JP3022379B2 - Electronic equipment with noise shield structure - Google Patents
Electronic equipment with noise shield structureInfo
- Publication number
- JP3022379B2 JP3022379B2 JP9057060A JP5706097A JP3022379B2 JP 3022379 B2 JP3022379 B2 JP 3022379B2 JP 9057060 A JP9057060 A JP 9057060A JP 5706097 A JP5706097 A JP 5706097A JP 3022379 B2 JP3022379 B2 JP 3022379B2
- Authority
- JP
- Japan
- Prior art keywords
- shield plate
- circuit board
- electronic circuit
- contact
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子機器製品に用い
られる漏洩電波等に対するノイズ対策用のシールド構造
を備える電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a shield structure for preventing noise against leaked radio waves and the like used in electronic device products.
【０００２】[0002]
【従来の技術】従来、コンピュータ等の電子機器等には
高周波信号が発生し、外部の電子機器機器に影響を及ぼ
すため、この電磁波の発生を防ぐためにさまざまな方策
が取られてきた。この方策の一つとして電子回路基板を
覆うシールド板が使用されている。従来技術として電子
回路基板端部に上下からシールド板を接触させた斜視図
を図５に示す。電子機器製品において、電子回路基板０
１を上下から金属製のシールドケースであるトップシー
ルド板０２とボトムシールド板０３で覆い、電子回路基
板０１を上下から挟み込んで螺子止めして電子回路基板
０１より発生する各種のノイズを低減させていた。図６
に電子回路基板とシールド板の断面図を示す。こうする
とトップシールド板０２とボトムシールド板０３が電子
回路基板の端部外側０４にて直接接触することができシ
ールド効果が得られていた。2. Description of the Related Art Hitherto, since high-frequency signals are generated in electronic devices such as computers and affect external electronic devices, various measures have been taken to prevent the generation of electromagnetic waves. As one of the measures, a shield plate covering an electronic circuit board is used. FIG. 5 is a perspective view showing a conventional technique in which a shield plate is brought into contact with an end portion of an electronic circuit board from above and below. In electronic equipment products, electronic circuit board 0
1 is covered from above and below with a top shield plate 02 and a bottom shield plate 03, which are metal shield cases, and the electronic circuit board 01 is sandwiched from above and below with screws to reduce various noises generated from the electronic circuit board 01. Was. FIG.
2 shows a cross-sectional view of the electronic circuit board and the shield plate. By doing so, the top shield plate 02 and the bottom shield plate 03 can directly contact at the outer end portion 04 of the electronic circuit board, and a shielding effect has been obtained.
【０００３】[0003]
【発明が解決しようとする課題】図７に電子回路基板の
端面に異物がある場合の断面図を示す。図７（Ａ）では
電子回路基板０１のトップシールド板０２側に半田の異
物０５がある場合であり、図７（Ｂ）は電子回路基板の
ボトムシールド板０３側に半田の異物０５がある場合を
示し、いずれの場合でもトップシールド板０２とボトム
シールド板０３が電子回路基板の端部外側０４で直接接
触しなくなり、シールド効果が薄れてしまう問題があっ
た。そこで本発明では、上下方向（鉛直方向）に加えて
前後左右の水平方向にも直接接触させることにより、シ
ールド板が電子回路基板から浮き上がっても接触が保た
れるノイズシールド構造を備える電子機器を提供する。FIG. 7 is a sectional view showing a case where foreign matter is present on the end face of the electronic circuit board. 7A shows a case where the solder foreign matter 05 is present on the top shield plate 02 side of the electronic circuit board 01, and FIG. 7B shows a case where the solder foreign matter 05 is present on the bottom shield plate 03 side of the electronic circuit board 01. In any case, there is a problem that the top shield plate 02 and the bottom shield plate 03 do not directly contact each other at the outer end portion 04 of the electronic circuit board, and the shielding effect is weakened. Therefore, in the present invention, there is provided an electronic device having a noise shield structure in which contact is maintained even when the shield plate floats up from the electronic circuit board by making direct contact in the front-rear and left-right horizontal directions in addition to the vertical direction (vertical direction). provide.
