JP3055727U - Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance - Google Patents

Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance

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Publication number
JP3055727U
JP3055727U JP1998005602U JP560298U JP3055727U JP 3055727 U JP3055727 U JP 3055727U JP 1998005602 U JP1998005602 U JP 1998005602U JP 560298 U JP560298 U JP 560298U JP 3055727 U JP3055727 U JP 3055727U
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Japan
Prior art keywords
temperature sensor
discharge pipe
thermistor element
improved water
thermal shock
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Expired - Lifetime
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JP1998005602U
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Japanese (ja)
Inventor
卓 北川
嘉之 角谷
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Shibaura Electronics Co Ltd
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Shibaura Electronics Co Ltd
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Abstract

(57)【要約】 【課題】 耐水性及び耐熱衝撃性を改善したエアコン吐
出管用サーミスタ温度センサを提供する。 【解決手段】 防水性及び耐熱衝撃性の優れた充填樹脂
と感熱部への熱伝達を配慮した保護ケースを組み合わせ
た構造からなる耐水及び耐熱衝撃を改善したエアコン吐
出管用サーミスタ温度センサとしての構成を有する。
(57) [Problem] To provide a thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and thermal shock resistance. SOLUTION: The configuration as a thermistor temperature sensor for an air-conditioner discharge pipe having improved water resistance and heat shock, which has a structure in which a filling resin having excellent waterproofness and heat shock resistance and a protective case considering heat transfer to a heat sensitive part is combined. Have.

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、エアコン冷媒配管吐出管部等、使用温度範囲が広く、ヒートショッ クが大きく、かつ、防水性を必要とする用途に使用する耐水及び耐熱衝撃を改善 したエアコン吐出管用サーミスタ温度センサに関するものである。 The present invention relates to a thermistor temperature sensor for an air-conditioner discharge pipe that has a wide range of operating temperatures, a large heat shock, and has improved water resistance and heat shock for use requiring waterproofness, such as an air-conditioner refrigerant pipe discharge pipe. Things.

【0002】[0002]

【従来の技術】[Prior art]

図2乃至図4は第1乃至第3の従来例としてのサーミスタ温度センサの模式的 断面構造図を示す。図2の従来例1において、1はガラス封止形サーミスタ素子 、2a,2bはリード線接続部、3はコート樹脂、4は保護ケース、5は充填樹 脂、6はリード線を示す。図3の従来例2において、7はチップ形サーミスタ素 子を示す。図4の従来例3において、8はダイオード型ガラス封止形サーミスタ 素子を示す。 2 to 4 show schematic sectional structural views of first to third conventional thermistor temperature sensors. 2, reference numeral 1 denotes a glass-sealed thermistor element, 2a and 2b denote lead wire connecting portions, 3 denotes a coating resin, 4 denotes a protective case, 5 denotes a filling resin, and 6 denotes a lead wire. In the conventional example 2 of FIG. 3, reference numeral 7 denotes a chip type thermistor element. In Reference Example 3 of FIG. 4, reference numeral 8 denotes a diode-type glass-sealed thermistor element.

【0003】 従来よりエアコン冷媒配管用サーミスタセンサは図2や図3や図4に示す構造 が一般的であり、+110℃を超える温度域や、大きなヒートショックが加わる 環境下で長期間使用することができなかった。Conventionally, a thermistor sensor for an air conditioner refrigerant pipe generally has a structure shown in FIGS. 2, 3, and 4, and is used for a long time in a temperature range exceeding + 110 ° C. or an environment where a large heat shock is applied. Could not.

【0004】 図2乃至図4に示す従来例1乃至3には次のような欠点があった。Conventional examples 1 to 3 shown in FIGS. 2 to 4 have the following disadvantages.

【0005】 (i)充填樹脂5に硬いエポキシ樹脂を使用した場合、充填樹脂5が熱衝撃によ り起こる膨張収縮時の機械的ストレスを緩和できず、保護ケース4から充填樹脂 5が抜ける。(I) When a hard epoxy resin is used as the filling resin 5, the filling resin 5 cannot reduce the mechanical stress at the time of expansion and contraction caused by thermal shock, and the filling resin 5 comes off from the protective case 4.

【0006】 (ii)充填樹脂5に柔らかいエポキシ樹脂を使用した場合、加熱(110℃以上 )により硬度が上昇し、密度が高くなるため、充填樹脂5自体がクラックを起こ す。(Ii) When a soft epoxy resin is used as the filling resin 5, the hardness increases by heating (110 ° C. or higher) and the density increases, so that the filling resin 5 itself cracks.

