JP3027358B2 - Die equipment for tape cutting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape cutting die apparatus for clamping an adhesive tape in which a cover tape is laminated on an elastic adhesive layer with an upper die and a lower die and punching out with a punch.

[0002]

2. Description of the Related Art Today, electronic devices such as PHSs, mobile phones, and notebook personal computers have become widespread, and a control unit of these electronic devices includes a control IC chip and a flash memory for storage on a substrate. Semiconductor device. This semiconductor device has been reduced in size and weight, and an adhesive tape (die bond tape) has been used for fixing an IC chip constituting the semiconductor device. For example, an adhesive tape (die-bond tape) having an adhesive layer formed thereon is cut and adhered onto a substrate on which a wiring pattern is formed, and the above-described IC chip is fixed via the adhesive tape. Have been. In order to cut the adhesive tape and affix it to the base material, the adhesive tape in the form of a tack seal was cut and cut with a cutter blade, and the adhesive tape was attached to the die pad position of the base material. This is because the productivity is low, dust easily adheres to the bonding surface, and the bonding position is not accurate. Therefore, it is conceivable to punch out and attach a long adhesive tape using a tape cutting die apparatus.

An example of the above-described tape cutting die apparatus will be described with reference to FIG. Long adhesive tape 51
Is paid out from a reel (not shown) on the payout side,
It is carried into the tape cutting die device 52 from the direction of arrow A in the figure. The adhesive tape 51 generally has a pre-elastic adhesive layer 53 for protecting the adhesive surface and facilitating handling.
The cover tape 54 is laminated on both sides of the. Before the adhesive tape 51 is carried into the tape cutting die device 52, the cover tape 54 on one side (adhesive surface side) is peeled off.

[0004] The above-mentioned tape cutting die device 52 is provided with an upper die 5.
5 and lower mold 56 are equipped. The upper die 55 is provided with a stripper plate 5 capable of pressing the adhesive tape 51.
7. A punch 58 for punching the adhesive tape 51 is provided. The punch 58 is attached to the punch plate 59 so that the tip thereof can be protruded through the stripper plate 57. This punch plate 5
9 is supported by the back plate 60. A shank plate 61 is provided above the back plate 60. A spring 63 is elastically mounted around a sleeve bolt 62 connecting the shank plate 61 and the stripper plate 57. The punch 58 and the back plate 60 have an air suction passage 58a connected to a vacuum generator (not shown).

[0005] The lower die 56 is provided with a die 64 having a cutting blade formed at a peripheral portion of a die hole 64a. The die 64 is fixed by a die holder (not shown). A heater block 65 is provided below the die hole 64a formed in the die 64. On the heater block 65, the cut adhesive tape 51
The film base material 66 to which is adhered is carried in, for example, from the back side to the front side in the direction perpendicular to the paper surface of FIG.

The adhesive tape 51 is clamped by a stripper plate 57 and a die 64 and the punch 5
8 is cut by shearing force when it enters the die hole 64a. The cut adhesive tape 51 is supplied to the air suction path 58.
By generating a vacuum pressure at a, it is adhered to the film base 66 supported by the heater block 65 while being attracted to the tip of the punch 58.

[0007]

However, since the adhesive tape 51 has elasticity, there is a possibility that the adhesive tape 51 cannot be cut by the shearing force of the punch 58 and the die 64 as shown in FIG. That is, since the cover tape 54 is relatively hard, it can be cut relatively easily. However, since the adhesive layer 53 is formed of a relatively soft elastic insulating resin, the adhesive tape 53 is stretched and cut. Inadequate,
Even if the cutting can be performed, there is a possibility that the cutting position accuracy and the cutting shape may vary. The adhesive tape 51
Is easy to stick to the lower mold surface because the adhesive surface is exposed,
Once adhered, the sliding resistance between the adhesive layer 53 and the lower mold surface is large, so that there is a possibility that the sheet cannot be conveyed.

An object of the present invention, the solve the problems of the prior art, <br/> The rewritable cut at reliably high precision an adhesive tape having an elastic, without adhesive tape sticking to the mold surface An object of the present invention is to provide a transportable tape cutting die apparatus.

[0009]

To solve the above-mentioned problems, the present invention has the following arrangement. That is, an adhesive tape cover tape to the adhesive layer are laminated with elastic, and clamped by the upper mold and the lower mold in the tape cutting die apparatus Unplug out by the punch, it is formed in the lower mold die Cutting blade
The upstream and downstream positions of the tape
In order to support the adhesive tape without contacting the cutting blade in the
Support rollers urged toward each other are provided rotatably
When the adhesive tape is clamped by the upper stripper plate and the lower die, the stripper press
The cutting blade adheres when the sheet pushes down the support roller.
The notch is formed in contact with the agent layer side, and the punch
The adhesive tape is punched out by pushing from the loop side
Characterized in that that.

Further, the support roller is rotatably supported by both side supporting blocks of the rotary shaft, the support block is urged upward by an elastic member, the stripper plate, by pressing the support block supporting A pressing block for pressing down the roller may be formed. At this time, it is preferable that the support roller is pressed down until the stripper plate hits a stopper provided on the lower die, and the cutting blade is brought into contact with the adhesive layer side to form a predetermined amount of cut. Further, the adhesive layer may be an insulating resin layer having elasticity, and the punched adhesive tape is attached to the film base material supplied below the die while being held by suction at the tip of the punch. You may do it.

According to the above construction, when the adhesive tape is clamped by the stripper plate and the die, a cut is formed by the cutting blade provided on the die coming into contact with the adhesive layer side, and the punch is moved to the cover tape side. since the adhesive tape is punched by more pressing, an adhesive tape having an adhesive layer can be reliably and easily cut with elastic. In addition , at the upstream and downstream positions of the cutting blade formed on the die in the tape conveying direction, a supporting roller urged upward to rotatably support the adhesive tape in a non-clamp state without contacting the cutting blade is rotatably provided. Since each is provided, when the adhesive tape is transported, the adhesive tape does not come into contact with and stick to the mold surface, so that good transportability can be maintained. In particular, when the support roller is pushed down until the stripper plate hits a stopper provided on the lower mold, and the cutting blade is brought into contact with the adhesive layer side to form a predetermined amount of cut, the adhesive having elasticity is used. Since the layer may be cut in advance with a cutting blade and then the cover tape is cut with a punch, the adhesive tape can be cut very smoothly.

[0012]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. 1 to 3 are explanatory views showing the operation of cutting the adhesive tape of the tape cutting die, FIG. 4 is an enlarged explanatory view of a cut portion of the adhesive tape of FIG. 2, and FIG. 5 is a plan view of the lower die. In this embodiment, a tape cutting die apparatus for cutting an adhesive tape used for fixing an IC chip of a semiconductor device will be described.

First, the structure of the adhesive tape will be described. The adhesive tape 1 fixes an IC chip and
In order to absorb the thermal stress acting on the chip, an elastic insulating resin layer such as an elastomer tape is preferably used as the adhesive layer 2. A cover tape 3 is applied to both sides of the adhesive layer 2 in consideration of protection and handling of the adhesive surface.
Are laminated and attached. Before the long adhesive tape 1 is carried into the tape cutting die device in the direction of arrow A, the cover tape 3 on one side (adhesive surface side) is peeled off (FIGS. 1 to 4). reference).

The adhesive tape 1 is punched out by a punch and a die in a cutting die apparatus as described later. This punched adhesive tape 1
The adhesive layer 2 is attached to the insulating film substrate 5 carried on the heater block 4 provided below the die while the cover tape 3 side is held by suction at the tip end surface of the punch.
The sides are glued. As the insulating film substrate 5, for example, a material obtained by laminating a metal foil such as a copper foil on a polyimide film is suitably used, and the metal foil is exposed to light,
A wiring pattern is formed through a photolithography process of performing etching or the like. The cut adhesive tape 1 is heated and pressed and adhered to the die pad portion of the insulating film substrate 5 on which the wiring pattern is formed (see FIGS. 1 to 3).

Next, the configuration of the above-described tape cutting die apparatus will be specifically described with reference to FIGS. The above-described tape cutting die apparatus is provided with an upper die 6 and a lower die 7. The upper die 6 is provided with a stripper plate 8 capable of pressing the adhesive tape 1 and a punch 9 for punching the adhesive tape 1. The punch 9 is attached to the punch plate 10 so that the tip can be inserted and protruded through the stripper plate 8. The punch plate 10 is supported by a back plate 11. Above the back plate 11, a shank plate 12 to which the upper and lower rods 12a are connected is provided. The shank plate 12 is provided with a sleeve bolt 13 through which the back plate 11 and the punch plate 10 are inserted. This sleeve bolt 13
Is connected to the stripper plate 8. A spring 14 is mounted around the sleeve bolt 13 between the stripper plate 8 and the shank plate 12. Further, the stripper plate 8 is provided with a pressing block 15 capable of pressing down a support block 23 described later provided on the lower die 7 side. The punch 9 and the back plate 11 have an air suction passage 9a connected to a vacuum generator (not shown).
Are formed (see FIGS. 1 to 3).

In the lower die 7, a die insert (hereinafter, simply referred to as "die") 18 is fixed to a die plate 17 fixed to a die holder 16 (see FIG. 5). The die plate 17 has a guide hole 17a through which a guide post (not shown) provided in the back plate 11 of the upper die 6 can be inserted when the upper die 6 moves up and down. A protruding cutting blade 19 is formed at the periphery of the die hole 18 a of the die 18. The cutting blade 19 is formed in an acute angle with the cutting edge facing upward (see FIG. 4). A tapered surface is formed on the inner wall of the die hole 18 so that the opening area of the lower opening is larger than that of the upper opening. A heater block 4 is provided below the die hole 18a of the die 18 (see FIGS. 1 to 3). On the heater block 4, an insulating film substrate 5 to which the cut adhesive layer 2 is adhered is carried in, for example, downward from above in FIG. The heater block 4 has a built-in heater 20.

Press support rollers 21 are provided rotatably at positions near the upstream and downstream sides of the cutting blade 19 formed on the die 18 in the tape transport direction (the direction of arrow A in FIG. 5). A fixed support roller 22 is rotatably provided on both sides of the pressing support roller 21. The pressing support roller 21 comes into contact with the adhesive layer 2 of the adhesive tape 1 so that the bonding is performed in an unclamped state. The tape 1 is supported so as to be out of contact with the cutting blade 19.
The fixed support roller 22 supports the adhesive tape 1 in an unclamped state so that the adhesive tape 1 does not contact the lower mold surface.

Both ends of the rotating shaft 21a of the pressing support roller 21 are supported by support blocks 23, respectively. The support block 23 is constantly urged upward by a pressing spring 24. Thus, in the unclamped state, the pressing support roller 21 supports the adhesive tape 1 so that the adhesive tape 1 is not in contact with the cutting blade 19. When the stripper plate 8 moves downward to clamp the adhesive tape 1, the pressing support roller 21 presses the pressing block 15
Abuts against the support block 23 and pushes down against the urging force of the pressing spring 24. The stripper plate 8 is provided with a height stopper 2 provided on a die 18.
The pressing support roller 21 is pressed down until it comes into contact with No. 5. At this time, the cutting blade 19 is brought into contact with the adhesive layer 2 of the adhesive tape 1 to form a predetermined amount of cut.
reference).

When the stripper plate 8 clamps the adhesive tape 1, the height position of the adhesive tape 1 in the clamped state is fixed by abutting against the height stopper 25, so that the cutting edge of the cutting blade 19 The amount of intrusion is adjusted so as to always reach a certain height position, in this embodiment, a height position at which the adhesive layer 2 is cut. By cutting the adhesive layer 2 having elasticity by the cutting blade 19 in advance, the punch 9 only needs to shear the cover tape 3 alone, so that the adhesive tape 1 can be cut very smoothly and with a high height. Can be done with precision.

Next, the cutting operation of the adhesive tape of the above tape cutting die apparatus will be described with reference to FIGS. First, in FIG. 1, a cover tape 3 is applied to the adhesive layer 2.
Is set on the lower mold 7 having the mold opened. At this time, the adhesive tape 1 is supported in a non-contact manner with the cutting blade 19 by the pressing support roller 21 and the fixed support roller 22 urged upward on the adhesive layer 2 side. Further, an insulating film substrate 5 is carried into the heater block 4 from the back side to the front side in FIG.

Next, in FIG. 2, the upper die 6 moves down, and the support block 23 is pressed by the pressing block 15 against the urging force of the pressing spring 24, so that the stripper plate 8 is moved. The pressing support roller 21 is pushed down until it hits the height stopper 25. Then, while the adhesive tape 1 is clamped, the cutting blade 19 comes into contact with the adhesive layer 2 to form a predetermined amount of cut (see FIG. 4). As a result, the adhesive layer 2 of the adhesive tape 1 is cut in advance. Further, since the adhesive layer 2 is supported by the pressing support roller 21 and the fixed support roller 22 in the clamped state, it is difficult for the adhesive layer 2 to adhere to the lower mold surface.
Even if they are in close contact with each other, the pressing support roller 21 is urged upward by the pressing spring 24 in an unclamped state, and therefore does not remain in close contact with the lower mold surface when being conveyed.

Next, in FIG. 3, in a state where the adhesive tape 1 is clamped by the stripper plate 8 and the die 18, when the punch 9 enters the die hole 18a, the cover tape 3 is cut by a shearing force. At this time, a vacuum generating device (not shown) has started a suction operation on the punch 9, and a vacuum pressure is generated in the air suction passage 9a. Thus, the cut adhesive layer 2 moves downward while the cover tape 3 side is being adsorbed to the tip of the punch 9, and the adhesive layer 2 adheres to the insulating film substrate 5 supported on the heater block 4. The layer 2 side is pressed, heated and pressed, and adhered.

According to the above configuration, when the adhesive tape 1 is clamped by the stripper plate 8 and the die 18, the cutting blade 19 provided on the die 18
The adhesive tape 1 having the adhesive layer 2 having elasticity can be reliably and reliably formed by cutting the adhesive tape 1 by pressing the cover 9 from the cover tape 3 by punching the adhesive tape 1 by pressing the cover 9 from the cover tape 3 side. Can be easily cut. In addition , at the upstream and downstream positions of the cutting blade 19 formed on the die 18 in the tape transport direction, the adhesive tape 1 is urged upward to support the adhesive tape 1 in a non-clamp state without contacting the cutting blade 19. Since the pressed pressure supporting rollers 21 are provided rotatably, when the adhesive tape 1 is conveyed, it does not contact and adhere to the lower mold surface,
Good transportability can be maintained. In particular, the pressing support roller 21 is pushed down until the stripper plate 8 hits a height stopper 25 provided on the lower die 7, and the cutting blade 19 is moved to the adhesive layer 2 side.
When a predetermined amount of cut is formed by contacting the adhesive tape, the elastic adhesive layer 2 may be cut in advance by the cutting blade 19 and then the cover tape 3 may be cut by the punch 9. The adhesive tape 1 can be cut very smoothly.

The present invention is not limited to the above embodiment, the tape cutting die apparatus, the manufacture of semiconductor devices
Has been described, but other elasticity
Widely used for cutting tape materials with high sliding resistance
It goes without saying that various modifications can be made without departing from the spirit of the invention.

[0025]

As described above, according to the present invention, when the adhesive tape is clamped by the stripper plate and the die, the cutting blade provided on the die contacts the adhesive layer side to form a cut, and the punch is formed. the since as punched adhesive tape by pressing from the cover tape side, it is possible to cut the adhesive tape having an adhesive layer having elasticity reliably and easily. In addition , at the upstream and downstream positions of the cutting blade formed on the die in the tape conveying direction, a supporting roller urged upward to rotatably support the adhesive tape in a non-clamp state without contacting the cutting blade is rotatably provided. Since each is provided, when the adhesive tape is transported, the adhesive tape does not come into contact with and stick to the mold surface, so that good transportability can be maintained. In particular, when the support roller is pushed down until the stripper plate hits a stopper provided on the lower mold, and the cutting blade is brought into contact with the adhesive layer side to form a predetermined amount of cut, the adhesive having elasticity is used. Since the layer may be cut in advance with a cutting blade and then the cover tape is cut with a punch, the adhesive tape can be cut very smoothly.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a cutting operation of an adhesive tape of a tape cutting die device.

FIG. 2 is an explanatory view showing an operation of cutting an adhesive tape in a tape cutting die apparatus.

FIG. 3 is an explanatory diagram showing a cutting operation of an adhesive tape of a tape cutting mold device.

FIG. 4 is an enlarged explanatory view of a cut portion of the adhesive tape of FIG. 2;

FIG. 5 is a plan view of a lower die.

FIG. 6 is an explanatory view of a conventional tape cutting die apparatus.

FIG. 7 is an explanatory view showing a conventional adhesive tape cutting operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesive tape 2 Adhesive layer 3 Cover tape 4 Heater block 5 Insulating film base material 6 Upper die 7 Lower die 8 Stripper plate 9 Punch 9a Air suction path 10 Punch plate 11 Back plate 12 Shank plate 12a Vertical rod 13 Sleeve bolt 14 Spring 15 Press block 16 Die holder 17 Die plate 17a Guide hole 18 Die 18a Die hole 19 Cutting blade 20 Heater 21 Press support roller 22 Fixed support roller 23 Support block 24 Press spring 25 Height stopper

──────────────────────────────────────────────────の Continued on the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B26F 1/44 B26F 1/40 B26F 1/38

Claims (5)

(57) [Claims] The method according to claim 1 adhesive tape cover tape adhesive layer having elasticity are laminated, the upper and lower molds and tape cutting die apparatus Unplug out by the punch is clamped in, the lower mold In the tape transport direction of the cutting blade formed on the die
At the upstream and downstream positions, the adhesive
To support the cutting blade in a non-contact manner with the cutting blade.
Are provided rotatably, and when the adhesive tape is clamped by the upper stripper plate and the lower die, the stripper is used.
The plate is pushed down by the support roller
The cutting blade contacts the adhesive layer side to form a cut.
The punch is pushed from the cover tape side.
Wherein the adhesive tape is punched by the following method. 2. The support roller supports both sides of a rotating shaft.
It is rotatably supported by a block, and the support block is
The stripper is urged upward by an elastic member.
The plate is pressed against the support block to
2. A tape cutting die apparatus according to claim 1, wherein a pressing block for pressing down the roller is formed . 3. The stripper roller according to claim 1 , wherein
Until the rate hits the stopper provided on the lower mold.
And the cutting blade comes into contact with the adhesive layer side
3. The tape cutting die device according to claim 2 , wherein a predetermined amount of cut is formed . 4. The adhesive layer is made of an insulating resin having elasticity.
Tape cutting mold system according to claim 1 or claim 3, wherein the a layer. 5. The punched adhesive tape according to claim 1 , wherein
While holding the tip of the
5. The tape cutting die device according to claim 1, wherein the tape cutting die device is attached to a supplied film substrate .