JP3065472U - Printed circuit board shield structure - Google Patents

Printed circuit board shield structure

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Publication number
JP3065472U
JP3065472U JP1999004950U JP495099U JP3065472U JP 3065472 U JP3065472 U JP 3065472U JP 1999004950 U JP1999004950 U JP 1999004950U JP 495099 U JP495099 U JP 495099U JP 3065472 U JP3065472 U JP 3065472U
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JP
Japan
Prior art keywords
shield plate
printed circuit
circuit board
shield
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1999004950U
Other languages
Japanese (ja)
Inventor
知鶴 荒井
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Advantest Corp
Original Assignee
Advantest Corp
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Publication date
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Priority to JP1999004950U priority Critical patent/JP3065472U/en
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Publication of JP3065472U publication Critical patent/JP3065472U/en
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Abstract

(57)【要約】 【課題】基板単位若しくは基板上の所定回路部位を対象
としたシールド構造を備えるプリント基板において、シ
ールド部材間における安定なシールド接触が得られるプ
リント基板のシールド構造を提供する。 【解決手段】少なくともシールド対象となる所定回路部
位を対象としてシールドし、回路部位の所定周囲を隔壁
するシールドする周壁シールド板と、プリント基板の部
品実装面の側を覆ってシールドする平板状の部品面シー
ルド板と、プリント基板の底面側を覆ってシールドする
平板状の底面シールド板とを備えるプリント基板のシー
ルド構造であって、上記部品面側周壁シールド板の上周
辺と上記部品面シールド板との間に導電性弾性材が弾性
接触可能に介在可能な所定の隙間を具備し、導電性弾性
材を備え、前記導電性弾性材は導電性を有する弾性材で
あり上記部品面シールド板の背面に接着され、周壁シー
ルド板上周辺と当接する部位に接着して備えるプリント
基板のシールド構造。
(57) Abstract: To provide a shield structure of a printed circuit board having a shield structure for a board unit or a predetermined circuit portion on the board, wherein stable shield contact between shield members is obtained. A peripheral wall shield plate that shields at least a predetermined circuit portion to be shielded and that partitions a predetermined periphery of the circuit portion, and a flat component that covers and shields a component mounting surface of a printed circuit board. A surface shield plate, a shield structure of a printed circuit board comprising a flat bottom shield plate that covers and shields the bottom surface side of the printed circuit board, wherein the component surface side peripheral wall shield plate upper periphery and the component surface shield plate, A predetermined gap in which a conductive elastic material can be interposed so that the conductive elastic material can elastically contact therewith, the conductive elastic material is provided, and the conductive elastic material is a conductive elastic material; The shield structure of the printed circuit board, which is adhered to the peripheral wall shield plate and adheres to the area that comes into contact with the periphery.

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【考案の属する技術分野】[Technical field to which the invention belongs]

この考案は、基板単位若しくは基板上の所定回路部位を対象としたシールド構 造を備えるプリント基板のシールド構造に関する。 The present invention relates to a shield structure of a printed circuit board having a shield structure for a substrate or a predetermined circuit portion on the substrate.

【0002】[0002]

【従来の技術】[Prior art]

