JPS6336674Y2 - - Google Patents
Info
- Publication number
- JPS6336674Y2 JPS6336674Y2 JP12168382U JP12168382U JPS6336674Y2 JP S6336674 Y2 JPS6336674 Y2 JP S6336674Y2 JP 12168382 U JP12168382 U JP 12168382U JP 12168382 U JP12168382 U JP 12168382U JP S6336674 Y2 JPS6336674 Y2 JP S6336674Y2
- Authority
- JP
- Japan
- Prior art keywords
- metallized
- melting point
- point metal
- capacitor
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 9
- 239000011104 metalized film Substances 0.000 claims description 8
- 230000006378 damage Effects 0.000 description 7
- 229920006254 polymer film Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 and sealed Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は保安機能を有する金属化コンデンサに
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metallized capacitor with safety features.
金属化プラスチツクフイルムや金属化紙を巻回
してコンデンサ素子とし、このコンデンサ素子を
樹脂ケースに収納して樹脂を充填し封止したコン
デンサやあるいは樹脂モールドの外装を施したコ
ンデンサは誘電体であるフイルムや紙の一部が極
度に劣化すると、その劣化部分に電流が集中して
パンクし、ケースやモールド外装を破壊し、ワツ
クス等の含浸剤が飛散する欠点がある。 Capacitors are made by winding metalized plastic film or metalized paper to form a capacitor element, and this capacitor element is housed in a resin case, filled with resin, and sealed, or capacitors with a resin molded exterior are dielectric films. If a part of the mold or paper becomes extremely deteriorated, the current will concentrate on the deteriorated part, resulting in a puncture, destroying the case or mold exterior, and causing the impregnating agent such as wax to scatter.
本考案は、以上の欠点を改良し、破壊を未然に
防止しうる金属化コンデンサの提供を目的とする
ものである。 The object of the present invention is to provide a metallized capacitor that can improve the above-mentioned drawbacks and prevent destruction.
本考案は、上記の目的を達成するために、金属
化フイルムまたは金属化紙の側部の長手方向に低
融点金属層を設け、該低融点金属層にメタリコン
を接触することを特徴とする金属化コンデンサを
提供するものである。 In order to achieve the above object, the present invention provides a metallized metal layer characterized by providing a low melting point metal layer in the longitudinal direction of the side of a metallized film or metalized paper, and contacting the low melting point metal layer with metallicon. The purpose of this invention is to provide a capacitor with a
以下、本考案の実施例を図面に基づいて説明す
る。 Hereinafter, embodiments of the present invention will be described based on the drawings.
第１図において、１はポリエステルやポリスチ
ロール等の高分子フイルムである。２はこの高分
子フイルムの一側部の長手方向に設けられた低融
点金属層であり、鉛等を蒸着して形成している。
３はアルミや亜鉛を蒸着して形成した金属層であ
り、一部が低融点金属層２に積層されている。高
分子フイルム１の他の側部は非金属化のままであ
る。 In FIG. 1, 1 is a polymer film such as polyester or polystyrene. Reference numeral 2 denotes a low melting point metal layer provided in the longitudinal direction of one side of this polymer film, and is formed by vapor depositing lead or the like.
3 is a metal layer formed by vapor-depositing aluminum or zinc, and a portion thereof is laminated on the low-melting point metal layer 2. The other side of the polymer film 1 remains non-metalized.
そして金属化フイルム４及び５が、第２図に示
す通り、低融点金属層６及び７が互いに逆方向と
なるように積層・巻回され、両端面にメタリコン
８及び９が施され、端子１０及び１１がメタリコ
ン８及び９に接続されコンデンサ素子１２が構成
されている。１３はこのコンデンサ素子１２を被
覆するように樹脂モールドされた外装である。 Then, as shown in FIG. 2, the metallized films 4 and 5 are laminated and wound so that the low melting point metal layers 6 and 7 are in opposite directions, metallized films 8 and 9 are applied to both end surfaces, and the terminal 10 and 11 are connected to metallic contacts 8 and 9 to form a capacitor element 12. Reference numeral 13 denotes a resin-molded exterior covering the capacitor element 12.
すなわち、外部回路からコンデンサ１４に電圧
が印加されて、高分子フイルムの一部が劣化し、
その劣化部分に電流が集中して流れ、その付近の
低融点金属層が融けてメタリコンとの電気的な接
続が切れる。従つて、劣化部分に流れる電流が減
少し、コンデンサ素子１２の破壊が防止される。 That is, a voltage is applied to the capacitor 14 from an external circuit, and a portion of the polymer film deteriorates.
Current flows concentrated in the degraded area, melting the low-melting point metal layer in the vicinity and breaking the electrical connection with the metallicon. Therefore, the current flowing through the degraded portion is reduced, and destruction of the capacitor element 12 is prevented.
なお、第３図に示す通り、スリツト１５，１
５′，…，１５(n-1)を設けて金属層１６，１６′，
…，１６(n)どうし及び低融点金属層１７，１７′，
…，１７(n)どうしを分離してもよく、この場合に
は、劣化部分が完全に分離されるので、より効果
的に素子の破壊が防止される。 In addition, as shown in FIG. 3, the slits 15, 1
5',...,15 (n-1) are provided to form metal layers 16, 16',
..., 16 (n) and low melting point metal layers 17, 17',
..., 17 (n) may be separated from each other. In this case, the deteriorated portions are completely separated, so that destruction of the element can be more effectively prevented.
以上の通り、本考案によれば、劣化部分に電流
が集中するのを防止することにより破壊を未然に
防ぐことができ、機器に組み込んだ場合等におい
て破壊にともなう含浸剤の飛散等による他の電子
部品の損傷を防止しうる金属化コンデンサが得ら
れる。 As described above, according to the present invention, destruction can be prevented by preventing current from concentrating on deteriorated parts, and when installed in equipment, other damage caused by impregnating agent scattering due to destruction etc. A metallized capacitor is obtained that can prevent damage to electronic components.
第１図は本考案の実施例に用いる金属化フイル
ムの断面図、第２図は本考案の実施例の断面図、
第３図は本考案の他の実施例に用いる金属化フイ
ルムの平面図を示す。
２，６，７，１７，１７′…，１７(n)……低融
点金属層、４，５……金属化フイルム、８，９…
…メタリコン、１４……コンデンサ。
FIG. 1 is a cross-sectional view of a metallized film used in an embodiment of the present invention, and FIG. 2 is a cross-sectional view of an embodiment of the present invention.
FIG. 3 shows a plan view of a metallized film used in another embodiment of the present invention. 2,6,7,17,17'...,17 (n) ...Low melting point metal layer, 4,5...Metalized film, 8,9...
...Metallicon, 14...Capacitor.
Claims (1)
メタリコンを施して端子を接続した金属化コンデ
ンサにおいて、金属化フイルムまたは金属化紙の
側部の長手方向に低融点金属層を設け、該低融点
金属層にメタリコンを接触することを特徴とする
金属化コンデンサ。 In a metallized capacitor in which a metallized film or metallized paper is wound and a metallicon is applied to the end face and a terminal is connected, a low melting point metal layer is provided in the longitudinal direction of the side of the metallized film or metallized paper, and the low melting point metal A metallized capacitor characterized by contacting layers with metallicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12168382U JPS5926233U (en) | 1982-08-12 | 1982-08-12 | metallized capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12168382U JPS5926233U (en) | 1982-08-12 | 1982-08-12 | metallized capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5926233U JPS5926233U (en) | 1984-02-18 |
| JPS6336674Y2 true JPS6336674Y2 (en) | 1988-09-28 |
Family
ID=30278402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12168382U Granted JPS5926233U (en) | 1982-08-12 | 1982-08-12 | metallized capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5926233U (en) |
-
1982
- 1982-08-12 JP JP12168382U patent/JPS5926233U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5926233U (en) | 1984-02-18 |
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