【０００４】[0004]
【課題を解決するための手段】本発明のノイズシールド
構造を備える電子機器は、各種電子部品が搭載された電
子回路基板を表面側から覆う導電性の表面側シールド板
と、該電子回路基板を裏面側から覆う導電性の裏面側シ
ールド板とを電気的に接触させて前記電子回路基板から
発生するノイズを防止するノイズシールド構造を備える
電子機器において、前記表面側シールド板は前記表面側
シールド板の略鉛直方向に立ち上げられた第１の立ち上
げ部が設けられ、前記裏面側シールド板は前記裏面側シ
ールド板の略鉛直方向に立ち上げられた第２の立ち上げ
部が設けられ、前記第１の立ち上げ部と前記第２の立ち
上げ部とを前記電子回路基板の水平方向で接触させるこ
とを特徴とする。また、上述の前記第１の立ち上げ部又
は前記第２の立ち上げ部のいずれか一方を熊手状にして
もよい。さらにまた、前記第１の立ち上げ部は、前記表
面側シールド板の斜め方向に立ち上げられた基部と、表
面側シールド板の鉛直方向に立ち上げられた端部とで構
成されてもよい。また、上述のノイズシールド構造を備
える電子機器は、前記表面側シールド板は前記電子回路
基板端部に延在するように形成された第１の水平部を、
前記裏面側シールド板は前記第１の水平部に対向するよ
うに形成された第２の水平部をそれぞれ有してもよく、
この場合、前記第１の水平部と前記第２の水平部とを前
記電子回路基板の鉛直方向で接触させるようにしてもよ
い。According to the present invention, there is provided an electronic apparatus having a noise shield structure, comprising: a conductive front side shield plate which covers an electronic circuit board on which various electronic components are mounted; In an electronic device having a noise shield structure for preventing noise generated from the electronic circuit board by making electrical contact with a conductive back side shield plate covering from the back side, the front side shield plate is the front side shield plate A first rising portion raised in a substantially vertical direction is provided, and the back side shield plate is provided with a second rising portion raised in a substantially vertical direction of the back side shield plate; A first rising portion and the second rising portion are brought into contact with each other in a horizontal direction of the electronic circuit board. Further, one of the above-mentioned first rising section and the above-mentioned second rising section may have a rake shape. Furthermore, the first rising portion may be constituted by a base portion raised in an oblique direction of the front side shield plate and an end portion raised in a vertical direction of the front side shield plate. Further, in the electronic device having the above-described noise shield structure, the front-side shield plate includes a first horizontal portion formed to extend to an end of the electronic circuit board.
The back side shield plate may include a second horizontal portion formed so as to face the first horizontal portion, respectively.
In this case, the first horizontal portion and the second horizontal portion may be brought into contact in a vertical direction of the electronic circuit board.
【０００５】上記構成による作用を述べれば、電子回路
基板の水平方向で各シールド板を互いに接触させること
ができる。さらに表面側シールド板または裏面側シール
ド板のいずれか一方のシールド板を熊手状にしてあるの
で、多少互いにずれがあっても接触させることができ
る。また、電子回路基板の水平方向及び鉛直方向で各シ
ールド板を互いに接触させることもできる。[0005] In the operation of the above structure, the shield plates can be brought into contact with each other in the horizontal direction of the electronic circuit board. Further, since one of the front-side shield plate and the rear-side shield plate is formed in a rake shape, it is possible to make contact even if there is a slight shift. Further, the shield plates can be brought into contact with each other in the horizontal direction and the vertical direction of the electronic circuit board.
【０００６】[0006]
【発明の実施の形態】本発明の一実施例を図面に基づき
詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to the drawings.
【実施例】図１は本発明のシールド板を用いた斜視図を
示し、図２は断面図を示す。表面側シールド板であるト
ップシールド板２は電子回路基板１の表面に搭載される
各種の電子部品を覆うべく、導電性を有するブリキ等の
金属製の鉄板を断面コ字状に折り曲げて脚部２ａとし、
その脚部２ａの高さｈは、電子回路基板１に搭載された
各種電子部品の高さより高くなっている。さらに、脚部
２ａの端部は外側に折り曲げられており、電子回路基板
端部１ａに延在するように第１の水平部である水平部２
ｂが設けられている。これによって、このトップシール
ド板２は、水平部２ｂで電子回路基板１に接触してい
る。さらにまた、電子回路基板端部の外側において、水
平部２ｂの外縁には熊手状に分かれ略鉛直方向に立ち上
がった第１の立ち上げ部である熊手部２ｘが形成されて
いる。この熊手部２ｘは、其々斜め上外側に向けて折曲
された熊手基台部２ｃと、鉛直方向に形成された熊手端
部２ｅとで構成されている。FIG. 1 is a perspective view using a shield plate of the present invention, and FIG. 2 is a sectional view. The top shield plate 2, which is a front-side shield plate, is formed by bending a metal iron plate such as a tinplate having conductivity into a U-shaped cross section so as to cover various electronic components mounted on the surface of the electronic circuit board 1. 2a,
The height h of the leg 2a is higher than the height of various electronic components mounted on the electronic circuit board 1. Further, the end of the leg 2a is bent outward, and the horizontal portion 2 which is the first horizontal portion extends to the end 1a of the electronic circuit board.
b is provided. Thus, the top shield plate 2 is in contact with the electronic circuit board 1 at the horizontal portion 2b. Further, outside the end of the electronic circuit board, a rake portion 2x, which is a first rising portion which is divided into a rake shape and rises in a substantially vertical direction, is formed on the outer edge of the horizontal portion 2b. The rake portion 2x is composed of a rake base portion 2c bent obliquely upward and outward, and a rake end 2e formed in a vertical direction.
【０００７】次に裏面側シールド板であるボトムシール
ド板３は電子回路基板１の裏側の半田面を覆うべく、導
電性を有するブリキ等の金属製の鉄板を断面コ字状に折
り曲げて短足の脚部３ａが形成されている。さらに、こ
の脚部３ａの端部は外側に折り曲げられており、電子回
路基板端部１ａに延在するように水平延在部３ｂが設け
られている。これによって、このボトムシールド板３
は、水平延在部３ｂで電子回路基板端部１ａに接触して
いる。さらにまた、この水平部３ｂの外縁には、該電子
回路基板端に沿って電子回路基板厚さ分折り曲げられた
厚部３ｃが形成されている。該厚部３ｃ端部は電子回路
基板の表面と同一平面上になるように折り曲げられ第２
の水平部であるシールド鉛直接触部３ｄが形成されてい
る。このシールド鉛直接触部３ｄの外縁部はさらに鉛直
方向に折り曲げられ、第２の立ち上げ部である外縁立ち
上げ部３ｅが形成されている。これによって、図２に示
されているように、トップシールド板２とボトムシール
ド板３とは、水平部２ｂ及びシールド鉛直接触部３ｄで
鉛直方向に接触するとともに、熊手端部２ｅ及び外縁立
ち上げ部３ｅで水平方向に接触している。特に、水平方
向で接触している部分においては、其々斜め上外側に向
けて折曲された熊手基台部２ｃが形成されているため
に、熊手端部２ｅには水平方向外側に付勢する力が働
き、接触強度がより大きくなっている。上述の構成によ
る効果を図３及び図４を用いて以下に説明する。Next, the bottom shield plate 3, which is the back side shield plate, is formed by bending a metal iron plate made of conductive tin or the like into a U-shaped cross section so as to cover the solder surface on the back side of the electronic circuit board 1. Is formed. Further, the end of the leg 3a is bent outward, and a horizontal extension 3b is provided so as to extend to the end 1a of the electronic circuit board. Thereby, the bottom shield plate 3
Is in contact with the electronic circuit board end 1a at the horizontal extension 3b. Further, a thick portion 3c is formed at the outer edge of the horizontal portion 3b along the edge of the electronic circuit board by the thickness of the electronic circuit board. The end of the thick portion 3c is bent so as to be flush with the surface of the electronic circuit board, and
Are formed as shield horizontal contact portions 3d. The outer edge portion of the shield vertical contact portion 3d is further bent in the vertical direction to form an outer edge rising portion 3e as a second rising portion. Thereby, as shown in FIG. 2, the top shield plate 2 and the bottom shield plate 3 are vertically contacted by the horizontal portion 2b and the shield vertical contact portion 3d, and the rake end portion 2e and the outer edge are raised. The portion 3e contacts in the horizontal direction. In particular, the rake base 2c bent obliquely upward and outward is formed at the portions in contact with each other in the horizontal direction, so that the rake end 2e is biased outward in the horizontal direction. And the contact strength is higher. The effects of the above configuration will be described below with reference to FIGS.