装置に実装されるプリント基板の中には、隣接する基板や回路との間で電磁波 の漏洩若しくは侵入を阻止する為に、基板単位若しくは基板上の所定回路部位に 対してシールドボックス構造を形状して的確にシールド処理することが要求され るものがある。 従来技術について、図2のプリント基板の所定回路部位を対象としたシールド 構造の外観図と、図3のシールド構造の要部を拡大した部分側断面図とを参照し て以下に説明する。 要部の構成要素は、周壁シールド板31、32を有するプリント基板10と、 部品面シールド板12と、底面シールド板13とで成る。尚、シールド構造はプ リント基板10上でシールドをすべき回路部位に部分的に適用する場合や、複数 箇所に分割して適用する場合や、全面に適用する形態がある。図2のシールド例 ではプリント基板の一部分に対して適用した例を示している。 Some printed circuit boards mounted on equipment have a shield box structure for each circuit board or a predetermined circuit part on the circuit board to prevent leakage or intrusion of electromagnetic waves between adjacent circuit boards or circuits. In some cases, accurate shielding is required. The prior art will be described below with reference to an external view of a shield structure for a predetermined circuit portion of a printed circuit board in FIG. 2 and a partial side sectional view in which a main part of the shield structure in FIG. 3 is enlarged. The main components are a printed circuit board 10 having peripheral wall shield plates 31 and 32, a component surface shield plate 12, and a bottom surface shield plate 13. The shield structure may be partially applied to a circuit portion to be shielded on the print substrate 10, divided into a plurality of portions, or applied to the entire surface. FIG. 2 shows an example in which the invention is applied to a part of a printed circuit board.

【0003】 図3(a)に示す周壁シールド板31、32は、当該回路部位の周囲を所定に 隔壁するシールド板である。一方の部品面側周壁シールド板31は基板上面側を 覆う金属製の板材であり、凸端子35(図3(b)参照)が所定ピッチ毎に形成 され、この凸端子35を基板に圧入した後、半田ディップして回路アースに半田 付け固定される。この部品面側周壁シールド板31の高さは、実装部品の部品よ り高い所定高さである。 底面側周壁シールド板32は基板下面側を覆う金属製の板材であり、所定高さ の板材により、上記同様にして凸端子35を基板に圧入して半田付け固定される 。[0003] The peripheral wall shield plates 31 and 32 shown in FIG. 3A are shield plates that partition the periphery of the circuit part in a predetermined manner. One of the component side peripheral wall shield plates 31 is a metal plate material that covers the upper surface of the substrate, and is formed with convex terminals 35 (see FIG. 3B) at a predetermined pitch. The convex terminals 35 are pressed into the substrate. After that, it is solder-dipped and fixed to the circuit ground. The height of the component surface side peripheral wall shield plate 31 is a predetermined height that is higher than the components of the mounted components. The bottom side peripheral wall shield plate 32 is a metal plate material that covers the lower surface side of the substrate, and the convex terminal 35 is pressed into the substrate in the same manner as described above and fixed by soldering using a plate material of a predetermined height.

【0004】 部品面シールド板12は、4辺を折り曲げ補強した平板であって、プリント基 板10の部品実装面の上部を覆う板状のシールド板である。これには例えば4カ 所に金属製ボス22が取り付けられている。金属製ボス22は、部品面シールド 板12が実装部品の部品に当たらないように、所定の高さのスペーサであり、一 端が部品面シールド板12へカシメて取り付けられ、他端はプリント基板のアー ス電極面に当接してネジ止めするネジ孔加工がされている。これに対応する位置 のプリント基板10にはアース電極面と取り付け孔が形成されている。これによ り電気的にアース接続されてプリント基板10の上面がシールドされる。尚、通 気性や放熱を考慮して部分的に多数個のパンチング孔を形成若しくは網目状のシ ールド板を用いる形態もある。The component-side shield plate 12 is a flat plate having four sides bent and reinforced, and is a plate-like shield plate that covers the upper part of the component mounting surface of the printed board 10. For example, metal bosses 22 are attached at four places, for example. The metal boss 22 is a spacer having a predetermined height so that the component surface shield plate 12 does not hit a component of a mounted component. One end is attached to the component surface shield plate 12 by caulking, and the other end is a printed board. A screw hole is formed to abut the earth electrode surface and screw it. A ground electrode surface and a mounting hole are formed in the printed circuit board 10 at the corresponding position. As a result, the upper surface of the printed circuit board 10 is electrically shielded and grounded. There is also a mode in which a large number of punching holes are formed partially or a mesh-shaped shield plate is used in consideration of air permeability and heat radiation.

