JP3049539B2 - Heating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus for baking semiconductors and liquid crystal panels, and for baking wafers and substrates in a film forming process.

[0002]

2. Description of the Related Art Conventional baking and film forming processes are divided into processes for manufacturing liquid crystals and semiconductors. In the production of liquid crystals and semiconductors, a heat treatment step is included in these steps.

A semiconductor photomask will be described as an example. The photomask forms a thin film by sputtering chromium on a glass substrate, applies a resist on the thin film, and selectively draws a pattern with an electron beam drawing apparatus. . Thereafter, development, etching, and stripping of the resist are performed to complete the process.

A mask coated with a resist is mounted on a heating device to evaporate a solvent contained in the resist. Since the exposure sensitivity of the resist changes depending on the temperature distribution of the mask at this time, the temperature distribution on the heating device must be uniform.

As shown in FIG. 6, a conventional heating device includes a base plate 101, a plate-shaped heating element 102 provided on one surface of the base plate 101, and a face plate 103 provided on one surface of the plate-shaped heating element. And

The plate-like heating element 102 includes a heating wire 10
4 are provided, both ends of the heating wire 104 are connected to a lead wire 105, and the lead wire 105 is connected to the base plate 1.
It is pulled out of 01.

In this heating device, the plate-shaped heating element 10
The object (not shown) mounted on the surface of the face plate 103 is heated by the heat conduction from the surface plate 103.

[0008]

However, as shown in FIG. 7, the surface temperature of the face plate 103 has a distribution curve A that becomes lower as it approaches the peripheral portion from the central portion of the face plate 103. The reason is that the heat dissipation in the peripheral part is greater than in other parts. In this type of heating device, the face plate 103
Is desirably allowed with an error of 0.5 ° C., but if the temperature of the peripheral portion of the face plate 103 is set within the error range by the heating wire 104, the temperature of the central portion exceeds the allowable range. There is a problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heating apparatus capable of preventing heat dissipation at a peripheral portion of a face plate and keeping the surface temperature of the face plate within an error range to improve temperature distribution characteristics. Is to provide.

[0010]

According to the present invention, there is provided a base plate, a plate-shaped heating element provided on one surface of the base plate, and a face plate provided on one surface of the plate-shaped heating element. , The plate-like heating element
Necessary between the base plate and the face plate
In the heating device fixed together by the
Serial faceplate is for heating an object to be mounted on the surface of the face plate by heat conduction from the plate-like heating element, said faceplate
DOO are made of aluminum material, the Fe is between the face plate and the plate-like heating element
Copper or copper alloy with higher thermal conductivity than base plate
A heat conductor is provided, wherein the face plate
A plate in which the thickness of the heat conductor is smaller than the thickness of the plate
A heating device characterized by having a thick dimension is obtained.

Further, according to the present invention, a base plate
And a plate-shaped light source provided on one surface of the base plate.
A heating element, and a face provided on one surface of the plate-shaped heating element.
A plate, wherein the plate-shaped heating element is
Screw between the face plate and the face plate.
Wherein the face is fixed
The plate is heated by heat conduction from the plate-shaped heating element.
The object to be heated mounted on the surface of the face plate
Heating, the surface of the face plate
On the same plane and from the outer edge of the face plate
A first plate portion extending from the tip of the first plate portion;
Facing the outer peripheral wall surface of the face plate at a predetermined interval
And a second plate portion extending therefrom.

Further, according to the present invention, the periphery of the heat conductor is provided.
A portion where the thickness of the edge portion is other than the peripheral portion of the heat conductor
The plate thickness is larger than that of the face plate
The thickness of the peripheral portion of the peripheral portion of the face plate
The thickness is smaller than that of the part excluding
The thickness of the part excluding the peripheral part of the conductor is
A plate smaller than the thickness of the part excluding the peripheral part of the rate
The heat conductor and the face plate having a thickness dimension
Where the total thickness of the sheet
Are also of the same dimensions .

[0013]

1 to 3 show a first embodiment of a heating apparatus according to the present invention. With reference to FIGS. 1 to 3, the heating device includes a base plate 1, a plate-shaped heating element 2 provided on one surface of the base plate 1, and a face plate 3 provided on one surface of the plate-shaped heating element 2. have.

Face plate 3 and plate-like heating element 2
A heat conductor 6 having a higher heat conductivity than the face plate 3 is provided between the heat conductor 6 and the heat conductor 6. Face plate 3
Is an object to be heated (not shown) mounted on the surface of the face plate 3 by conduction of heat from the plate-shaped heating element 2
Is to be heated.

