JPH0575631U - Temperature sensor - Google Patents
Temperature sensorInfo
- Publication number
- JPH0575631U JPH0575631U JP1410792U JP1410792U JPH0575631U JP H0575631 U JPH0575631 U JP H0575631U JP 1410792 U JP1410792 U JP 1410792U JP 1410792 U JP1410792 U JP 1410792U JP H0575631 U JPH0575631 U JP H0575631U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- thermistor
- resin
- lead wire
- results
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
(57)【要約】
【目的】 本考案は、高い信頼性を有し、耐水性にも優
れた温度センサ1を提供する。
【構成】 本考案は、発熱源の温度検出用のサーミスタ
3と、このサーミスタ3に先端部の導体部4aを接続し
たリード線4とを具備する温度センサ1において、少な
くとも前記サーミスタ3及びリード線4の導体部4aの
回りを覆うウレタン樹脂5と、このウレタン樹脂5を覆
うエポキシ樹脂6とを有する。この構成により、温度変
化時サーミスタ3に作用する応力を緩和でき信頼性が高
まるとともに、耐水性も良好となる。
(57) [Summary] [Object] The present invention provides a temperature sensor 1 having high reliability and excellent water resistance. According to the present invention, at least the thermistor 3 and the lead wire are provided in a temperature sensor 1 including a thermistor 3 for detecting a temperature of a heat source and a lead wire 4 in which a conductor portion 4a at a tip end is connected to the thermistor 3. 4 has a urethane resin 5 that covers the conductor portion 4a and an epoxy resin 6 that covers the urethane resin 5. With this configuration, the stress acting on the thermistor 3 at the time of temperature change can be relaxed, the reliability is enhanced, and the water resistance is also improved.
Description
【0001】[0001]
本考案は、エアーコンデイショナーや自動販売機等の各種温度検出に用いる温 度センサの改良に関する。 The present invention relates to improvement of a temperature sensor used for detecting various temperatures of an air conditioner, a vending machine, and the like.
【0002】[0002]
この種の温度センサの従来例を図8に示す。 A conventional example of this type of temperature sensor is shown in FIG.
【0003】 同図に示す温度センサ20は、有底のケース21と、このケース21内に配置 したサーミスタ23と、リード線端部をサーミスタ23に接続しケース21の外 方に導出したリード線24と、前記サーミスタ23及びリード線24の端部の囲 りに塗布したフェノール系の下塗樹脂25と、この下塗樹脂25の囲りに塗布し たエポキシ系の上塗樹脂26と、前記ケース21内の上塗樹脂26の囲りに充填 した硬いエポキシ系の充填樹脂27とを具備している。The temperature sensor 20 shown in FIG. 1 includes a case 21 having a bottom, a thermistor 23 arranged in the case 21, and a lead wire connected to the thermistor 23 at the end of the lead wire and led out to the outside of the case 21. 24, a phenolic undercoat resin 25 applied around the ends of the thermistor 23 and the lead wire 24, an epoxy overcoat resin 26 applied around the undercoat resin 25, and the inside of the case 21. And a hard epoxy-based filling resin 27 filled in a space around the overcoat resin 26.
【0004】 図8に示す温度センサのデフロスタ通電試験及び温水煮沸通電試験の結果を図 9及び図10に示す。The results of the defroster energization test and the hot water boiling energization test of the temperature sensor shown in FIG. 8 are shown in FIGS. 9 and 10.
【0005】 尚、デフロスタ通電試験は、温度センサ20に0.5mAの電流を流し−40 ℃と+60℃との水中に多数のサンプルを各4時間浸積するサイクルを多数回繰 り返した場合の良品の残存率を求めるものである。In the defroster energization test, when a current of 0.5 mA is applied to the temperature sensor 20 and a large number of samples are immersed in water of −40 ° C. and + 60 ° C. for 4 hours each, the cycle is repeated many times. The remaining rate of non-defective products is calculated.
【0006】 また、温水煮沸通電試験は、多数のサンプルを90℃の温水中に浸積し、温度 センサ20に0.5mAの電流を流した場合の良品の残存率と時間との関係を示 すものである。The hot water boiling current test shows the relationship between the remaining rate of non-defective products and time when a large number of samples are immersed in 90 ° C. hot water and a current of 0.5 mA is applied to the temperature sensor 20. It is something.
【0007】 図9,図10に示すように、前記温度センサ20は、温水煮沸通電試験の結果 は良好であるもののデフロスタ通電試験の結果が良くなく、100サイクルで7 0%程度、200サイクルで40%程度となってしまう。As shown in FIGS. 9 and 10, the temperature sensor 20 has a good result in the hot water boiling energization test, but a poor result in the defroster energization test. It will be about 40%.