【0005】 底面シールド板13も4辺を折り曲げ補強した平板であって、プリント基板1 0の下面を覆う板状のシールド板である。プリント基板10のアース電極面が形 成された対応する位置には図3(a)に示すように、プレスにより突き出し加工 して数ミリ前後の高さの凸部26を形成し、当該凸部の中央には止め孔が形成さ れている。この図の場合は皿ビスに対応したテーパー加工例である。また、取付 方法は上記部品面シールド板12と底面シールド板13とを同一孔位置とし、皿 ビス24で共締めする構造例である。尚、凸部26の形成の代わりに、上述した ボスをカシメ取付けする形態もある。尚、底面シールド板13についても通気性 や放熱を考慮してパンチング孔や網目状のシールド板を用いる形態がある。また 、パターン面と接近する面には電気的絶縁処理された鋼板を使用、あるいは絶縁 シートを貼り付ける形態もある。The bottom shield plate 13 is also a flat plate having four sides bent and reinforced, and is a plate-shaped shield plate that covers the lower surface of the printed circuit board 10. At the corresponding position where the ground electrode surface of the printed circuit board 10 is formed, as shown in FIG. 3 (a), a projection is formed by pressing to form a projection 26 having a height of about several millimeters. A stop hole is formed in the center of the. The case of this figure is an example of taper processing corresponding to a countersunk screw. The mounting method is an example of a structure in which the component surface shield plate 12 and the bottom surface shield plate 13 are located at the same hole position, and are fastened together with a countersunk screw 24. Incidentally, instead of forming the convex portion 26, there is also a form in which the above-mentioned boss is crimped. The bottom shield plate 13 may be a punched hole or a mesh-shaped shield plate in consideration of air permeability and heat radiation. There is also a form in which a steel sheet subjected to electrical insulation treatment is used on the surface approaching the pattern surface, or an insulating sheet is attached.

【0006】 ところで、図3Aの位置に示す部品面側周壁シールド板31の上端と部品面シ ールド板12とは電気的に接触するように寸法設計されてはいるものの、部品面 側周壁シールド板31の半田付けのばらつき、基板自身の反り等に伴う高さずれ 、偏り、傾き等の組配ばらつきに伴って、必ずしも両者が電気的に的確に接触で きない場合が生じる。この場合においては非接触部位の隙間によっては、所定の シールド効果が期待できなくなり、また接触不安定でもある。このことは実用上 好ましくない。 一方、金属製ボス22を多数箇所に設ける場合は、各ボス点毎に電気的にアー ス接続される結果、所定のシールド効果が得られるものの、多数箇所に金属製ボ ス22を設けることは、実装可能な部品点数の制限や配置制限をもたらすため実 用的ではない。By the way, although the upper end of the component-side peripheral wall shield plate 31 shown in the position of FIG. 3A and the component-side shield plate 12 are designed to be in electrical contact with each other, the component-surface-side peripheral wall shield plate is designed. Due to variations in the soldering of the substrate 31 and variations in the arrangement such as height deviation, deviation, inclination and the like due to the warpage of the substrate itself, the two may not always be able to electrically contact accurately. In this case, the predetermined shielding effect cannot be expected depending on the gap between the non-contact portions, and the contact is unstable. This is not preferable in practical use. On the other hand, in the case where the metal bosses 22 are provided at many locations, although a predetermined shielding effect is obtained as a result of being electrically connected to each boss point, it is not possible to provide the metal bosses 22 at many locations. However, this is not practical because it limits the number of components that can be mounted and limits the placement.

