JP3014035B2 - Substrate for optical coupling device, optical coupling device, and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate having a mounting guide groove for high-precision non-adjustment coupling between an optical component such as an optical waveguide or an LD / PD and an optical fiber required for optical communication, and the substrate. And a method for manufacturing the same.

[0002]

2. Description of the Related Art As an optical axis non-adjustable connection method between an optical component such as an optical waveguide or an LD / PD and an optical fiber, an anisotropic etching using an alkali solution such as potassium hydroxide (KOH) is performed on a Si substrate. There is a method in which a groove is formed and an optical fiber is supported by the V-groove by using a V-groove optical fiber guide of Si.

When a V-groove for supporting an optical fiber is formed on a Si substrate, if the <110> direction of the Si substrate is angularly displaced from the edge direction of the V-groove forming mask, the V-groove to be formed is formed. Expands its width. As a result, the optical fiber supported by the V-groove sinks excessively downward, so that the optical axis of the optical fiber and the optical component such as the optical waveguide are displaced. In contrast, more mask pattern division, or the provision of the uneven mask pattern, a method of compensating for angular displacement has been proposed by Japanese Patent Laid-Open No. 7-35948. That is, as shown in FIG.
The (111) face 6a for supporting the optical fiber is made discontinuous by subdividing it from the groove forming mask 8a or by making the boundary of the V groove forming mask 8a uneven as shown in FIG. In this method, the optical axis shift due to the widening of the V groove width is reduced.

FIG. 9 shows a state where the (100) plane 6c appears at the bottom of the V-groove. Under the mask, (111) other than the (111) surface 6a for supporting the optical fiber is used.
The surface 6d also appears. FIG. 10 shows a state where the optical fiber 2 is mounted on the substrate on which the V-groove is formed by this method. In the figure, reference numeral 32 denotes L which is optically coupled to the optical fiber 2.
D, an optical component such as an optical waveguide. As shown in FIG. 10, the optical fiber 2 has a V-groove forming mask whose edge direction is Si.
When there is an angle shift with respect to the <110> direction of the substrate, the substrate is supported by a set of corners of the subdivided V-groove block 31 (subdivided V-groove row). 6a.

FIG. 11 is a sectional view showing a conventional method for mounting an optical fiber in a guide groove. Conventionally, as shown in the figure, an optical fiber 2 is mounted in a guide V-groove 6 via an adhesive such as a thermosetting resin or an ultraviolet curable resin, and a load block (spacer) 30 is placed on the optical fiber. The optical fiber is fixed in the V-groove by curing the adhesive while applying a load by, for example, such a method.

[0006]

The conventional V shown in FIG.
The groove forming method has the following problems. In general, in the anisotropic etching of Si, as shown in FIG. 12, the corners of the square pattern are formed in the (nn1) plane 2 under the anisotropic etching mask 8 in proportion to the etching depth.
There is a phenomenon called corner undercut (hereinafter, corner cut) that is chamfered by etching such as 1. When there is no angular deviation of the V-groove mask, the optical fiber is supported by the (111) plane.
Since the portion of the (111) plane supporting the optical fiber which is in contact with the optical fiber disappears as a result of the erosion by the (nn1) plane, the optical fiber cannot be stably supported.

In the case where an optical fiber is mounted by subdivided V-groove rows, the V-groove forming mask is made of Si <1.
When there is an angle shift with respect to the 10> direction, if the size of the mask pattern is not extremely large, since the optical fiber is mounted in the mode shown in FIG. 10, the axis shift amount mainly depends on the corner cut amount. Increases with the amount of corner cut.

As a means for reducing the above-mentioned corner cut amount, for example, as shown in FIG.
For example, there is a method in which an alcohol such as isopropyl alcohol (IPA) is added to KOH, which is an etchant for anisotropic etching, in order to reduce the speed of the corner cutting itself.

However, when the corner cut is to be compensated only by the method of the corner cut compensation pattern, the compensation pattern becomes very large (for example, about 5 times more than the case of adding IPA (each of KOH 20w).
t%, when using an etchant at 80 ° C))
There is a problem that the degree of freedom in designing a subdivided V-groove forming mask is reduced due to restrictions due to the value of the V-groove width and the like.

Therefore, it is necessary to combine the above alcohol addition methods. However, when an alcohol such as IPA is added, micro-pyramids (fine projections) are likely to be generated on the (100) plane appearing by etching. If the micro-pyramid remains, the optical fiber cannot be stably seated in the V-groove, so that the optical axis of the optical fiber and the optical waveguide cannot be aligned as designed.

Further, when forming a V-groove for mounting an optical fiber, a stage where Si under the corner cut compensation pattern portion just above the subdivided V-groove block has disappeared (the corner of the original mask 8). Even when the etching has progressed to the portion A), traces of the mark of the corner cut compensation pattern portion mask remain on the lower portion of the corner of the block.
20 are left [FIGS. 13 (a) and 13 (b)]. If the residual Si in the trace of the compensation pattern portion mask is large, it becomes an obstacle when mounting the optical fiber. Therefore, it is necessary to further perform over-etching to eliminate this. As a result, the corner cut amount cannot be completely compensated, which causes an optical axis shift.

Further, the conventional optical fiber mounting method has the following problem. While the adhesive resin is being cured, a load is applied from above by a spacer or the like to
If the accuracy of the shape of the spacer is poor because it is necessary to press it into the groove, "play" will occur between the spacer and the optical fiber or substrate.The optical fiber is likely to shift depending on the direction and magnitude of the load. It is difficult to evenly load multiple optical fibers at the same time,
There is a problem with reliability.

Further, when the optical fiber is fixed to the V-groove by using an ultraviolet curing resin, the amount of the ultraviolet light applied to the bonding surface between the optical fiber and the V-groove is reduced by the amount of the ultraviolet light scattered and absorbed by the optical fiber. In addition, it takes extra time to cure the resin. Therefore, there is a high possibility that the optical axes of the optical fiber and the optical waveguide are shifted during the curing of the resin.

The present invention has been made in view of the above-mentioned problems of the conventional example, and has as its first object to prevent generation of residual Si or the like due to a micropyramid or a compensation mask. Second, the mounting of the optical fiber into the guide V-groove is not hindered. Second, the mounting of the optical fiber into the guide V-groove is performed easily and with high accuracy. It is to be.

[0015]

A substrate for an optical coupling device according to the present invention for achieving the above object has a V-groove formed with an optical fiber to be optically coupled to an optical component. At least the optical fiber in this V-groove is seated
This is characterized in that the bottom portion of the portion to be removed is entirely removed to provide a through hole communicating with the back surface of the substrate.

Further, in a method of manufacturing a substrate for an optical coupling device according to the present invention for achieving the above object, a mask for forming a V-groove is provided on a surface of the substrate, and anisotropically formed to a predetermined depth through the mask. A step of performing an etching process so that at least a portion in contact with the optical fiber has a V-shape, before, after or simultaneously with the etching step, to be formed or formed as a result of the etching. The method is characterized in that a step of removing at least the entire bottom portion of the portion of the groove in which the optical fiber is seated to form a through hole is added.

According to another aspect of the present invention, there is provided an optical coupling device comprising: a substrate for an optical coupling device having a V-groove for mounting an optical fiber;
An optical fiber mounted in the groove and an optical component optically coupled to the optical fiber, wherein the optical coupling device substrate has at least the V-groove along the V-groove.
It is characterized in that a through hole is provided in which the entire bottom portion of the portion where the optical fiber is seated is removed.

Further, a method of manufacturing an optical coupling device according to the present invention for achieving the above object is to provide at least an optical fiber
Is provided with through holes throughout its entire section .
Is formed V groove is in the optical coupling device substrate optical component is adhered to the surface be one having a step of bonding the optical fiber, the or adhesive while vacuum suction through the through-hole The optical fiber is bonded while irradiating ultraviolet rays for curing.

[0019]

1 (a) and 1 (b) are a perspective view and a sectional view for explaining an embodiment of the present invention. In order to manufacture a substrate for an optical coupling device according to the present invention, as shown in FIG.
The mask 8 for anisotropic etching is formed on the surface of the substrate 1 so that the groove forming direction is the <110> direction. The mask 8 can be a stripe-shaped mask,
The mask may be a subdivided mask shown in FIG. 9A or a pattern having irregularities shown in FIG. 9B. FIG.
When a mask having the pattern shown in (a) and (b) is used,
Further, a corner cut compensation pattern portion as shown in FIG. 13 can be added.

Materials for the etching mask include a single-layer or multilayer metal film or alloy film, a thermally oxidized SiO ₂ film,
A VDSiO ₂ film, a CVDSi ₃ N ₄ film, or the like can be used. After forming the mask, the Si substrate 1 is etched using KOH. An etchant to which IPA is added can be used. At the stage where the V-groove 6 is formed to a depth capable of holding the optical fiber on the (111) plane,
Stop etching. In this state, the cross-sectional shape of the V-groove 6 is trapezoidal and has not yet been completely V-shaped. Here, the reason for limiting the etching depth from the substrate surface side to shallow is that by performing deep etching,
This is to avoid an increase in the width of the V-groove due to side etching (in the (111) plane direction) and an increase in the amount of corner cut when the V-groove is subdivided.

When a trapezoidal V-shaped groove is formed, a micro-pyramid 18 is formed on the bottom surface of the V-shaped groove 6 or when a mask having a corner cut compensation pattern portion added to the mask is used. In this case, there is a possibility that residual Si (not shown) indicating a trace of the compensation pattern may be formed, which may hinder the mounting of the optical fiber.
Therefore, in the present invention, the micro pyramid and the remaining Si are removed by removing the bottom of the V-groove (trapezoidal groove).

The following means can be used for removing the bottom of the V-groove. After processing to the state shown in FIG. 1A, a through hole 3 is formed using a mechanical means such as a dicing saw as shown in FIG. 1B. In FIG. 1B, reference numeral 16 denotes a portion from which Si is removed by a through hole. Prior to etching from the front surface of the substrate, a hole having a depth to reach the bottom of the etched V-groove from the back surface of the substrate is formed in advance. An etching mask is also formed on the back surface of the substrate, and etching is performed from the back surface side of the substrate.

FIG. 2 is a sectional view in the case where etching is also performed from the back side of the substrate. In the example shown in FIG. 2, an anisotropic etching mask 8 having a corner cut compensation pattern portion 19 is formed on the front surface of the substrate, and an anisotropic etching mask 9 is formed on the rear surface of the substrate to perform etching. A V-groove 6 and a back-side V-groove 7 are formed, thereby forming a through hole. When only the front-side V-groove 6 is formed, the (100) plane 6c appears at the bottom of the V-groove 6 and the remaining Si20 as a trace of the mask is formed at the corner of the bottom.
These are removed by etching from the back side.

After the formation of the V-groove 6 communicating with the back surface through the through hole is completed, as shown in FIG. 1B, the V-groove 6 is mounted with the optical fiber 2 and bonded using an adhesive (not shown). I do. In this case, since the remaining Si and the like due to the micro-pyramid 18 and the compensation pattern portion mask no longer exist, the optical fiber can be stably seated.
In this bonding step, air can be suctioned from the direction of the back surface 1b of the substrate 1 through the through holes 3. As a result, the optical fiber 2 is pressed against the (111) surface of the front V-groove 6 and is sucked. This state is more stable than the state where the optical fiber is simply placed in the V-groove.
By bonding the optical fiber to the groove, the optical fiber can be mounted with higher precision.

FIGS. 3 and 4 are sectional views showing another mounting method of the optical fiber. As shown in FIG. 3, an ultraviolet curing resin 10 is used as an adhesive for fixing the optical fiber, and the optical fiber can be fixed by irradiating ultraviolet rays 11 from the back side of the substrate through the through hole 3. According to this method, the ultraviolet light irradiated from the back surface of the substrate is not scattered or absorbed by the optical fiber. In addition to improving the workability, the possibility of optical fiber misalignment during the bonding process can be reduced.

As shown in FIG. 4, when the polarization-maintaining optical fiber 12 is mounted in the front V-groove 6, the coherent or incoherent illumination light 13 is irradiated from the back side of the substrate through the through hole 3 of the substrate. . When the intensity distribution image 15 of the transmitted light 14 of the polarization maintaining fiber 12 obtained as a result is observed on the substrate surface 1a side, the transmitted image changes due to the rotational displacement of the polarization maintaining fiber 12 around the optical axis. For this reason, by observing and knowing in advance the transmitted light intensity distribution in a desired polarization direction such as a direction perpendicular or parallel to the substrate surface, the polarization preserving Without monitoring by measuring fiber waveguide optical power,
The polarization direction can be easily adjusted by observing the transmitted light intensity distribution. In the adjustment of the polarization direction of the polarization-maintaining optical fiber by this method, the substrate surface 1a is turned upside down.
It is also possible to adopt a configuration in which illumination light is incident from the direction and observation is performed from the back surface 1b direction.

[0027]

Next, embodiments of the present invention will be described in detail with reference to the drawings. FIGS. 5 and 6 show a case where the optical coupling device of the present invention is formed by forming a V-groove for an optical fiber and an optical waveguide of silica glass on the same Si substrate. The steps in the case of using a method of forming holes by anisotropic etching from both sides of a Si substrate are shown in the order of steps. First, FIG.
As shown in (a), masks 8 and 9 for anisotropic etching are provided on a front surface 1a and a back surface 1b on a Si substrate 1, respectively. Regarding the formation position of the mask 9 for anisotropic etching on the back side, as shown in FIG. 5A, it is sufficient to provide the mask 9 only on the opposite side of the substrate corresponding to the surface V groove. That is,
The back side V-groove 7 opposite to the front side formed by etching from the back side is connected to the front side V-groove 6 to form a through-hole, and (10) of the portion where the optical fiber is to be placed
0) The surface is removed and provided at a position where traces of the corner cut compensation pattern remaining at the bottom of the V-groove can be removed without performing deep etching by over-etching.

When an alkaline solution such as KOH is used as an etchant for anisotropic etching, for example, tungsten silicide (WSi) or Au which is hardly etched by KOH may be used for this mask. Unless a quartz glass optical waveguide is provided on the same substrate, a thermal oxide film of Si can be used as a mask for anisotropic etching to form a V-groove for optical fiber guide. It is. As a means for forming the masks 8 and 9 for anisotropic etching on the front side and the back side, after forming a mask forming material layer, for example, a photoresist is applied and then exposed using a double-sided mask aligner or the like to form a pattern. Should be performed.

When the silica glass optical waveguide is formed on the Si substrate, as shown in FIG. 5B, the surface 1a of the substrate after the formation of the masks 8 and 9 for anisotropic etching.
Next, a silica glass optical waveguide composed of the clad 4 and the core 5 is formed. This optical waveguide can be formed as follows. For example, a lower cladding 4b made of a silica glass material and an optical waveguide core material layer are deposited by an AP-CVD method or a flame deposition method, and the core material layer is patterned by photolithography and reactive ion etching (RIE) to form a light guide. After forming the waveguide core 5, the upper clad 4a is deposited in the same manner as the lower clad. Next, the optical waveguide forming mask 40 is
Formed on a. As shown in FIGS. 5C and 5C ', this mask 40 is formed above the portion of the upper cladding of the optical waveguide that is to be left, avoiding the position where the V groove for optical fiber guide is formed. do it.

Next, as shown in FIG. 6D, the substrate is etched to an appropriate depth from the back surface of the substrate by using the anisotropic etching mask 9 on the back side. At this time, the surface 1 of the Si substrate
In a, since Si is not exposed, it is not etched yet. Further, at this time, the specific etching depth from the back surface is set such that the thickness of the substrate is T (μm) and the etching depth from the front surface as a result of the double-sided etching in the later step is d (μm). In some cases, it may be about T-2d (μm).

Thereafter, the waveguide layer including the optical waveguide clad 4 and the optical waveguide core 5 is etched using the mask 40 for forming the optical waveguide end face, and as shown in FIG. An optical waveguide is formed at 42. A terminal end face 42 a is formed on the end face of the optical waveguide section 42. In the case of a silica glass-based waveguide layer, the above etching may be performed by, for example, wet etching using buffered hydrofluoric acid or reactive ion etching using, for example, a CF-based gas. As a result, Si is exposed in the V-groove forming portion 41 on the surface of the substrate.

Further, by performing anisotropic etching from both sides of the substrate, as shown in FIG. 6F, a through hole 3 is provided in the lower bottom portion of the front V-groove 6. As a result, the portion (10) where the optical fiber should lie
0) A structure with no remaining surface is realized. Therefore,
Even if a micro pyramid is formed on the (100) plane, it does not remain. Further, even when the V-groove is formed by being subdivided, the trace Si20 remaining on the corner cut compensation pattern portion mask which should remain at the bottom of the V-groove is removed (see FIG. 2).

If the etching of the Si substrate is performed in two stages as described above, for example, when the substrate thickness is 500 μm and the required etching depth of the front side V-groove for mounting the optical fiber is 60 μm, The etching depth from the front surface and the back surface can be made different, and the important
It can be avoided that the corner cut is increased by making the etching more deeply than necessary.

In the above method, the (100) plane where the micro-pyramid is likely to be generated is located at the portion where the optical fiber should lie down and at the bottom of the V-groove the trace of the corner cut compensation pattern portion mask remaining Si
However, since it is only necessary to be able to remove without over-etching, high precision is not required for the position where anisotropic etching is performed from the back surface.

FIG. 7A is a perspective view of the optical coupling device substrate thus formed. Next, as shown in FIG. 7B, the optical fiber is mounted on the V-groove by using any of the methods described above, and the V-groove with the through hole is formed. At the stage, as shown in FIG. 7A, Si (11) appearing by anisotropic etching
Since the (111) surface 6b having the edge at the terminal end surface 42a of the optical waveguide portion among the 1) surfaces is present, the end of the optical fiber can be completely abutted against the terminal end surface 42a of the optical waveguide portion. Can not. Therefore, before mounting the optical fiber in the V-groove, as shown in FIG. 8, a cutting groove 51 deeper than the front V-groove is provided between the V-groove forming portion 41 and the optical waveguide portion 42 with a dicing saw or the like. . As a result, a new terminal end face 42b of the optical waveguide is formed.

It is apparent that the optical waveguide formed on the Si substrate is not limited to the silica glass optical waveguide, but may be an optical waveguide made of, for example, fluorinated polyimide.
Further, the optical component to be coupled to the optical fiber may be a laser diode or a photodiode other than the optical waveguide. Further, as the substrate material, GaAs or InP can be used instead of Si, as long as the V-groove can be formed by anisotropic etching.

[0037]

As described above, the substrate for an optical coupling device according to the present invention has the (100) plane which is to be left at the bottom of the V-groove in which the optical fiber is mounted. Does not occur,
The trace Si remaining on the corner cut compensation pattern portion mask which should remain at the bottom of the V-groove can be removed without performing deep etching by over-etching. Therefore, according to the present invention, the optical fiber can be supported with high precision and stability without being disturbed by the residual Si of the trace of the micro pyramid or the corner cut compensation pattern portion mask. In an optical coupling device of a non-adjustable coupling type of a component and an optical fiber, high-efficiency coupling having both mass productivity and reliability is possible.

Further, according to the present invention, when mounting the optical fiber in the V-groove, the air can be sucked from the back surface of the substrate, so that a load is applied to the optical fiber from the surface of the substrate (upper side of the V-groove) by a spacer or the like. This eliminates the necessity and allows for simple and highly accurate mounting. Further, since the ultraviolet curable resin can be irradiated with ultraviolet rays not only from above the optical fiber on the substrate surface but also from the rear surface of the substrate through the through hole, the optical fiber can be fixed to the V-groove in a shorter time. For this reason, the probability of occurrence of optical axis shift between the external optical waveguide and the optical fiber, which improves workability, is reduced.

When the polarization direction of the polarization maintaining fiber is adjusted and mounted, coherent or incoherent illumination light is irradiated from below or from above and the transmission image of the polarization maintaining fiber is observed by a microscope or the like. Since the polarization direction can be matched, compared to the conventional method of monitoring the guided light power of the polarization maintaining fiber,
The angle adjustment of the polarization maintaining fiber can be easily performed. That is, according to the present invention, in the optical coupling device of the high-precision optical fiber non-adjustment mounting method, the time required for mounting the optical fiber can be reduced, and the reliability and workability can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view and a cross-sectional view illustrating an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a manufacturing method according to an embodiment of the present invention in the order of steps.

FIG. 6 is a sectional view and a perspective view in the order of steps for explaining the manufacturing method according to the embodiment of the present invention.

FIG. 7 is a perspective view and a sectional view of one embodiment of the present invention.

FIG. 8 is a cross-sectional view for explaining a manufacturing method according to one embodiment of the present invention.

FIG. 9 is a plan view for explaining a conventional example.

FIG. 10 is a plan view for explaining a conventional example.

FIG. 11 is a cross-sectional view illustrating a conventional example.

FIG. 12 is a perspective view for explaining a problem of the conventional example.

FIG. 13 is a perspective view and a cross-sectional view for explaining a problem of the conventional example.

[Explanation of symbols]

Reference Signs List 1 Si substrate 1a Si substrate front surface 1b Si substrate back surface 2 Optical fiber 3 Through hole 4 Optical waveguide cladding 4a Upper layer cladding 4b Lower layer cladding 5 Optical waveguide core 6 Front side V groove 6a, 6b, 6d (111) plane 6c (100) plane 7 Back V-groove 8, 9 Anisotropic etching mask 8a V-groove forming mask 10 UV curable resin 11 UV 12 Polarization preserving optical fiber 13 Illumination light 14 Transmitted light 15 Intensity distribution image 16 Si removal portion by through hole 17 Optical fiber Part to be laid down 18 Micro pyramid 19 Corner cut compensation pattern portion 20 Corner cut compensation pattern portion Remaining trace of mask 21 (nn1) surface 30 Load block (spacer) 31 Subdivided V-groove block 32 Light from LD, optical waveguide, etc. Component 40 Waveguide forming mask 41 V-groove forming part 42 Optical waveguide part 42a Terminal end face of optical waveguide part 42b Terminal end face of optical waveguide part (after cutting groove formation) 51 Cutting groove

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-164706 (JP, A) JP-A-59-38709 (JP, A) JP-A-2-287504 (JP, A) 2106 (JP, U) Japanese Utility Model Showa 57-9916 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/30

Claims (9)

(57) [Claims] 1. A substrate for an optical coupling device in which a V-groove for mounting an optical fiber to be optically coupled to an optical component is formed, wherein at least a bottom portion of the V-groove at a portion where the optical fiber is seated is provided. A substrate for an optical coupling device, wherein a through hole which is entirely removed and communicates with a back surface of the substrate is provided along a V-groove. 2. A V-groove forming mask is provided on a surface of a substrate, and anisotropic etching is performed to a predetermined depth through the mask so that at least a portion in contact with the optical fiber has a V-shape. A method of manufacturing a substrate for an optical coupling device having a processing step, wherein before or after the etching step, at least a bottom portion of a portion of the groove to be formed or formed as a result of the etching, in which the optical fiber is seated, is formed.
A method for manufacturing a substrate for an optical coupling device, further comprising a step of removing all of the substrate to form a through hole. 3. A V-groove forming mask is provided on the front and back surfaces of the substrate, and anisotropic etching is performed from the front and back surfaces of the substrate to a predetermined depth through each mask to form at least the front surface. And the groove formed from the front side and the groove formed from the back side are connected to form a V-shaped groove.
At least in the area where the optical fiber is seated,
A method for manufacturing a substrate for an optical coupling device, characterized in that a through hole is formed in the substrate. 4. The method for manufacturing a substrate for an optical coupling device according to claim 3, wherein etching is performed to a predetermined depth from the back surface of the substrate, and thereafter, etching is performed simultaneously from the front and back surfaces of the substrate. 5. The amount of etching from the substrate surface is such that the cross section of the groove to be formed has a trapezoidal shape, and the horizontal portion of the trapezoidal shape is removed by means other than etching from the substrate surface. 4. The method for manufacturing a substrate for an optical coupling device according to claim 2, wherein 6. An optical coupling device substrate formed with a V-groove for mounting an optical fiber, an optical fiber mounted in the V-groove of the optical coupling device substrate, and optically coupled to the optical fiber. In the optical coupling device having the optical component, the substrate for the optical coupling device has at least the V-groove along the V-groove.
Optical coupling device, wherein a through hole which the optical fiber to remove any bottom portion of the part to be seated is provided. 7. At least a portion where an optical fiber is seated.
Is a method for manufacturing an optical coupling device, comprising a step of bonding an optical fiber to a substrate for an optical coupling device having a V-groove provided with a through hole over the entire section and having an optical component fixed to a surface thereof. And bonding an optical fiber while performing vacuum suction through the through hole. 8. At least a portion where an optical fiber is seated.
Is a method for manufacturing an optical coupling device, comprising a step of bonding an optical fiber to a substrate for an optical coupling device having a V-groove provided with a through hole over the entire section and having an optical component fixed to a surface thereof. A method of manufacturing an optical coupling device, comprising: irradiating ultraviolet rays from at least the back surface of the substrate through the through holes using an ultraviolet-curable adhesive to cure the adhesive. 9. At least a portion where an optical fiber is seated.
Is a method for manufacturing an optical coupling device, comprising the step of bonding a polarization maintaining optical fiber to an optical coupling device substrate having a V-groove provided with a through hole over the entire section and having an optical component fixed to the surface. And irradiating light from the back surface of the substrate through the through-hole and observing the transmitted light intensity distribution, or irradiating light from the substrate surface and observing the transmitted light intensity distribution through the through-hole and preserving the polarization. A method for manufacturing an optical coupling device, comprising adjusting a polarization direction of an optical fiber.