JP3037685B2 - How to use rubber products or rubber members - Google Patents
How to use rubber products or rubber membersInfo
- Publication number
- JP3037685B2 JP3037685B2 JP11164299A JP11164299A JP3037685B2 JP 3037685 B2 JP3037685 B2 JP 3037685B2 JP 11164299 A JP11164299 A JP 11164299A JP 11164299 A JP11164299 A JP 11164299A JP 3037685 B2 JP3037685 B2 JP 3037685B2
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- dust
- solvent
- electronic component
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001971 elastomer Polymers 0.000 title claims description 76
- 239000005060 rubber Substances 0.000 title claims description 76
- 239000000428 dust Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 27
- 239000002904 solvent Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 244000043261 Hevea brasiliensis Species 0.000 claims description 9
- 229920003052 natural elastomer Polymers 0.000 claims description 9
- 229920001194 natural rubber Polymers 0.000 claims description 9
- 229920000459 Nitrile rubber Polymers 0.000 claims description 7
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 4
- 229920005549 butyl rubber Polymers 0.000 claims description 4
- 229920003049 isoprene rubber Polymers 0.000 claims description 4
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 4
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 229920005558 epichlorohydrin rubber Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920006311 Urethane elastomer Polymers 0.000 claims description 2
- 229920000800 acrylic rubber Polymers 0.000 claims description 2
- 229920001973 fluoroelastomer Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920001021 polysulfide Polymers 0.000 claims description 2
- 239000005077 polysulfide Substances 0.000 claims description 2
- 150000008117 polysulfides Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 1
- 241000894007 species Species 0.000 claims 1
- 239000000463 material Substances 0.000 description 22
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 206010042674 Swelling Diseases 0.000 description 6
- 230000008961 swelling Effects 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- -1 trichlene Chemical compound 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 235000014692 zinc oxide Nutrition 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、クリーンルーム等
の除塵環境下で使用するゴム製品又はゴム部材の使用方
法、及びそれを利用した電子部品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of using a rubber product or a rubber member used in a dust-removing environment such as a clean room, and a method of manufacturing an electronic component using the same.
【0002】[0002]
【従来の技術】従来、電子部品製造設備等におけるクリ
ーンルーム内において、電子部品又は電子部品用部材等
を取り扱う際の手袋としては、主に天然ゴム系のクラス
100対応のもの等が使用されている。このようなゴム
手袋は、製造時に十分な洗浄を行ってゴミの除去を行っ
ているにもかかわらず、この手袋を用いてスパッタ処理
前の基板等を取り扱うと、スパッタ処理の歩留まりが悪
いといった問題があった。その原因として、手袋に付着
したゴミの再付着によって基板が汚染されたものと考え
られていた。2. Description of the Related Art Conventionally, gloves used for handling electronic parts or members for electronic parts in a clean room of an electronic parts manufacturing facility or the like are mainly made of natural rubber-based class 100 or the like. . Even though such rubber gloves are sufficiently cleaned during production to remove dust, handling a substrate or the like before sputter processing using the gloves has a problem in that the yield of the sputter processing is poor. was there. It was considered that the cause was that the substrate was contaminated by the re-adhesion of dust attached to the glove.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、本発明
者らが上記問題を解消すべく、手袋の交換回数を増加さ
せたにもかかわらず、状況はほとんど改善しなかった。
そこで問題となっているゴミを分析したところ、手袋自
身から出るカルシウム、硫黄といったゴミが検出され
た。また、電子部品等に接触したときにゴム手袋に付着
するシリカ、カーボン系のゴミが、基板に再付着してそ
れを汚染していることも判明した。However, despite the fact that the present inventors have increased the number of times of changing gloves in order to solve the above problems, the situation has hardly improved.
When the garbage in question was analyzed, garbage such as calcium and sulfur emitted from the glove itself was detected. It has also been found that silica and carbon-based dust adhering to rubber gloves when they come into contact with electronic components or the like are re-adhering to the substrate and contaminating it.