【0007】[0007]

【考案が解決しようとする課題】[Problems to be solved by the invention]

上述説明したように従来技術においては、組配ばらつきや接触不安定等に伴い 所定のシールド効果が安定して期待できない場合があり、この点において実用上 の難点がある。 そこで、本考案が解決しようとする課題は、基板単位若しくは基板上の所定回 路部位を対象としたシールド構造を備えるプリント基板において、シールド部材 間における安定なシールド接触が得られるプリント基板のシールド構造を提供す ることである。 As described above, in the related art, there is a case where a predetermined shielding effect cannot be stably expected due to variations in arrangement and contact instability, and there is a practical difficulty in this point. Therefore, the problem to be solved by the present invention is to provide a printed circuit board having a shield structure for a substrate unit or a predetermined circuit portion on the substrate, and the shield structure of the printed circuit board capable of obtaining a stable shield contact between the shield members. It is to provide.

【0008】[0008]

【課題を解決するための手段】[Means for Solving the Problems]

第1に、上記課題を解決するために、本考案の構成では、少なくともシールド 対象となる所定回路部位を対象としてシールドし、当該回路部位の所定周囲を隔 壁するシールドする周壁シールド板31、32と、プリント基板10の部品実装 面(部品面)の側を覆ってシールドする平板状の部品面シールド板12と、プリ ント基板10の底面側を覆ってシールドする平板状の底面シールド板13とを備 えるプリント基板のシールド構造であって、 上記周壁シールド板31、32は当該回路部位の周囲を所定に隔壁するシール ド板であって、部品面側をシールドする部品面側周壁シールド板31と底面側を シールドする底面側周壁シールド板32とで成り、前記部品面側周壁シールド板 31は実装部品の部品より高い所定の一様な高さで囲う金属製の板材とし、基板 面と周接する辺は凸端子35を備えて基板の回路アースに所定間隔で半田付け固 定し、前記底面側周壁シールド板32は所定の一様な高さで囲う金属製の板材と し、基板面と周接する辺は凸端子35を備えて基板の回路アースに所定間隔で半 田付け固定し、 上記部品面シールド板12はプリント基板10の上面部を覆う平板状のシール ド板であり、上記部品面側の周壁シールド板31の高さに対応した長さで複数個 の金属製ボス22が当該部品面シールド板12へカシメて取り付けられ、金属製 ボス22の他端に当接するプリント基板10の基板面位置にはアース電極面が形 成された止め孔を有し、ネジ止め固定されて基板上面を電気的にアース接続し、 上記底面シールド板13はプリント基板10の下面部を覆う平板状のシールド 板であり、当接するプリント基板10の基板面位置にはアース電極面が形成され た止め孔を有し、これに対向する位置に凸部26と止め孔とを形成してネジ止め 固定されて基板下面を電気的にアース接続し、 上記シールド構造を備えるプリント基板のシールド構造において、 上記部品面側周壁シールド板31の上周辺と上記部品面シールド板12との間 に導電性弾性材50が弾性接触可能に介在可能な所定の隙間を具備し、 導電性弾性材50を備え、前記導電性弾性材50は導電性を有する弾性材であ り上記部品面シールド板12の背面に接着され、周壁シールド板31上周辺と当 接する部位に接着して備えることを特徴とするプリント基板のシールド構造であ る。 上記考案によれば、基板単位若しくは基板上の所定回路部位を対象としたシー ルド構造を備えるプリント基板において、導電性弾性材を貼り付けてシールド部 材間における安定なシールド接触が得られるプリント基板のシールド構造が実現 できる。 First, in order to solve the above-mentioned problems, in the configuration of the present invention, the peripheral wall shield plates 31 and 32 for shielding at least a predetermined circuit portion to be shielded and for shielding a predetermined periphery of the circuit portion are shielded. A flat component surface shield plate 12 that covers and shields the component mounting surface (component surface) of the printed circuit board 10; and a flat bottom shield plate 13 that covers and shields the bottom surface of the printed substrate 10. The peripheral wall shield plates 31 and 32 are shield plates for partitioning the periphery of the circuit portion in a predetermined manner, and the component side peripheral wall shield plate 31 for shielding the component surface side. And a bottom side peripheral wall