JP3011101U - Electrostatic breakdown test equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] Positioning is performed while observing the pins of the device under test with an ultra-compact CCD camera and an enlarged image on the CRT monitor connected to the device in the electrostatic breakdown tester for electronic devices, and making contact. (EN) Provided is an electrostatic breakdown test device capable of easily aligning a pin with a device pin to be tested. [Structure] A charging / discharging pin 13 on the side of a test device is brought into contact with a pin of a device under test 21, the device under test is charged from the side of the device under test, and then discharged to cause electrostatic breakdown of the device under test. In the electrostatic breakdown test apparatus for measuring the withstand voltage, the imaging device 25 capable of imaging the test target device is provided, and from the pin position on the enlarged image of the test target device imaged by the imaging device, the pin of the test target device and the Align the charge and discharge pins on the test equipment side.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electrostatic breakdown test apparatus for testing the electrostatic breakdown withstand capability of electronic devices, particularly semiconductor integrated circuits (IC, LSI), and more specifically, an electrostatic breakdown test apparatus based on a charged device model. Destruction test equipment.

[0002]

[Prior art]

 It is widely known that electronic devices such as semiconductor integrated circuits are destroyed or deteriorated by electrostatic discharge, and countermeasures for this are one of the major issues for improving reliability. The model in which an electronic device receives electrostatic discharge from a charged object outside it has already been established and widely used as a method of simulating with a human body model or mechanical model. On the other hand, it has been known in recent years that the electronic device itself is charged by friction and the like, and even when the charge is rapidly discharged from the pin of the electronic device to an external metal, it is destroyed. This electrostatic discharge breakdown model is called a device charging model (CDM), and has been actively studied in recent years and various papers have been published (for example, Masaki Tanaka et al., Establishment of ESD test method of device charging model, RCJ 2nd. The EOS / ESD Symposium November 1992).

The principle of the electrostatic breakdown withstand capability test method using this device charging model (CDM) is disclosed in, for example, Japanese Patent Publication No. 5-668, and the test method disclosed in this publication is a so-called contact method. Type is a type of direct charge (contact type direct charge) method. In this method, as shown in FIG. 6, the device under test is connected to the device under test with the high voltage power supply Ev and the charging circuit consisting of the resistors R ₁ and R ₂ kept in contact with the device under test while SW ₁ is opened. The charge is charged, and then SW ₁ is closed to discharge the charged charge. Since the contact type direct charge has a simple circuit configuration, it is easy to realize an automatic test device.Because the electronic device is placed on the grounded metal and charged directly from the pin, the charge amount is stable. Highly reproducible tests are possible.

However, what is important in the electrostatic breakdown test by the device charging model (CDM) is to monitor the discharge current from the capacitance C _{0 of the} device under test when SW ₁ is closed by the current flowing through SW _1. That is. In the circuit shown in FIG. 6, the monitored discharge current is also added with the current due to the discharge of the electric charge charged in the stray capacitance C _A of the discharge circuit system, and the discharge current of only the charge capacitance C _{0 of the} device is calculated. Difficult to detect. Therefore, the applicant of the present invention has disclosed an electrostatic breakdown tester capable of measuring a discharge current based on a device charging model and having good reproducibility in Japanese Patent Application No. 6-387 (utility model registration No. 3003557). It is disclosed.

In addition to the above, an electrostatic breakdown test device using a device charging model (CDM) has a charging side and a discharging side separated. For charging and discharging, the contact pin on the testing device side is mechanically used as a device pin. There are a direct method of moving and contacting with respect to, and a method of placing the device to be tested on a high voltage electrode plate and inductively charging it.

An important point common to these methods is that the contact pin on the side of the test apparatus that charges and discharges the device under test is in proper contact with the pin of the device under test. It is to detect and confirm. Even if charging is started from the test equipment side while the two are not in contact, the device under test is not charged, so there is no stress during discharge, no damage even when the charging voltage is increased, and electrostatic breakdown occurs. You get the wrong result, which is very strong.