【0007】 (iii)(i)(ii)を解決するため、加熱による硬度変化が少ないウレタン樹脂 等を充填樹脂5として選択すると、熱伝導率が低いため、熱時定数が極端に遅く なってしまう。(Iii) In order to solve the problems (i) and (ii), when a urethane resin or the like having a small change in hardness due to heating is selected as the filling resin 5, the thermal time constant becomes extremely slow because of low thermal conductivity. I will.

【0008】 (iv)(i)(ii)を解決するため、加熱による硬度変化が少ないウレタン樹脂 等を充填樹脂5として選択すると、熱伝導率が低く、又、サーミスタ素子(1, 7,8)の保護ケース4内での位置がまちまちになるため、熱時定数にばらつき が出てしまう。(Iv) In order to solve the problems (i) and (ii), when a urethane resin or the like having a small change in hardness due to heating is selected as the filling resin 5, the thermal conductivity is low and the thermistor element (1, 7, 8) Since the position in the protective case 4) varies, the thermal time constant varies.

【0009】 (v)(iii)(iv)を解決するため、保護ケース4の径そのものを細くすると、 リード線の被覆が保護ケース4の内壁に触れやすくなる。リード線6の被覆が保 護ケース4の内壁に触れると、その部分の充填樹脂5の回り込みが悪くなり、水 がその充填樹脂5の回り込みの悪い部分を伝わって保護ケース4内部へ侵入する ことがあった。(V) To solve (iii) and (iv), if the diameter of the protective case 4 itself is reduced, the coating of the lead wire can easily touch the inner wall of the protective case 4. When the coating of the lead wire 6 touches the inner wall of the protective case 4, the wraparound of the filling resin 5 at that portion becomes worse, and water penetrates into the inside of the protective case 4 through the poorly wrapping portion of the filling resin 5. was there.

【0010】[0010]

【考案が解決しようとする課題】[Problems to be solved by the invention]

本考案の目的は上述の従来技術の欠点を解消し、構造上熱時定数が短く、かつ ばらつきが抑制され、充填樹脂の回り込みが良好で防水性能が向上し、充填樹脂 の硬度が低くヒートショックが緩和され、保護ケースからの充填樹脂の抜けがな く、サーミスタ素子への負担も極めて低いエアコン冷媒配管吐出管部等の使用温 度範囲の広い耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度セン サを提供することにある。 The object of the present invention is to solve the above-mentioned drawbacks of the conventional technology, to shorten the thermal time constant in structure, to suppress variations, to improve the wraparound of the filling resin, to improve the waterproof performance, to reduce the hardness of the filling resin, and to reduce the heat shock. The temperature of the thermistor for the air-conditioner discharge pipe is improved with improved water resistance and heat-resistant shock with a wide operating temperature range, such as the air-conditioner refrigerant pipe discharge pipe section, where the resin is not released from the protective case and the burden on the thermistor element is extremely low. The purpose is to provide sensors.

【0011】[0011]

【課題を解決するための手段】[Means for Solving the Problems]

本考案は以下の構成を有する。即ち、防水性及び耐熱衝撃性の優れた充填樹脂 10と感熱部への熱伝達を配慮した保護ケース9を組み合わせたことを特徴とす る耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度センサとしての 構成を有する。 The present invention has the following configuration. That is, as a thermistor temperature sensor for an air-conditioner discharge pipe with improved water resistance and thermal shock, characterized by combining a filled resin 10 having excellent waterproofness and thermal shock resistance with a protective case 9 considering heat transfer to the heat-sensitive part. It has the following configuration.

【0012】 [0012]

【考案の実施の形態】[Embodiment of the invention]

以下、本考案の実施の形態を説明する。 Hereinafter, embodiments of the present invention will be described.

【0013】 (i)例えば、ガラス封止形サーミスタ素子1もしくはチップ形サーミスタ素子 7もしくはダイオード型ガラス封止形サーミスタ素子8等のサーミスタ素子をリ ード線接続部2a,2bにおいてリード線6へ半田付け又はウエルド等の方法で 接続する。(I) For example, a thermistor element such as the glass-sealed thermistor element 1, the chip-type thermistor element 7, or the diode-type glass-sealed thermistor element 8 is connected to the lead wire 6 at the lead wire connecting portions 2 a and 2 b. Connect by soldering or welding.