【0008】 図11は、従来の他の温度センサ30を示すものである。FIG. 11 shows another conventional temperature sensor 30.
【0009】 この温度センサ30は、前記温度センサ20と略同様な構成であるが、下塗樹 脂25aとしてシリコン系の樹脂を、上塗樹脂26aとしてエポキシ系の樹脂を 、充填樹脂27として柔らかいエポキシ樹脂を用いたものである。The temperature sensor 30 has substantially the same structure as the temperature sensor 20, except that a silicon resin is used as the undercoat resin 25a, an epoxy resin is used as the topcoat resin 26a, and a soft epoxy resin is used as the filling resin 27. Is used.
【0010】 この温度センサ30のデフロスタ通電試験及び温水煮沸通電試験の結果を図1 2及び図13に示す。The results of the defroster energization test and the hot water boiling energization test of the temperature sensor 30 are shown in FIGS. 12 and 13.
【0011】 図12,図13から明らかなように、図11に示す温度センサ30は、デフロ スタ通電試験の結果は良好であるものの温水煮沸通電試験の結果が良くなく、1 000時間経過で良品の残存率が20%程度となってしまう。As is clear from FIGS. 12 and 13, the temperature sensor 30 shown in FIG. 11 has a good defroster energization test result, but does not have a hot water boiling energization test result, and is a non-defective product after 1,000 hours. The remaining rate of is about 20%.
【0012】[0012]
上述したように、硬いエポキシ樹脂を充填した従来の温度センサ20の場合に は、耐水性は良いが、下塗樹脂25及び充填樹脂27が硬いことにより温度変化 時サーミスタ23に作用する応力を緩和することができず信頼性(ヒートサイク ル性)の点で問題がある。 As described above, in the case of the conventional temperature sensor 20 filled with a hard epoxy resin, the water resistance is good, but since the undercoating resin 25 and the filling resin 27 are hard, the stress acting on the thermistor 23 at the time of temperature change is relaxed. However, there is a problem in terms of reliability (heat cycle property).
【0013】 また、柔らかいエポキシ樹脂を充填した従来の温度センサ30の場合には、耐 水性の点で問題がある。Further, the conventional temperature sensor 30 filled with a soft epoxy resin has a problem in water resistance.
【0014】 そこで、本考案は、高い信頼性を有し、耐水性にも優れた温度センサを提供す ることを目的とするものである。Therefore, the present invention aims to provide a temperature sensor having high reliability and excellent water resistance.
【0015】[0015]
本考案は、発熱源の温度検出用のサーミスタと、このサーミスタに先端部の導 体部を接続したリード線とを具備する温度センサにおいて、少なくとも前記サー ミスタ及びリード線の前記導体部の回りを覆うウレタン樹脂と、このウレタン樹 脂を覆うエポキシ樹脂とを有するものである。 According to the present invention, in a temperature sensor including a thermistor for detecting the temperature of a heat source and a lead wire connecting a conductor portion at a tip end to the thermistor, at least the thermistor and the conductor portion of the lead wire are surrounded. It has a urethane resin for covering and an epoxy resin for covering this urethane resin.
【0016】[0016]
以下に前記温度センサの作用を説明する。 The operation of the temperature sensor will be described below.
【0017】 この温度センサによれば、柔らかく耐水性の良いウレタン樹脂により少なくと もサーミスタ及びリード線の導体部の回りを覆ったので、温度変化時サーミスタ に作用する応力を緩和することができるとともに、耐水性も良好となり、充填樹 脂として耐水性の良くない柔らかいエポキシ樹脂を使用することもできる。According to this temperature sensor, since the circumference of the thermistor and the conductor portion of the lead wire is covered with the soft and water-resistant urethane resin, the stress acting on the thermistor when the temperature changes can be relaxed. Also, the water resistance becomes good, and it is possible to use a soft epoxy resin having poor water resistance as the filling resin.
