JP3021399B2 - Metal lid substrate for electronic component package, metal lid and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal lid substrate for an electronic component package, a metal lid and a method of manufacturing the same, and more particularly, to sealing electronic components such as a crystal unit, a SAW filter, a transistor, and an IC. The present invention relates to a metal lid substrate (hereinafter, also referred to as a lid substrate or simply a substrate) used for a package, a metal lid (hereinafter, also simply referred to as a lid), and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a metal lid of this kind, Fe-
Ni-based alloy (42 alloy, Fe-Ni-Co alloy, etc.)
It is well known that a metal substrate made of is plated with Ni (nickel). In the case of sealing by a seam welding method using this lid, this is put on a weld ring formed on the sealing surface (lid contact surface) of the package body and sealed one by one by resistance welding. However, the drawback is that large quantities cannot be processed at once.

[0003] On the other hand, the method in which a solder preform is sandwiched between the lid and the package body to perform reflow sealing is excellent in mass productivity in that it can be sealed by passing through a reflow furnace. Workability is difficult because it is necessary to set a preform when putting it on. In addition, since the preform itself is expensive, the sealing cost is increased. Further, since the entire surface of the lid on the sealing surface side is easily wetted by the solder, the molten solder at the time of reflow is easily spread from the solder sealing portion to the inside (or the outside) on the sealing surface side. For this reason, there is a problem that the solder for sealing is reduced and airtightness is reduced, a part of the solder is in contact with a bonding wire, and serious defects such as dripping on an electronic component such as an IC are likely to occur. was there.

As a lid which solves such a problem, there is one disclosed in Japanese Patent Application Laid-Open No. 4-96256. And
In this publication, the Ni substrate formed on the sealing surface of the lid substrate
Of the layers, a portion near the outer periphery forming the solder sealing portion (hereinafter also referred to as a solder sealing portion) is masked with an aluminum plate, and a portion other than the solder sealing portion is oxidized by irradiation with a YAG laser. There has been disclosed a technique in which the surface is roughened to lower the wettability of the solder at that portion than that of the solder sealing portion. That is, in this device, the inner surface surrounded by the solder sealing portion has a lower wettability of the solder than the surface of the solder sealing portion, thereby preventing the solder from spreading and spreading at the time of sealing. This is to avoid any problems.

[0005]

Problems to be Solved by the Invention
In the lid described in the above publication, a large amount of sealing treatment can be performed at one time, and since the inside surface surrounded by the solder sealing portion is oxidized to reduce the wettability of the solder, The spread of the wet solder is also prevented. However, in the above-mentioned lid, since oxidation for reducing the wettability of the solder is performed by laser irradiation, there is a problem that the process is troublesome and the cost increases.

The present invention has been devised in view of the above problems, and not only prevents the solder for sealing from spreading from the solder sealing portion to the inside of the sealing surface and the like,
An object of the present invention is to provide a metal lid substrate, a metal lid, and a method for manufacturing such a metal lid that can be efficiently manufactured at low cost.

[0007]

In order to achieve the above object, a metal lid substrate for an electronic component package according to the present invention comprises a clad plate material of a metal layer to which solder is hardly wet and a metal layer to which solder is easily wet. , The metal layer where the solder is easily wetted leaves an area near the outer periphery forming a solder sealing portion,
A region adjacent to the region is removed.

[0008] Here, the metal layer to which the solder is difficult to wet is formed by an iron-nickel alloy (an alloy containing iron and nickel as main components, such as a Fe-Ni-Co alloy, 42 alloy) when sealing the ceramic package. Is similar to ceramic and has a coefficient of thermal expansion similar to that described above, and is preferably exemplified, but may be selected according to the material of the package body. As the metal layer to which the solder is easily wetted, copper or a copper alloy is exemplified as being preferable because of its low cost. That is, it is preferable to use a clad plate material whose base material is an Fe-Ni-based alloy (Fe-Ni-Co alloy or 42 alloy) and whose clad material is Cu (copper).

Here, the "solder sealing portion" means a surface on which the sealing solder is formed or a surface which is wetted by the solder for sealing. The region adjacent to the portion closer to the outer periphery may be not only the inside surrounded by the portion but also the outside. In the above-described means, the metal layer on which the solder is easily wetted may be entirely removed except for the region of the outer peripheral portion forming the solder sealing portion, but the region of the outer peripheral portion forming the solder sealing portion is left, Only a portion having a predetermined width adjacent to the region may be removed. This is because the metal layer to which the solder is easily wetted may be removed so as to prevent the spread of the molten solder to the inside, and the entire inner surface surrounded by the region near the outer periphery forming the solder sealing portion. This is because it is not necessary.

According to such a metal lid substrate, the sealing lid is formed on a metal layer on the outer periphery of the solder sealing portion where the solder is easily wetted. It is not necessary to set the solder preform each time when covering and sealing the main body.
Then, the solder does not wet and spread inside the solder sealing portion of the lid, so that the airtightness does not decrease, a part of the solder does not come into contact with the bonding wire, and the solder does not drop on the IC or the like in the package.

The preferred method for producing the metal lid according to the present invention is as follows. That is, a plurality of lid substrates are partially connected at their side edges from a clad plate material of a metal layer that is difficult to wet solder and a metal layer that is easily wetted by solder, and the lid substrate aggregate is formed. In each of the lid substrate portions, of the metal layer to which the solder is easily wetted, a region near the outer periphery forming the solder sealing portion is left, and a region adjacent to the region is removed by etching, and solder sealing in each of the lid substrate portions is performed. The method is characterized in that sealing solder is formed on a metal layer where the solder near the outer periphery forming the portion is easily wetted, and thereafter, each lid substrate portion is cut at a connection portion at a side edge thereof.

Another method is as follows.
That is, on both sides of a clad plate material of a metal layer where solder is difficult to wet and a metal layer where solder is easy to wet, and a plurality of lid substrates can form a lid substrate aggregate in which the lid substrates are partially connected at their side edges, Each of the lid substrates is partially etched at the side edges by applying an etching resist, exposing and developing, removing the metal layer where solder is difficult to wet, and then removing the metal layer where solder is easy to wet by etching. A lid substrate assembly connected to the substrate, and in each of the lid substrate portions, the metal layer where solder is difficult to wet exists without being removed, and the metal layer where solder easily wets is formed on the outer periphery forming a solder sealing portion. Exposing the metal layer to which the solder is unlikely to wet and the metal layer to which the solder is likely to wet so as to leave the region of the deviated part and remove the region adjacent to the region, Below, the exposed portion of the metal layer where solder is not easily wetted is removed by etching, and then the exposed portion of the metal layer where solder is easily wetted is removed by etching, and a plurality of lid substrates are partially connected at their side edges. Then, an etching resist is removed, and a solder for sealing is formed on a metal layer where solder near an outer periphery forming a solder sealing portion in each lid board portion is easily wetted. Thereafter, each lid substrate portion is cut at a connection portion at a side edge thereof.

By these methods, a large number of metal lids with sealing solder can be efficiently manufactured at once. In addition, the connection part on the side edge surface, in order to facilitate cutting,
It is preferable that the cutting area be as small as possible within a range that does not hinder handling during manufacturing.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lid substrate according to the present invention will be described below in detail with reference to FIGS. In the figure, reference numeral 1 denotes a lid substrate, which is 4 in this example.
2 alloy plate 2 as a substrate (base material), and a Cu layer 3
Is formed from a clad plate material obtained by cladding the above.
The portion of the Cu layer 3 is left annularly with a predetermined width W only in a portion near the outer periphery so as to form a solder sealing portion, and Cu (layer) in other portions is removed by etching.
As described above, in this example, the 42 alloy plate (hereinafter, also referred to as 42 alloy) 2 is exposed on the entire surface (both surfaces and side edge surfaces) of the substrate 1 except for the solder sealing portion, and is located on the sealing surface side. Also, other than the Cu layer 3, the surface is hardly wetted by solder (solder non-wetting surface). In this example, the outer peripheral edge 3a of the solder sealing portion (Cu layer) is formed so as to be slightly lowered d inward (toward the center of the substrate) over the entire periphery from the outer peripheral edge 2a of the 42 alloy plate 2.

The lid substrate 1 of this embodiment is formed by etching the Cu layer 3 of the clad plate as follows. That is, the entire surface of the Cu layer 3 is coated with an etching resist, and exposed and developed to remove the portion (width W) near the outer periphery forming the solder sealing portion, and the inside and outside of the substrate 1 surrounded by this portion. Is exposed, the exposed Cu layer 3 is removed by etching, and then the resist is removed. In the substrate 1 formed in this manner, the solder is easily wetted only at the solder sealing portion, and the solder is hardly wetted at other portions. Therefore, the lid substrate 1 can prevent the solder for sealing from spreading from the solder sealing portion (the region of the Cu layer having the width W) to the inside of the sealing surface.

As described above, in this embodiment, the solder wettability of the portion near the outer periphery forming the solder sealing portion is ensured while the wettability of the solder at the inner portion surrounded by the solder seal portion is reduced. Can be formed simply by removing the metal lid substrate, so that the processing is simple, and therefore, a metal lid substrate can be obtained at low cost.

Then, on the Cu layer 3 near the outer periphery of the lid substrate 1, a solder 9 for sealing is formed with a predetermined thickness as shown in FIG. By doing so, the metal lid 11 having the solder 9 for sealing with a predetermined width W at a position near the outer periphery of one main surface is obtained. In addition, this sealing solder 9
Can be formed by, for example, printing and reflowing a solder paste. At this time, the inside of the solder sealing portion is 42
The solder does not spread because the alloy is exposed. Therefore, the solder for sealing can be easily formed only on the surface of the Cu layer 3 forming the solder sealing portion. In FIG. 1, the Cu layer in the entire region except for the solder sealing portion (the region having the width W) was removed by etching. However, the Cu layer region inside the solder sealing portion was removed from the inside of the molten solder. Since it is only necessary to prevent inflow, a central portion (for example, 2
The Cu layer may be removed only in the region adjacent to the region having the width W without removing the Cu layer in the portion 4) surrounded by the chain line.

As shown in FIG. 4, when the package body 21 having the same dimensions and the same planar shape is sealed by the lid (substrate) 11 of this embodiment, the molten solder 9 is placed inside. Not only does it not spread out, but also the amount d pulled down from the outer peripheral edge of the lid 11 does not wet the solder. That is, the outer peripheral edge 3a of the solder sealing portion (Cu layer) is
Since the meniscus is drawn inward, the meniscus is as shown in the figure, and the solder is prevented from protruding outward during sealing. Therefore, the lid (substrate) 11 of this example
According to the method, there is no difficulty in handling due to the protrusion, and it is also effective for positioning at the time of mounting on a circuit board and for preventing reduction in reliability of the circuit board. Incidentally, the amount of pulling d depends on the thickness and width of the sealing solder, and also on the type of solder, but in general, a range of 50 to 500 μm is appropriate. However, in the lid substrate and the lid of the present invention, the pull-down may not be required.

Next, a preferred method of manufacturing such a lid will be described in detail with reference to FIGS.
First, a clad thin plate having a predetermined size in which the base material is made of 42 alloy and the metal layer to be clad is made of Cu (for example, the thickness of the 42 alloy layer is 0.1 mm, and the thickness of the Cu layer is 0 mm) .03 mm), and as shown in FIGS. 5 and 6, the outer periphery of each lid substrate 1 is cut out, for example, by etching, and the plurality of lid substrates 1 and 1 are partially connected at their side edges. A lid substrate assembly (also simply referred to as an assembly) 31 is manufactured. In addition, as shown in FIG. 6, the assembly 31 of the present example was removed in a frame shape by etching so that the periphery of each substrate 1 was left at four connection portions 32 at the center of each side thereof. Therefore, each of the substrates 1, 1 is connected and supported by four connecting portions 32, 32. In addition, such an assembly 31 is formed by applying an etching resist to each surface, exposing and developing, and forming a frame-shaped cutout N
Are formed by exposing the respective metals and etching them.

Next, the etching resist of the lid substrate assembly 31 thus formed is removed, and an etching resist R is applied to the entire surface of the Cu layer 3 of the lid substrate assembly 31 (see FIG. 7-A). Then, Cu other than the region (the region having a width W between two-dot chain lines in FIG. 6) near the outer periphery forming the solder sealing portion in each lid substrate 1 portion
Exposure and development are performed so that the layer 3 is exposed (see FIG. 7-B). Then, the exposed Cu layer 3 is removed by etching (see FIG. 7C). Next, the etching resist is removed to expose the Cu layer 3 at the portion where the sealing solder is to be formed (see FIG. 7D).

Then, a solder paste is screen-printed on the exposed Cu layer (solder sealing portion) 3 and then reflowed to form a sealing solder 9 having a predetermined thickness (for example, 50 μm) (see FIG. 8). ). At this time, since the solder is hardly wetted (repelled) by the 42 alloy 2, the sealing solder 9 is selectively formed only on the Cu layer 3 of the solder sealing portion. Thereafter, the flux is removed and the aggregate 31
Connection portions 32, 32 of the substrates 1, 1
By cutting along the vertical and horizontal sides (side edges), a large number of metal lids 11 shown in FIG. 3 can be obtained at one time. In addition, if it cut | disconnects at the connection part 32 before formation of the solder 9 for sealing, the metal lid substrate 1 shown in FIGS. 1 and 2 can be obtained.

As described above, according to the manufacturing method of this embodiment, the lid 11 according to the present invention can be efficiently manufactured. Therefore, it is very suitable for mass production. In particular, it is most suitable for manufacturing a small lid such as a package lid used for a quartz oscillator or the like. In the above example, the solder is formed by printing a paste and reflowing. However, the present invention is not limited to this method, and may be formed by, for example, dipping (immersion) in molten solder or wave soldering. it can.

The connecting portion 32 on the side edge surface of each lid 11 in the assembly 31 is formed to facilitate cutting.
It is preferable that the cutting area be as small as possible within a range that does not hinder handling during manufacturing. Although the number of the connection portions 32 is four in this example, it is preferable to reduce the number of connection portions as much as possible for the same reason.

In the present manufacturing method as well, the entire surface of the Cu layer 3 surrounded by the sealing solder 9 was removed. However, as described above, the removed region spreads inside the molten solder by spreading (flowing). ) Can be prevented, and therefore, the solder is removed with a predetermined width along the inner peripheral edge 3b of the solder sealing portion (the area of width W in FIG. 6) without removing the entire surface.
The central portion may not be removed. Needless to say, the arrangement pattern (cut shape) of the substrates in the assembly and the number of pieces to be taken may be designed to have an appropriate shape and number.

Next, another manufacturing method will be described (FIGS. 5 and 6).
And FIGS. 9-12). First, a clad plate material similar to the one described above, which can form a lid substrate assembly in which a plurality of lid substrates are partially connected at the side edges, as shown in FIG. 5, is prepared. Then, an etching resist is applied to the entire surface of both surfaces (the surface of the 42 alloy and the surface of the Cu layer) of the clad plate material.

Then, exposure and development are performed so that each metal layer is covered as follows. That is, by removing the 42 alloy layer by etching and then removing the Cu layer by etching, a lid substrate assembly in which a plurality of lid substrates are partially connected at their side edges,
In each of the lid substrate portions, the 42 alloy layer is present without being removed, and the Cu layer leaves a region near the outer periphery forming a solder sealing portion, and a region adjacent to the outer periphery portion is removed. Next, the 42 alloy and Cu are exposed.

A specific example is as follows (FIGS. 5 and 6).
reference). That is, an etching resist is applied to the entire surface of the 42 alloy layer of the clad plate material (not shown), and the punched portion N (FIGS.
Exposure and development are performed so that the portion corresponding to (see) is exposed. On the other hand, an etching resist is applied to the entire surface of the Cu layer of the clad plate material (not shown), and a portion corresponding to a cutout N (see FIGS. 5 and 6) around each lid substrate 1 in the previous example. In addition, in each lid substrate 1, exposure and development are performed so that a portion other than a portion near the outer periphery (a region having a width W in FIG. 6) forming a solder sealing portion is exposed. As a result, as shown in FIG.
The entire surface of the alloy layer 2 is covered with the etching resist R, and only the portion near the outer periphery (the region of width W in FIG. 6) forming the solder sealing portion is covered with the etching resist R on the surface of the Cu layer 3. I have. On the surface of the 42 alloy layer 2, as shown in FIG. 10, in addition to the lid substrate 1, the connection portion 32 and the like are covered with the etching resist R.

In the present embodiment, the portion corresponding to the connection portion 32 of the 42 alloy layer 2 is also exposed for the Cu layer 3, but the portion near the outer periphery forming the solder sealing portion (the region of width W in FIG. 6). And the connecting portion 32 may be continuously covered with the etching resist R. That is, in the present manufacturing method, even if both metal layers are removed from the 42 alloy layer 2 by etching first, a small number of lid substrates are formed so as to form a lid substrate assembly in which the plurality of lid substrates are partially connected at their side edges. In any case, it is sufficient that the etching resist is formed at a portion corresponding to the connection portion on the surface of any one of the metal layers.

Then, under such a state of the assembly, first, the 42 alloy layer 2 is removed by etching.
In this way, as shown in FIG. 11, the cutout portion N around each lid substrate 1 in the 42 alloy layer 2 except for the connection portion 32 is removed. Next, the Cu layer 3 is removed by etching. By doing so, as shown in FIG. 12, the Cu layer 3 is removed except for a portion near the outer periphery forming a solder sealing portion.

As a result, a plurality of lid substrates 1 similar to those shown in FIG. 5 in plan view are partially connected at the connection portions 32 on the side edges thereof. The Cu layer 3 in one portion remains only in the region near the outer periphery forming the solder sealing portion, and a region adjacent to the outer periphery is removed to form a lid substrate assembly. Incidentally, the Cu layer cannot be etched first by this manufacturing method. This is because, when the Cu layer is etched first, when the 42 alloy layer is etched, the 42 alloy layer below the previously removed Cu layer is also removed, and a lid cannot be formed.

Such a lid substrate assembly is then
After removing the etching resist R, in the same manner as in the above-described manufacturing method,
Solder paste is printed and reflowed on the Cu layer near the outer periphery forming the solder sealing portion in each lid substrate 1 to form a solder for sealing. After a while
By cutting each lid substrate portion at the connection portion at the side edge, a large number of metal lids can be obtained at one time. As described above, according to the present manufacturing method, after the lid substrate aggregate is formed as in the above-described manufacturing method, the Cu layer on each substrate portion is not etched, so that the manufacturing can be performed more efficiently. The solder for sealing is dipped (immersed) in molten solder.
Alternatively, it can be formed by wave soldering.

In the above-mentioned substrate, the case where the width of the metal layer (the base on which the solder layer is provided) on which the solder near the outer periphery forming the solder sealing portion is easily wetted is fixed. Partially or intermittently, narrow or wide,
It may be formed by changing. That is, as shown in the plane shape illustrated in FIG. 13, the width of the metal layer such as the Cu layer 3 that is easily wetted by the solder is formed so as to be narrow at a constant width Ws near the center of each side of the substrate 1. Is also good. Further, as in the plane shape of the substrate 1 illustrated in FIG. 14, the width of the metal layer made of the Cu layer 3 or the like where the solder is easily wetted is relatively narrow at substantially the center of each side of the substrate 1, and at each corner. It may be changed in an inclined manner so as to be wider.

Conventionally, the height of the sealing solder is changed by changing the width of the metal layer to which the solder is easily wetted, a gas path at the time of sealing the electronic component package is secured, and the scattering of the solder is prevented. Have been done. However, even with such a method, it is difficult to change the width of the metal layer (the base on which the solder layer is provided) to which the solder is easily wetted when the substrate is small. However, according to the present invention, since the planar shape (pattern) of the metal layer to which the solder is easily wetted can be formed by etching, the degree of freedom of the change of the width is high, and therefore the height of the solder is changed even with a small lid substrate. There is an effect that the material can be easily formed.

In the above description, the case is described in which the metal which is hardly wetted by the solder constituting the clad material is 42 alloy. ) Are exemplified as suitable ones. However, SUS304 has a coefficient of thermal expansion much larger than that of ceramics, and thus is not suitable for sealing a ceramic package. Further, Cu is exemplified as the metal that is easily wetted by the clad solder, but a copper alloy or Au may be used. The present invention is not limited to the above-described contents, and can be embodied with appropriate modifications without departing from the gist thereof.

[0035]

The metal lid substrate according to the present invention comprises a clad plate made of a metal layer with which solder is hardly wetted and a metal layer with which solder is easily wetted, and the metal layer with which solder is easily wetted has an outer periphery forming a solder sealing portion. Since the region adjacent to the outer peripheral portion is removed while leaving the region closer to the outer periphery, a lid substrate in which solder is unlikely to spread and spread can be efficiently provided at a relatively simple process at a low cost.

According to the metal lid according to the present invention, since a lid with solder is used, a solder preform set is not required for sealing. And, unlike the seam welding method, the sealing process can be performed collectively,
The mass productivity is improved, and the cost is reduced. in addition,
It is difficult for solder to spread inside the lid during sealing.

Further, according to the method for manufacturing a metal lid according to the present invention, for each lid substrate assembly in which a plurality of lid substrates are integrated, each step (a step of removing a metal layer where solder is easily wetted, a step of sealing, ), A large number of lids can be efficiently manufactured. Also, because it was removed by etching,
The removal process is simplified, and the manufacturing cost of the lid can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of an embodiment of a metal lid substrate according to the present invention as viewed from a sealing surface side.

FIG. 2 is a central transverse sectional view of the metal lid substrate of FIG. 1;

FIG. 3 is a sectional view of an embodiment of a metal lid according to the present invention.

FIG. 4 is a partially broken cross-sectional view illustrating a state where the package body is sealed with the metal lid of FIG. 3;

FIG. 5 is an explanatory plan view of an assembly of lid substrates illustrating an embodiment of a method for manufacturing a metal lid according to the present invention.

FIG. 6 is a partially enlarged view of FIG. 5;

FIG. 7 is a cross-sectional view taken along line AA of FIG. 6, and is an explanatory diagram of a process from a step of applying an etching resist to a Cu layer to a step of removing the etching resist after etching.

FIG. 8 is a view showing a state in which sealing solder is formed in FIG. 6;

FIG. 9 is a cross-sectional view including a lid substrate portion for explaining a state of covering with a plating resist, for explaining another embodiment of a method for manufacturing a metal lid according to the present invention.

FIG. 10 is a plan view of FIG. 9 as viewed from a 42 alloy layer side.

FIG. 11 is a view obtained by etching 42 alloy in FIG. 9;

12 is a diagram in which Cu is etched in FIG. 11;

FIG. 13 is a plan view of the lid substrate as viewed from the sealing surface side, showing another example of the planar shape of the metal layer to which solder is easily wetted.

FIG. 14 is a plan view of a lid substrate as viewed from a sealing surface side, showing another example of a planar shape of a metal layer to which solder is easily wetted.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 metal lid substrate 2 42 alloy layer (metal layer on which solder is difficult to wet) 2 a side edge of lid substrate 3 Cu layer (metal layer on which solder is easily wettable) 9 solder for sealing 11 metal lid 31 lid substrate assembly 32 connection Part R Etching resist W Region near the outer periphery that forms the solder sealing part

Claims (5)

(57) [Claims] 1. A clad plate comprising a metal layer to which solder is difficult to wet and a metal layer to which solder is easily wet, wherein the metal layer to which solder is easy to wet leaves a region near the outer periphery forming a solder sealing portion. A metal lid substrate for an electronic component package, wherein an adjacent region is removed. 2. A clad plate made of a metal layer on which solder is hardly wet and a metal layer on which solder is easily wetted, wherein the metal layer on which solder is easily wetted is removed except for a region near the outer periphery forming a solder sealing portion. A metal lid substrate for an electronic component package, characterized in that: 3. The solder for sealing is formed on a metal layer on the outer peripheral portion forming a solder sealing portion of the metal lid substrate for an electronic component package according to claim 1 or 2 where the solder is easily wetted. A metal lid for an electronic component package. 4. A lid substrate assembly in which a plurality of lid substrates are partially connected at their side edges from a clad plate material of a metal layer with which solder is less likely to wet and a metal layer with which solder is easily wet, is formed. In each of the lid substrate portions forming the body, of the metal layer to which the solder is easily wetted, the region near the outer periphery forming the solder sealing portion is left, and a region adjacent to the region is removed by etching. An electronic device, comprising: forming a sealing solder on a metal layer where solder near an outer periphery forming a solder sealing portion is easily wetted; and thereafter, cutting each lid substrate portion at a connection portion on a side edge thereof. Manufacturing method of metal lid for parts package. 5. A clad plate material comprising a metal layer with which solder is hardly wet and a metal layer with which solder is easily wet, which can form a lid substrate assembly in which a plurality of lid substrates are partially connected at their side edges. Each lid substrate is exposed and developed by applying an etching resist, and after removing the metal layer where solder is difficult to wet by etching, and then removing the metal layer where solder is easy to wet by etching, a plurality of lid substrates are formed on the side edges. Is a lid substrate assembly partially connected in, in each of the lid substrate portion,
The metal layer where solder is difficult to wet exists without being removed,
The metal layer where the solder is easily wetted leaves an area near the outer periphery forming the solder sealing portion, and the metal layer where the solder is hardly wet and the metal layer where the solder is easily wetted are exposed so that the area adjacent to the area is removed. Under this, the exposed portion of the metal layer where solder is not easily wetted is removed by etching, and then the exposed portion of the metal layer where solder is easily wetted is removed by etching so that the plurality of lid substrates are partially A lid substrate assembly is formed, and then the etching resist is removed, and sealing solder is formed on a metal layer where the solder near the outer periphery forming a solder sealing portion in each lid substrate portion is easily wetted. Thereafter, each lid substrate portion is cut at a connection portion at a side edge thereof, and a method of manufacturing a metal lid for an electronic component package.