【0014】 (ii)使用する保護ケース9は、例えば、ガラス封止形サーミスタ素子1もしく はチップ形サーミスタ素子7もしくはダイオード型ガラス封止形サーミスタ素子 8等のサーミスタ素子が収まる近傍の内径が細く(サーミスタ素子及びその接続 部が入るだけの空間を確保できる程度)、かつ肉厚が厚く、サーミスタ素子近傍 部の上から入り口部にかけての内径が広く、かつ肉厚が薄いものを使用する。(Ii) The protective case 9 used has, for example, an inner diameter near the thermistor element such as the glass-sealed thermistor element 1 or the chip-type thermistor element 7 or the diode-type glass-sealed thermistor element 8. Use a thin (though enough space for the thermistor element and its connection area can be secured), thick wall, wide inside diameter from near the thermistor element to the entrance, and thin.

【0015】 (iii)(ii)の保護ケース9に,硬度が低く、又、高温にさらされても硬度の増 加が小さい、ウレタン樹脂等の充填樹脂10を充填する。(Iii) The protective case 9 of (ii) is filled with a filling resin 10 such as urethane resin, which has a low hardness and a small increase in hardness even when exposed to a high temperature.

【0016】 (iv)(iii)に(i)でリード線6に接続したサーミスタ素子(1,7,8)を 挿入し、充填樹脂10の硬化を行う。(Iv) The thermistor element (1, 7, 8) connected to the lead wire 6 in (i) is inserted into (iii), and the filling resin 10 is cured.

【0017】 本考案は、以上の構成よりなっている。The present invention has the above configuration.

【0018】[0018]

【実施例】【Example】

(実施例1) 図1は本考案の第1の実施例としての耐水及び耐熱衝撃を改善したエアコン吐 出管用サーミスタ温度センサの模式的断面構造を図に示す。図1において1はガ ラス封止形サーミスタ素子、2a,2bはリード線接続部、6はリード線、9は 保護ケース、10は充填樹脂を示す。以下にその製造方法を説明する。 Embodiment 1 FIG. 1 shows a schematic cross-sectional structure of a thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and thermal shock as a first embodiment of the present invention. In FIG. 1, 1 is a glass-sealed thermistor element, 2a and 2b are lead wire connecting portions, 6 is a lead wire, 9 is a protective case, and 10 is a filling resin. The manufacturing method will be described below.

【0019】 (i)ガラス封止形サーミスタ素子1をリード線接続部2a,2bにおいてリー ド線6へ接続する。(I) The glass-sealed thermistor element 1 is connected to the lead wire 6 at the lead wire connecting portions 2a and 2b.

【0020】 (ii)使用する保護ケース9はガラス封止形サーミスタ素子1が収まる近傍の内 径が細く、かつ肉厚が厚く、ガラス封止形サーミスタ素子1の近傍部の上から入 り口部にかけての内径が広く、かつ肉厚が薄いものを使用する。(Ii) The protective case 9 used has a small inner diameter near the glass-sealed thermistor element 1 and a large thickness near the glass-sealed thermistor element 1, and an entrance from above the vicinity of the glass-sealed thermistor element 1. Use a material with a large inner diameter and a thin wall.

【0021】 (iii)(ii)の保護ケース9に、硬度が低く、又、高温にさらされても硬度の増 加が小さいウレタン樹脂等の充填樹脂10を充填する。(Iii) The protective case 9 of (ii) is filled with a filling resin 10 such as urethane resin having a low hardness and a small increase in hardness even when exposed to a high temperature.

【0022】 (iv)(iii)に(i)でリード線6に接続したガラス封止形サーミスタ素子1を 挿入し、充填樹脂10の硬化を行う。(Iv) The glass-sealed thermistor element 1 connected to the lead wire 6 in (i) is inserted into (iii), and the filling resin 10 is cured.

【0023】 本考案の実施例1は、以上の構成よりなる耐水及び耐熱衝撃を改善したエアコ ン吐出管用サーミスタ温度センサである。The first embodiment of the present invention is a thermistor temperature sensor for an air-con discharge pipe having the above-described structure and improved water resistance and thermal shock resistance.

【0024】 サーミスタ素子として上記の例ではガラス封止形サーミスタ素子1の例を示し たが、図3に示した従来例2と同様のチップ形サーミスタ素子7、図4に示した 従来例3と同様のダイオード型ガラス封止形サーミスタ素子8を用いてもよいこ とはもちろんである。以下(実施例2),(実施例3)について同様に説明する 。In the above example, the glass-sealed thermistor element 1 has been described as an example of the thermistor element, but the chip-type thermistor element 7 similar to the conventional example 2 shown in FIG. 3 and the conventional example 3 shown in FIG. Of course, a similar diode-type glass-sealed thermistor element 8 may be used. Hereinafter, (Example 2) and (Example 3) will be similarly described.

