JP3031703U - Substrate holding device - Google Patents

Abstract

(57) [Abstract] [PROBLEM] To make it possible to easily and reliably weld terminals by manual soldering using a soldering iron, greatly improving workability and reducing equipment costs. By pressing down to reduce costs, it will be possible to easily handle a wide variety of small-scale production. SOLUTION: When a plurality of terminals 3 which are respectively inserted into a plurality of holes communicating with a wiring pattern of a substrate 1 and projecting are soldered to the wiring pattern, a base 10 is held in an apparatus for holding the substrate 1. And holding means 1 for holding the substrate
1 and supporting means 30 for supporting the holding means 11 on the base 10 so that the substrate 1 is tilted with respect to the horizontal plane. The substrate 1 is held while being tilted with respect to the horizontal plane.
While the solder H is melted by the soldering iron K to flow down from above the terminal 3 which is on the upper slope of the surface of the terminal 3, the terminal 3 through which the solder flowing down passes is heated by the soldering iron K,
So that they can be soldered in sequence.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

 The present invention relates to a board holding device effective when soldering a plurality of terminals to a wiring pattern of a board as an electronic component.

[0002]

[Prior art]

 Generally, as a substrate of an electronic component, there is a substrate as shown in FIG. 6, for example. The substrate 1 is formed in a rectangular plate shape (for example, 50 mm × 10 mm), has a terminal wiring pattern (not shown) for terminal connection on the surface, and is inserted into a connector or the like at one side edge 1 a. It has a comb-teeth-shaped external wiring pattern 2 to be connected with each other. The substrate 1 is formed with a plurality of holes (not shown) communicating with the terminal wiring pattern. The holes are arranged in parallel in the longitudinal direction of the substrate 1 at a predetermined pitch P (for example, P = 1 to 3 mm), and are arranged in a plurality of rows (for example, three rows) at a predetermined row interval D (for example, D = 1 to 3 mm). ) Is provided. Then, the terminals 3 are inserted into these holes from the back surface of the substrate 1 and protruded by a predetermined dimension, and are connected to each terminal wiring pattern by soldering. As a result, each terminal 3 is also arranged in a plurality of rows at a predetermined pitch P and a predetermined row interval D, like the above holes. At both ends of the substrate 1 in the longitudinal direction, resin-made rod-shaped attachment members 4 to be the housing of the substrate 1 are attached at a predetermined angle θ with respect to the substrate surface.

In such a board 1, when the terminals 3 are welded to the terminal wiring pattern by soldering, conventionally, for example, a method of applying cream solder and then irradiating with laser, or a method using a soldering iron is used. There is a method of welding the terminals 3 one by one by work. A method of dipping solder treatment, reflow treatment, or the like in which the solder is melted in hot water may be considered. However, since the attachment member 4 is attached, the attachment member 4 is affected by the heat of the solder water. Its application is difficult because it will break.

[0004]

[Problems to be solved by the device]

 By the way, in the conventional soldering method for PCBs, the former cream solder requires expensive equipment such as a laser irradiation device, resulting in high equipment costs, especially when producing large quantities in small quantities. There was a problem that was not suitable for. Also, in the latter method of welding the terminals 3 one by one, the welding must be done one by one, so the work becomes complicated, and especially when the distance between the terminals 3 is 3 mm or less. Had a problem that even a skilled worker was extremely complicated and the workability was poor. Further, there is a problem in that the amount of solder is likely to vary, and the amount of solder rises or is small, resulting in poor soldering quality.

The present invention has been made in view of the above problems, and enables the terminal to be easily and surely welded by manual soldering using a soldering iron, thereby improving workability. It is an object of the present invention to provide a substrate holding device that can significantly cope with a large variety of small-quantity production by reducing the equipment cost and thereby reducing the cost.

[0006]

[Means for Solving the Problems]

 In order to achieve such an object, the board holding device of the present invention solders a plurality of terminals, which are respectively inserted into a plurality of holes communicating with the wiring pattern of the board and projecting, to the wiring pattern. When performing the above, in a substrate holding device for holding the substrate, a base, a holding means for holding the substrate, and a support for supporting the holding means on the base so that the substrate is inclined with respect to a horizontal plane. And means.