【０００８】図３には電子回路基板端面に凹凸があっ
て、トップシールド板２の水平部２ｂが電子回路基板端
部１ａに面接触しない場合の断面図を示している。この
場合、電子回路基板端部１ａの表面側に半田等の異物４
があり、トップシールド板２の水平部２ｂの下面が異物
４により電子回路基板１に面接触できない状態である。
これによって、トップシールド板２の水平部２ｂがボト
ムシールド板３のシールド鉛直接触部３ｄに面接触でき
ない状態が生じる。最悪の場合は図示したように全く接
触しない状態も生じる。しかしながら、トップシールド
板２には略鉛直方向に立ち上がった熊手部２ｘが形成さ
れ、ボトムシールド板３には鉛直方向に折り曲げられた
立ち上げ部３ｅが形成されているので、図示したように
トップシールド板２とボトムシールド板３とを水平方向
で確実に接触させることができる。これによって、電子
回路基板１全体のシールド状態を確実に保つことができ
る。FIG. 3 is a sectional view showing a case where the end face of the electronic circuit board has irregularities and the horizontal portion 2b of the top shield plate 2 does not make surface contact with the end 1a of the electronic circuit board. In this case, foreign matter 4 such as solder is
In this state, the lower surface of the horizontal portion 2b of the top shield plate 2 cannot be brought into surface contact with the electronic circuit board 1 due to foreign matter 4.
As a result, a state occurs in which the horizontal portion 2b of the top shield plate 2 cannot make surface contact with the shield vertical contact portion 3d of the bottom shield plate 3. In the worst case, there is a state where no contact is made as shown. However, since the top shield plate 2 is formed with a rake portion 2x that rises in a substantially vertical direction, and the bottom shield plate 3 is formed with a rise portion 3e that is bent in a vertical direction. The plate 2 and the bottom shield plate 3 can be reliably brought into contact in the horizontal direction. Thereby, the shield state of the entire electronic circuit board 1 can be reliably maintained.
【０００９】次に、図４には電子回路基板端面裏側に凹
凸がある場合の断面図を示す。この場合、トップシール
ド板２は電子回路基板端部１ａと面接触しているが、電
子回路基板端部１ａの裏面側に半田等の異物４があり、
ボトムシールド板３の端部３ｂの上面が異物により電子
回路基板１に面接触できない状態である。これによっ
て、ボトムシールド板３は電子回路基板端部１ａから少
し浮いた状態となり、ボトムシールド板３のシールド鉛
直接触部３ｄがトップシールド板２の水平部２ｂに面接
触できない状態が生じる。最悪の場合は図示したように
全く接触しない状態も生じる。しかしながら、図示した
ように、ボトムシールド板３の外縁立ち上げ部３ｅが鉛
直方向に多少移動するものの、トップシールド板２の熊
手端部２ｅには水平方向外側に付勢する力が働いている
ため、トップシールド板２とボトムシールド板３とを水
平方向で確実に接触させることができる。これによっ
て、電子回路基板１全体のシールド状態を確実に保つこ
とができる。Next, FIG. 4 is a cross-sectional view showing a case where there is unevenness on the back side of the end surface of the electronic circuit board. In this case, the top shield plate 2 is in surface contact with the electronic circuit board end 1a, but there is a foreign substance 4 such as solder on the back side of the electronic circuit board end 1a.
