pattern 11b-1 in the first row is led out only from the through hole 11a-1 in the first row in the direction orthogonal to the through-hole row direction B by the surface layer pattern alone.

The wiring patterns 11b-2 in the second row are arranged at high density along the wiring patterns 11b-1 in the first row, and the through holes 11a-1 and 11a- 2 is bypassed and derived only by the surface layer pattern.

[0007]

However, according to the above-described wiring structure, there is no problem because the wiring pattern of the first column derived from the through-hole of the first column is not detoured. The second derived from the through hole in the row
The wiring pattern in the column bypasses the first and second through holes because the line width cannot pass between the first through hole columns due to the relationship between the withstand voltage and the current capacity with respect to the through hole land. Since it is derived, there has been a problem that wiring efficiency in the space is poor, and miniaturization and high-density mounting are hindered.

In view of the above problems, the present invention provides a wiring of a multi-layer printed wiring board capable of improving the wiring efficiency in the space of a wiring pattern derived from a through hole for connecting a two-row terminal pin group such as a connector. The purpose is to provide a structure.

[0009]

In order to achieve the above object, a wiring structure of a multilayer printed wiring board according to the present invention comprises:
As shown in an exploded perspective view of a main part of FIG. 1 (the figure shows a state in which a surface layer and an inner layer are separated), a through-hole for connecting a terminal pin group having a two-row configuration of a connector is a first hole corresponding to the terminal pin group. The first and second rows of through holes are formed, and the wiring patterns derived from the respective through holes are the first and second rows.
A first row of wiring patterns derived from the through holes of a row as a surface layer pattern, and a via hole provided between lines of the first row of wiring patterns and a second row of through holes are arranged between the first row of through hole lands. And a second row of wiring patterns derived from the via holes by a surface layer pattern passing between the lines of the first row of wiring patterns.

[0010]

The wiring pattern of the first row derived from the through holes of the first row by the surface layer pattern can be made to have a conventional line width, so that it can be a wiring pattern of a high withstand voltage and a large current capacity row.

The wiring patterns of the second row derived from the through holes of the second row are divided into surface layer patterns and inner layer patterns from the through holes of the second row, and then the wiring patterns of the wiring pattern of the first row are separated. The surface layer pattern and the inner layer pattern are designed to have a narrow line width that takes into account the withstand voltage for through-hole lands by connecting the via layer to the via hole prepared in advance and drawing out the surface layer pattern from the via hole. The current can be led through the first row of through-hole lands without bypassing the through-hole, and the insufficient current capacity due to the narrow width can be supplemented by using the inner layer pattern as a bypass line.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described below in detail with reference to the embodiments shown in the drawings. As shown in FIG. 1, the multilayer printed wiring board 1 (corresponding to the back board 11 in FIG. 2 in the related art)
The wiring structure of (2) is a two-row configuration of terminal pins (not shown) of the connector 10 (corresponding to the main connector 20 of FIG. 7
Pins x 2 rows) 1 mm diameter through-holes 1a, ie, a first row of through-holes 1a-1 and a second row of through-holes 1a-2, and a first row and a second row of through-holes 1a. -1,1
A wiring pattern 1b derived from a-2, that is, a wiring pattern 1b-1 in the first row and a wiring pattern 1b-2 in the second row.

The wiring pattern 1b-1 in the first row has a surface layer pattern extending from the first row of through-holes 1a-1 outward in a direction orthogonal to the line A in the through-hole row direction with the same line width of 0.7 mm as in the prior art. Is derived.

The second row of wiring patterns 1b-2 includes a via hole 1d having a diameter of 0.6 mm provided between lines of the first row of wiring patterns 1b-1 and a second row of through holes 1a-2. Line width 0.26m passing between through hole lands 1a-1a (1.4mm square)
The same line width of 0.26m as the surface layer pattern of m and the bypass line
m, ie, the first inner layer pattern 1c-1 and the second inner layer pattern 1c-2 are connected to each other, and the via hole 1d
0.7m line width between the lines of the first row of wiring patterns 1b-1
It is derived by the surface layer pattern of m.

As described above, the wiring pattern of the first column derived from the through holes of the first column can be made the same as the conventional line width in the surface layer pattern. Can be

The wiring pattern of the second row derived from the through holes of the second row has a narrow line width in consideration of the withstand voltage against the land of the through hole, so that the wiring pattern of the first row can be formed without bypassing the through hole. Since it is possible to derive through the space between the through holes, it is possible to derive the surface layer pattern and the inner layer pattern from the second row of through holes and then to derive the first layer.
By connecting to the via holes provided between the lines of the column wiring pattern collectively and deriving with the surface layer pattern from the via hole, the line width can be narrowed and the insufficient current capacity can be supplemented by using the inner layer pattern as a bypass line. The wiring pattern of the second column derived from the via hole with the surface layer pattern can be wired with the same line width as the wiring pattern of the first column. The first row of wiring patterns and the second row of wiring patterns can be wired along with each other.

[0017]

As described in detail above, according to the present invention,
Of the first and second rows of wiring patterns derived from the first and second rows of through-hole groups for connecting two rows of terminal pin groups such as connectors requiring high withstand voltage and large current capacity, the second row By dividing the wiring pattern into a surface layer pattern and an inner layer pattern and leading it through between the first rows of through holes, wiring efficiency in space can be improved. An extremely useful effect in industry such as downsizing and high-density mounting can be achieved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a main part of an embodiment according to the present invention.

FIG. 2 is a perspective view of a main part according to a conventional technique.

[Explanation of symbols]

 1 is a multilayer printed wiring board (backboard) 1a is a through hole 1a-1,1a-2 is a first row, a second row of through holes 1a-1a is a through hole land 1b is a wiring pattern 1b-1,1b-2 Is the wiring pattern of the first and second rows, 1c is the inner layer pattern 1c-1,1c-2 is the first and second inner layer pattern 10 is the connector (main connector)

Claims (1)

(57) [Claims] 1. A multi-layer printed wiring board for connecting and mounting terminal pins in a two-row configuration through a through hole (1a) to a wiring pattern (1).
b) a wiring structure for deriving b), wherein the through-holes (1a) are composed of through-holes (1a-1, 1a-2) in a first row and a second row corresponding to the terminal pin group, The wiring pattern (1b) is provided with the through holes (1a-
First row wiring pattern derived from 1) using surface layer pattern
(1b-1), the via hole (1d) provided between the lines of the first row of wiring patterns (1b-1), and the second row of through holes (1a-2). 1a-1a) and the inner layer patterns (1c), which are bypass lines, are connected to each other through the via hole (1d), and the first row of wiring patterns
A wiring structure of a multilayer printed wiring board, comprising: a second row of wiring patterns (1b-2) derived by a surface layer pattern passing between lines (1b-1).