Then, if necessary, the holding means includes a clamp mechanism for holding the substrate. Also, if necessary, the holding means is configured to include a clamp mechanism that holds the substrate, and the clamp mechanism cooperates with a support member that supports one side edge of the substrate and the support member. And a holding member that is movable to two positions, a holding position for holding one side edge of the substrate and a separation position separated from the holding position, and the holding member is locked so that the holding member can be unlocked in the holding position. A lock mechanism is further provided, and the holding means is further provided with a support body which supports the other side edge portion of the substrate in the same position as the support member of the clamp mechanism. In this case, it is effective that the support member of the clamp mechanism of the holding means, the holding member, and the support body of the holding means are made of a heat insulating material that cannot be welded to the solder.

Further, if necessary, the supporting means is configured so that the angle of the substrate can be adjusted. In this case, the supporting means includes a rotating member that supports the holding means and is rotatably provided on the base, and a positioning holding mechanism that positions and holds the rotating member at an appropriate rotating position. Are configured. Further, in this case, it is effective that the holding means is provided on the rotating member via a support shaft rotatable about an axis orthogonal to the rotating shaft of the rotating member. Furthermore, if necessary, the holding means is constituted by providing a restraining means for restraining an attached member attached to the substrate at a predetermined angle.

In addition, if necessary, the support means is a rotation member that is rotatably provided on a stand that supports the holding means and that is provided on the base and that has a horizontal rotation axis, and the rotation member. A positioning holding mechanism for positioning and holding the member at an appropriate turning position is provided so that the angle of the substrate can be adjusted, and the holding means is attached to the turning shaft of the turning member. A slider provided on the rotating member via a support shaft rotatable about orthogonal shafts, and the positioning holding mechanism is fitted to the rotating member and provided between the support shaft and a stand. A spacer; a bolt provided at the other end of the rotating member; and a screw tightened on the bolt to press the rotating member against a stand via the spacer, A nut for fixing the support shaft to the stand, and a nut provided on the nut. It is effective to have an operation handle for rotating the.

[0010]

[Embodiment of device]

 Hereinafter, a substrate holding device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same components as those described above will be designated by the same reference numerals. As shown in FIGS. 1 to 5, the substrate holding device according to the embodiment holds the same substrate 1 as described above.

As shown in FIGS. 1 and 6, the substrate 1 is formed in a rectangular plate shape (for example, 50 mm × 10 mm) and has a terminal wiring pattern (not shown) for terminal connection on the surface. In addition, it has a comb-teeth-shaped external wiring pattern 2 to be inserted into a connector or the like at one side edge 1a. The substrate 1 also has a plurality of holes (not shown) communicating with the terminal wiring pattern. The holes are arranged in parallel in the longitudinal direction of the substrate 1 at a predetermined pitch P (for example, P = 1 to 3 mm), and are arranged in a plurality of rows (for example, three rows) at a predetermined row interval D (for example, D = 1 to 3 mm). ) Is provided. Then, the terminals 3 are respectively inserted into the holes from the back surface of the substrate 1 so as to protrude by a predetermined dimension, and are connected to the wiring patterns of the terminals by soldering. As a result, each terminal 3 is also provided in a plurality of rows with a predetermined pitch P and a predetermined row spacing D, like the above holes, and is densely inserted at a small spacing. At both ends of the substrate 1 in the longitudinal direction, resin-made rod-shaped attachment members 4 to be the housing of the substrate 1 are attached at a predetermined angle θ with respect to the surface of the substrate 1. A groove 5 is formed inside the attachment member 4 along the longitudinal direction.

The basic configuration of the substrate holding device according to the embodiment shown in FIGS. 1 to 5 is that a base 10 to be grounded, a holding means 11 for holding the substrate 1, and a substrate 1 with respect to a horizontal plane. Supporting means 30 for supporting the holding means 11 on the base 10 so as to be tilted is provided. The holding means 11 is configured to include a clamp mechanism 12 that holds the substrate 1. In the clamp mechanism 12, 13 is a support member having a rectangular support surface for supporting one side edge portion 1a of the substrate 1, and is fixed on a first fixing member 14 made of metal with screws or the like. . The support member 13 is made of a heat insulating material such as bakelite or ceramics that cannot be welded to solder.