【0018】[0018]
以下に本考案の実施例を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
【0019】 図1に示す温度センサ1は、有底のケース2と、このケース2内に配置したサ ーミスタ3と、リード線端部の導体部4aをサーミスタ3に接続するとともにケ ース2の外方に導出したリード線4と、前記サーミスタ3及びリード線4の導体 部4aの囲りに塗布した柔らかく耐水性の良いポリブタジエン系ウレタン樹脂5 と、このウレタン樹脂5の囲りに設けたエポキシ系のコート樹脂6と、このエポ キシ系のコート樹脂6の囲りに充填したエポキシ系の充填樹脂7とを具備してい る。A temperature sensor 1 shown in FIG. 1 has a case 2 having a bottom, a thermistor 3 arranged in the case 2, and a conductor portion 4 a at the end of the lead wire connected to the thermistor 3 and a case 2 The lead wire 4 led out to the outside, the thermistor 3 and the conductor portion 4a of the lead wire 4, and a soft and water-resistant polybutadiene-based urethane resin 5 applied to the surrounding area of the urethane resin 5. It is equipped with an epoxy-based coating resin 6 and an epoxy-based filling resin 7 filled in the area surrounding the epoxy-based coating resin 6.
【0020】 図2は、本考案の他の実施例を示すものである。FIG. 2 shows another embodiment of the present invention.
【0021】 図2に示す温度センサ1Aは、図1に示す温度センサ1のエポキシ系のコート 樹脂6を削除し、その代りに、ウレタン樹脂5の塗布量を多くしたものである。The temperature sensor 1A shown in FIG. 2 is one in which the epoxy-based coating resin 6 of the temperature sensor 1 shown in FIG. 1 is deleted and the amount of the urethane resin 5 applied is increased instead.
【0022】 図1に示す温度センサ1のデフロスタ通電試験の結果を図4に、また温水煮沸 通電試験の結果を図5に示す。尚、デフロスタ通電試験及び温水煮沸通電試験は 、従来例と同様に行った。FIG. 4 shows the results of the defroster energization test of the temperature sensor 1 shown in FIG. 1, and FIG. 5 shows the results of the hot water boiling energization test. The defroster energization test and the hot water boiling energization test were performed in the same manner as in the conventional example.
【0023】 また、図2に示す温度センサ1Aのデフロスタ通電試験の結果を図6に、温水 煮沸通電試験の結果を図7に示す。FIG. 6 shows the results of the defroster energization test of the temperature sensor 1A shown in FIG. 2, and FIG. 7 shows the results of the hot water boiling energization test.
【0024】 図4,図5及び図6,図7から明らかなように、前記図1,図2に示す各温度 センサ1,1Aの場合、デフロスタ通電試験と温水煮沸通電試験の結果がいずれ も良好で300サイクル、3000時間に至るまで、良品の残存率が100%を 維持し、極めて信頼性が高く、耐水性も良好である。As is apparent from FIGS. 4, 5 and 6 and 7, in the case of the temperature sensors 1 and 1A shown in FIGS. 1 and 2, the results of the defroster energization test and the hot water boiling energization test are both Good, the remaining rate of non-defective products remains 100% for up to 300 cycles and 3000 hours, extremely high reliability and good water resistance.
【0025】 即ち、図1に示す温度センサ1の場合、柔らかく、かつ、耐水性のよいウレタ ン樹脂5を下塗樹脂として用いているので、ヒートサイクル特性と耐水特性の双 方が良好となる。That is, in the case of the temperature sensor 1 shown in FIG. 1, since the urethane resin 5 which is soft and has good water resistance is used as the undercoat resin, both heat cycle characteristics and water resistance characteristics are good.
【0026】 図2に示す温度センサ1Aの場合も、図1に示す温度センサ1の場合と同様で ある。The case of the temperature sensor 1A shown in FIG. 2 is similar to that of the temperature sensor 1 shown in FIG.
【0027】 図3は、本考案のさらに別の実施例を示すものである。FIG. 3 shows still another embodiment of the present invention.
【0028】 図3に示す温度センサ1Bは、図1に示す温度センサ1のケース2及び充填樹 脂7を削除したものである。The temperature sensor 1B shown in FIG. 3 is obtained by removing the case 2 and the filling resin 7 of the temperature sensor 1 shown in FIG.
【0029】 このような温度センサ1Bの場合も、図1,図2に示す各温度センサ1,1A の場合と同様な作用を発揮させることができる。Also in the case of such a temperature sensor 1B, it is possible to exhibit the same operation as in the case of each of the temperature sensors 1 and 1A shown in FIGS.
【0030】 本考案は詳述した実施例の他、その要旨の範囲内で種々の変形が可能である。The present invention can be modified in various ways within the scope of the invention in addition to the detailed embodiment.
【0031】[0031]
【考案の効果】 以上説明した本考案によれば、上述した構成としたので信頼性に優れ、耐水性 も良好な温度センサを提供することができる。According to the present invention described above, since it has the above-mentioned configuration, it is possible to provide a temperature sensor having excellent reliability and excellent water resistance.
