JP3022027U - Case exterior electronic components - Google Patents

Abstract

(57) [Summary] [Object] The present invention enhances the bonding force of the boundary surface of the filling resin layer regardless of the resin hardness by devising the boundary surface of the filling resin layer in the case exterior type electronic component. To provide electronic components that can [Composition] In an electronic component in which an electronic component element is housed in a resin or metal outer case and resin is injected into the outer case, the resin in the outer case is composed of a plurality of layers in contact with each other. In addition, the layers of the resin are formed of corrugated or sawtooth-shaped boundary surfaces.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

 The present invention relates to an electronic component that uses a case to package an element such as a capacitor, a resistor, a transistor or a composite component thereof.

[0002]

[Prior art]

 As is well known, in the above electronic parts, the quality of the device itself is of course important for determining the quality of various performances, but it is also an important element in the exterior means for covering and protecting the device. ing. Of course, basically the same thing can be said, although there are differences in the degree of influence on performance due to differences in electronic components.

Taking the case exterior type of a capacitor as an example, the performance such as impact resistance, heat resistance, or moisture resistance is greatly affected by the filling resin that directly embeds and directly covers the element in addition to the case that houses the element. Has been done. For this reason, improvements are being made daily in order to improve their performance.

FIG. 7 shows a conventional case exterior type capacitor C (Japanese Patent Publication No. 63-51528). The manufacturing method in this case is to store the capacitor element b in the outer case a, and inject the low-grade urethane resin c (hardness according to JIS K6301 is A-80 or less) as the filling resin to embed the element b. After the resin c is semi-cured, a high-hardness urethane resin d (hardness according to ASTM D-2240 is D-50 or more) is injected from above to completely cure both resins.

As described above, the conventional one using the filling resins c and d based on the hardness defined by JIS or ASTM can reduce the tightening to the element b by the low hardness resin c, so that the capacity change It is possible to prevent or prevent breakage, and the high hardness resin d can firmly seal the case a. That is, conventionally, performances such as impact resistance and moistureproof insulation were secured based on the hardness values of the filled resins c and d.

[0006]

[Problems to be solved by the device]

 However, in the conventional case of using such filling resins c and d, in order to obtain the above performance, it is necessary to pay attention to the setting of the respective resin hardness conditions, the preparation or the storage, and therefore control them. Annoyance was a problem. Even if both resins c and d are matched to the specified hardness such as JIS, if there is a slight difference in the properties and hardness of the resin, it is extremely difficult to integrate the interfaces, and each resin layer is temporarily joined. Even if it looks like it is not, it cannot be completely integrated, and as shown in FIG. 7, a monotonically curved boundary surface e is formed between the resin layers. In this case, when the capacitor element b expands due to some influence, the filling resin c is pushed up in response to it and a gap is easily formed in the boundary surface e, and the boundary surface e is weaker than other points. It was. Therefore, it cannot be said that it is sufficient in terms of moisture protection.

[0007]

[The purpose of the device]

 Therefore, the present invention has been made in view of the above problems, and by devising the boundary surface of the filling resin layer, it is possible to enhance the bonding force of the boundary surface of the filling resin layer regardless of the resin hardness. The purpose is to provide an electronic component with a case exterior.

[0008]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention provides an electronic component in which an electronic component element is housed in an outer case made of resin or metal, and a resin is injected into the outer case to be cured. The resin in the case may be composed of a plurality of layers in contact with each other, and the layers of the resin may have a corrugated or serrated boundary surface.

[0009]

[Embodiment of device]

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a film capacitor of a case exterior type. In the figure, 1 is a film capacitor, 2 is a capacitor element (hereinafter simply referred to as element), 3 is an outer case, 4 is a primary filling resin, and 5 is a secondary filling resin.

The film capacitor 1 has a structure in which an element 2 is housed and fixed in an outer case 3, and a primary filling resin 4 is injected into the film case 1. When the final hardness of the resin 4 is 50% or less, The case opening 6 is sealed by injecting the next filling resin 5 from above the resin 4. In this case, the difference in specific gravity between the resins 4 and 5 is set to be larger in the resin 5 than in the resin 4 by about 0.001 to 0.5 g / cm ³ .

The element 2 has a structure in which one or more strip-shaped metallized films are stacked and wound or laminated in multiple layers to form an internal electrode body 7, and a sprayed metal layer 8 is formed on a side surface of the body 7, and the internal metal body 8 is formed on the internal electrode body 7. It is formed by welding the lead wire 9.

As the metallized film, polyethylene terephthalate film, polypropylene film, polyphenylene sulfide film or the like having a vapor deposition film containing aluminum, zinc, copper or the like metal element on one or both sides as an electrode layer is used. It

When the outer case 3 is made of resin, it is desirable to use a thermoplastic resin made of polybutylene terephthalate, polycarbonate, polypropylene, polyethylene terephthalate or the like (single or complex), but even if it is a thermosetting resin, Good. In the case of metal, use a prismatic or tubular material made of aluminum or iron as a material (single or composite). Further, the primary filling resin 4 and the secondary filling resin 5 filled in the outer case 3 are both made of polybutadiene-based, polyester-based or polyether-based urethane resin or epoxy resin, and the primary filling resin 4 is If the hardness is lower than that of the secondary filling resin 5, it is more effective in mechanical strength and is appropriately selected according to the properties of the resin.

