JP3016675B2 - Semiconductor device dropping device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for dropping a semiconductor device into a test socket after positioning the semiconductor device.

[0002]

2. Description of the Related Art When a semiconductor device is completed by housing an IC element in a package, it is necessary to perform a durability test (for example, a burn-in test) of the semiconductor device. In the burn-in test, the semiconductor device positioned above the socket is dropped from a predetermined height and held in a test open-top socket, and then the semiconductor device is heated in a burn-in furnace. Is applied through a socket to test the durability of the semiconductor device.

FIG. 3 is a sectional view of a conventional semiconductor device dropping device which drops a semiconductor device into an open-top socket after positioning, and FIG. 4 is an explanatory view of the operation of the dropping device.

In FIG. 1, reference numeral 1 denotes a semiconductor device in which an IC element is housed in a package;
And an open-top socket for performing a burn-in test of the semiconductor device while holding the semiconductor device. When the upper movable lid 2a, which is pressed and urged upward, is depressed downward, a contact terminal (not shown) inside the socket is opened, and the semiconductor device 1 is properly positioned on its set surface 2b. After that, when the movable lid 2a rises, the contact terminals hold down the terminals 1a of the semiconductor device 1 and are electrically connected. Reference numeral 3 denotes a semiconductor device that is sucked at a predetermined place and horizontally moved to a position above the socket 2. Then, the semiconductor device 1 is positioned and dropped into the socket 2.
b is a dropping device of a semiconductor device to be mounted on the semiconductor device.

The drop device 3 will be further described. In the drawing, reference numeral 11 denotes a main body 11a, an upper guide 11
b, a lower guide 11c. The cylinder 11 is vertically supported by the apparatus main body 10 and has an upper air passage 11d and a lower air passage 11e for introducing pressurized air therein.
Numeral 12 denotes a vertically oriented cylinder chamber formed in the cylinder 11. An upper air passage 11d and a lower air passage 11e of the cylinder 11 communicate with the upper 12b and lower 12a sides of the cylinder chamber 12, respectively. 13 is a cylinder rod whose large-diameter piston portion 13a moves up and down in the cylinder chamber 12 and moves between an uppermost first position A and a lowermost third position C via an intermediate second position B. It is.

Reference numeral 14 denotes a suction rod for vacuum-sucking the semiconductor device 1 at a lower end thereof through a suction hole 14a formed therein. The suction rod 14 is inserted vertically into the cylinder rod 13 and is integrated with the cylinder rod 13 by an E-ring 15, and moves up and down together with the cylinder rod 13. Reference numeral 16 denotes a slider whose lowering position is regulated by a stopper 40. Reference numeral 17 denotes an E-ring which is attached to a lower end portion of the cylinder rod 13 and serves as an upward regulating means for supporting the slider 16, and the E-ring 17 allows the slider 16 to move downward. As a result, the cylinder rod 13 is moved downward and the upward movement of the cylinder rod 13 is restricted. 18 is a lower guide 1 of the cylinder 11
A slider pressing spring 19 is provided at 1c and presses the slider 16 downward. Reference numeral 19 denotes a positioning claw whose center portion is supported by the slider 16 so as to swing. The four positioning claws 19 are attached to the left, right, front and back with the suction rod 14 as a center.

Reference numeral 20 denotes a compression spring which is supported by the slider 16 and presses the positioning claw 19 away from the semiconductor device 1 whose lower end 19a is attracted to the attraction rod 14.
A roller 21 engages with an upper end portion 19b of the positioning claw 19, engages a lower end portion 19a thereof with a side portion of the semiconductor device 1, and positions the semiconductor device 1 with respect to the suction rod 14 in a horizontal direction. A pusher is attached to the lower portion of the slider 16 and presses the movable lid 2a of the socket 2 downward.