The upper surface of the end 3b of the bottom shield plate 3 cannot be brought into surface contact with the electronic circuit board 1 due to foreign matter. As a result, the bottom shield plate 3 slightly floats from the electronic circuit board end 1a, and a state occurs in which the shield vertical contact portion 3d of the bottom shield plate 3 cannot make surface contact with the horizontal portion 2b of the top shield plate 2. In the worst case, there is a state where no contact is made as shown in the figure. However, as shown in the figure, although the outer edge rising portion 3e of the bottom shield plate 3 moves slightly in the vertical direction, a force for urging the rake end 2e of the top shield plate 2 outward in the horizontal direction acts. Thus, the top shield plate 2 and the bottom shield plate 3 can be reliably brought into contact in the horizontal direction. Thereby, the shield state of the entire electronic circuit board 1 can be reliably maintained.
【００１０】また、熊手部２ｘを設けたことで、トップ
シールド板２及びボトムシールド板３が水平方向にずれ
たとしても、トップシールド板２とボトムシールド板３
とを確実に接触させることができる。なお、上述したよ
うにトップシールド板２に熊手部２ｘを設けたが、トッ
プシールド板２に熊手部２ｘを鉛直方向に立ち上げた板
形状にし、ボトムシールド板３の立ち上がり部３ｅを熊
手状にしてもよい。Further, even if the top shield plate 2 and the bottom shield plate 3 are displaced in the horizontal direction by providing the rake portion 2x, the top shield plate 2 and the bottom shield plate 3
Can be surely brought into contact. Although the rake portion 2x is provided on the top shield plate 2 as described above, the rake portion 2x is formed in the top shield plate 2 in a vertically raised plate shape, and the rising portion 3e of the bottom shield plate 3 is formed in a rake shape. You may.
【００１１】[0011]
【発明の効果】上記構成による効果を述べれば、電子回
路基板に対して、表面側シールド板及び裏面側シールド
板で上下から挟み、鉛直方向で表面側シールド板と裏面
側シールド板とを接触させるだけでなく、各シールド板
の端部で水平方向にも接触させているので、電子回路基
板の端面がシールド板に面接触していなくとも、各シー
ルド板を確実に接触させておくことができる。これによ
って、シールド効果を確実に保持し、ノイズの増大を効
果的に防止することができるのである。The effect of the above configuration is as follows. The electronic circuit board is sandwiched from above and below by a front side shield plate and a rear side shield plate, and the front side shield plate and the rear side shield plate are brought into contact in the vertical direction. Not only that, since the end portions of each shield plate are also in horizontal contact, even if the end surface of the electronic circuit board is not in surface contact with the shield plate, each shield plate can be reliably contacted. . As a result, the shield effect can be reliably maintained, and an increase in noise can be effectively prevented.
【図１】本発明のシールド板を用いた斜視図である。FIG. 1 is a perspective view using a shield plate of the present invention.
【図２】本発明のシールド板を用いた斜視図である。FIG. 2 is a perspective view using the shield plate of the present invention.
【図３】電子回路基板端面に凹凸があって、トップシー
ルド板の接触面が電子回路基板に面接触しない場合の断
面図である。FIG. 3 is a cross-sectional view of the case where the end surface of the electronic circuit board has irregularities and the contact surface of the top shield plate does not make surface contact with the electronic circuit board.
【図４】電子回路基板端面裏側に凹凸がある場合の断面
図である。FIG. 4 is a cross-sectional view in a case where there is unevenness on the back side of the end surface of the electronic circuit board.
【図５】従来技術として電子回路基板端部に上下からシ
ールド板を接触させた斜視図をである。FIG. 5 is a perspective view in which a shield plate is brought into contact with an end of an electronic circuit board from above and below as a conventional technique.
【図６】従来技術としての電子回路基板とシールド板の
断面図である。FIG. 6 is a cross-sectional view of an electronic circuit board and a shield plate as a conventional technique.
【図７】従来技術での電子回路基板の端面に異物がある
場合の断面図である。FIG. 7 is a cross-sectional view of a related art in which a foreign substance is present on an end surface of an electronic circuit board.