【0004】しかし、天然ゴム等のゴム材料では、これ
らのゴミの発生は不可避のものである。また、電子部品
等に接触したときに手袋に付着するゴミについても、作
業環境を改善するといった対策を行っても、それを減少
させるには限界がある。そして、他のゴム材料やゴム材
料に代替可能な材料についても検討したが、適切なもの
は特に存在しなかった。[0004] However, in the case of rubber materials such as natural rubber, generation of these dusts is inevitable. In addition, there is a limit to the reduction of dust adhering to gloves when it comes into contact with electronic components and the like, even if measures are taken to improve the working environment. Then, other rubber materials and materials that can be substituted for the rubber material were examined, but no suitable material was found.
【0005】一方、上記のような問題はゴム手袋に限ら
ず、除塵環境下で使用するゴム製品又はゴム部材のいず
れにも生じ得る問題であり、また、ゴム材料自体からの
発塵については、取り扱い対象に直接接触しないような
ゴム部材等でも生じ得る問題である。On the other hand, the above-mentioned problem is not limited to rubber gloves, but can occur in any rubber product or rubber member used in a dust-free environment. This is a problem that can occur with a rubber member or the like that does not directly contact the object to be handled.
【0006】そこで、本発明の目的は、ゴム材料からの
ゴミの発生防止と、後に付着するゴミの再付着防止とが
可能なゴム製品又はゴム部材の使用方法、及びそれを利
用した電子部品の製造方法を提供することにある。Accordingly, an object of the present invention is to provide a method of using a rubber product or a rubber member capable of preventing generation of dust from a rubber material and preventing reattachment of dust attached later, and an electronic component using the same. It is to provide a manufacturing method.
【0007】[0007]
【課題を解決するための手段】本発明者らは、上記目的
を達成すべく、ゴム材料表面の改質・処理などを種々試
みた結果、適当な溶剤でゴム材料の表面を膨潤させると
いう意外にも簡単な方法により、上記目的が達成できる
ことを見出し、本発明を完成するに至った。Means for Solving the Problems The inventors of the present invention have made various attempts to modify and treat the surface of a rubber material in order to achieve the above object. It has been found that the above object can be achieved by a simple method, and the present invention has been completed.
【0008】即ち、本発明のゴム製品又はゴム部材の使
用方法は、除塵環境下で使用するゴム製品又はゴム部材
の表面の少なくとも取扱い対象と直接接触する部分を、
溶剤により膨潤させた状態で使用することを特徴とす
る。That is, in the method of using the rubber product or the rubber member according to the present invention, at least a portion of the surface of the rubber product or the rubber member used in a dust-removing environment, which is in direct contact with a handling object ,
It is characterized in that it is used in a state swollen with a solvent.
【0009】本発明によると、ゴム製品又はゴム部材の
表面の少なくとも取扱い対象と直接接触する部分を溶剤
により膨潤させた状態とするため、後述の実施例の結果
が示すように、ゴム材料からのゴミの発生防止と、後に
付着するゴミの再付着防止とが可能となる。その理由の
詳細は明らかではないが、膨潤したゴム材料は、自己の
粘着力により発塵成分の脱落・再付着などを防止できる
と共に、外部から付着したゴミを粘着力により粘着しつ
つ溶着させて、外部に再付着するのを防止できるためと
考えられる。なお、図2は、ゴム手袋1の表面にゴミ4
が付着して、膨潤したゴム材料の粘着力により脱落しに
くい状態を示している。According to the present invention, at least the portion of the surface of the rubber product or the rubber member which is in direct contact with the object to be handled is swollen by the solvent. It is possible to prevent generation of dust and prevent reattachment of dust that later adheres. Although the details of the reason are not clear, the swollen rubber material can prevent falling and re-adhesion of dust-generating components by its own adhesive force, and also adheres and adheres dust adhered from outside while adhering by the adhesive force. It is considered that this can prevent re-adhesion to the outside. FIG. 2 shows that the dust 4
Shows a state in which the rubber material adheres and is hard to fall off due to the adhesive force of the swollen rubber material.
【0010】上記において、前記溶剤をほぼ定期的に前
記表面に供給することが好ましい。これにより、溶剤供
給後に付着したゴミを、新たな溶剤の供給によりゴム材
料に溶着させて、その脱落や再付着をより確実に防止す
ることができる。In the above, it is preferable that the solvent is supplied to the surface almost regularly. Thus, the dust adhered after the supply of the solvent is welded to the rubber material by the supply of a new solvent, so that the falling-off and re-adhesion can be more reliably prevented.