As shown in FIG. 3, the plate-shaped heating element 2 is formed by winding a strip-shaped heating wire 4 on a mica plate, and a single mica substrate 8 and a plurality of mica wires are connected to the mica board. It is sandwiched between the plates 8a to 8d. A holding plate 9 is provided integrally below the plate-shaped heating element 2. A heat shield plate 10 is fixed to the holding plate 9. The plate-shaped heating element 2 and the heat conductor 6 are integrally fixed between the base plate 1 and the face plate 3 by screws 12. The holding plate 9 and the base plate 1 are integrally fixed via a plurality of spacers 11 and a plurality of screws 13. The heat shield plate 10 is integrally fixed to the holding plate 9 with a plurality of screws 14 via a plurality of spacers 15. The holding plate 9 is held by a holding member 17 that holds a heating device.

The heating wire 4 of the plate-shaped heating element 2 is connected to a lead wire 5, from the lead hole 1 a formed in the base plate 1 to the lead hole 9 a of the holding plate 9 and the lead hole 10 a of the heat shielding plate 10. It is led out through each. Further, an over-temperature prevention device 18 is provided on the back surface of the base plate 1. Furthermore, face plate 3
Is inserted with a temperature detecting element 19 for detecting the temperature of the face plate 3 from the base plate 1 side. The excessive temperature rise prevention device 18 and the temperature detection element 19 serve to open and close the power supply of the plate-shaped heating element 2 by a control device (not shown).

More specifically, the face plate 3 has a substantially flat shape with a diameter of 220 mm and a thickness of 13 mm, and is made of an aluminum material. The surface of the face plate 3 is anodized. The heat conductor 6 has the same diameter as the face plate 3 and is made of copper or a copper alloy having a thickness of 3 mm.

In this heating device, since heat is transmitted from the plate-shaped heating element 2 to the face plate 3 via the heat conductor 6, if the temperature of the peripheral portion of the face plate 6 becomes lower than the other portions, it immediately follows. As a result, the predetermined temperature distribution on the surface of the face plate 3 is maintained.

FIG. 4 shows a second embodiment of the heating device. In this heating device, the same parts as those in the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof will be omitted.

In the heating device of the second embodiment, the total thickness T of the plate thickness of the face plate 3 and the heat conductor 6 is equal at any point. The thickness t1 of the face plate 3 is larger than the thickness t2 of the heat conductor 6. However, the ratio of the thickness t3 of the thermal conductor 6 to the thickness of the peripheral portion of the thermal conductor 6 is large.

In this heating device, when heat is transmitted from the plate-shaped heating element 2 to the face plate 3 via the heat conductor 6, the ratio of the thickness t3 of the peripheral portion of the heat conductor 6 is increased. When the temperature of the peripheral portion of the face plate 3 becomes lower than that of the other portions, the surface plate 3 works so as to be able to immediately follow the temperature, so that a predetermined temperature distribution on the surface of the face plate 3 is maintained. The thickness t3 of the peripheral portion with the heat conductor 6 may be formed in a stepped shape as shown in FIG. 4, and the thickness is increased so as to approach the peripheral edge. May be formed so as to be inclined.

FIG. 5 shows a third embodiment of the heating device. In this heating device, FIGS.
The same parts as those in the first embodiment shown in FIG.

The heating device according to the third embodiment comprises a base plate 1, a plate-like heating element 2 provided on one surface of the base plate 1, and a face plate 3 provided on one surface of the plate-like heating element 2. Are fixed integrally. Further, the heating device includes a first plate portion 3a extending on the same surface as the surface of the face plate 3 and extending from the outer peripheral end surface of the face plate 3, and an outer periphery of the face plate 3 from a tip end of the first plate portion 3a. And a second plate portion 3b extending so as to face the wall surface at a predetermined interval.

In this heating device, heat is transmitted from the plate-shaped heating element 2 to the face plate 3. At this time, the first and second plate portions 3a, 3
b, the outer peripheral wall surface and the first
And an air layer S is formed between the first plate portion 3a and the second plate portion 3b. This acts to prevent the temperature of the peripheral portion of the face plate 3 from lowering than other portions. 3 can maintain a predetermined temperature distribution on the surface.

Further, the outer peripheral wall surface of the face plate 3
By inserting a packing 3c for reducing convection with outside air between the second plate portion 3b and the second plate portion 3b, an effect of air insulation can be expected. Also, the outer peripheral wall surface of the face plate 3
The facing surface of the second plate portion 3b facing the surface is made uneven.
As a result, the opposing surface is closer to the outer surface than the outer surface of the second plate portion 3b.
Has a large area, so the amount of heat radiation is large, so the heat insulation effect is high.
It becomes.

Although the heating device of the third embodiment does not have the heat conductor 6, the heating plate of the face plate 3 and the plate-like heat-generating device as in the second and third embodiments are provided. If the heat conductor 6 having a higher thermal conductivity than the face plate 3 is provided between the body 2 and the heat conductor 6, the surface temperature distribution of the face plate 3 can be further uniformly improved.

FIG. 7 shows a comparison between the temperature distributions of the conventional heating apparatus and that of the heating apparatus according to the present invention. In the first embodiment of the present invention, as shown by the distribution curve B, the temperature of the outer periphery increases and the temperature distribution becomes uniform. It became clear that it became.

[0028]

As described in the above embodiments, according to the heating device of the present invention, the structure in which the heat conductor is interposed between the face plate and the plate-shaped heating element, or the peripheral edge of the face plate is used. Since the first and second plate portions are provided in the portion, the temperature of the peripheral portion of the face plate can be prevented from lowering, and the surface temperature distribution of the face plate in the baking process and the heat treatment of the semiconductor in the film formation manufacturing process. Can be improved, so that the efficiency in the manufacturing process can also be improved.

Therefore, it is possible to provide a heating device having good temperature distribution of the face plate and high reliability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of a heating device according to the present invention.

FIG. 2 is a perspective view of the heating device of FIG. 1 as viewed from above.

FIG. 3 is an exploded perspective view of the heating device of FIG.

FIG. 4 is a cross-sectional view showing a second embodiment of the heating device of the present invention.

FIG. 5 is a sectional view showing a third embodiment of the heating device of the present invention.

FIG. 6 is a sectional view showing a conventional heating device.

FIG. 7 is a graph comparing the temperature distributions of a heating device according to the related art and the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1,101 Base plate 2,102 Plate-shaped heating element 3,103 Face play and 4,104 Heating wire 5,105 Lead wire 6 Heat conductor 8 Mica board 9 Holding plate 10 Heat shielding plate 11,15 Spacer 12,13,14 Screw 18 Overheat prevention device 19 Temperature detection element

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05B 3/20 H05B 3/68

Claims (8)

(57) [Claims] 1. A base plate, a plate-shaped heating element provided on one surface of the base plate, and a face plate provided on one surface of the plate-shaped heating element , wherein the plate-shaped heating element is connected to the base plate. The fa
Are fixed together by screws between the plate
In the heating device, the face plate heats an object to be heated mounted on a surface of the face plate by heat conduction from the plate-shaped heating element, and the face plate is made of an aluminum material.
The heat conductivity between the face plate and the plate-shaped heating element is higher than that of the face plate.
There is a large copper or copper alloy thermal conductor
The heat conduction is greater than the thickness of the face plate.
A heating device, wherein the body has a smaller thickness . 2. The heating device according to claim 1, wherein
The thickness of the peripheral portion of the thermal conductor is the peripheral portion of the thermal conductor.
The thickness of the plate is larger than that of the part excluding
The thickness of the peripheral portion of the base plate is
The thickness of the plate is smaller than that of the
And the heat conductor and the face plate are combined.
The same size is used at any place where the total thickness is
Heating and wherein the that. 3. A base plate and a base plate.
A plate-like heating element provided on one side;
And a face plate provided on one side of the heat body.
The plate-shaped heating element is connected to the base plate and the face.
Are fixed together by screws between the plate
In the heating device, the face plate may
The face plate by heat conduction from the heating element
For heating the object to be heated mounted on the surface of the
The same face as the face plate and the face
First plate portion extending outward from the outer peripheral edge of the plate
And the outside of the face plate from the tip of the first plate portion.
A second, which is opposed to the peripheral wall surface at a predetermined interval.
A heating device having a plate portion . 4. The heating device according to claim 3, wherein
The fan is located between the base plate and the face plate.
Provide a heat conductor with higher heat conductivity than the base plate
A heating device. 5. The heating device according to claim 1, wherein the plate-shaped heating element is formed by winding a heating wire around a mica substrate, and the mica substrate and the heating wire are formed by a plurality of mica plates. A heating device characterized by being sandwiched. 6. The heating device according to claim 3, wherein
The thickness of the heat conductor is greater than the thickness of the face plate
A heating device characterized in that the dimensions are smaller in thickness . 7. The heating device according to claim 1, wherein
The thickness of the peripheral portion of the heat conductor is smaller than that of the heat conductor.
It has a larger plate thickness compared to the part excluding the peripheral part of
The thickness of the peripheral portion of the face plate is
Smaller plate thickness than the part excluding the peripheral part of the base plate
Dimensions and thickness of the heat conductor excluding the peripheral part
A plate whose dimensions exclude the peripheral portion of the face plate
The thickness is smaller than the thickness, and the heat conductor and
The total thickness of the face plate combined with the face plate is
A heating device having the same dimensions at any point . 8. The heating device according to claim 3, wherein
At least it faces the outer peripheral wall of the face plate
A heating device, wherein an opposing surface of the second plate portion is an uneven surface .