Example 1 The respective constituent materials described above are prepared, and first, a typical method will be described as a first example. As shown in FIG. 2, the element 2 is set in the outer case 3. At this time, the element 2 is fixed so as not to move in the case by an appropriate fixing means. In this state, as shown in FIG. 3, the primary filling resin 4 is injected into the outer case 3. After that, a secondary filling resin 5 having a specific gravity difference of 0.001 to 0.5 g / cm ³ larger than that of the primary filling resin 4 is immediately injected.

In this way, while the curing of the primary filling resin 4 does not proceed (10% or less), the secondary filling resin 5 having a larger specific gravity than the resin is poured from above, so that the two resins 4, 5 Swelling of the resin occurs at the boundary surface 10, and thereafter, the hardening progresses with the lapse of time, so that a stable waveform as shown in FIG. 1 can be formed and the resin can be completely hardened. In this case, when the specific gravity difference is set to about 0.5 g / cm ³ , the amplitude further increases, and conversely, when it is close to 0.001 g / cm ³ , a gentle waveform can be obtained.

From the results of the experiment, when the specific gravity difference is larger than 0.5 g / cm ³ , the undulations of both the primary filling resin 4 and the secondary filling resin 5 are excessively disturbed, and a regular waveform cannot be obtained. Has also been confirmed.

Further, in order to arrange the waveform more uniformly or to make it into a sawtooth shape, physical vibration such as ultrasonic vibration may be applied before curing proceeds. Next, a method slightly different from that of the first embodiment will be described.

Example 2 In this case, the procedure is the same as that of Example 1 until the element 2 is set in the outer case 3 by an appropriate fixing means and the primary filling resin 4 is injected into the case 3. However, here, when the timing of injecting the secondary filling resin 5 is changed and the primary filling resin 4 reaches about 50% of the final hardness, that is, several minutes after the injection of the primary filling resin 4 After a few hours, the secondary filling resin is injected.

In such a case, the curing of the primary filling resin 4 progresses, and the fluidity of the resin is much slower than in the case of Example 1, so that the boundary surface of the resin layer is as shown in FIG. Waveform becomes gentle. Therefore, in this case, the difference in specific gravity between the primary filling resin 4 and the secondary filling resin 5 should be set to around 0.5 g / cm ³ as much as possible. <Embodiment 3> In the above-described embodiment, the element 2 is horizontally long, and the outer case 3 is made of horizontally long resin to match this, but here, as shown in FIG. 5, the element 11 is vertically long. Now, the case where the outer case is made of a vertically long metal will be described.

Since the element 11 is vertically long, a vertically long outer case 12 having a small opening is used, and the outer case 12 is made of metal such as aluminum or iron.

The method of setting the element 11 in the outer case 12 is the same as that in the above-mentioned embodiment, but since the outer case 12 has a vertically long shape, the viscosity of the resin 4 injected first is as low as possible. Is good. Therefore, when the secondary filling resin 5 injected later is injected immediately after the injection of the primary filling resin 4, the specific gravity difference is smaller around 0.001 g / cm ³ or 0.5 g / cm ³ after a few minutes. Make it nearby. By doing so, even in the case of the vertically long case, the boundary surface of the resin layer can be made into a corrugated shape or the like, the boundary area can be increased, and a strong resin bonding surface can be easily obtained. In the above examples, the case where the filling resin layer is two layers has been described, but it may be three layers, and the unevenness formed on the boundary surface of the resin layer may have a regular corrugation, or As shown in FIG. 6, the irregularities may be fine, irregular waveforms or saw-toothed ones. Further, in each of the above-described embodiments, the element is stored in the case before the resin is filled, but it may be after the primary filling resin 4 is injected.

Further, in each of the above embodiments, the film capacitor is described as the electronic component, but the invention is not limited to this, and a ceramic capacitor or an electrolytic capacitor may be used, and a resistor, a transistor, or a composite other than the capacitor may be used. It can be applied to parts and the like, and various design changes can be made within the scope not departing from the technical idea described in the scope of claims for utility model registration.

[Effect of device]

 As described above, according to the present invention, the boundary surface of the filled resin layer has an uneven shape such as a corrugated shape, and it is possible to allow the resin layer to bite into the other resin, so that pressure from inside and outside the electronic component is applied. In this case, the direction of force can be dispersed, and at the same time, the contact area between the resin layers can be expanded. Therefore, it has an advantage that the adhesive strength between the resin layers and the moisture-proof insulation can be increased.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a basic internal structure in an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the manufacturing process of the first embodiment.

FIG. 3 is a cross-sectional view showing the manufacturing process of the first embodiment.

FIG. 4 is a sectional view showing the internal structure of the electronic component formed in the second embodiment.

FIG. 5 is a sectional view showing the internal structure of the electronic component formed in the third embodiment.

FIG. 6 is a sectional view showing a modified example of the above embodiment.

FIG. 7 is a cross-sectional view showing a conventional case exterior type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Film capacitor 2 ... Capacitor element 3 ... Exterior case 4 ... Primary filling resin 5 ... Secondary filling resin 6 ... Case opening 7 ... Internal electrode body 8 ... Sprayed metal layer 9 ... Lead wire 10 ... Boundary surface 11 ... Element 12 ... Exterior case

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Claims (2)

[Scope of utility model registration request] 1. An electronic component in which an electronic component element is housed in an outer case made of resin or metal and resin is injected into the outer case, and the resins in the outer case are in contact with each other. A case-exterior type electronic component comprising a layer, and the resin layers having a corrugated or sawtooth-shaped uneven boundary surface. 2. The resin has a larger specific gravity when injected later into the outer case than when injected earlier, and the specific gravity difference is 0.001 to 0.5 g / cm ^3. The case exterior type electronic component described in 1.