【0025】 (実施例2) (i)チップ形サーミスタ素子7をリード線接続部2a,2bにおいてリード線 6へ接続する。(Example 2) (i) The chip type thermistor element 7 is connected to the lead wire 6 at the lead wire connecting portions 2a and 2b.

【0026】 (ii)使用する保護ケース9はチップ形サーミスタ素子7が収まる近傍の内径が 細く、かつ肉厚が厚く、チップ形サーミスタ素子7の近傍部の上から入り口部に かけての内径が広く、かつ肉厚が薄いものを使用する。(Ii) The protective case 9 used has a small inner diameter near the chip-type thermistor element 7 and a large wall thickness, and has an inner diameter from above the vicinity of the chip-type thermistor element 7 to the entrance. Use a wide and thin one.

【0027】 (iii)(ii)の保護ケース9に、硬度が低く、又、高温にさらされても硬度の増 加が小さいウレタン樹脂等の充填樹脂10を充填する。(Iii) The protective case 9 of (ii) is filled with a filling resin 10 such as urethane resin having a low hardness and a small increase in hardness even when exposed to a high temperature.

【0028】 (iv)(iii)に(i)でリード線6に接続したチップ形サーミスタ素子7を挿入 し、充填樹脂10の硬化を行う。(Iv) The chip type thermistor element 7 connected to the lead wire 6 in (i) is inserted into (iii), and the filling resin 10 is cured.

【0029】 本考案の実施例2は、以上の構成よりなる耐水及び耐熱衝撃を改善したエアコ ン吐出管用サーミスタ温度センサである。The second embodiment of the present invention is a thermistor temperature sensor for an air-con discharge pipe having the above-described structure and having improved water resistance and thermal shock resistance.

【0030】 (実施例3) (i)ダイオード型ガラス封止形サーミスタ素子8をリード線接続部2a,2b においてリード線6へ接続する。Embodiment 3 (i) The diode-type glass-sealed thermistor element 8 is connected to the lead wire 6 at the lead wire connecting portions 2a and 2b.

【0031】 (ii)使用する保護ケース9はダイオード型ガラス封止形サーミスタ素子8が収 まる近傍の内径が細く、かつ肉厚が厚く、ダイオード型ガラス封止形サーミスタ 素子8の近傍部の上から入り口部にかけての内径が広く、かつ肉厚が薄いものを 使用する。(Ii) The protective case 9 used has a small inner diameter near the diode type glass-sealed thermistor element 8 and a large wall thickness near the diode type glass-sealed thermistor element 8. Use a material with a large inner diameter from the entrance to the entrance and a thin wall.

【0032】 (iii)(ii)の保護ケース9に、硬度が低く、又、高温にさらされても硬度の増 加が小さいウレタン樹脂等の充填樹脂10を充填する。(Iii) The protective case 9 of (ii) is filled with a filling resin 10 such as urethane resin having a low hardness and a small increase in hardness even when exposed to a high temperature.

【0033】 (iv)(iii)に(i)でリード線6に接続したダイオード型ガラス封止形サーミ スタ素子8を挿入し、充填樹脂10の硬化を行う。(Iv) The diode-type glass-sealed thermistor element 8 connected to the lead wire 6 in (i) is inserted into (iii), and the filling resin 10 is cured.

【0034】 本考案の実施例3は、以上の構成よりなる耐水及び耐熱衝撃を改善したエアコ ン吐出管用サーミスタ温度センサである。Embodiment 3 of the present invention is a thermistor temperature sensor for an air-con discharge pipe having the above-described structure and improved water resistance and thermal shock resistance.

【0035】[0035]

【考案の効果】 本考案の耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度センサ によれば、保護ケースの内径をサーミスタ素子が収まる近傍を細くすることによ り、熱時定数が速く、かつばらつきが抑えられる。[Effects of the Invention] According to the thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and thermal shock of the present invention, the inner diameter of the protective case is made narrower in the vicinity where the thermistor element is accommodated, so that the thermal time constant is faster and Variation is suppressed.

【0036】 更に本考案の耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度セ ンサによれば、サーミスタ素子近傍部上から入り口部にかけての内径が広いため 、リード線被覆の周りに、充填樹脂が良く回り込み防水性能も向上する。Further, according to the thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and thermal shock of the present invention, since the inner diameter from the vicinity of the thermistor element to the entrance is wide, the resin filled around the lead wire coating. The wraparound waterproof performance is also improved.

