CN111247407A - Temperature sensor and method for manufacturing same - Google Patents
Temperature sensor and method for manufacturing same Download PDFInfo
- Publication number
- CN111247407A CN111247407A CN201880068847.XA CN201880068847A CN111247407A CN 111247407 A CN111247407 A CN 111247407A CN 201880068847 A CN201880068847 A CN 201880068847A CN 111247407 A CN111247407 A CN 111247407A
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- China
- Prior art keywords
- thermistor element
- sensor
- temperature sensor
- cable
- covering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to a temperature sensor with a thermistor element molded by resin and a manufacturing method thereof, and provides a temperature sensor which improves the airtightness of the thermistor element and improves the stability of performance and yield during manufacturing and a manufacturing method thereof. In a temperature sensor and a method for manufacturing the same, the temperature sensor includes a sensor unit (A) including a thermistor element (1) and a connection terminal (2), a cable unit (B) connected to the connection terminal (2), and a covering unit (C) covering the entire sensor unit (A) and a front end portion of the cable unit (B), the covering unit (C) includes: a sensor case (5) having a hollow portion (5a), wherein the hollow portion (5a) is tapered toward the center of the distal end portion in which the thermistor element (1) is housed; an elastic resin coating layer (6) that covers the entire surface of the thermistor element (1); and a resin filling layer (7) which fills the space between the inner surface of the sensor case (5) and the elastic resin coating layer (6).
Description
Technical Field
The present invention relates to a temperature sensor in which a thermistor element is resin-molded and a method for manufacturing the temperature sensor.
Background
A known temperature sensor is configured such that a sensor portion in which a thermistor element and a connection terminal (a copper wire, a copper beryllium iron nickel alloy wire, or the like) are connected by a lead wire is inserted into a metal case, and an opening of the case is sealed by a resin mold portion formed of a mold resin (see, for example, patent document 1 below).
Such a temperature sensor is extremely important to ensure airtightness in the sensor portion because the temperature sensor causes disconnection, short-circuiting, and the like of the sensor portion due to corrosion of the metal alloy caused by the intrusion of moisture.
Therefore, a structure has been proposed in which a resin insulating cap is inserted into an opening of a metal case, a sensor portion is inserted into the opening of the insulating cap, and the case and the opening of the insulating cap are molded with resin and sealed in this state.
In this example, the same resin is used for the insulating cap and the resin mold, and the interface is welded at the time of molding, thereby blocking the moisture entry path.
In such a temperature sensor, a thermistor element is often used, but the thermistor surface may be covered with an extremely brittle protective film.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2014-77678
Disclosure of Invention
Problems to be solved by the invention
However, if such a temperature sensor is to be downsized, the creepage distance of the welded portion that blocks the water penetration path is shortened, which causes a problem of a decrease in airtightness for the thermistor element.
Further, the molding resin expands in the limited void during curing, which causes damage to the protective film of the thermistor element, and reduces the yield during manufacturing.
Further, such a molded-type temperature sensor has a problem that the sensor is unstable in quality because the sensitivity or characteristics of the sensor vary due to a difference in the molding position of the thermistor element in the case.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a temperature sensor in which the airtightness of a thermistor element is improved and the stability of performance and the yield at the time of manufacturing are improved, and a method for manufacturing the temperature sensor.
Means for solving the problems
The temperature sensor according to the present invention, which is made to solve the above problems, includes: a sensor unit including a thermistor element and a connection terminal; a cable portion connected to the connection terminal; and a covering portion that covers the entire sensor portion and a front end portion of the cable portion, wherein the covering portion includes: a sensor case having a hollow portion that becomes thinner toward the center of a distal end portion that houses the thermistor element; an elastic resin coating layer covering the entire surface of the thermistor element; and a resin filling layer filling the space between the inner surface of the sensor housing and the elastic resin coating layer.
The temperature sensor may be provided with a primer layer covering the front end portion of the cable portion.
Further, the elastic resin coating layer may be provided continuously over the entire thermistor element and in a region from the entire thermistor element to the tip of the cable portion.
The primer is generally used as an adhesion promoter or a primer, and has an effect of improving adhesion between members.