【図1】本考案の実施例を示す断面図FIG. 1 is a sectional view showing an embodiment of the present invention.
【図2】本考案の他の実施例を示す断面図FIG. 2 is a sectional view showing another embodiment of the present invention.
【図3】本考案のさらに別の実施例を示す断面図FIG. 3 is a sectional view showing still another embodiment of the present invention.
【図4】図1に示す温度センサのデフロスタ通電試験の
結果を示すグラフFIG. 4 is a graph showing the results of a defroster electrification test of the temperature sensor shown in FIG.
【図5】図1に示す温度センサの温水煮沸通電試験の結
果を示すグラフ5 is a graph showing the results of a hot water boiling current test of the temperature sensor shown in FIG.
【図6】図2に示す温度センサのデフロスタ通電試験の
結果を示すグラフ6 is a graph showing the results of a defroster electrification test of the temperature sensor shown in FIG.
【図7】図2に示す温度センサの温水煮沸通電試験の結
果を示すグラフ7 is a graph showing the results of a hot water boiling current test of the temperature sensor shown in FIG.
【図8】従来の温度センサの断面図FIG. 8 is a sectional view of a conventional temperature sensor.
【図9】図8に示す温度センサのデフロスタ通電試験の
結果を示すグラフ9 is a graph showing the results of a defroster electrification test of the temperature sensor shown in FIG.
【図10】図8に示す温度センサの温水煮沸通電試験の
結果を示すグラフ10 is a graph showing the results of a hot water boiling current test of the temperature sensor shown in FIG.
【図11】従来の温度センサの他例を示す断面図FIG. 11 is a sectional view showing another example of a conventional temperature sensor.
【図12】図11に示す温度センサのデフロスタ通電試
験の結果を示すグラフ12 is a graph showing the results of a defroster electrification test of the temperature sensor shown in FIG.
【図13】図11に示す温度センサの温水煮沸通電試験
の結果を示すグラフ13 is a graph showing the results of a hot water boiling current test of the temperature sensor shown in FIG.
1 温度センサ 2 ケース 3 サーミスタ 4 リード線 4a 導体部 5 ウレタン樹脂 6 エポキシ樹脂 1 Temperature Sensor 2 Case 3 Thermistor 4 Lead Wire 4a Conductor 5 Urethane Resin 6 Epoxy Resin
Claims (1)
と、このサーミスタに先端部の導体部を接続したリード
線とを具備する温度センサにおいて、少なくとも前記サ
ーミスタ及びリード線の前記導体部の回りを覆うウレタ
ン樹脂と、このウレタン樹脂を覆うエポキシ樹脂とを有
することを特徴とする温度センサ。1. A temperature sensor comprising a thermistor for detecting various temperatures of a heat source and a lead wire connecting a conductor portion at a tip portion to the thermistor, at least around the thermistor and the conductor portion of the lead wire. A temperature sensor comprising: a urethane resin covering the epoxy resin; and an epoxy resin covering the urethane resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1410792U JPH0575631U (en) | 1992-03-17 | 1992-03-17 | Temperature sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1410792U JPH0575631U (en) | 1992-03-17 | 1992-03-17 | Temperature sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0575631U true JPH0575631U (en) | 1993-10-15 |
Family
ID=11851899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1410792U Withdrawn JPH0575631U (en) | 1992-03-17 | 1992-03-17 | Temperature sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0575631U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014507671A (en) * | 2011-03-09 | 2014-03-27 | ティーエスアイ テクノロジーズ エルエルシー | Microwire temperature sensor configured to eliminate stress-related temperature measurement errors and method of manufacturing the sensor |
WO2019082618A1 (en) * | 2017-10-28 | 2019-05-02 | 株式会社立山科学センサーテクノロジー | Temperature sensor and manufacturing method for same |
-
1992
- 1992-03-17 JP JP1410792U patent/JPH0575631U/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014507671A (en) * | 2011-03-09 | 2014-03-27 | ティーエスアイ テクノロジーズ エルエルシー | Microwire temperature sensor configured to eliminate stress-related temperature measurement errors and method of manufacturing the sensor |
WO2019082618A1 (en) * | 2017-10-28 | 2019-05-02 | 株式会社立山科学センサーテクノロジー | Temperature sensor and manufacturing method for same |
JP2019082342A (en) * | 2017-10-28 | 2019-05-30 | 株式会社立山科学センサーテクノロジー | Temperature sensor and production method thereof |
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Legal Events
Date | Code | Title | Description |
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A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960606 |