【0011】また、前記除塵環境としては、後述する種
々のものが挙げられるが、電子部品製造設備におけるも
のであることが好ましい。その場合、前述のように電子
部品製造設備では、ゴム材料からのゴミの発生だけでな
く、電子部品又は電子部品用部材からゴム材料へ付着す
るゴミの電子部品等への再付着が問題となるところ、本
発明ではその両者をいずれも防止することができるた
め、本発明が特に有効なものになる。その結果、例えば
半導体製造工程などにおいて基板等の汚染が少なくな
り、後に続く成膜処理等における歩留まりを向上させる
ことができる。[0011] Examples of the dust-removing environment include various ones described later, but it is preferable that the dust-removing environment is in an electronic component manufacturing facility. In that case, as described above, in the electronic component manufacturing facility, not only generation of dust from the rubber material, but also reattachment of dust attached to the rubber material from the electronic component or electronic component member to the electronic component or the like becomes a problem. However, the present invention can prevent both of them, so that the present invention is particularly effective. As a result, for example, contamination of a substrate or the like is reduced in a semiconductor manufacturing process or the like, and yield in a subsequent film forming process or the like can be improved.
【0012】また、前記ゴム製品又は前記ゴム部材とし
ては、後述する種々のものが挙げられるが、ゴム手袋、
吸引保持部材、搬送支持部材、又は把持部材であること
が好ましい。これらはいずれも除塵環境下で使用される
と共に、清浄に維持すべき取り扱い対象物と直接接触す
る部分を有するため、ゴム材料からのゴミの発生と一旦
ゴム材料に付着したゴミの再付着とが、特に大きな影響
を与えるので、本発明が特に有効なものになる。As the rubber product or the rubber member, there can be mentioned various ones described later.
It is preferably a suction holding member, a transport support member, or a gripping member. All of these are used in a dust-free environment and have a part that comes into direct contact with the object to be kept clean, so that the generation of dust from the rubber material and the reattachment of the dust once attached to the rubber material are reduced. The present invention is particularly effective because it has a particularly large effect.
【0013】更に、前記ゴム製品又は前記ゴム部材の原
料ゴムとしては、天然ゴム(NR)、イソプレンゴム
(IR)、スチレン−ブタジエンゴム(SBR)、ブタ
ジエンゴム(BR)、クロロプレンゴム(CR)、ニト
リルゴム(NBR)、ブチルゴム(IIR)、エチレン
プロピレンゴム(EPM)、ウレタンゴム(U)、シリ
コーンゴム(Q)、フッ素ゴム(FKM)、アクリルゴ
ム(ACM,ANM)、エピクロロヒドリンゴム(C
O,ECO)、及び多硫化ゴム(T)よりなる群から選
ばれる1種以上が好ましい。これらは、いずれも架橋ゴ
ムとして使用されるため、溶剤による膨潤が適度に生じ
て適度な粘着性を示すと共に、ゴム成分の溶出なども生
じにくいものとなる。Further, as the raw rubber for the rubber product or the rubber member, natural rubber (NR), isoprene rubber (IR), styrene-butadiene rubber (SBR), butadiene rubber (BR), chloroprene rubber (CR), Nitrile rubber (NBR), butyl rubber (IIR), ethylene propylene rubber (EPM), urethane rubber (U), silicone rubber (Q), fluoro rubber (FKM), acrylic rubber (ACM, ANM), epichlorohydrin rubber (C
O, ECO) and one or more selected from the group consisting of polysulfide rubbers (T). Since these are all used as crosslinked rubbers, they are moderately swelled by a solvent, exhibit appropriate tackiness, and are less likely to elute rubber components.