In order to solve the above problem, a method for manufacturing a temperature sensor according to the present invention includes: a sensor unit including a thermistor element and a connection terminal; a cable portion connected to the connection terminal; and a covering portion that covers the entire sensor portion and a tip end portion of the cable portion, the method for manufacturing the temperature sensor including: a connection step of connecting a lead wire of the cable portion to a connection terminal of the sensor portion; a coating step of attaching an elastic resin coating layer to the entire surface of the thermistor element of the sensor section; a base forming step of attaching a primer layer to the tip end portion of the cable portion; a loading step of inserting the thermistor element having undergone the above-described steps into a front end of a hollow portion of a sensor case having the hollow portion, the hollow portion becoming thinner toward a center of a front end portion in which the thermistor element is housed; a filling step of filling the space between the inner surface of the sensor case and the elastic resin coating layer with a filling resin layer; and a curing step of curing the filled resin layer.
Effects of the invention
According to the temperature sensor and the method of manufacturing the same of the present invention, the hollow portion of the sensor case is formed in a shape having a hollow portion that becomes thinner toward the center of the distal end portion in which the thermistor element is housed, and thus when the thermistor element comes into contact with the distal end of the inner surface of the case, the position of the thermistor element can be determined more easily and accurately because the position of the thermistor element is automatically positioned toward the center of the distal end portion of the sensor case.
Further, since the hollow portion is tapered at the tip, the amount of the filling resin existing in the vicinity of the thermistor element is reduced, and the stress applied to the thermistor element can be relaxed in addition to the case where the pressure caused by the expansion of the filling resin is directed to the opening of the sensor case.
Further, by providing the elastic resin coating layer covering the entire surface of the thermistor element, it is possible to avoid a problem that the protective film provided on the surface of the thermistor element is damaged by pressure generated when the filling resin is cured, by utilizing the cushioning effect thereof.
Further, by adopting a configuration in which the elastic resin coating layer is continuously provided in a region up to the distal end portion of the cable portion, it is also possible to prevent a short circuit due to deformation of the connection terminal when the sensor portion is loaded into the covering portion.
On the other hand, if a material having high thermal conductivity, such as PPS containing a reinforcing material such as glass fiber or an inorganic filler, is used as the material of the sensor case, the thermal responsiveness of the thermistor element filled in the hollow portion can be improved in addition to the reduction in the thickness of the filler resin present in the vicinity of the thermistor element.
Further, by passing through the base forming step of attaching the primer layer to the tip end portion of the cable portion, the adhesion between the coating of the cable and the filler resin is improved, and the entry of air, moisture, or oil along the surface of the cable is avoided, whereby good temperature detection can be performed over a long period of time.
Drawings
Fig. 1 is a cross-sectional view showing an example of a temperature sensor according to the present invention.
Fig. 2(a), (B), and (C) are exploded views showing an example of components of the temperature sensor of the present invention.
Fig. 3 is an explanatory view showing one step of the method for manufacturing a temperature sensor according to the present invention.
Fig. 4 is an explanatory view showing one step of the method for manufacturing a temperature sensor according to the present invention.
Fig. 5 is an explanatory view showing one step of the method for manufacturing a temperature sensor according to the present invention.
Fig. 6 is a cross-sectional view showing examples (a) and (B) of the sensor case of the temperature sensor of the present invention in comparison with an example (C) of a conventional temperature sensor.
Detailed Description
Hereinafter, an embodiment of the temperature sensor according to the present invention and a method for manufacturing the same will be described in detail with reference to the drawings.
The temperature sensor of the present invention includes: a sensor unit A including a thermistor element 1 and a connection terminal 2; a cable unit B including a lead wire 3 connected to the connection terminal 2 and a sheath 4 for insulating and protecting each copper wire; and a covering part C for covering the whole sensor part A and the front end part of the cable part B.
The sensor unit a includes a glass-sealed thermistor element 1 whose surface is covered with a glass protective film 1a, and a pair of connection terminals 2 and 2 for passing current between the thermistor element 1 and a temperature control circuit.
The cable portion B includes a pair of conductive wires 3 and a sheath 4 made of fluororubber or the like covering the side surfaces thereof, and the pair of conductive wires 3 and 3 are soldered to the pair of connection terminals 2 and 2, respectively.
The coating portion C includes: a sensor case 5 having a hollow portion 5a, the hollow portion 5a being tapered toward the center of the distal end portion in which the thermistor element 1 is housed; an elastic resin coating layer 6 covering the entire surface of the thermistor element 1; and a resin filling layer 7 filling the space between the inner surface of the sensor case 5 and the elastic resin coating layer 6.
The sensor case 5 is a protective case made of insulating synthetic resin or the like having relatively high thermal conductivity, and in this example, PPS (polyphenylene sulfide) is used.
The sensor case 5 of this example has a rectangular parallelepiped shape which is easy to install, and has a hollow portion 5a whose tip is tapered at its center.
