JP3044909B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly, to an electronic component mounting apparatus capable of identifying a transfer head at a glance.

[0002]

2. Description of the Related Art As a high-speed electronic component mounting apparatus capable of mounting several electronic components such as ICs, LSIs, and capacitor chips on a substrate every second, a device having a rotary head is often used.

In such an electronic component mounting apparatus, several to several tens of transfer heads are provided, and these transfer heads rotate while rotating along a rotary head.
Electronic components are mounted. here,
Of these plurality of transfer heads, only a specific transfer head may exhibit problems such as pick-up errors and noise. In such a case, the operator must first identify which of the plurality of transfer heads is defective in order to perform maintenance or the like of the transfer head. To do so, it is first necessary that each of the plurality of transfer heads can be distinguished from other transfer heads.

[0004]

Here, in the conventional means, these transfer heads are provided with "1", "2",
.., Or “A”, “B”, “C”,..., Etc., so that individual heads can be identified by these characters.

[0005] However, in order to further increase the mounting speed of electronic components, the speed at which the transfer head is rotationally moved is increasing, and even if the transfer head is identified by the characters described above. However, it was difficult for the operator to read it. Therefore, there is a problem that even if there is a transfer head that causes the above-described problem, the transfer head that causes this problem cannot be specified.

Accordingly, an object of the present invention is to provide means for distinguishing transfer heads at a glance.

[0007]

According to the present invention, each of a plurality of transfer heads is provided with a head identification mark whose direction sequentially changes along the rotary head.

[0008]

According to the above configuration, the operator only has to pay attention to the direction indicated by the head identification mark, and the transfer head can be specified according to the direction. Therefore, unlike the conventional means, the operator does not need to recognize what the character is, and can sufficiently identify even if the rotational movement speed of the transfer head is high.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus according to the present embodiment, and FIG. 2 is an exemplary view of a head identification mark.

In FIG. 1, R is a rotary head, H
Reference numerals 1 to H12 denote transfer heads that rotate in an index along the rotary head R, and each have a nozzle N at a lower portion for sucking and picking up the electronic component P. U is a driving means for rotating the transfer heads H1 to H12.

Reference numeral F denotes a parts feeder such as a tape feeder or a tube feeder arranged in parallel behind the rotary head R. The parts feeder F supplies an electronic component P to a nozzle N at a pickup position Q. O is a substrate, L is a land formed on the surface of the substrate O, XT and YT are X tables and Y tables for positioning the substrate O, and MX and MY are these tables XT and XT.
This is a YT drive motor.

The transfer heads H1 to H12 are provided with head identification marks M1 to M12 each having a clock-like arrow D1 to D12 indicating a different direction. This arrow
When D1 is zero and D2 is one, they are successively formed in steps with equal angular differences. Of course, the direction of the bar-shaped mark may be changed sequentially instead of the illustrated arrow, and various modifications are possible.

This embodiment has the above configuration, and its operation will be described below. The plurality of transfer heads H1,.
Driven by the driving means U, the index rotation is performed along the rotary head R. Then, the nozzle N of each transfer head
Receives the supply of the electronic component P from the parts feeder F at the pickup position Q, rotates the index while sucking the electronic component P, and heads toward the substrate O side. On the other hand, X
When the Y tables XT and YT are driven, the lands L on the substrate O are driven.
Cooperates with the movement of the nozzle N, the electronic component P is mounted on the land L, and the transfer head is again mounted on the parts feeder F.
Rotating to the side.

The operator OP monitoring this is provided with marks M1 to M12 attached to the transfer heads H1 to H12, respectively.
Observe. Then, the arrows D1 to D12 are observed as if the hands of the clock are just rotating on the dial, and the operator OP can instantly grasp in which direction the arrow being observed is pointing. Then, it is possible to easily identify a transfer head exhibiting a defect such as a pick-up error or noise by using this arrow.

[0016]

According to the present invention, each of the plurality of transfer heads is provided with a head identification mark whose direction sequentially changes along the rotary head, so that the moving speed of the transfer head is increased. However, the operator OP can easily identify the problematic head depending on the direction of the sign.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing an example of a head identification mark according to an embodiment of the present invention;

[Explanation of symbols]

 F Parts feeder H Transfer head M Head identification sign N Nozzle O Substrate P Electronic component R Rotary head XT X table YTY table

Claims (1)

(57) [Claims] A plurality of transfer heads having a nozzle for picking up an electronic component pick up an electronic component supplied by a parts feeder and position the electronic component on an XY table while rotating along a rotary head. An electronic component mounting apparatus adapted to be mounted on a mounted substrate, wherein each of the plurality of transfer heads is provided with a head identification mark whose direction sequentially changes along the rotary head. apparatus.