１…電子回路基板 ２…トップシールド板 ３…ボトムシールド板 ４…異物 １ａ…電子回路基板端部 ２ｂ…水平部 ２ｃ…熊手基部 ２ｅ…熊手端部 ２ｘ…熊手部 ３ｄ…シールド鉛直接触部 ３ｅ…外縁立ち上がり部 DESCRIPTION OF SYMBOLS 1 ... Electronic circuit board 2 ... Top shield plate 3 ... Bottom shield plate 4 ... Foreign matter 1a ... Electronic circuit board end 2b ... Horizontal part 2c ... Rake base 2e ... Rake end 2x ... Rake 3d ... Shield vertical contact part 3e ... Outer edge rising part
Claims (4)
を表面側から覆う導電性の表面側シールド板と、該電子
回路基板を裏面側から覆う導電性の裏面側シールド板と
を電気的に接触させて前記電子回路基板から発生するノ
イズを防止するノイズシールド構造を備える電子機器に
おいて、 前記表面側シールド板には前記表面側シールド板の略鉛
直方向に立ち上げられた第１の立ち上げ部が設けられ、
前記裏面側シールド板には前記裏面側シールド板の略鉛
直方向に立ち上げられた第２の立ち上げ部が設けられ、 前記第１の立ち上げ部と前記第２の立ち上げ部とを前記
電子回路基板の水平方向で接触させることを特徴とする
ノイズシールド構造を備える電子機器。An electrically conductive front side shield plate that covers an electronic circuit board on which various electronic components are mounted from the front side, and a conductive rear side shield plate that covers the electronic circuit board from the back side. An electronic device having a noise shield structure for preventing noise generated from the electronic circuit board by being in contact with the electronic device, wherein the front-side shield plate has a first rising portion which is raised substantially in a vertical direction of the front-side shield plate. Is provided,
The rear surface side shield plate is provided with a second rising portion which is raised substantially in a vertical direction of the rear surface side shielding plate, and the first rising portion and the second rising portion are connected to each other by the electronic device. An electronic device having a noise shield structure, wherein the electronic device is in contact with a circuit board in a horizontal direction.
ち上げ部のいずれか一方を熊手状にしたことを特徴とす
る請求項１に記載のノイズシールド構造を備える電子機
器。2. The electronic device according to claim 1, wherein one of the first rising portion and the second rising portion has a rake shape.
ールド板の斜め方向に立ち上げられた基部と、表面側シ
ールド板の鉛直方向に立ち上げられた端部とで構成され
ることを特徴とする請求項１又は２に記載のノイズシー
ルド構造を備える電子機器。3. The first rising portion includes a base portion raised in an oblique direction of the front side shield plate and an end portion raised in a vertical direction of the front side shield plate. An electronic device comprising the noise shield structure according to claim 1 or 2.
板端部に延在するように形成された第１の水平部を有
し、前記裏面側シールド板は前記第１の水平部に対向す
るように形成された第２の水平部を有し、 前記第１の水平部と前記第２の水平部とを前記電子回路
基板の鉛直方向で接触させることを特徴とする請求項１
乃至請求項３のいずれかに記載のノイズシールド構造を
備える電子機器。4. The front-side shield plate has a first horizontal portion formed to extend to an end of the electronic circuit board, and the back-side shield plate faces the first horizontal portion. A second horizontal portion formed as described above, wherein the first horizontal portion and the second horizontal portion are brought into contact with each other in a vertical direction of the electronic circuit board.
An electronic device comprising the noise shield structure according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9057060A JP3022379B2 (en) | 1997-02-24 | 1997-02-24 | Electronic equipment with noise shield structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9057060A JP3022379B2 (en) | 1997-02-24 | 1997-02-24 | Electronic equipment with noise shield structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10229289A JPH10229289A (en) | 1998-08-25 |
| JP3022379B2 true JP3022379B2 (en) | 2000-03-21 |
Family
ID=13044910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9057060A Expired - Fee Related JP3022379B2 (en) | 1997-02-24 | 1997-02-24 | Electronic equipment with noise shield structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3022379B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2020255790A1 (en) * | 2019-06-17 | 2020-12-24 |
-
1997
- 1997-02-24 JP JP9057060A patent/JP3022379B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10229289A (en) | 1998-08-25 |
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