Reference numeral 15 denotes a holding position A (FIG. 2) for holding the one side edge portion 1a of the substrate 1 in cooperation with the support member 13 and a separation position B (FIG. 4) separated from the holding position A. The holding member has a movable rectangular contact surface. The holding member 15 is also made of a heat insulating material such as Bakelite or ceramics that cannot be welded to the solder, like the support member 13. The holding member 15 is rotatable via a drive link 17 on the second fixing member 16 made of metal, which faces the first fixing member 14 made of metal and is connected to the first fixing member 14 by a connecting member 16a. And is positioned at the holding position A 1 and the separation position B by this rotation.

Reference numeral 18 denotes a lock mechanism that locks the holding member 15 at the holding position A so that the holding member 15 can be unlocked. The lock mechanism 18 is a well-known toggle mechanism having a first link 18a that rotates in the same direction as the drive link 17 and a second link 18b that is installed between the first link 18a and the drive link 17. It is composed of. Reference numeral 19 denotes an operation lever, which is provided on the first link 18a to rotate the holding member 15 via the first link 18a and the second link 18b, and locks the locking mechanism 18 at the holding position A of the holding member 15. Is to enable.

Further, the holding means 11 is configured to include a bearing body 20 having a rectangular bearing surface that bears the other side edge portion 1b of the substrate 1 in the same direction as the bearing member 13 of the clamp mechanism 12. The support 20 is fixed to the metal third fixing member 21 facing the metal first fixing member 14 and connected to the first fixing member 14 by a connecting member 21a with a screw or the like. It has a bearing surface that is the same as the bearing surface of the bearing member 13, and is formed so that both side edges of the substrate 1 can be supported together with the bearing member 13. Further, like the support member 13, the support body 20 is formed of a heat insulating material that cannot be welded to solder, such as Bakelite or ceramics. Furthermore, the holding means 11 is provided with a restraining means 22 for restraining the attachment member 4 attached to the substrate 1 at a predetermined angle. The restraint means 22 is composed of ridges 23 provided on both sides of the third fixing member 21. The ridges 23 are slidably engaged with the grooves 5 formed inside the attachment member 4 of the base plate 1 when the base plate 1 is supported by the support member 13 and the support body 20.

The support means 30 is configured so that the angle of the substrate 1 can be adjusted. Specifically, as shown in FIG. 2, in the supporting means 30, 31 supports the support shaft 24 of the second fixing member 16 of the holding means 11 and is rotatably provided on the base 10 via a stand 32. It is a rotating member. The support shaft 24 is formed in a cylindrical shape and is provided so as to hang down from the lower portion of the second fixing member 16. The rotating member 31 is rotatably inserted into the through hole 33 provided in the stand 32 so that its axis line becomes horizontal. The support shaft 24 has a shaft that directly intersects with the rotation shaft of the rotation member 31, and is inserted into an insertion hole 34 provided at one end side of the rotation member 31 so as to be rotatable around this shaft. It has been inserted.

Reference numeral 35 is a position holding mechanism for positioning and holding the rotating member 31 and the support shaft 24 at appropriate rotating positions. As shown in FIG. 2, the positioning and holding mechanism 35 includes a spacer 36 fitted to the rotating member 31 and provided between the support shaft 24 and the stand 32, and a spacer 36 on the other end of the rotating member 31. The bolt 37 provided and screwed to the bolt 37 and tightened to press the rotating member 31 against the stand 32 via the spacer 36, and the rotating member 31 and the support shaft 24 to the stand 32. A nut 38 fixed to the nut 38 and an operation handle 39 provided on the nut 38 for rotating the nut 38 are provided.