The hollow portion 5a includes a planar, spherical, or pyramid-shaped support surface 5B capable of holding the thermistor element 1 at a substantially fixed position at the distal end portion of the sensor case 5, and a guide surface 5c that gradually spreads continuously or intermittently from the support surface 5B (see, for example, fig. 6(a) or (B)).
Due to the relationship between the outer shape of the sensor case 5 and the shape of the hollow portion 5a, the left and right thickness of the front end portion of the sensor case 5 is increased, and the thickness of the front end portion in the front-rear direction is decreased.
In this way, although the situation where the sensitivity of the thermistor element 1 varies depending on the direction cannot be denied in the environment where the thermistor element 1 is wound, since PPS, which is the material of the sensor case 5, is an insulating material having relatively high thermal conductivity, the variation in the sensitivity of the thermistor element 1 due to the directivity can be alleviated.
When higher responsiveness is required, glass fibers, inorganic fillers, or the like may be contained to increase the thermal conductivity, or the thickness of the front end portion of the sensor case 5 may be reduced to a direction in which temperature detection is to be performed.
The elastic resin coating layer 6 of this example is formed on the entire surface of the thermistor element 1 and the tip end of the cable portion B using a resin material having low hardness, such as silicone resin.
The filling resin layer 7 in this example is formed of an epoxy resin so as to fill the gap between the primer layer 8 and the inner surface of the sensor case 5.
< production method >
The temperature sensor is manufactured by a manufacturing method in which the respective components of the temperature sensor are assembled in a molding space while suppressing the arrangement variation of the thermistor element 1, through the following steps: a connection step (see fig. 2) of welding the lead wires 3, 3 of the cable portion B to the connection terminals 2, 2 of the sensor portion a by a method using laser, ultrasonic, soldering, or the like; a coating step (see fig. 3) of impregnating and curing the thermistor element 1 of the sensor portion a in silicone resin to adhere an elastic resin coating layer 6 to the entire surface of the thermistor element 1; a base forming step (see fig. 4) of impregnating and drying the thermistor element 1 from the tip to the tip of the cable portion B with a primer to adhere a primer layer 8 to the entire surface of the thermistor element 1 and the tip of the cable portion B; a loading step (see fig. 5) of inserting the thermistor element 1 subjected to the above-described steps into the support surface 5b at the front end of the hollow portion 5a of the sensor case 5; a filling step of filling a space between the inner surface of the sensor case 5 and the primer layer 8 with a filling resin made of an epoxy resin; and a curing step (see fig. 1) of heating and curing the filling resin (forming a filling resin layer 7) while maintaining the position of the thermistor element 1 in the sensor case 5 that has undergone the filling step.
According to this manufacturing method, the elasticity of the elastic resin coating layer 6 is supplemented with the gradual expansion of the hollow portion 5a of the sensor housing 5 through the coating step, and thus the glass protective film 1a can be prevented from being damaged by the expansion of the filling resin during the curing step or when subjected to a high-temperature load during use.
Further, by the step of forming a base layer by adhering the primer layer 8 to the entire surface of the thermistor element 1 and the tip end portion of the cable portion B before the filling step, the affinity between the filling resin 7 and the sheath 4 of the cable portion B is improved in the curing step, and the airtightness around the sensor portion a is not necessarily higher than that of the conventional water blocking structure using the filling step without passing through the base forming step.
Description of the reference symbols
A sensor part, a B cable part, a C coating part,
1 thermistor element, 1a protective film,
2 a connection terminal,
3 conducting wires, 4 protective sleeves,
5 sensor case, 5a hollow portion, 5b support surface, 5c guide surface,
6 an elastic resin coating layer,
7 a filling resin layer and 8 a primer layer.
Claims (4)
1. A temperature sensor is provided with: a sensor unit including a thermistor element and a connection terminal; a cable portion connected to the connection terminal; and a covering part covering the entire sensor part and the front end part of the cable part,
the coating portion includes:
a sensor case having a hollow portion that becomes thinner toward the center of a distal end portion that houses the thermistor element;
an elastic resin coating layer covering the entire surface of the thermistor element; and
and the filling resin layer is filled between the inner surface of the sensor shell and the elastic resin coating layer.
2. The temperature sensor according to claim 1,
the temperature sensor is provided with a primer layer covering the front end portion of the cable portion.
3. The temperature sensor according to claim 1 or 2,
the elastic resin coating layer is continuously provided over the entire thermistor element and over a region from the entire thermistor element to the tip end of the cable portion.
4. A method for manufacturing a temperature sensor, the temperature sensor comprising: a sensor unit including a thermistor element and a connection terminal; a cable portion connected to the connection terminal; and a covering portion that covers the entire sensor portion and a distal end portion of the cable portion, wherein the method for manufacturing the temperature sensor includes:
a connection step of connecting a lead wire of the cable portion to a connection terminal of the sensor portion;
a coating step of attaching an elastic resin coating layer to the entire surface of the thermistor element of the sensor unit;
a base forming step of attaching a primer layer to the front end portion of the cable portion;
a loading step of inserting the thermistor element having undergone the above-described steps into a front end of a hollow portion of a sensor case having the hollow portion, the hollow portion being tapered toward a center of a front end portion in which the thermistor element is housed;
a filling step of filling a space between the inner surface of the sensor case and the elastic resin coating layer with a filling resin layer; and
and a curing step of curing the filled resin layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017208683A JP6944341B2 (en) | 2017-10-28 | 2017-10-28 | Temperature sensor and its manufacturing method |
| JP2017-208683 | 2017-10-28 | ||
| PCT/JP2018/037152 WO2019082618A1 (en) | 2017-10-28 | 2018-10-04 | Temperature sensor and manufacturing method for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111247407A true CN111247407A (en) | 2020-06-05 |
Family
ID=66247318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880068847.XA Pending CN111247407A (en) | 2017-10-28 | 2018-10-04 | Temperature sensor and method for manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6944341B2 (en) |
| CN (1) | CN111247407A (en) |
| WO (1) | WO2019082618A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117501077A (en) * | 2022-01-18 | 2024-02-02 | 株式会社芝浦电子 | Temperature sensor and method for manufacturing temperature sensor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102351955B1 (en) * | 2020-02-24 | 2022-01-17 | 주식회사 한성시스코 | A valve with a built-in temperature sensor and an automatic flow control hot water heating system using it |
| CN115307766A (en) | 2021-05-08 | 2022-11-08 | 热敏碟公司 | Temperature sensor probe |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333633A (en) * | 1986-07-28 | 1988-02-13 | Sanyo Electric Co Ltd | Manufacture of temperature detector |
| JPH01191026A (en) * | 1988-01-27 | 1989-08-01 | Mitsui Mining & Smelting Co Ltd | Cold and heat resisting shock structure for thermistor used in molten metal or the like |
| JPH0894452A (en) * | 1994-09-21 | 1996-04-12 | Mitsubishi Materials Corp | Resin molded thermistor sensor |
| JP3055727U (en) * | 1998-07-10 | 1999-01-29 | 株式会社芝浦電子 | Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance |
| KR101162301B1 (en) * | 2011-09-06 | 2012-07-04 | 주식회사 디케이쎈서 | Temperature sensor having silicone housing and process of the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575631U (en) * | 1992-03-17 | 1993-10-15 | ティーディーケイ株式会社 | Temperature sensor |
| JP3378930B2 (en) * | 1994-01-31 | 2003-02-17 | 株式会社大泉製作所 | Hot water sensor |
-
2017
- 2017-10-28 JP JP2017208683A patent/JP6944341B2/en active Active
-
2018
- 2018-10-04 WO PCT/JP2018/037152 patent/WO2019082618A1/en active Application Filing
- 2018-10-04 CN CN201880068847.XA patent/CN111247407A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333633A (en) * | 1986-07-28 | 1988-02-13 | Sanyo Electric Co Ltd | Manufacture of temperature detector |
| JPH01191026A (en) * | 1988-01-27 | 1989-08-01 | Mitsui Mining & Smelting Co Ltd | Cold and heat resisting shock structure for thermistor used in molten metal or the like |
| JPH0894452A (en) * | 1994-09-21 | 1996-04-12 | Mitsubishi Materials Corp | Resin molded thermistor sensor |
| JP3055727U (en) * | 1998-07-10 | 1999-01-29 | 株式会社芝浦電子 | Thermistor temperature sensor for air conditioner discharge pipe with improved water resistance and thermal shock resistance |
| KR101162301B1 (en) * | 2011-09-06 | 2012-07-04 | 주식회사 디케이쎈서 | Temperature sensor having silicone housing and process of the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117501077A (en) * | 2022-01-18 | 2024-02-02 | 株式会社芝浦电子 | Temperature sensor and method for manufacturing temperature sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019082342A (en) | 2019-05-30 |
| WO2019082618A1 (en) | 2019-05-02 |
| JP6944341B2 (en) | 2021-10-06 |
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