【0014】一方、本発明の電子部品の製造方法は、除
塵環境下において、ゴム製品又はゴム部材の表面の少な
くとも取扱い対象と直接接触する部分を、溶剤により膨
潤させた状態で電子部品又は電子部品用部材を取り扱う
ことで、電子部品を製造するものである。本発明の製造
方法によると、上記の如く、ゴム材料からのゴミの発生
と、一旦ゴム材料に付着したゴミの再付着とを有効に防
止できるため、電子部品又は電子部品用部材の汚染が少
なくなり、電子部品の製造の際の各種工程における歩留
まりを向上させることができる。On the other hand, the method for manufacturing an electronic component according to the present invention provides a method for manufacturing an electronic component or an electronic component in a dust-removing environment in a state where at least a portion of a surface of a rubber product or a rubber member that is in direct contact with an object to be handled is swollen with a solvent. The electronic component is manufactured by handling the member for use. According to the manufacturing method of the present invention, as described above, since generation of dust from the rubber material and reattachment of dust once attached to the rubber material can be effectively prevented, contamination of electronic components or electronic component members is reduced. Thus, the yield in various processes in the production of electronic components can be improved.
【0015】[0015]
【発明の実施の形態】本発明のゴム製品又はゴム部材
は、除塵環境下で使用されるものであるが、除塵環境と
しては、上述の電子部品製造設備の他、精密機器製造設
備、バイオテクノロジー関連設備、医療設備、食品製造
設備、薬品製造設備、純水製造設備などのクリーンルー
ム、クリーンブース等を使用する各種設備におけるもの
が挙げられる。BEST MODE FOR CARRYING OUT THE INVENTION The rubber product or rubber member of the present invention is used in a dust-removing environment. Related equipment, medical equipment, food manufacturing equipment, chemical manufacturing equipment, pure water manufacturing equipment, and other clean rooms, clean booths, and other various equipments may be used.
【0016】ゴム製品としては、各種ゴム手袋の他、ゴ
ム栓、ゴムチューブ、ゴムホースなどが挙げられる。ま
た、ゴム部材としては、各種自動化機器における吸引保
持部材、搬送支持部材、把持部材の他、シール部材、緩
衝部材、防振動部材、免振部材などが挙げられる。な
お、これらの部材は、表面にのみゴム材料が被覆された
ものも含まれる。Examples of rubber products include various rubber gloves, rubber stoppers, rubber tubes, rubber hoses, and the like. Examples of the rubber member include a seal member, a cushioning member, a vibration-proof member, a vibration-proof member, and the like, in addition to a suction holding member, a transfer supporting member, and a gripping member in various kinds of automation equipment. In addition, these members also include those in which only a surface is covered with a rubber material.
【0017】上記ゴム製品等の表面を溶剤により膨潤さ
せる方法は、いずれの方法でもよいが、例えば洗浄ビン
に入った溶剤をふきかける方法、溶剤が入っている容器
に浸漬する方法、スプレーで表面に吹き付ける方法など
が挙げられる。なお、溶剤が表面に液滴として残留する
と、その液滴が他のものに付着して汚染するおそれがあ
るため、表面に残留する溶剤液滴は少ない方が好まし
い。これは、揮発性の溶剤を使用したり、ゴミの発生の
少ないクロス等で吸収除去すること、あるいはクリーン
エアーで強制的にゴム材料の表面を乾燥させることで達
成される。Any method may be used to swell the surface of the rubber product or the like with a solvent. For example, a method of wiping a solvent in a washing bottle, a method of dipping in a container containing a solvent, or a method of spraying the surface with a spray. And the like. If the solvent remains on the surface as droplets, the droplets may adhere to other substances and become contaminated. Therefore, it is preferable that the solvent droplets remaining on the surface be small. This can be achieved by using a volatile solvent, absorbing and removing with a cloth or the like that generates little dust, or forcibly drying the surface of the rubber material with clean air.
【0018】膨潤させる箇所としては、発塵防止等の観
点からは表面全体とすることが好ましいが、清浄に維持
すべき取り扱い対象物と直接接触する部分を少なくとも
膨潤させることが好ましい。The area to be swollen is preferably the entire surface from the viewpoint of preventing dust generation and the like, but it is preferable that at least the part in direct contact with the object to be kept clean is swollen.