【0037】 更に本考案の耐水及び耐熱衝撃を改善したエアコン吐出管用サーミスタ温度セ ンサによれば、充填樹脂の硬度が低いためヒートショックを緩和し、保護ケース からの充填樹脂の抜けがなく、かつサーミスタ素子への負担が極めて小さい。Further, according to the thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and heat shock of the present invention, the heat shock is reduced due to the low hardness of the filling resin, and the filling resin does not come off from the protective case, and The burden on the thermistor element is extremely small.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の第1の実施例としての耐水及び耐熱衝
撃を改善したエアコン吐出管用サーミスタ温度センサの
模式的断面構造図
FIG. 1 is a schematic sectional structural view of a thermistor temperature sensor for an air-conditioner discharge pipe with improved water resistance and thermal shock as a first embodiment of the present invention.

【図2】第1の従来例としてのサーミスタ温度センサの
模式的断面構造図(従来例1)
FIG. 2 is a schematic cross-sectional structure diagram of a thermistor temperature sensor as a first conventional example (conventional example 1).

【図3】第2の従来例としてのサーミスタ温度センサの
模式的断面構造図(従来例2)
FIG. 3 is a schematic cross-sectional structure diagram of a thermistor temperature sensor as a second conventional example (conventional example 2).

【図4】第3の従来例としてのサーミスタ温度センサの
模式的断面構造図(従来例3)
FIG. 4 is a schematic cross-sectional structural view of a thermistor temperature sensor as a third conventional example (conventional example 3).

【符号の説明】[Explanation of symbols]

1 ガラス封止形サーミスタ素子 2a,2b リード線接続部 3 コート樹脂 4,9 保護ケース 5,10 充填樹脂 6 リード線 7 チップ形サーミスタ素子 8 ダイオード型ガラス封止形サーミスタ素子 DESCRIPTION OF SYMBOLS 1 Glass-sealed thermistor element 2a, 2b Lead wire connection part 3 Coated resin 4, 9 Protective case 5, 10 Filled resin 6 Lead wire 7 Chip-type thermistor element 8 Diode-type glass-sealed thermistor element

Claims (1)

【実用新案登録請求の範囲】[Utility model registration claims] 【請求項1】 防水性及び耐熱衝撃性の優れた充填樹脂
と感熱部への熱伝達を配慮した保護ケースを組み合わせ
たことを特徴とする耐水及び耐熱衝撃を改善したエアコ
ン吐出管用サーミスタ温度センサ。
1. A thermistor temperature sensor for an air conditioner discharge pipe with improved water resistance and thermal shock, comprising a combination of a filling resin having excellent waterproofness and thermal shock resistance and a protective case considering heat transfer to a heat sensitive part.
JP1998005602U 1998-07-10 1998-07-10 Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance Expired - Lifetime JP3055727U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1998005602U JP3055727U (en) 1998-07-10 1998-07-10 Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1998005602U JP3055727U (en) 1998-07-10 1998-07-10 Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09104489A (en) * 1995-09-28 1997-04-22 Kraft Inc Food container with cooling pack
KR100848392B1 (en) * 2000-11-07 2008-07-24 베르 테르모트-트로닉 게엠베하 Valve housing
WO2019082618A1 (en) * 2017-10-28 2019-05-02 株式会社立山科学センサーテクノロジー Temperature sensor and manufacturing method for same
JP2019095355A (en) * 2017-11-24 2019-06-20 株式会社デンソー Temperature sensor
WO2019159221A1 (en) 2018-02-13 2019-08-22 株式会社芝浦電子 Temperature sensor, sensor element, and method for manufacturing temperature sensor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09104489A (en) * 1995-09-28 1997-04-22 Kraft Inc Food container with cooling pack
KR100848392B1 (en) * 2000-11-07 2008-07-24 베르 테르모트-트로닉 게엠베하 Valve housing
WO2019082618A1 (en) * 2017-10-28 2019-05-02 株式会社立山科学センサーテクノロジー Temperature sensor and manufacturing method for same
JP2019082342A (en) * 2017-10-28 2019-05-30 株式会社立山科学センサーテクノロジー Temperature sensor and production method thereof
CN111247407A (en) * 2017-10-28 2020-06-05 立山科学传感器科技株式会社 Temperature sensor and method for manufacturing same
JP2019095355A (en) * 2017-11-24 2019-06-20 株式会社デンソー Temperature sensor
JP6992442B2 (en) 2017-11-24 2022-01-13 株式会社デンソー Temperature sensor
WO2019159221A1 (en) 2018-02-13 2019-08-22 株式会社芝浦電子 Temperature sensor, sensor element, and method for manufacturing temperature sensor
US11428584B2 (en) 2018-02-13 2022-08-30 Shibaura Electronics Co., Ltd. Temperature sensor, sensor element and manufacturing method of temperature sensor

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