shield plate 32 for shielding the bottom side. The component side peripheral wall shield plate 31 is surrounded by a predetermined uniform height higher than the component of the mounted component. A metal plate is used, and the side that is in circumferential contact with the substrate surface is provided with a convex terminal 35 and soldered and fixed at predetermined intervals to the circuit ground of the substrate, and the bottom side peripheral wall shield plate 32 is surrounded at a predetermined uniform height. A metal plate is provided, and a side which is in contact with the substrate surface is provided with a convex terminal 35 and is fixed to a circuit ground of the substrate at a predetermined interval by soldering. The component surface shield plate 12 is a flat plate which covers the upper surface of the printed circuit board 10. A plurality of metal bosses 22 having a length corresponding to the height of the peripheral wall shield plate 31 on the component surface side are caulked and attached to the component surface shield plate 12. The printed circuit board 10 has a stop hole in which a ground electrode surface is formed at the position of the printed circuit board 10 in contact with the other end of the printed circuit board 10. The printed circuit board 10 is screwed and fixed to electrically connect the upper surface of the substrate to the ground. Lower surface of printed circuit board 10 It is a flat shield plate that covers the printed circuit board 10. The printed circuit board 10 has a stop hole in which a ground electrode surface is formed at the position of the substrate surface to be in contact with, and a convex portion 26 and a stop hole are formed at a position facing the stop hole. In the shield structure of the printed circuit board provided with the shield structure, the lower surface of the substrate is electrically fixed and screwed, and the conductive structure is provided between the upper peripheral portion of the peripheral surface shield plate 31 on the component surface side and the shield plate 12 on the component surface. A predetermined gap in which the conductive elastic material 50 can be interposed so as to be elastically contactable; and a conductive elastic material 50. The conductive elastic material 50 is a conductive elastic material. A shield structure for a printed circuit board, which is adhered to a back surface and adhered to a portion that comes into contact with the periphery of the peripheral wall shield plate 31. According to the invention, in a printed circuit board having a shield structure for a substrate unit or a predetermined circuit part on the substrate, a printed circuit board in which a conductive elastic material is attached and a stable shield contact between the shield members is obtained. Shield structure can be realized.

【0009】 また、導電性シート56を備え、前記導電性シート56は上記導電性弾性材5 0を保護する保護シートであり、導電性弾性材50の表面に接着されて上記部品 面側周壁シールド板31の上周辺の鋭辺と電気的に接触することを特徴とする上 述プリント基板のシールド構造がある。The conductive sheet 56 is a protective sheet that protects the conductive elastic member 50. The conductive sheet 56 is adhered to the surface of the conductive elastic member 50 and is connected to the component surface side peripheral wall shield. There is the above-described shield structure for a printed circuit board, which is in electrical contact with the sharp edge at the upper periphery of the plate 31.

【0010】 また、プリント基板10の一部分、全部、若しくは複数箇所に対してシールド 適用することを特徴とする上述プリント基板のシールド構造がある。In addition, there is the above-mentioned shield structure of the printed circuit board, wherein the shield is applied to a part, the whole, or a plurality of portions of the printed circuit board 10.

【0011】[0011]

【考案の実施の形態】[Embodiment of the invention]

以下に本考案の実施の形態を実施例と共に図面を参照して詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings together with examples.

【0012】 本考案について、図1を参照して以下に説明する。尚、従来構成に対応する要 素は同一符号を付し、重複する部位の説明を省略する。 要部の構成要素は、周壁シールド板31、32を有するプリント基板10と、 部品面シールド板12と、底面シールド板13と、導電性弾性材50と、導電性 シート56とで成る。これは従来構成に対して導電性弾性材50と導電性シート 56とを追加した構成で成る。 ここで、本考案では部品面側周壁シールド板31の上辺と部品面シールド板1 2との間において、部品面側周壁シールド板31の半田付け等の組配ばらつきが 有っても、導電性弾性材50を介在させて適度に押圧できる所定の隙間、例えば 2mmを設けておく。The present invention will be described below with reference to FIG. Elements corresponding to those of the conventional configuration are denoted by the same reference numerals, and description of overlapping parts will be omitted. The essential components include the printed circuit board 10 having the peripheral wall shield plates 31 and 32, the component surface shield plate 12, the bottom surface shield plate 13, the conductive elastic material 50, and the conductive sheet 56. This is a configuration in which a conductive elastic material 50 and a conductive sheet 56 are added to the conventional configuration. Here, in the present invention, even if there is a variation in the arrangement such as soldering of the component-side peripheral wall shield plate 31 between the upper side of the component-side peripheral wall shield plate 31 and the component-side shield plate 12, the conductivity is maintained. A predetermined gap, for example, 2 mm, which can be appropriately pressed with the elastic material 50 interposed therebetween, is provided.

【0013】 導電性弾性材50は、導電性を有する弾性材であり、例えばカーボンを含有さ せたゴム系ラバー材、スポンジ材である。この他に、ゴム系ラバー材の上下面間 に多数の針状金属線を貫通状態に埋め込んだラバーシールド材がある。この導電 性弾性材50が部品面側周壁シールド板31の上周辺(図1A参照)に当接する 部品面シールド板12の背面部位の少なくとも周辺に導電性接着剤等で接着して 取り付ける。 これにより、部品面シールド板12と部品面側周壁シールド板31とのシール ド部材間における安定なシールド接触が可能となる利点が得られる。The conductive elastic material 50 is a conductive elastic material, and is, for example, a rubber rubber material or sponge material containing carbon. In addition, there is a rubber shield material in which a large number of needle-like metal wires are buried between upper and lower surfaces of a rubber rubber material in a penetrating state. The conductive elastic material 50 is attached to at least the periphery of the rear surface of the component surface shield plate 12 which is in contact with the upper peripheral portion (see FIG. 1A) of the component surface side peripheral wall shield plate 31 with a conductive adhesive or the like. Thereby, there is obtained an advantage that stable shield contact between the shield members of the component surface shield plate 12 and the component surface side peripheral wall shield plate 31 is possible.

【0014】 導電性シート56は、部品面側周壁シールド板31の上周辺のエッジによって 上記導電性弾性材50であるゴム材が切れたり離散するのを保護する為の導電性 を有するシート材であり、これを上記導電性弾性材50の表面に面接着する。尚 、実用的に保護の必要性がない強度を備える導電性弾性材50を使用する場合は 、当該導電性シート56は削除しても良い。The conductive sheet 56 is a sheet material having conductivity for protecting the rubber material, which is the conductive elastic material 50, from being cut or separated by the upper and peripheral edges of the component surface side peripheral wall shield plate 31. Then, this is surface-bonded to the surface of the conductive elastic material 50. When the conductive elastic material 50 having a strength that does not need to be practically protected is used, the conductive sheet 56 may be omitted.

【0015】[0015]

【考案の効果】[Effect of the invention]

本考案は、上述の説明内容から、下記に記載される効果を奏する。 上述説明したように本考案によれば、部品面にある部品面側周壁シールド板3 1と部品面シールド板12との間に所定の隙間を設け、この隙間に導電性を有す る弾性材を配設する構造を具備することにより、部品面側周壁シールド板31の 半田付けばらつき等が有っても、両者間で安定した電気的な弾性接触がされる結 果、長期間に渡って継続的に安定で良好なるシールド効果が得られる大きな利点 が得られる。 The present invention has the following effects from the above description. As described above, according to the present invention, a predetermined gap is provided between the component side shield plate 31 on the component side and the component side shield plate 12, and a conductive elastic material is provided in the gap. Is provided, even if there is a variation in soldering of the peripheral surface shield plate 31 on the component side, a stable electrical elastic contact is obtained between the two, resulting in a long period of time. A great advantage is obtained in that a stable and good shielding effect can be obtained continuously.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の、要部を拡大した部分側断面図。FIG. 1 is an enlarged partial sectional side view of a main part of the present invention.

【図2】従来の、プリント基板の所定回路部位を対象と
したシールド構造例の外観正面図と側面図。
FIG. 2 is an external front view and a side view of a conventional shield structure example for a predetermined circuit portion of a printed circuit board.

【図3】従来の、シールド構造の要部を拡大した部分側
断面図と、周壁シールド板の斜視構造例。
FIG. 3 is a partial sectional side view in which a main part of a conventional shield structure is enlarged, and a perspective structure example of a peripheral wall shield plate.

【符号の説明】[Explanation of symbols]

10 プリント基板 12 部品面シールド板 13 底面シールド板 22 金属製ボス 24 皿ビス 26 凸部 31 部品面側周壁シールド板 32 底面側周壁シールド板 35 凸端子 50 導電性弾性材 56 導電性シート DESCRIPTION OF SYMBOLS 10 Printed circuit board 12 Component surface shield plate 13 Bottom shield plate 22 Metal boss 24 Countersunk screw 26 Convex part 31 Component surface side peripheral wall shield plate 32 Bottom side peripheral wall shield plate 35 Convex terminal 50 Conductive elastic material 56 Conductive sheet

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成11年8月24日(1999.8.2
4)
[Submission date] August 24, 1999 (1999.8.2
4)

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】実用新案登録請求の範囲[Correction target item name] Claims for utility model registration

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【実用新案登録請求の範囲】[Utility model registration claims]

Claims (3)

【実用新案登録請求の範囲】[Utility model registration claims] 【請求項1】 少なくともシールド対象となる所定回路
部位を対象としてシールドし、当該回路部位の所定周囲
を隔壁するシールドする周壁シールド板と、プリント基
板の部品実装面(部品面)の側を覆ってシールドする平
板状の部品面シールド板と、プリント基板の底面側を覆
ってシールドする平板状の底面シールド板とを備えるプ
リント基板のシールド構造であって、 上記周壁シールド板は当該回路部位の周囲を所定に隔壁
するシールド板であって、部品面側をシールドする部品
面側周壁シールド板と底面側をシールドする底面側周壁
シールド板とで成り、該部品面側周壁シールド板は実装
部品の部品より高い所定の一様な高さで囲う金属製の板
材とし、基板面と周接する辺は基板の回路アースに所定
間隔で半田付け固定し、該底面側周壁シールド板は所定
の一様な高さで囲う金属製の板材とし、基板面と周接す
る辺は基板の回路アースに所定間隔で半田付け固定し、 上記部品面シールド板は該プリント基板の上面部を覆う
平板状のシールド板であり、上記部品面側の周壁シール
ド板の高さに対応した長さで複数個の金属製ボスが当該
部品面シールド板へカシメて取り付けられ、該金属製ボ
スの他端に当接する該プリント基板の基板面位置にはア
ース電極面が形成された止め孔を有し、ネジ止め固定さ
れて基板上面を電気的にアース接続し、 上記底面シールド板は該プリント基板の下面部を覆う平
板状のシールド板であり、当接する該プリント基板の基
板面位置にはアース電極面が形成された止め孔を有し、
これに対向する位置に凸部と止め孔とを形成してネジ止
め固定されて基板下面を電気的にアース接続し、 上記シールド構造を備えるプリント基板のシールド構造
において、 該部品面側周壁シールド板の上周辺と該部品面シールド
板との間に導電性弾性材が弾性接触可能に介在可能な所
定の隙間を設け、 導電性弾性材を備え、該導電性弾性材は導電性を有する
弾性材であり該部品面シールド板の背面に接着され、該
周壁シールド板上周辺と当接する部位に接着して備える
ことを特徴とするプリント基板のシールド構造。
1. A peripheral wall shield plate for shielding at least a predetermined circuit portion to be shielded and for partitioning a predetermined periphery of the circuit portion, and covering a component mounting surface (component surface) of a printed circuit board. A shield structure of a printed circuit board including a flat component surface shield plate for shielding, and a flat bottom shield plate for covering and shielding the bottom side of the printed circuit board, wherein the peripheral wall shield plate surrounds the circuit portion. A shield plate for partitioning in a predetermined manner, comprising a component surface side peripheral wall shield plate for shielding the component surface side and a bottom surface peripheral wall shield plate for shielding the bottom surface side. A metal plate that surrounds the board at a high and uniform height is fixed to the circuit ground of the board by soldering at predetermined intervals on the side that is in contact with the board surface. The shield plate is a metal plate material surrounding the board at a predetermined uniform height, and a side that is in contact with the board surface is soldered and fixed to a circuit ground of the board at a predetermined interval. A plurality of metal bosses having a length corresponding to the height of the peripheral wall shield plate on the component surface side are caulked and attached to the component surface shield plate. The printed circuit board has a stop hole formed with a ground electrode surface at a position on the board surface in contact with the other end, and is screwed and fixed to electrically connect the upper surface of the board to the ground. A shield plate that covers the lower surface of the printed circuit board, and has a stop hole in which a ground electrode surface is formed at a board surface position of the printed board in contact with the shield board.
In a shield structure of a printed circuit board having the shield structure, a convex portion and a stop hole are formed at positions opposed thereto and screw-fixed to electrically ground the lower surface of the substrate. A predetermined gap in which a conductive elastic material can be interposed so as to be elastically contactable between the upper periphery and the component surface shield plate, the conductive elastic material being provided, wherein the conductive elastic material is a conductive elastic material A shield structure for a printed circuit board, which is adhered to a back surface of the component surface shield plate and is adhered to a portion that comes into contact with the periphery on the peripheral wall shield plate.
【請求項2】 導電性シートを備え、該導電性シートは
該導電性弾性材を保護する保護シートであり、該導電性
弾性材の表面に接着されて該部品面側周壁シールド板の
上周辺と電気的に接触することを特徴とする請求項1記
載のプリント基板のシールド構造。
2. A conductive sheet, comprising: a protective sheet for protecting the conductive elastic material, wherein the conductive sheet is adhered to a surface of the conductive elastic material and is provided on an upper peripheral portion of the peripheral wall shield plate on the component side. The shield structure for a printed circuit board according to claim 1, wherein the shield structure electrically contacts the printed circuit board.
【請求項3】 プリント基板の一部分、全部、若しくは
複数箇所に対してシールド適用することを特徴とする請
求項1記載のプリント基板のシールド構造。
3. The shield structure for a printed circuit board according to claim 1, wherein the shield is applied to a part, all, or a plurality of portions of the printed circuit board.
JP1999004950U 1999-07-05 1999-07-05 Printed circuit board shield structure Expired - Lifetime JP3065472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1999004950U JP3065472U (en) 1999-07-05 1999-07-05 Printed circuit board shield structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1999004950U JP3065472U (en) 1999-07-05 1999-07-05 Printed circuit board shield structure

Publications (1)

Publication Number Publication Date
JP3065472U true JP3065472U (en) 2000-02-02

Family

ID=43199079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1999004950U Expired - Lifetime JP3065472U (en) 1999-07-05 1999-07-05 Printed circuit board shield structure

Country Status (1)

Country Link
JP (1) JP3065472U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180031906A (en) * 2016-09-21 2018-03-29 주식회사 영진전기 Method for manufacturing shield for shielding electromagnetic wave

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180031906A (en) * 2016-09-21 2018-03-29 주식회사 영진전기 Method for manufacturing shield for shielding electromagnetic wave

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