【0019】前記溶剤をほぼ定期的にゴム表面に供給す
る方法としては、新たなゴミの付着量などを考慮して適
当な時間間隔を設定すればよい。例えば数分〜数十分毎
に上記の方法にて溶剤を供給するなどすればよい。ま
た、溶剤の蒸発速度を考慮して上記間隔を設定してもよ
い。また、時間ではなく、一定量の作業後に溶剤を供給
するようにしてもよい。As a method of supplying the solvent to the rubber surface almost regularly, an appropriate time interval may be set in consideration of the amount of new dust attached. For example, the solvent may be supplied by the above method every several minutes to several tens of minutes. Further, the interval may be set in consideration of the evaporation rate of the solvent. Further, the solvent may be supplied after a certain amount of work, instead of the time.
【0020】本発明に用いられる溶剤を、原料ゴムとの
対応で例示すると表1のようになる。Table 1 shows examples of the solvents used in the present invention in correspondence with the raw rubber.
【0021】[0021]
【表1】 これらのうち、適度な揮発性を有する低分子量(低炭素
数)のもの、例えばアセトン、メチルエチルケトン、酢
酸エチル、石油エーテル、エタノール、トリクレン、ベ
ンゼン、トルエンなどが、表面に液滴として残留しにく
いため好ましい。特に、ケトン類としてのアセトンは、
揮発性が高く乾燥までの時間が短く待ち時間が少なくな
るため作業性を向上させることができること、また取り
扱いやすいことから望ましい。なお、上記溶剤を複数混
ぜ合わせたものも使用可能である。[Table 1] Of these, those having low molecular weight (low carbon number) having moderate volatility, such as acetone, methyl ethyl ketone, ethyl acetate, petroleum ether, ethanol, trichlene, benzene, and toluene, hardly remain as droplets on the surface. preferable. In particular, acetone as ketones
It is desirable because it has high volatility and the time to dry is short and the waiting time is short, so that workability can be improved and it is easy to handle. A mixture of a plurality of the above solvents may be used.
【0022】一方、本発明の電子部品の製造方法は、以
上で説明した本発明の使用方法を利用するものであり、
除塵環境下において、ゴム製品又はゴム部材の表面の少
なくとも一部を溶剤により膨潤させた後、電子部品又は
電子部品用部材を取り扱うことで、電子部品を製造する
ものである。その際、膨潤を行う以外の点は、従来の電
子部品を製造方法や、電子部品又は電子部品用部材の取
り扱い方法を、何れも採用することができる。On the other hand, the method of manufacturing an electronic component according to the present invention utilizes the method of use of the present invention described above.
In a dust removing environment, an electronic component is manufactured by treating at least a part of the surface of a rubber product or a rubber member with a solvent and then handling the electronic component or the electronic component member. At this time, except for the swelling, any of the conventional methods for manufacturing electronic components and the methods for handling electronic components or members for electronic components can be adopted.
【0023】製造される電子部品としては、特にクリー
ンな環境が要求される集積回路類(ULSI,VLS
I,LSI,IC等)、光半導体素子、トランジスタ類
などのいわゆる半導体部品、又は、電子回路を構成する
各種電子部品、その他、プリント配線基板、多層配線基
板、電池など、電子機器類を構成する部品の全てが包含
される。また、電子部品用部材としては、電子部品を構
成する各種素材、素子、材料、中間製品などが挙げられ
る。As electronic parts to be manufactured, integrated circuits (ULSI, VLS, etc.) that require a particularly clean environment are used.
I, LSI, IC, etc.), so-called semiconductor components such as optical semiconductor elements and transistors, or various electronic components constituting electronic circuits, and other electronic devices such as printed wiring boards, multilayer wiring boards, and batteries. All of the parts are included. Examples of the electronic component member include various materials, elements, materials, and intermediate products constituting the electronic component.
【0024】[0024]
【実施例】以下、本発明の具体的な構成と効果を示す実
施例等について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments and the like showing specific configurations and effects of the present invention will be described below.