[0008] 23 has a suction hole 23a formed therein,
An upper rod 25 connected to the upper end side of the suction rod 14 via a ring 24 is a compression spring that presses the upper rod 23 toward the suction rod 14 via an E-ring 26. 14 and the upper rod 23 always move integrally. 27 is a light-shielding plate attached to the upper part of the upper rod 23, 28 is a light-shielding plate 27
Detects that the cylinder rod 13 is at the second position B by detecting the lower portion 27a of the
7b to detect that the cylinder rod 13 is at the third position c.

Next, the operation of the drop device 3 for a semiconductor device will be described. At a predetermined place where the semiconductor device 1 is positioned, the cylinder rod 13 is lowered to the third position c,
After the suction rod 14 is evacuated to hold the semiconductor device 1 by suction, the positioning and dropping device 3 is horizontally moved to a position above the socket 2 where the positioning is performed. During this horizontal movement,
Pressurized air is introduced into the lower portion 12a of the cylinder chamber 12 through the lower air passage 11e of the cylinder 11 of the dropping device 3,
The piston portion 13a of the cylinder rod 13 is moved to the upper end side of the cylinder chamber 12 and rises to the first position A.

In this case, the suction rod 14 is also connected to the E-ring 15
The slider 16 is also lifted by the E-ring 17 and lifts, and the upper end portion 19b of the positioning claw 19 engages with the roller 21 to spring the compression spring 20. The lower end 19a moves toward the semiconductor device 1 against the force. Accordingly, the four positioning claws 19 move the semiconductor device 1 from all sides to the suction rod 14 side, and position the semiconductor device 1 so that the suction rod 14 suction-supports the center of the semiconductor device 1.

Next, after the dropping device 3 of the semiconductor device is positioned above the socket 2, the air in the lower air passage 11e of the cylinder 11 is evacuated little by little to the outside, and the cylinder chamber 12 is moved through the upper air passage 11d. Pressurized air is introduced into the upper part 12b side of. This allows the cylinder chamber 12
The difference in air pressure between the lower part 12a side and the upper part 12b side slightly increases in the lower part 12a side.
The slider 16, E
The cylinder rod 13 is moved downward via the ring 17. The slider 16 moves the cylinder rod 13 downward to a position where it comes into contact with the stopper 40, and the position of the tip of the cylinder rod 13 at that time is the second position B. The second position B is also a position where the pusher 22 linked to the slider 16 pushes down the movable lid 2a of the socket 2 downward.

When the pusher 22 pushes down the movable lid 2a, the positioning claw 19 is disengaged from the roller 21, the upper end 19b is pushed by the compression spring 20, and the lower end 19a is connected to the semiconductor device. 1 away. In this state, the suction rod 14 moves down together with the cylinder rod 13, and the semiconductor device 1 has moved to near the upper surface of the movable lid 2a. On the other hand, as the suction rod 14 is lowered, the upper rod 23 is also lowered via the compression spring 25 and the E-ring 26, and the lower part 27a of the light shielding plate 27 is
, The sensor 28 detects that the movable lid 2a of the socket 2 has been pressed down. When the movable lid 2a is pushed down, the contact terminal of the socket 2 is released from the setting surface 2b, and the socket 2 enters a standby state in which the semiconductor device 1 can be set.

Next, the vacuum state of the suction hole 14a of the suction rod 14 and the suction hole 23a of the upper rod 23 is released, and air is sent into the suction holes 14a, 23a, so that the semiconductor device 1 is set in the socket 2. It falls on the surface 2b. When the semiconductor device 1 is dropped, the pressurized air on the lower portion 12a side of the cylinder chamber 12 is released to the outside via the lower air passage 11e, so that the piston portion 13a of the cylinder rod 13 is applied to the upper portion 12b side of the cylinder chamber 12. The cylinder rod 13 is lowered to the third position c by the pressure of the air and lowered to the lower end of the cylinder chamber 12.

In this case, the suction rod 14 integrated with the cylinder rod 13 via the E-ring 15 also descends, and its lower end moves to the vicinity of the upper surface of the semiconductor device 1 on the set surface 2b of the socket 2. For example, when the semiconductor device 1 is not horizontal but is inclined, the semiconductor device 1 is set on the set surface 2b.
Position correctly on top. In this case, the upper rod 2
3 also descends, and the upper portion 27b of the light shielding plate 27 stops at the position of the sensor 28. The sensor 28 detects that the semiconductor device 1 has dropped to the set surface 2b of the socket 2.