Therefore, when the terminal 3 of the substrate 1 is soldered by using the substrate holding device according to this embodiment, it is performed as follows. The angle of the holding device is set in advance. First, the nut 38 is loosened by the operation handle 39 of the positioning and holding mechanism 35 to release the rotating member 31 and the support shaft 24. Then, the rotating member 31 and the support shaft 24 are appropriately rotated to tilt the substrate 1. In this case, when the soldering described later is performed, it is necessary to test several boards 1 in advance so that the flow of the solder is properly performed and excess solder is easily discharged. . For example, the two rotations of the rotation member 31 and the support shaft 24 cause the substrate 1 to rotate by the angle α 1 in FIG. 5 and the angle β in FIG. 3, and as shown in FIG. Therefore, it is desirable that the corner portion 1c on the bearing 20 side be adjusted so as to have an inclined lower end. Then, when the angle setting is completed, the nut 38 is tightened and fixed by the operation handle 39.

In this state, the substrate 1 in which the terminals 3 are previously inserted and which is projected is held by the holding device. First, as shown in FIG. 4, the holding member 15 of the clamp mechanism 12 is opened at the separated position B, and the groove 5 of the attachment member 4 is slidably engaged with the ridge 23 of the restraining means 22. Meanwhile, the substrate 1 is supported by the support member 13 and the support body 20 of the clamp mechanism 12. Next, as shown in FIG. 2, the gripping member 15 is set to the gripping position A by the operation lever 19 and locked by the lock mechanism 18. As a result, the substrate 1 is held by the holding means 11. In this case, a release portion that does not hold the substrate 1 is provided below the inclined side of the substrate 1. That is, the corner portion 1c on the supporting body 20 side, which is the inclined lower side of the substrate 1, serves as a release portion. Further, since the substrate 1 can be held by the one-touch operation of the clamp mechanism 12, the operability is extremely good, and accordingly, the workability is good.

In this case, the comb-teeth-shaped external wiring pattern 2 on the one side edge 1 a of the substrate 1 is held by the support member 13 and the holding member 15 of the clamp mechanism 12 so as to be covered. Further, the one edge portion 1a of the base plate 1 is held by the support member 13 and the holding member 15 of the clamp mechanism 12, so that if the substrate 1 is warped or bent, this is corrected. Further, since the other side edge 1b of the substrate 1 is supported by the support body 20 and is on the same side as the support member 13, the other side edge 1b also follows the support body 20 by holding the clamp mechanism 12. Therefore, the substrate 1 is surely corrected. Further, when the substrate 1 is clamped and fixed by the clamp mechanism 12, the substrate 1 becomes a flat plate and the attachment member 4 is constrained by the protrusions 23 of the constraining means 22, so that as shown in FIG. The angular relationship (θ) between the substrate 1 and the attachment member 4 is corrected.

In this state, as shown in FIG. 1, a plurality of terminals 3 are soldered with a soldering iron K to the terminal wiring pattern on the surface of the substrate 1. At this time, for example, the winding solder H is added to the row of the terminals 3. Then, the winding solder H is melted with a soldering iron K to flow down from above the terminal 3 which is on the upper slope of the surface of the substrate 1, and the terminal 3 through which the flowing down solder passes is heated with the soldering iron K. While soldering, start from the highest terminal 3. As a result, the flowing solder passes through the heated terminals 3 in order, so that the terminals 3 and the terminal wiring pattern are sequentially welded.

In this case, even with manual soldering using the soldering iron K, it is sufficient to flow down the solder while heating the terminal 3, so that the terminal 3 can be welded extremely easily and reliably. The workability can be greatly improved. In addition, since the solder flows down, excess solder is prevented from fusing, which prevents variations in the amount of solder, prevents swelling or low soldering, and significantly improves soldering quality. Be improved to. Furthermore, since the substrate 1 is held by the clamp mechanism 12 and also supported by the support 20, the substrate 1 is reliably pressed, and therefore, even if it is pressed by the soldering iron K, it does not wobble easily. The soldering work is stable and the workability is improved, and the welding is performed reliably. Furthermore, since the support member 13, the holding member 15 and the support body 20 of the clamp mechanism 12 are made of a heat insulating material that cannot be welded to the solder, the heat given by the soldering iron K does not easily escape from the substrate 1 and is welded. Since the temperature of the part can be maintained, the welding is surely performed in this respect as well.

Further, the external wiring pattern 2 on the one side edge portion 1 a of the substrate 1 is sandwiched and covered by the support member 13 and the sandwiching member 15 of the clamp mechanism 12, and the sandwiching member 15 is further covered by Since it cannot be welded to the solder, the solder is unlikely to enter the external wiring pattern 2, and therefore, the external wiring pattern 2 which is an unnecessary exposed portion of the solder is prevented from being affected. In particular, when the corner portion 1c on the supporting body 20 side is adjusted so that the corner portion 1c is on the inclined lower end of the substrate 1, it is difficult to flow to the one side edge portion 1a side. 2 is prevented.

On the inclined lower side, the flowed-down solder partially drops and partially adheres to the lower terminal 3 a little. A large amount of solder is removed while melting at the tip of the soldering iron K and dropped. In this case, since the releasing portion (corner portion 1c) that does not hold the substrate 1 is provided on the inclined lower side of the substrate 1, the excess solder flowing down can be easily discharged from the releasing portion, which improves workability. To be Further, since this release portion is composed of the corner portion 1c on the side of the support body 20 on the lower side of the inclination of the substrate 1 and is located at the lowermost end of the inclination, the solder flowing down should flow down toward this corner portion 1c. Therefore, also in this respect, the excess solder can be easily discharged, and the workability can be improved.

When the soldering is completed in this way, the clamp mechanism 12 is released and the substrate 1 is removed. In this case, the board 1 is corrected into a flat plate shape, and the angular positional relationship with the attachment member 4 is also corrected, so that the shape is excellent, and the solder is welded at a proper position and a proper amount is welded, so that the quality is good. The substrate 1 is obtained. Then, similarly to the above, the next substrate 1 may be soldered.

[0026]

【Example】

 Next, examples will be described. In the embodiment, the board 1 is provided with a housing projecting from the surface as the attachment member 4, and a large number of terminals 3 whose tip is cut are inserted in three rows at intervals of 1.3 mm. The inclination angle α between the plane in the longitudinal direction of the substrate 1 and the horizontal plane is set to about α = 35 °, a soldering iron K having a tip diameter of 4.5φ and a capacity of 17.5W is used, and 0.8φ winding solder is used. H was melted. When the solder is heated above the inclined substrate 1, the melted solder flows downward while adhering to the roots of the terminals 3 inserted into the holes of the terminal wiring pattern of the substrate 1, and the surplus drops or falls. A large amount was attached to the terminal 3. A large amount of solder was removed while melting and adhering at the tip of the soldering iron K.

Although the toggle mechanism is used as the clamp device in the above-described embodiment, the clamp device is not necessarily limited to this, and a mini air cylinder or the like may be used as appropriate. Further, the substrate 1 to which the present invention is applied is not limited to the above-mentioned one, and may have any shape. Furthermore, the number and the intervals of the terminals 3 provided on the substrate 1 are not limited to those described above. Furthermore, it goes without saying that the holding device according to the present invention may be used not only for the above-mentioned soldering but also for correction.

[0028]

[Effect of device]

 As described above, according to the substrate holding apparatus of the present invention, the holding means for holding the substrate and the supporting means for supporting the holding means on the base so that the substrate is inclined with respect to the horizontal plane are provided. Since the board can be held tilted, it is possible to perform soldering manually by soldering the board to the board using a soldering iron, by allowing the solder to flow down while heating the terminal, and it is extremely simple and reliable. Can be welded, and workability can be greatly improved. That is, the board is tilted with respect to the horizontal plane, and while the terminals are heated with the soldering iron from above the terminals on the upper side of the tilt of the board, the solder is melted with the soldering iron to flow down, and the terminals are sequentially soldered In manual soldering with a soldering iron, it is only necessary to allow the solder to flow down while heating the terminals, so it is possible to weld the terminals very easily and reliably. Workability can be significantly improved. Especially, it is extremely effective when the distance between the terminals is as small as 3 mm or less.

Further, since the solder flows down, it is possible to prevent the excess solder from being welded, so that it is possible to prevent variations in the amount of solder from occurring, and to prevent a situation where the amount of solder rises or is small. The quality can be greatly improved. Furthermore, when it is difficult to apply the method of welding by soldering to solder such as dip soldering process or reflow process, there is no need to use special welding such as cream soldering that requires expensive equipment such as laser irradiation equipment. However, welding can be performed easily. Therefore, the equipment cost can be kept low, and it is possible to easily cope with a wide variety of small-quantity production.

Further, when the holding means is constituted by a clamp mechanism for holding the board, the board is held by the clamp mechanism, so that the board can be surely pressed, so that it is pressed by the soldering iron, etc. Even if it does not wobble easily, the soldering work will be stable, the workability will be improved, and the welding can be done more reliably. Further, since the substrate can be held by one-touch operation of the clamp mechanism, the operability is extremely good, and the workability can be improved accordingly. Furthermore, since the board is clamped by the clamp mechanism, if there is a warp or a bend in the board, it can be corrected, the shape is excellent, the solder is performed at the proper position, and an appropriate amount of welded quality is applied. A good substrate can be obtained.

Further, the holding means includes a clamp mechanism having a support member and a holding member for pressing one side edge portion of the substrate, and a support body that supports the other side edge portion of the substrate at the same position as the support member of the clamp mechanism. In the case of the provision, the supporting member and the supporting body of the clamp mechanism support the boards on the same side from both sides, so that in addition to the clamping function of the clamp mechanism, the board can be pressed surely and securely. It can be straightened into a flat plate. Further, when the support member of the clamp mechanism of the holding means, the holding member and the support body of the holding means are made of a heat-insulating material that cannot be welded to the solder, the heat from the soldering iron does not easily escape from the board and Since it can be held, it is possible to reliably perform welding. Also, if there is an unnecessary exposed part of the solder such as the external wiring pattern for the connector on the side edge part, it can be covered up and the solder will not be welded, so that there is no solder between the board and the holding member. It is difficult for the metal to enter, and therefore it is possible to suppress the influence on the exposed exposed portion of the solder. In addition, since the amount of solder adhered is small and the solder need not be removed and cleaned, it is possible to endure continuous use.

Furthermore, when the supporting means is configured so that the angle of the board can be adjusted, the angle of the board can be adjusted to various angles, so that the flow condition of the solder can be adjusted and a proper welded state can be obtained. it can. In addition, since the tilt angle of the board surface can be adjusted, it is possible to quickly deal with subtle differences in the board surface angle due to changes in the indoor atmosphere, the solder material, the soldering tool, and individual differences in body size and habits. It is possible to find the optimum board angle for the current environment.

Further, the supporting means includes a rotating member that supports the holding means and is rotatably provided on the base, and a positioning holding mechanism that positions and holds the rotating member at an appropriate rotating position. In this case, the tilt angle can be adjusted with a simple mechanism. In this case, if the holding means is provided on the rotating member via a support shaft rotatable about an axis orthogonal to the rotating shaft of the rotating member, the angle can be adjusted by two-axis rotation. The degree of freedom in changing the flow direction of the solder is increased, so that it is possible to prevent the solder from flowing easily to the exposed portion where the solder is not needed, and to suppress the adverse effect. Further, in this case, if the holding means is configured by providing a restraining means for restraining the attached member attached to the substrate at a predetermined angle, the attached member can be restrained, so that the substrate can be held when the substrate is held by the clamp mechanism. In addition to straightening, the predetermined angle between the substrate and the attached member can be straightened at the same time.

Further, the holding means is provided on the rotating member via a support shaft rotatable about an axis orthogonal to the rotating shaft of the rotating member, and the positioning holding mechanism is provided on the rotating member. A spacer fitted and provided between the spindle and the stand, a bolt provided at the other end of the rotating member, and a bolt that is screwed into the bolt and tightened to move the rotating member through the spacer. When a nut is provided to press the rotating member and the support shaft to the stand by pressing it against the stand, and an operation handle provided on the nut for rotating the nut, the above-mentioned board is provided with a simple mechanism. It has the effect that the angle can be adjusted by rotating the two axes.

[Brief description of drawings]

FIG. 1 is a side view showing a substrate holding device according to an embodiment of the present invention.

FIG. 2 is a front partial cross-sectional view showing a substrate holding device according to an embodiment of the present invention.

FIG. 3 is a plan view showing a substrate holding device according to an embodiment of the present invention.

FIG. 4 is a front view of essential parts of the substrate holding device according to the embodiment of the present invention.

FIG. 5 is a side view showing a substrate holding device according to an embodiment of the present invention.

FIG. 6 is a perspective view showing an example of a substrate held by the substrate holding device according to the embodiment of the present invention.

[Explanation of symbols]

 K soldering iron H winding solder 1 substrate 1a one side edge part 1b other side edge part 1c corner part (opening part) 2 external wiring pattern 3 terminal 4 attachment member 5 groove 10 base 11 holding means 12 clamp mechanism 13 support member 14 First fixing member 15 Holding member A Holding position B Separation position 16 Second fixing member 17 Drive link 18 Lock mechanism 19 Operating lever 20 Bearing 21 Third fixing member 22 Restraint means 23 Protrusion 24 Spindle 30 Support means 31 Rotation Member 32 Stand 35 Positioning / holding mechanism 39 Operation handle

Claims (9)

[Scope of utility model registration request] 1. A substrate holding device for holding a substrate when soldering a plurality of terminals, each of which is inserted into a plurality of holes communicating with a wiring pattern of the substrate and projecting, to the wiring pattern. A substrate holding device comprising: a base, a holding means for holding the substrate, and a supporting means for supporting the holding means on the base so that the substrate is inclined with respect to a horizontal plane. 2. The holding means comprises a clamp mechanism for holding the substrate.
The substrate holding device described. 3. The holding means comprises a clamp mechanism for holding the substrate, and the clamp mechanism cooperates with a support member that supports one side edge of the substrate and the support member. A holding member that is movable to two positions, a holding position for holding one side edge of the substrate and a separation position separated from the holding position, and a locking mechanism that locks the holding member so that the holding member can be unlocked at the holding position. 2. The substrate according to claim 1, wherein the holding means further comprises a support body that supports the other side edge portion of the substrate at the same position as the support member of the clamp mechanism. Holding device. 4. The substrate holding device according to claim 3, wherein the support member of the clamp mechanism of the holding means, the holding member, and the support body of the holding means are made of a heat insulating material that cannot be welded to solder. . 5. The supporting means is configured so that the angle of the substrate can be adjusted.
3. The substrate holding device according to 3 or 4. 6. A rotating member that supports the holding means and is rotatably provided on the base, and a positioning holding mechanism that positions and holds the rotating member at an appropriate rotating position. The substrate holding device according to claim 5, wherein the substrate holding device is provided. 7. The rotating member is provided with the holding means via a support shaft rotatable about an axis orthogonal to the rotating shaft of the rotating member. 6. The substrate holding device according to item 6. 8. The holding means comprises a restraining means for restraining an attachment member attached to the substrate at a predetermined angle.
The substrate holding device described. 9. A substrate holding device for holding a substrate when soldering a plurality of terminals, each of which is inserted into a plurality of holes communicating with a wiring pattern of the substrate and projecting, to the wiring pattern. A table, a holding means for holding the substrate, and a supporting means for supporting the holding means on the base so that the substrate is inclined with respect to a horizontal plane, and a clamp for holding the holding means with the substrate. And a holding position for holding the one side edge of the substrate, and a holding position and a holding position for holding the one side edge of the substrate in cooperation with the supporting member. A holding member that is movable to two separated positions and a lock mechanism that locks the holding member so that the holding member can be unlocked at the holding position. Same as bearing member And a supporting member for supporting the other side edge portion of the substrate, the supporting member of the clamp mechanism of the holding means, the holding member, and the supporting member of the holding means are formed of a heat insulating material that cannot be welded to solder. A rotating member having the horizontal rotating shaft rotatably provided on a stand provided on the base for supporting the holding means, and the rotating member at an appropriate rotating position. A positioning and holding mechanism for positioning and holding is provided so that the angle of the substrate can be adjusted, and the holding means can be rotated about an axis orthogonal to the rotation axis of the rotating member. A spacer provided on the rotating member via a support shaft and fitted to the rotating member so that the positioning holding mechanism is provided between the support shaft and a stand; With the bolts provided at the end, A nut for pressing the rotating member against the stand via the spacer to fix the rotating member and the support shaft to the stand, and an operation handle provided on the nut for rotating the nut are configured. A substrate holding device, characterized in that the holding means is provided with a restraining means for restraining an attachment member attached to the substrate at a predetermined angle.