【0025】実施例1(天然ゴム手袋) ゴム手袋として、天然ゴム90重量%、亜鉛華6重量
%、イオウ(加硫剤)3重量%、ステアリン酸(加硫助
剤)1重量%の組成のものを用意した。図1に示すよう
に、ゴム手袋1の取り扱う部品に接触する部分1a(主
に指先部分)に洗浄ビン2でアセトン3をふきかけた。
数十秒大気中(常温)に放置し、表面に液滴が残留して
ないことを確認した。この手袋を用いて、通常通り、絶
縁膜製造工程においてアルミナチタンカーバイト基板を
取り扱い、スパッタ処理を行った。なお、アルミナチタ
ンカーバイト基板は、電子部品である薄膜磁気ヘッドを
製造するための基板等として使用され、例えばスパッタ
処理等の薄膜堆積技術によって、絶縁膜や合金層等が積
層され、磁気素子等と共に薄膜磁気ヘッドが成形され
る。Example 1 (Natural rubber gloves) A rubber glove composition of 90% by weight of natural rubber, 6% by weight of zinc white, 3% by weight of sulfur (vulcanizing agent), and 1% by weight of stearic acid (vulcanizing aid) I prepared something. As shown in FIG. 1, acetone 3 was sprayed with a washing bottle 2 on a portion 1 a (mainly a fingertip portion) of the rubber glove 1 which comes into contact with a part to be handled.
It was left in the atmosphere (normal temperature) for several tens of seconds, and it was confirmed that no droplets remained on the surface. Using this glove, the alumina titanium carbide substrate was handled and sputtered in the insulating film manufacturing process as usual. The alumina titanium carbide substrate is used as a substrate or the like for manufacturing a thin-film magnetic head as an electronic component. At the same time, a thin-film magnetic head is formed.
【0026】その結果、上記膨潤処理により、基板1平
方センチメータ中、100個前後存在した大きさ0.5
〜10ミクロンのゴミを5個前後に減少させることがで
き、スパッタ処理後における歩留まりを大きく改善(比
較例1の約2倍)することができた。つまり、ゴム手袋
表面を膨潤させることによって、手袋自身からゴミが発
生したり、また作業中に基板等からゴミが付着したとし
ても、手袋から離れずアルミナチタンカーバイト基板を
汚染してしまうことがなかった。As a result, by the above-mentioned swelling process, the size of about 100 pieces per square centimeter of the substrate was 0.5
The dust of 10 to 10 microns can be reduced to about 5 pieces, and the yield after the sputtering process can be greatly improved (about twice as large as that of Comparative Example 1). In other words, by swelling the surface of the rubber glove, dust may be generated from the glove itself, and even if dust adheres to the substrate during the work, the dust may not contaminate the alumina titanium carbide substrate without leaving the glove. Did not.
【0027】なお、上記手袋の処理はアルミナチタンカ
ーバイト基板を用いた電子部品の製造工程において、大
きな効果があったが、ゴム材料を用いて部品等を製造す
るあらゆる場合に転用できると考えられる。Although the treatment of the gloves has a great effect in a process of manufacturing an electronic component using an alumina titanium carbide substrate, it is considered that it can be diverted to any case where a component is manufactured using a rubber material. .
【0028】比較例1(膨潤なし) 実施例1において、アセトンによる膨潤処理を行わない
こと以外は、実施例1と同様にして、スパッタ処理を行
った。その結果、基板1平方センチメータ中、100個
前後のゴミが存在し、スパッタ処理後の歩留まりも実施
例1の約半分程度であった。Comparative Example 1 (without swelling) A sputtering process was performed in the same manner as in Example 1 except that the swelling treatment with acetone was not performed. As a result, about 100 dusts were present in one square centimeter of the substrate, and the yield after the sputtering process was about half that of Example 1.
【0029】実施例2(ニトリルゴム手袋) 実施例1において、天然ゴム手袋の代わりに下記組成の
ニトリルゴム手袋を用い、アセトンの代わりにベンゼン
を用いる以外は、実施例1と同様にして、スパッタ処理
を行った。その結果、実施例1と同様に大きさ0.5〜
10ミクロンのゴミを5個前後に減少させることがで
き、また、スパッタ処理後における歩留まりを大きく改
善(比較例1の約2倍)することができた。Example 2 (Nitrile rubber glove) Sputtering was carried out in the same manner as in Example 1 except that a nitrile rubber glove having the following composition was used instead of the natural rubber glove, and benzene was used instead of acetone. Processing was performed. As a result, the size is 0.5 to
It was possible to reduce the number of dust particles of 10 microns to about five, and to greatly improve the yield after the sputtering process (about twice as large as that of Comparative Example 1).