Next, the pressurizing air is introduced into the lower portion 12a while the pressurizing air on the upper portion 12b side of the cylinder chamber 12 is extracted to the outside, and the cylinder rod 13 is raised to the first position A. The movable cover 2a of the socket 2 rises to its original position, and the contact terminal of the socket 2 presses the terminal 1a of the semiconductor device 1 so that the semiconductor device 1 and the socket 2 are electrically connected to each other. Is ready for testing. Then, the socket 2 is moved into a burn-in furnace, and while heating in the burn-in furnace, a voltage or the like is applied to the semiconductor device 1, and the durability of the semiconductor device 1 is tested.

[0016]

Since the conventional dropping device 3 for a semiconductor device is constructed as described above, the semiconductor device held at the lower end of the suction rod 14 when the cylinder rod 13 is at the second position b. The falling distance a between the lower surface of the device 1 and the set surface 2b of the socket 2 is constant (about 3 mm), and depending on the type of the semiconductor device 1, the semiconductor device 1 bounces after falling on the set surface 2b of the socket 2. As a result, the semiconductor device 1 is largely misaligned from the predetermined position, and the semiconductor device 1 after the cylinder rod 13 moves to the third position C and pushes the semiconductor device 1 toward the set surface 2b is not correctly positioned on the set surface 2b. There were challenges. In order to prevent this, the vacuum of the suction rod 14 may be released while the cylinder rod 13 is being lowered to the third position C, and the semiconductor device 1 may be dropped from the suction rod 14 into the socket 2. However, in this case, there is a problem that the semiconductor device 1 cannot be placed at a predetermined position on the set surface 2a because the falling distance is not stable.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and a semiconductor device dropping device capable of positioning and dropping a semiconductor device while maintaining an appropriate drop distance for each type of semiconductor device. The purpose is to provide.

[0018]

According to a first aspect of the present invention, there is provided a semiconductor device dropping device which includes a cylinder having a cylinder chamber therein, and is provided within the cylinder so as to be vertically movable and slides vertically within the cylinder chamber. A first cylinder rod having a free piston portion formed at one end portion, and a free piston portion is provided inside the cylinder so as to be vertically movable in opposition to the first cylinder rod and formed inside the piston portion. A second sliding part is formed at the end of the sliding part which moves up and down in the concave part.
A cylinder rod, elastic means contracted between the concave portion and the sliding portion, locking means provided in the concave portion to adjust the amount of movement of the sliding portion, and the first cylinder A suction rod that penetrates the rod and the second cylinder rod, has a suction hole therein, and is integrated with the second cylinder rod, and a suction rod that is provided at the other end of the first cylinder rod. An upward regulating means for regulating the upward movement of the first cylinder rod, and a slider supported by the upward regulating means and for urging the first cylinder rod downward through the upward regulating means. A pressure difference between an upper portion and a lower portion of the cylinder chamber defined by the piston portion, the first cylinder rod approaches the set surface side of the socket, and
So that the cylinder rod approaches the first cylinder rod side against the elastic force of the elastic means, and the suction rod approaches the set surface of the socket in conjunction with the second cylinder rod. Is what it is.

[0019]

According to the present invention, the second cylinder rod is locked in the recess by the elastic means having the sliding portion on the lower end side thereof mounted in the recess of the piston portion on the upper end side of the first cylinder rod. It has been pushed up to the position of the means. Therefore, when the pressure medium is introduced into the lower side of the cylinder chamber,
The first cylinder rod is raised to the first position by the piston portion being pushed upward, and the second cylinder rod is also raised together with the first cylinder rod via the elastic means and the locking means. In this case, the suction rod is also raised by raising the first cylinder rod, and horizontal positioning of the semiconductor device that is suctioned at the lower end of the suction rod with respect to the suction rod is performed.

Next, when a pressure medium is introduced into the upper part of the cylinder chamber, the sliding portion of the second cylinder rod is pushed downward through the pressure medium, and this compresses the elastic means to compress the first cylinder rod. Since it is drawn into the concave portion of the cylinder rod, it descends by that amount. Therefore, the suction rod that has sucked the semiconductor device at the lower end is lowered by the amount of pull-in. Further, by introducing the pressure medium into the upper side of the cylinder chamber, the piston portion of the first cylinder rod descends,
Move to the second position. In this case, the second cylinder rod and the suction rod move down together with the first cylinder rod. However, when the first cylinder rod moves down to the second position, the suction section of the second cylinder rod slides. Since the lowering position of the first cylinder rod is lowered by an amount drawn into the concave portion, the falling distance of the semiconductor device sucked by the suction rod to the socket is shortened accordingly.

Incidentally, by changing the position of the locking means in the recess of the first cylinder rod, the falling distance between the semiconductor device and the socket can be easily changed.

[0022]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a sectional view of a drop device of a semiconductor device according to one embodiment of the present invention, and FIG. 2 is an explanatory view of the operation of the drop device. In the drawings, the same or corresponding portions as those of the dropping device of the semiconductor device shown in FIGS. 3 and 4 are denoted by the same reference numerals, and description thereof will be omitted.

In the figure, reference numeral 30 denotes a lower cylinder rod which is a first cylinder rod divided vertically at a position of a piston portion of the cylinder rod, and 31 denotes an upper cylinder rod which is a second cylinder rod. The lower cylinder rod 30 has a piston portion 13a on the upper end side, and a concave portion 30a that is vertically oriented is formed at the upper end of the piston portion 13a. A slider 16 is supported on the lower end of the lower cylinder rod 30 via an E-ring 17 serving as an upward regulating means.
By the vertical movement of a, it is possible to move between the first position A and the third position C via the second position B. The upper cylinder rod 31 has a sliding portion 31a formed at the lower end thereof so as to be vertically slidable in the recess 30a of the lower cylinder rod 30. The upper end of the upper cylinder rod 31 is integrated with the suction rod 14 via an E-ring 15.

Reference numeral 32 denotes a concave portion 30 of the lower cylinder rod 30.
A compression spring as an elastic means attached in the inside a. This compression spring 32 allows the upper cylinder rod 31
Of the lower cylinder rod 30
C-type retaining ring 33 as a locking means attached to the upper part of
Has been pushed up to the position.

Next, the operation of the drop device 3 of the semiconductor device will be described focusing on the operation of the lower and upper cylinder rods 30, 31 and the like. When pressurized air is introduced into the lower part 12a of the cylinder chamber 12 through the lower air passage 11e of the cylinder 11, the lower cylinder rod 30
a, the upper cylinder rod 31 is also pushed up to the compression spring 32 and the C-shaped retaining ring 33.
Through the lower cylinder rod 30 by the same amount. Therefore, the suction rod 14 holding the semiconductor device 1 at the lower end thereof is also pushed upward by the upper cylinder rod 31. In this case, the slider 16 is also pushed up through the E-ring 17 as the lower cylinder rod 30 moves up to the first position A, so that the upper end 19b of the positioning claw 19 engages with the roller 21. The four positioning claws 19 allow the center of the semiconductor device 1 to be on the axis of the suction rod 14.

Next, the lower air passage 11e of the cylinder 11
When pressurized air is introduced into the upper portion 12b of the cylinder chamber 12 through the upper air passage 11d while bleeding air little by little from the upper cylinder rod 31, the sliding portion 31a of the upper cylinder rod 31 Pressurized by pressurized air. Therefore, the upper cylinder 31 compresses the compression spring 32 and moves by a predetermined length b into the concave portion 30a of the lower cylinder rod 30. Therefore, the suction rod 14 integrated with the upper cylinder 31 and the E-ring 15 also moves downward by a predetermined distance b with respect to the lower cylinder rod 30. In this case, the lower part 12 a and the upper part 12
The pressure with respect to b is still slightly higher in the lower portion 12a, but the lower cylinder rod 30 is pressed via the E-ring 17 by the force pressing the slider 16 of the slider pressing spring 18 which overcomes this force. The slider 16 descends to the second position B together with the upper cylinder rod 31 (at this time, the slider 16 is in contact with the stopper 40). As the slider 16 moves downward, the pusher 22 pushes down the movable lid 2 a of the socket 2, the positioning claw 19 is separated from the roller 21, and the lower end 19 a is separated from the semiconductor device 1 by the compression spring 20.

In this case, as the suction rod 14 is lowered, the upper rod 23 is also lowered by the compression spring 25 which presses the upper rod 23 downward through the E-ring 26, and the sensor 2
8 detects the lower part 27a of the light-shielding plate 27 and detects that the movable lid 2a of the socket 2 is opened.

Then, the cylinder rod 30 is moved to the second position shown in FIG.
In the position B, the lower end of the suction rod 14 is located at a position lower than the lower end of the suction rod 14 in the conventional positioning and dropping device 3 by a distance b, so that the distance between the lower surface of the semiconductor device 1 and the set surface 2b of the socket 2 is set. Is shorter than the conventional distance a by the distance b. Therefore, when the vacuum in the suction hole 14a of the suction rod 14 is released and air blow is performed in this state, the semiconductor device 1 drops by the distance (ab) and is placed on the set surface 2b of the socket 2. Is done.

As the semiconductor device 1 falls, the cylinder chamber 1
2, the pressurized air on the lower side 12a side is discharged to the outside via the lower air passage 11e, the lower cylinder rod 30 is also lowered together with the upper cylinder rod 31, and the piston portion 13a contacts the upper surface of the lower guide portion 11c. Lower cylinder rod 3
0 falls to the third position c. As a result, the suction rod 14 integrated with the upper cylinder rod 31 via the E-ring 15 descends to the vicinity of the upper surface of the semiconductor device 1 on the set surface 2b of the socket 2, and the semiconductor device 1 is moved to the socket 2
Is properly positioned on the set surface 2b. In addition, the upper rod 23 also moves down, and the sensor 28
b, the semiconductor device 1 moves the set surface 2 of the socket 2
(b) is detected as being correctly placed.

Next, when pressurized air is introduced into the lower portion 12a while extracting the pressurized air from the upper portion 12b of the cylinder chamber 12 to the outside, the lower cylinder rod 30 is moved to its piston portion 1
3a, the slider 16 rises to the first position A, and the slider 16
The movable lid 2a of the socket 2 is raised to raise the pusher 22 through the connector 2, and the semiconductor device 1 is set in the socket 2. The sliding portion 31a of the upper cylinder rod 31 is compressed by the compression spring 32 so that the lower cylinder rod 30
The lower cylinder rod 30 is raised together with the lower cylinder rod 30 while being pushed up to the position of the C-shaped retaining ring 33 of the concave portion 30a, and the suction rod 14 integral with the upper cylinder rod 31 via the E-ring 15 is also raised.

As described above, the lower cylinder rod 30 having the piston portion 13a having the concave portion formed on the upper end side.
And an upper cylinder rod 31 which holds the suction rod 14 and in which the sliding portion 31a can slide up and down the recess 30a of the lower cylinder rod 30.
Of the upper cylinder rod 31 in the recess 30a
Since the compression spring 32 that presses and moves the semiconductor device 1a to the position of the C-shaped retaining ring 33 in the concave portion 30a is attached, when the semiconductor device 1 is dropped into the socket 2 from the falling device 3 of the semiconductor device, Depending on the type, the position of the C-shaped retaining ring 33 can determine the drop distance of the semiconductor device 1 to the set surface 2b of the socket 2, and the semiconductor device 1 can be properly set in the socket 2. In addition, the mounting position of the C-shaped retaining ring 33 in the concave portion 30a can be easily changed.

In the above embodiment, the piston portion 13a having a concave portion is formed at the upper end of the lower cylinder rod 30 and the sliding portion is formed at the end of the upper cylinder rod 31. Alternatively, a sliding portion may be formed in the portion, and a piston portion having a concave portion in the lower end portion of the upper cylinder rod 31 may be formed.

[0033]

As described above, according to the apparatus for dropping a semiconductor device of the present invention, a cylinder having a cylinder chamber therein and a vertically movable cylinder inside the cylinder are provided. A first cylinder rod having a piston part slidably movable at one end thereof;
A second sliding member is provided in the cylinder so as to be movable up and down in opposition to the first cylinder rod, and has a sliding portion at an end portion that vertically moves in a recess formed inside the piston portion. A cylinder rod, elastic means contracted between the concave part and the sliding part, locking means provided in the concave part for adjusting a moving amount of the sliding part,
A suction rod penetrating through the second cylinder rod and the second cylinder rod and having a suction hole therein and integrated with the second cylinder rod; and provided at the other end of the first cylinder rod. Upward regulating means for regulating the upward movement of the first cylinder rod, and a slider supported by the upward regulating means for urging the first cylinder rod downward via the upward regulating means. The first cylinder rod approaches the set surface side of the socket by the pressure difference between the upper and lower portions of the cylinder chamber defined by the piston portion, and the second cylinder rod Approaches the first cylinder rod side against the resilience of the elastic means, and the suction rod moves the suction hole of the socket in conjunction with the second cylinder rod. Since so as to approach the up surface, while maintaining the appropriate fall distance for each type of semiconductor device,
There is an effect that the semiconductor device can be dropped on the set surface of the socket.

[Brief description of the drawings]

FIG. 1 is a sectional view of a drop device of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is an operation explanatory view of a drop device of the semiconductor device of FIG. 1;

FIG. 3 is a cross-sectional view illustrating an example of a conventional dropping device for a semiconductor device.

FIG. 4 is an operation explanatory view of the dropping device of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Socket 2b Set surface 3 Dropping device of semiconductor device 11 Cylinder 12 Cylinder chamber 12a Upper part 12b Lower part 13 Cylinder rod 13a Piston part 14 Suction rod 16 Slider 17 E-ring (upward regulation means) 30 Lower cylinder rod (No. 1 cylinder rod) 30a recess 31 upper cylinder rod (second cylinder rod) 31a sliding part 32 compression spring (elastic means) 33 C-type retaining ring (locking means) i first position b second position c third position

──────────────────────────────────────────────────続 き Continued on the front page (56) References JP-A-4-5645 (JP, U) JP-A-2-85373 (JP, U) (58) Fields surveyed (Int. Cl. ⁷ , DB name) G01R 31/26 H01L 21/66

Claims (1)

(57) [Claims] 1. A dropping device for a semiconductor device for dropping and mounting a semiconductor device on a set surface in a socket, comprising: a cylinder having a cylinder chamber therein; A first part in which a piston part slidable up and down in the room is formed at one end.
A cylinder rod and a sliding part which is provided in the cylinder so as to be vertically movable in opposition to the first cylinder rod and which moves vertically in a recess formed inside the piston part is provided at an end. A second cylinder rod formed, elastic means contracted between the concave part and the sliding part, locking means provided in the concave part and adjusting a moving amount of the sliding part; A suction rod penetrating the first cylinder rod and the second cylinder rod and having a suction hole therein and integrated with the second cylinder rod; and the other end of the first cylinder rod. Upward restricting means provided on the portion for restricting the upward movement of the first cylinder rod, and attaching the first cylinder rod supported by the upward restricting means in a downward direction via the upward restricting means. Momentum slider The first cylinder rod approaches the set surface side of the socket by the pressure difference between the upper part and the lower part of the cylinder chamber defined by the piston part, and the second cylinder rod The suction rod approaches the first cylinder rod side against the elastic force of the elastic means, and the suction rod approaches the set surface of the socket in conjunction with the second cylinder rod. A falling device for a semiconductor device, comprising: