JP3056861B2 - Ultrasonic probe and method of manufacturing ultrasonic probe - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe used in an ultrasonic endoscope for medical use and the like.
The present invention relates to a method for manufacturing an ultrasonic probe .

[0002]

2. Description of the Related Art An ultrasonic endoscope / flaw detector scans an ultrasonic beam oscillated from an ultrasonic transducer and re-examines ultrasonic waves reflected by internal walls and lesions of internal organs and structural defects in the material. The information is received by an ultrasonic transducer and processed to obtain information on a defect in an object and an ultrasonic tomographic image. The above-described ultrasonic transducer is generally configured using piezoelectric ceramics, and an electrode formed on the surface is used to apply a high-frequency voltage pulse to the piezoelectric ceramics to rapidly deform the piezoelectric ceramics, thereby generating ultrasonic waves. Generate a pulse. As a general wiring method for the above surface electrode, for example,
As in the invention described in Japanese Patent Application Laid-Open No. 0-42793, a method of directly connecting lead wires with a conductive paste or solder is employed.

[0003]

However, in the connection method according to the prior art, when the size of the transducer is reduced, the ratio of the connection portion to the vibrating portion of the transducer increases, which is not preferable in terms of acoustic characteristics. In addition, since it is necessary to perform wiring work for each transducer one by one, handling of lead wires becomes complicated and workability is inferior.

Accordingly, the present invention has been developed in view of the above-mentioned drawbacks in the prior art, in which connection of an electric terminal and a lead wire in an ultrasonic probe affects acoustic characteristics. It is an object of the present invention to provide an ultrasonic probe which can be easily and reliably performed without any trouble, and a method of manufacturing the ultrasonic probe.

[0005]

The present invention comprises a piezoelectric element, an acoustic matching layer superposed on the surface of the piezoelectric element, and a load member superposed on the other surface of the piezoelectric element. In an ultrasonic probe that generates ultrasonic vibration by applying a voltage to the piezoelectric element, a surface electrode that applies a voltage to the piezoelectric element is formed to extend to a portion other than the acoustic matching layer, and the extension is performed. With gaps and gaps
Electrode terminals arranged in a fluid state in the gaps.
Having a conductive material cured after being clothed.
It is a sign .

Further, the present invention relates to a piezoelectric element and a piezoelectric element.
The acoustic matching layer superimposed on the surface of the piezoelectric element
A load member superposed on one side, and the piezoelectric element
To generate ultrasonic vibration by applying voltage to
A surface which is an acoustic probe and applies a voltage to the piezoelectric element
Forming an electrode extending to a portion other than the acoustic matching layer,
A supersonic electrical connection between the extended portion and the electrode terminal.
A method for manufacturing a wave probe, comprising:
A gap is provided between the surface electrode and the electrode element, and the gap is
After applying the conductive material in a flowing state, the conductive material is hardened.
It is characterized in that

[0007]

Further , the present invention provides a piezoelectric element and the piezoelectric element.
The acoustic matching layer superimposed on the surface of the piezoelectric element
A load member superposed on one side, and the piezoelectric element
To generate ultrasonic vibration by applying voltage to
A surface which is an acoustic probe and applies a voltage to the piezoelectric element
Forming an electrode extending to a portion other than the acoustic matching layer,
The extended portion, wherein the piezoelectric element
Parts other than the part that vibrates when voltage is applied by the surface electrode
Manufactures ultrasonic probes bonded to electrode terminals at
Forming the electrode terminals with a low melting point metal.
Between the electrode terminal and the surface electrode of the piezoelectric element.
A gap is provided between the electrodes to melt the electrode terminals.
It is characterized by connecting a user.

FIGS. 1 to 3 are conceptual views of the present invention and show the manufacturing steps. The ultrasonic transducer 13 which is an ultrasonic transducer is configured by integrally laminating and joining the acoustic matching layer 3, the piezoelectric element 2, and the back load member 4. At this time, the surface electrode 7 of the piezoelectric element 2 is formed so as to extend to the outside of the joint surface with the acoustic matching layer 3 which is the acoustic radiation surface of the ultrasonic transducer. An electrode terminal 1 made of a conductive material is joined to a portion other than the portion of the piezoelectric element 2 which vibrates when a voltage is applied by the surface electrode 7. At the time of assembling in a housing or the like after the lamination process, the lead wire 6 is joined to the electrode terminal 1 by soldering or the like. The lead wire 6 is connected to a high-frequency power supply (not shown) and an observation device.

In the present invention, the surface electrode 7 of the piezoelectric element 2 is
Extends beyond the joint surface with the acoustic matching layer 3 that is the acoustic radiation surface
Is formed, the extended portion, wherein the
A voltage is applied by the surface electrode 7 of the piezoelectric element 2.
Electrode end made of conductive material other than vibrating part
Since the terminals 1 are joined, it is possible to prevent the electric terminals 1 and the lead wires 6 connected to the ultrasonic transducer from affecting the acoustic characteristics.

[0011]

Embodiment 1 FIGS. 4 to 10 show this embodiment, FIGS. 4 to 7 are cross-sectional views showing a manufacturing process, FIG. 8 is a partial cross-sectional view, and FIGS. 9 and 10 are perspective views. Ultrasonic transducer 1
3 is formed by integrally laminating and joining the acoustic matching layer 3, the piezoelectric element 2, the back load member 4, and the electrode terminal 1 made of a conductive material. Here, the electrode terminal 1 is made of a low melting point metal material. In this embodiment, a solder alloy was used. The surface electrode 7 of the piezoelectric element 2 is formed so as to extend around the side surface of the piezoelectric element 2. As a material, a solderable material such as an Ag paste was used. In addition, there is a high-energy light irradiator (not shown) including a CW laser such as a YAG laser or a light beam irradiator, and is installed on the electrode terminal 1 so as to converge the high-energy light.

In the method of manufacturing the ultrasonic transducer 13 having the above-described structure, the electrode terminal 1 is bonded to the adhesive 5 when the acoustic matching layer 3, the piezoelectric element 2, and the back load 4 are joined.
To be integrally laminated. After that, the high-energy light 8 converges on the electrode terminal 1 to melt the electrode terminal 1, and the surface electrode 7
By welding, the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1 are electrically connected. After completion of the above steps, wiring is performed on the electrode terminals 1 by using lead wires 6.
If electrical insulation is required, the exposed portions of the conductors such as the electrode terminals 1 and the lead wires 6 are sealed with an insulating sealing material (not shown) such as epoxy resin or silicone resin. You may. Also, the welding of the electrode terminal 1 and the surface electrode 7 and the welding of the electrode terminal 1 and the lead wire 6 can be performed simultaneously by irradiating the same high-energy light 8.

Further, in this embodiment, as shown in FIG. 8, the surface of the electrode terminal 1 is masked with a water-soluble resin 14 before the joining, except for the joining surface, and then joined and washed with water. Alternatively, the surface of the electrode terminal may be exposed, and a lead wire may be wired in this portion. In this case, since the terminal surface is protected during the joining process, parts management and handling / application of an adhesive during the process are facilitated. At the same time, after washing with water, wiring can be performed on a surface that is not contaminated with adhesive etc.
The reliability of the electrical connection is increased. Further, as shown in FIGS. 9 and 10, it is possible to use a metal plate as the electrode terminal and to form a lead wire insertion groove 21 in the terminal.
In this case, the production becomes easier because the positioning of the lead wire becomes easier, the resin wire can be easily sealed because there is less protrusion of the lead wire, and the connection between the terminal and the lead wire becomes stronger, thereby improving the reliability. Has the advantage of increasing.

According to this embodiment, since the extension electrodes are formed on the side surfaces of the piezoelectric element, the electrode terminals and the lead wires do not protrude in the oscillation direction of the transducer, so that the acoustic characteristics of the transducer are not adversely affected. Further, the electrical connection between the surface electrode 7 of the piezoelectric element 2 and the lead wire 6 can be made easily and reliably.

[0015]

[Embodiment 2] FIGS. 11 to 15 are cross-sectional views of a manufacturing process showing this embodiment. The basic configuration of this embodiment is the same as that of the first embodiment. The same components are denoted by the same reference numerals, and only the differences will be described. In this embodiment, the electrode terminal 1 is made of a metal material such as a copper alloy having high wettability with solder. In this embodiment, the cream solder 11 and a discharge device (not shown) for the cream solder 11 are used in addition to the above.

In the method of manufacturing the ultrasonic transducer 13 having the above-described structure, the acoustic matching layer 3, the back load member 4, the piezoelectric element and the gap 16 are provided between the electrode terminal 1 and the surface electrode 7 of the piezoelectric element 2. 2 are joined by an adhesive 5. After curing, the cream solder 11 is discharged from a discharge device (not shown) into the gap between the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1, and the high-energy light 8 is focused on the cream solder 11 to melt the solder. In addition, the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1 are electrically connected by welding with the surface electrode 7. Further, similarly to the first embodiment, the welding of the electrode terminal 1 and the surface electrode 7 and the wiring of the electrode terminal 1 and the lead wire 6 can be simultaneously performed by the same cream solder 11 and high-energy light 8 irradiation. is there.

According to this embodiment, in addition to the effects of the first embodiment, the flux in the cream solder can be used.
More reliable electrical connection can be made.

[0018]

Embodiment 3 FIGS. 16 to 19 are cross-sectional views showing a manufacturing process according to this embodiment. The basic configuration of this embodiment is the same as that of the second embodiment. The same components are denoted by the same reference numerals, and only the differences will be described. In this embodiment, a drying oven or a thermostat (not shown) is used instead of the high energy light irradiation device. In this embodiment, the conductive resin 10 and a discharge device (not shown) for the conductive resin 10 are used in addition to the above.

The method of manufacturing the ultrasonic transducer 13 having the above-described structure is the same as that of the acoustic matching layer 3, the back-side load material 4, the piezoelectric element 3 with the gap 16 provided between the electrode terminal 1 and the surface electrode 7 of the piezoelectric element 2. The element 2 is joined with the adhesive 5.
After the curing, the conductive resin 10 is discharged from a discharge device (not shown) between the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1, and the conductive resin 10 is cured in a drying furnace or a constant temperature bath. By electrically connecting to the surface electrode 7, the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1 are electrically connected. Further, similarly to the first embodiment, the joining of the electrode terminal 1 and the surface electrode 7 and the wiring of the electrode terminal 1 and the lead wire 6 can be simultaneously performed by the same conductive resin 10.

According to this embodiment, in addition to the effects of the first embodiment, since the connection can be made at a lower temperature, the gap 15 can be made smaller, and the area of the piezoelectric element can be used more effectively.

[0021]

Embodiment 4 FIGS. 20 to 24 show this embodiment.
23 to 23 are cross-sectional views showing a manufacturing process, and FIG. 24 is a cross-sectional view showing a modification. The basic configuration of this embodiment is the same as that of the second embodiment. The same components are denoted by the same reference numerals, and only the differences will be described. In this embodiment, a metal foil or a thin metal wire 12 is used as an electrode terminal.

In the method of manufacturing the ultrasonic transducer 13 having the above configuration, a metal foil or a thin metal wire 12 is soldered to the surface electrode 7 of the piezoelectric element 2 using the cream solder 11 with the high energy light 8. Then the acoustic matching layer 3
Each member of the back load member 4 and the piezoelectric element 2 are joined by the adhesive 5.

Using a CW laser such as a YAG laser,
For example, when a copper thin wire of about φ75 μm is used, 10 W
The laser beam converged to a spot diameter of about 3 mm at a class output was scanned at a feed rate of about 15 mm / s, whereby the fine wire 12 and the surface electrode 7 were joined.

In the present embodiment, as shown in FIG. 24, the thin wire 12 is masked with a water-soluble resin 14 prior to joining, except for the joint, and then the thin wire 12 is exposed by joining and washing with water. A lead wire may be wired at the portion. In this case, since the thin wires 12 are protected during the joining process, parts management, handling, application of an adhesive, and the like during the process are facilitated. At the same time, wiring can be performed on a portion not contaminated with an adhesive or the like after washing with water, so that the reliability of electrical connection is increased.

According to the present embodiment, in addition to the effects of the first embodiment, the number of parts to be handled at the time of joining is reduced, which is more suitable for mass production.

[0026]

Fifth Embodiment FIGS. 25 to 28 are cross-sectional views showing a manufacturing process according to this embodiment. The basic configuration of this embodiment is the same as that of the fourth embodiment. The same components are denoted by the same reference numerals, and only the differences will be described. In this embodiment, no cream solder is used. The high energy light source uses a pulse YAG laser.

In the method of manufacturing the ultrasonic transducer 13, a metal foil or a thin metal wire 12 is spot-welded to the surface electrode 7 of the piezoelectric element 2 by using pulsed high-energy light 8. After that, the members of the acoustic matching layer 3 and the back load member 4 and the piezoelectric element 2 are joined with the adhesive 5.

According to this embodiment, in addition to the effects of the fourth embodiment, the handling of cream solder is not required.
More suitable for mass production.

[0029]

[Embodiment 6] FIGS. 29 to 34 are cross-sectional views of a manufacturing process showing this embodiment. The basic configuration of this embodiment is the same as that of the third embodiment. The same components are denoted by the same reference numerals, and only the differences will be described. A sealing resin 17 and a dispenser (not shown) for the sealing resin are used.

In the method for manufacturing the acoustic transducer 13 having the above-described structure, the electrode terminal 1 and the piezoelectric element 2 are temporarily joined with a water-soluble resin 14, and then the acoustic matching layer 3, the back load member 4, and the piezoelectric element 2 are joined. Joining is performed with the adhesive 5. Surplus adhesive 18 not used for bonding among the used adhesives 5
Covers the upper surface of the water-soluble resin 14 and a part of the upper surface of the electrode terminal 1. After the adhesive 5 is cured, a part of the water-soluble resin 14 and the electrode terminal 7 is removed by a grinder or the like around the joint between the water-soluble resin 14 and the electrode terminal 7 to form a groove 19. After processing the groove 19, the surface electrode 7 of the piezoelectric element 2 and a part of the surface of the electrode terminal 1 and the processed surface are exposed by washing. After the cleaning, the conductive resin 10 is discharged from a discharge device (not shown) to a protective resin removing portion 20 formed between the surface electrode 7 of the piezoelectric element 2 and the electrode terminal 1, and the conductive resin is discharged in a drying furnace or a thermostat. 10 is cured and electrically connected to the electrode terminal 1 and the surface electrode 7, thereby forming the surface electrode 7 of the piezoelectric element 2.
And the electrode terminal 1 are electrically connected. When the lead wire 6 is wired to the electrode terminal 1 and then sealed, a portion of the surplus adhesive 18 not removed by the groove processing becomes a part of the sealing resin 17.

According to this embodiment, it is not necessary to strictly control the amount of the adhesive at the time of joining, and the production becomes easy.

[0032]

As described above , according to the present invention,
Even if the air terminal and lead wire are connected, it will affect the acoustic characteristics.
An ultrasonic probe that cannot be obtained can be provided.
Further, according to the present invention, the connection between the electric terminal and the lead wire is established.
It can be done reliably and easily without affecting the acoustic characteristics
Can provide a method of manufacturing an ultrasonic probe that can
You.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of the present invention.

FIG. 2 is a conceptual diagram of the present invention.

FIG. 3 is a conceptual diagram of the present invention.

FIG. 4 is a sectional view showing the first embodiment.

FIG. 5 is a sectional view showing the first embodiment.

FIG. 6 is a sectional view showing the first embodiment.

FIG. 7 is a sectional view showing the first embodiment.

FIG. 8 is a partial sectional view showing the first embodiment.

FIG. 9 is a perspective view showing the first embodiment.

FIG. 10 is a perspective view showing the first embodiment.

FIG. 11 is a sectional view showing Example 2.

FIG. 12 is a sectional view showing Example 2.

FIG. 13 is a sectional view showing a second embodiment.

FIG. 14 is a sectional view showing a second embodiment.

FIG. 15 is a sectional view showing Example 2.

FIG. 16 is a sectional view showing a third embodiment.

FIG. 17 is a sectional view showing a third embodiment.

FIG. 18 is a sectional view showing a third embodiment.

FIG. 19 is a sectional view showing a third embodiment.

FIG. 20 is a sectional view showing a fourth embodiment.

FIG. 21 is a sectional view showing Example 4.

FIG. 22 is a sectional view showing Example 4.

FIG. 23 is a sectional view showing Example 2.

FIG. 24 is a sectional view showing Example 4.

FIG. 25 is a sectional view showing a fifth embodiment.

FIG. 26 is a sectional view showing a fifth embodiment.

FIG. 27 is a sectional view showing Example 5;

FIG. 28 is a sectional view showing a fifth embodiment;

FIG. 29 is a sectional view showing Example 6.

FIG. 30 is a sectional view showing Example 6.

FIG. 31 is a sectional view showing Example 6.

FIG. 32 is a sectional view showing Example 6.

FIG. 33 is a sectional view showing Example 6.

FIG. 34 is a sectional view showing Example 6.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrode terminal 2 Piezoelectric element 3 Acoustic matching layer 4 Back load material 5 Adhesive 6 Lead wire 7 Surface electrode 13 Ultrasonic transducer

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H04R 17/00 330 A61B 8/00 G01N 29/24

Claims (3)

(57) [Claims] 1. A piezoelectric element comprising: a piezoelectric element; an acoustic matching layer superposed on the surface of the piezoelectric element; and a load member superposed on the other surface of the piezoelectric element. in the ultrasonic probe to generate ultrasonic vibrations, the surface electrode for applying a voltage to the piezoelectric element and formed to extend to a portion other than the acoustic matching layer, and the extended portion
An electrode terminal arranged with a gap, and a flow to the gap portion;
Causing ultrasonic probe characterized in that it comprises electrical and conductive material which is cured after being applied in dynamic state, the. 2. A piezoelectric element, and a surface of the piezoelectric element is polymerized.
Acoustic matching layer and the other side of the piezoelectric element
And a voltage applied to the piezoelectric element.
An ultrasonic probe that generates ultrasonic vibrations
The surface electrode for applying a voltage to the piezoelectric element
Extending to a portion other than the matching layer;
Manufactures an ultrasonic probe that electrically connects the electrode and the electrode terminal
Manufacturing method, wherein a gap is provided between a surface electrode of the piezoelectric element and the electrode element, and the conductive material is cured after applying a conductive material in a flowing state to the gap. Manufacturing method of ultrasonic probe. 3. A piezoelectric element, and a surface of the piezoelectric element is polymerized.
Acoustic matching layer and the other side of the piezoelectric element
And a voltage applied to the piezoelectric element.
An ultrasonic probe that generates ultrasonic vibrations
The surface electrode for applying a voltage to the piezoelectric element
Extending to a portion other than the matching layer;
And the power is applied by the surface electrode of the piezoelectric element.
Electrode ends at portions other than the portion that vibrates when pressure is applied
Manufacturing method for manufacturing an ultrasonic probe bonded to a probe.
The electrode terminals are formed of a low melting point metal and
Providing a gap between the pole terminal and the surface electrode of the piezoelectric element,
Connecting the two by melting the electrode terminals
A method for manufacturing an ultrasonic probe, comprising: