JP3028453B2 - PCB cutting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board cutting apparatus suitable for cutting a plurality of unit printed circuit boards from a multi-panel board.

[0002]

2. Description of the Related Art Conventionally, a board moving mechanism is used to move a plurality of printed circuit boards integrated with a plurality of printed circuit boards with respect to a cutter, and to cut a plurality of unit printed circuit boards from the plurality of printed circuit boards. The cutting device is known, and the applicant of the present invention has already disclosed in
No. 3333 proposes this.

In the cutting apparatus disclosed in the publication, a V-groove (cutting line) formed in advance on a multiple substrate is further cut by a cutter to a thickness of about 0.1 to 0.2 m.
m is formed by cutting a separation groove. Thereby, the separation groove can be easily broken to separate each unit printed circuit board.

[0004]

By the way, the substrate moving mechanism provided in such a conventional cutting device supports a plurality of positions of the multi-faced substrate at a plurality of points by a point support structure.
In addition, as shown in FIG. 5, while the upper surface of the set multi-layer substrate is pressed by the pressing roller, the lower surface of the multi-layer substrate is cut by the rotating cutting blade (cutter) disposed below the pressing roller. In addition, depending on the position of the cutting line, there is a problem in that the bending pressure is generated at the time of cutting, so that the multiple substrate is bent and deformed, thereby lowering the cutting accuracy and the cutting quality.

The present invention has been made to solve the problems existing in the prior art, and it is possible to realize high-precision and high-quality cutting by reliably preventing bending deformation of a multi-panel substrate during cutting. An object of the present invention is to provide a printed circuit board cutting device.

[0006]

According to the present invention, a board P is moved by a board moving mechanism section 2 with respect to a cutter 3, and a plurality of unit printed boards Pa,
When configuring the printed circuit board cutting apparatus 1 for cutting Pb ..., notches that allow the cutter 3 to enter, having board holding grooves 4p and 4q that slidably support both sides of the multi-panel board P. Part 10p, 1
A pair of X-direction guide rails 5p, 5q having 0q,
The substrate moving mechanism unit 2 includes an X-direction moving drive unit 6 for moving the multi-panel substrate P in the X direction, and a Y-direction moving drive unit 7 for moving the X-direction guide rails 5p, 5q in the Y direction. And

In this case, according to the most preferred embodiment, the X-direction moving drive unit 6 is provided with a board locking mechanism 8 which is slidably mounted on the X-direction guide rails 5p and 5q and locks the multi-panel board P. And the board locking mechanism 8
Are provided with positioning projections 9 to be fitted into the recesses Ph provided on the multiple substrate P. Also, the X-direction guide rail 5
and Y-direction guide rails 11p and 11q that slidably support p and 5q.

[0008]

According to the printed circuit board cutting apparatus 1 of the present invention, both ends of the multi-panel board P are connected to the pair of X-direction guide rails 5p, 5q in the board moving mechanism 2.
Are slidably supported by the substrate holding grooves 4p and 4q. That is, the multi-panel substrate P is line supported (surface supported) by the substrate holding grooves 4p and 4q. In addition, the multiple board P
Is moved in the longitudinal direction (X direction) of the substrate holding grooves 4p and 4q by the X direction movement drive unit 6. In this case, the X-direction movement drive unit 6 includes a board locking mechanism 8 that is slidably mounted on the X-direction guide rails 5p and 5q. The board locking mechanism 8 is moved and the board locking mechanism 8 is moved. The positioning projections 9 provided on the mechanism section 8 are fitted into the concave sections Ph provided on the multiple board P, and the board locking mechanism 8 locks the multiple board P. Therefore, the multiple board P moves integrally by the movement of the board locking mechanism 8,
The movement of the multiple substrate P in the X direction is controlled by the X direction movement drive unit 6.

On the other hand, the X-direction guide rails 5p, 5q are moved by the Y-direction movement
Moved in the direction. In this case, the X-direction guide rails 5p and 5q are slidably supported by the Y-direction guide rails 11p and 11q.
p and 5q move along the Y-direction guide rails 11p and 11q. Therefore, the movement of the multiple substrate P is controlled in the Y direction by the Y direction movement drive unit 7.

Therefore, if the board P is relatively moved in the X and Y directions with respect to the cutter 3 by the board moving mechanism 2, a plurality of unit printed boards Pa, Pb... Are cut from the board P. it can. At this time, when the cutting direction is perpendicular to the X-direction guide rails 5p and 5q, the cutter 3
After entering the notches 10p and 10q provided in p and 5q, cutting can be performed up to the end of the multi-panel substrate P.

[0011]

Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, a cutting apparatus 1 according to the present embodiment.
Will be described with reference to FIGS.

In FIG. 4, reference numeral 20 denotes a machine base.
Is provided with a substrate moving mechanism 2. The board moving mechanism 2 has a pair of Y-direction guide rails 11p and 11q,
The direction guide rails 11p and 11q are provided on the upper surface of the machine base 20,
It is fixed by being spaced apart in parallel so that the longitudinal direction is the Y direction.

On the other hand, Y-direction guide rails 11p and 11q
A pair of X-direction guide rails 5p, 5q perpendicular to and spaced apart from the respective Y-direction guide rails 11p, 11q are arranged above the. Each X direction guide rail 5p, 5q
Are provided on the bottom surface of the Y-axis guide rails 11p, 11q.
To slide freely. Reference numeral 7 denotes a Y-direction movement drive unit that moves each of the X-direction guide rails 5p and 5q in the Y direction. For example, a ball screw provided on the upper surface of the machine base 20 and a ball nut provided on the bottom surface of the X-direction guide rail 5q And a ball screw mechanism or the like.

The X-direction guide rail 5p is connected to the horizontal portion 2
It is formed in an L-shaped section having 2p and a vertical portion 23p. Then, as shown in FIG. 3, the front end of the horizontal portion 22p is formed with a step, and the groove forming plate 24p is fixed with screws or the like to provide a substrate holding groove 4p having a rectangular concave cross section. . In this case, as shown in FIG. 1, a notch 10 p cut in a rectangular shape from the tip end side is provided at the center of the horizontal portion 22 p. The notch 10p allows the cutter 3 to enter during cutting.
On the other hand, the vertical rail 23p is provided with an auxiliary rail 25p extending in the longitudinal direction. As described above, one X-direction guide rail 5p
However, the other X-direction guide rail 5q is formed similarly except that it is symmetric with respect to the one X-direction guide rail 5p. In the X direction guide rail 5q, 4q is a substrate holding groove, 22q is a horizontal portion, 2q
3q is a vertical part, 24q is a groove forming plate, and 25q is an auxiliary rail part. Therefore, the openings of the board holding grooves 4p and 4q are opposed to each other, and the board holding grooves 4p and 4q can slidably support both side edges of the multi-panel board P on which a plurality of printed boards are integrated. .

Further, a board locking mechanism 8 having a rectangular locking frame 26 is disposed above the X-direction guide rails 5p and 5q. Slider portions 27 are provided at a total of four locations in the locking frame 26, and each slider portion 27 is provided with a vertical portion 23p in each X-direction guide rail 5p, 5q,
23q and the auxiliary rails 25p, 25q are slidably loaded. Further, locking portions 28 are provided at a total of four positions on the locking frame 26. Locking part 2
As shown in FIG. 3, each of the projections 8 has a positioning projection 9 at the tip thereof, and this positioning projection 9 can be fitted into a recess (hole) Ph provided at each of the four corners of the multi-panel substrate P. To distribute. The locking portions 28 are supported by rods 29, are rotatable about the rods 29, and are position-adjustable according to the size and shape of the multi-panel substrate P. Therefore, the multiple board P is locked by the positioning projections 9 in the board locking mechanism 8 and is positioned in the X direction, and together with the board locking mechanism 8, the X-direction guide rails 5p, 5q. Along the X direction. Reference numeral 6 denotes an X-direction movement drive unit for moving the board locking mechanism 8, which can be constituted by, for example, a ball screw mechanism including a ball screw provided on the X-direction guide rail 5p and a ball nut provided on the locking frame 26. .

On the other hand, the cutter 3 is disposed on the machine base 20. As shown in FIGS. 3 and 5, the cutter 3 includes a rotary cutting blade 31 located below the multi-faced substrate P,
A rotation drive unit 32 for rotating the cutting blade 31 is provided. The cutting blade 31 is formed by a grindstone, etc.
The sectional shape of c is formed flat. The cutting blade 3
1 is positioned at a straight line in contact with its end face.
It is set so as to pass through the approximate center of p and 10q. On the other hand, a pressing roller 34 rotatably supported by a support mechanism 33 is disposed above the multiple substrate P at a position facing the cutting blade 31. In this case, the peripheral surface 34c of the pressing roller 34 is provided with a concave groove 34s along the circumferential direction. The direction of the cutting blade 31 and the pressing roller 34 is 90 degrees.
° can be changed, and the position is controlled so as to approach or separate from the multiple substrate P.

On the other hand, reference numeral 35 denotes a controller for performing NC control. The controller 35 controls the X-direction movement drive unit 6, the Y-direction movement drive unit 7, and the rotation drive unit 32 in the substrate movement mechanism unit 2, and controls the entire apparatus. Prepare.

Next, the cutting device 1 according to the present embodiment
Will be described with reference to the drawings.

First, both side edges of the multiple board P are aligned with the board holding grooves 4p of the X-direction guide rails 5p and 5q.
Insert at 4q. In this case, the cutting blade 31 and the pressing roller 34 are kept apart. As a result, the multi-panel board P moves along the X-direction guide rails 5p and 5q, that is,
It is slidably supported in the X direction. Note that electronic components and the like are mounted on the multiple-surface board P. V-grooves Sv are formed on both surfaces of the multiple substrate P in the X and Y directions along a plurality of cutting lines, and concave portions (holes) Ph are formed at four corners.

Then, the locking portions 28 provided on the substrate locking mechanism 8 are displaced, and the positioning projections 9 are inserted into the concave portions Ph of the multiple substrate P as shown in FIGS. And
The multiple board P is locked and positioned by the board locking mechanism 8.

On the other hand, the controller 35 controls the X-direction moving drive unit 6 to move the board locking mechanism 8 in the X direction, thereby positioning a predetermined cutting line on the multi-panel board P on the cutter 3. In addition, the controller 35 controls the Y-direction movement drive unit 7 to move the X-direction guide rails 5p and 5q in the Y direction, thereby positioning the cutting start position of the multi-panel substrate P on the cutter 3. Then, the pressing roller 34 and the cutting blade 31 are moved in the approaching direction to set the cutting blade 31 at the cutting position. As a result, the controller 35 controls the rotation drive unit 32 to rotate the cutting blade 31 and controls the Y-direction movement drive unit 7 to move the X-direction guide rails 5p and 5q (the multi-layer substrate P) in the Y direction. Then, the lower surface of the multiple substrate P is cut along the cutting line. At this time, the peripheral groove 34s of the pressing roller 34 abuts the peripheral surface 34c of the pressing roller 34 across the V groove Sv formed on the multiple substrate P, so that the unit printed circuit boards Pa and Pb on both sides are stable. Is held.

When the cutting for one cutting line has been completed, the board P is moved by the board moving mechanism unit 2 or the direction of the cutting blade 31 and the pressing roller 34 is changed by 90 °, and Other cutting lines (V-grooves Sv) formed on the lower surface of P are cut in the same manner. When the cutting direction is perpendicular to the X-direction guide rails 5p and 5q, the cutter 3
Can enter the notches 10p, 10q in the X-direction guide rails 5p, 5q, and cut to the end of the multi-panel substrate P.

As a result, a rectangular separation groove Sp is cut and formed on the lower surface of the multiple substrate P as shown in FIG. In this case, the thickness D between the bottom of the V-groove Sv formed on the upper surface of the multiple substrate P and the separation groove Sp is approximately 0.1 to 0.
It is desirable to cut so as to be 2 mm, and optimally about 0.15 mm. In addition, by making the separation groove Sp rectangular, even if a slight displacement occurs in the surface direction of the substrate, an accurate dimension of the thickness D with respect to the V groove Sv can be secured.

When all the separation grooves Sp have been formed by cutting, the multiple substrate P is removed from the substrate holding grooves 4p and 4q. At this time, since the multiple substrate P is integrated, it can be easily and quickly removed. Each of the unit printed circuit boards Pa, Pb,.
b ... are easily separated from each other.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The configuration, shape, quantity, and the like of the details can be arbitrarily changed without departing from the gist of the present invention.

[0027]

As described above, the present invention relates to a printed circuit board cutting apparatus for moving a plurality of printed circuit boards with respect to a cutter by a board moving mechanism and cutting a plurality of unit printed circuit boards from the plurality of printed circuit boards. A pair of X-direction guide rails having a substrate holding groove for slidably supporting both side edges of the X-axis and a notch for allowing the cutter to enter, and an X-direction movement drive for moving the multi-faced substrate in the X-direction Part and the X-direction guide rail
Since it is provided with a substrate moving mechanism unit composed of a Y-direction moving drive unit that moves in the direction, it is possible to reliably prevent the bending deformation of the multi-panel substrate during cutting, thereby realizing high-precision and high-quality cutting, In addition, when the cutting direction is perpendicular to the X-direction guide rail, the cutter enters the notch provided in the X-direction guide rail, so that it is possible to perform cutting up to the end of the multi-plane substrate. To play.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a principal part of a cutting device according to the present invention,

FIG. 2 is an extracted enlarged view of a portion corresponding to a circle A in FIG. 1;

FIG. 3 is a cross-sectional front view showing a part of a main part in the cutting apparatus.

FIG. 4 is a perspective view of a substrate moving mechanism in the cutting apparatus.

FIG. 5 is a side view showing the vicinity of a cutter in the cutting apparatus;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cutting device 2 Substrate moving mechanism part 3 Cutter 4p ... Substrate holding groove 5p ... X direction guide rail 6 X direction movement drive part 7 Y direction movement drive part 8 Board locking mechanism part 9 ... Positioning convex part 10p ... Notch part 11p ... Y-direction guide rail P Multi-panel board Pa ... Unit printed circuit board Ph ... Recess

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-63-62697 (JP, A) JP-A-4-289095 (JP, A) JP-A-4-83431 (JP, U) JP-A-6-62997 33696 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B26D 7/06 B26D 7/01 H05K 3/00

Claims (4)

(57) [Claims] 1. A printed circuit board cutting device for moving a multi-panel board with respect to a cutter by a substrate moving mechanism and cutting a plurality of unit printed boards from the multi-panel board by sliding both side edges of the multi-panel board. A pair of X-direction guide rails having a substrate holding groove for freely supporting and having a notch for allowing the cutter to enter; an X-direction movement drive unit for moving the multi-plane substrate in the X direction; A printed circuit board cutting device comprising a board moving mechanism section comprising a Y direction moving drive section for moving a rail in the Y direction. 2. The printed circuit board according to claim 1, wherein the X-direction moving drive unit is slidably mounted on the X-direction guide rail and includes a board locking mechanism for locking the multi-panel board. Cutting equipment. 3. The printed circuit board cutting device according to claim 2, wherein the substrate locking mechanism includes a positioning projection that fits into a recess provided in the multi-panel substrate. 4. The printed circuit board cutting device according to claim 1, further comprising a Y-direction guide rail slidably supporting the X-direction guide rail.