【0030】(ニトリルゴムの組成)ニトリルゴム90
重量%、亜鉛華6重量%、イオウ(加硫剤)3重量%、
ステアリン酸(加硫助剤)1重量%(Composition of Nitrile Rubber) Nitrile Rubber 90
Weight%, zinc white 6%, sulfur (vulcanizing agent) 3%,
Stearic acid (vulcanization aid) 1% by weight
【図1】実施例1における膨潤処理の説明図FIG. 1 is an explanatory diagram of a swelling process in Example 1.
【図2】ゴミの付着状態の説明図FIG. 2 is an explanatory view of a state of attachment of dust.
1 ゴム手袋 2 洗浄ビン 3 アセトン(溶剤) 4 ゴミ 1 Rubber gloves 2 Cleaning bottle 3 Acetone (solvent) 4 Garbage
Claims (6)
部材の表面の少なくとも取扱い対象と直接接触する部分
を、溶剤により膨潤させた状態で使用するゴム製品又は
ゴム部材の使用方法。A method of using a rubber product or a rubber member used in a state where at least a portion of the surface of a rubber product or a rubber member used in an environment free of dust is in direct contact with an object to be handled is swollen with a solvent. .
する請求項1記載の使用方法。2. The method according to claim 1, wherein the solvent is supplied to the surface almost regularly.
けるものである請求項1又は2記載の使用方法。3. The use method according to claim 1, wherein the dust removing environment is in an electronic component manufacturing facility.
手袋、吸引保持部材、搬送支持部材、又は把持部材であ
る請求項1〜3いずれかに記載の使用方法。4. The method according to claim 1, wherein the rubber product or the rubber member is a rubber glove, a suction holding member, a transport support member, or a gripping member.
ムが、天然ゴム(NR)、イソプレンゴム(IR)、ス
チレンブタジエンゴム(SBR)、ブタジエンゴム(B
R)、クロロプレンゴム(CR)、ニトリルゴム(NB
R)、ブチルゴム(IIR)、エチレンプロピレンゴム
(EPM)、ウレタンゴム(U)、シリコーンゴム
(Q)、フッ素ゴム(FKM)、アクリルゴム(AC
M,ANM)、エピクロロヒドリンゴム(CO,EC
O)、及び多硫化ゴム(T)よりなる群から選ばれる1
種以上である請求項1〜4いずれかに記載の使用方法。5. The raw material rubber for the rubber product or the rubber member is made of natural rubber (NR), isoprene rubber (IR), styrene butadiene rubber (SBR), butadiene rubber (B
R), chloroprene rubber (CR), nitrile rubber (NB
R), butyl rubber (IIR), ethylene propylene rubber (EPM), urethane rubber (U), silicone rubber (Q), fluoro rubber (FKM), acrylic rubber (AC
M, ANM), epichlorohydrin rubber (CO, EC
O) and 1 selected from the group consisting of polysulfide rubber (T)
The use according to any one of claims 1 to 4, which is at least one species.
部材の表面の少なくとも取扱い対象と直接接触する部分
を、溶剤により膨潤させた状態で電子部品又は電子部品
用部材を取り扱うことで、電子部品を製造する電子部品
の製造方法。6. An electronic component or a member for an electronic component in a state in which at least a portion of a surface of a rubber product or a rubber member that is in direct contact with an object to be handled is swollen with a solvent in a dust removing environment. For manufacturing electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11164299A JP3037685B2 (en) | 1998-05-08 | 1999-04-20 | How to use rubber products or rubber members |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12607998 | 1998-05-08 | ||
JP10-126079 | 1998-05-08 | ||
JP11164299A JP3037685B2 (en) | 1998-05-08 | 1999-04-20 | How to use rubber products or rubber members |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000026633A JP2000026633A (en) | 2000-01-25 |
JP3037685B2 true JP3037685B2 (en) | 2000-04-24 |
Family
ID=26450987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11164299A Expired - Fee Related JP3037685B2 (en) | 1998-05-08 | 1999-04-20 | How to use rubber products or rubber members |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3037685B2 (en) |
-
1999
- 1999-04-20 JP JP11164299A patent/JP3037685B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2000026633A (en) | 2000-01-25 |
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