Conventionally, in the electrostatic breakdown test device disclosed in Utility Model Registration No. 3003557, the contact between the contact pin and the device pin is mechanically detected by sensing the downward movement range of the contact pin when moving vertically. Was. However, this method can cope well with the device under test in which the pins of the device under test face upward, such as a dual in-line type integrated circuit, but the pins typified by the flat package are oriented horizontally. In the case of a device shape, it may be difficult to detect it correctly.

In order to solve this difficulty, the applicant of the present invention electrostatically breaks down the contact between the contact pin and the device under test by a device charging model that can be electrically detected by sensing a minute change in the capacitance before and after the contact. A test device is disclosed in Japanese Patent Application No. 6-5356 (utility model registration No. 3003306).

[0009]

[Problems to be solved by the device]

 The technological progress of semiconductor integrated circuits is extremely rapid, and the increase in the degree of integration and the miniaturization of pins are unavoidable. As a result, in many cases, the intrinsic capacitance of each device under test exceeds several tens pF. The discharge current from such a large-capacity integrated circuit according to the device charging model instantaneously exceeds 50 amperes. In order to pass such a large current, a pseudo-ground metal body that temporarily absorbs the electric charge discharged from the device under test is formed into a large plate (generally a disk), and the device under test is mounted. In recent years, it has become clear that the device under test must be sandwiched between the lower grounded metal body and the above-described pseudo ground metal plate at close intervals from above and below. In addition, the length of the charging / discharging pin that contacts the pins of the device under test for charging / discharging must also be extremely short. In addition, the pin shape of the device under test and the distance between them are becoming finer. Therefore, it has become difficult to perform the conventional method of aligning the charge / discharge pin and the device pin to be tested with eyes or directly confirming the mutual position with a magnifying glass.

The present invention has been made in view of the above circumstances. In the electrostatic breakdown test apparatus for an electronic device, the pin of the device under test is aligned while observing the pin with a magnified image, and the contact pin is attached. It is an object of the present invention to provide an electrostatic breakdown test device that can be easily aligned with a device under test.

[0011]

[Means for Solving the Problems]

 In the electrostatic breakdown test apparatus of the present invention, the pin of the device under test placed on the grounded metal plate is brought into contact with the charging / discharging pin of the device under test to charge the device under test from the side of the device under test. Then, in the electrostatic breakdown tester that measures the electrostatic breakdown resistance of the device under test by discharging, the charging / discharging pin is placed on the pseudo-ground metal plate in a direction perpendicular to the plate through an insulator. The pseudo ground metal plate is provided with an opening, and an imaging device capable of imaging the device under test through the opening is provided. The position of the charging / discharging pin is calculated from the pin position on the enlarged image of the device under test captured by the imaging device that is parallel to the discharge pin and kept at a constant horizontal distance, and the position of the device under test is calculated. Align with pin It is characterized in.

An illumination device is provided around the opening of the pseudo-grounded metal plate, and an image is taken by the imaging device while illuminating the device under test.

The horizontal distance between the optical axis of the image pickup device and the axis of the charging / discharging pin is a capacitor provided with two disc-shaped parallel plate electrodes having a center point. It is characterized in that it is calculated by using a means for detecting a change in capacity as seen from the charge / discharge pin that moves in the horizontal direction with respect to the upper electrode.

[0014]

[Action]

 When the pseudo-ground metal plate that is closer to the device under test becomes larger, it is practical to perform alignment while visually checking the mechanical contact between the test device side contact pin and the device under test. It will be impossible. According to the present invention, it is possible to display an enlarged image of the test target device pin imaged by the imaging device on the CRT monitor, and it is possible to check the position of the test target device pin and align the contact pin and the test target device pin very efficiently. It becomes possible to carry out the test, and the data of the mutual positional relationship of the pins of the device under test, which is the basis, can also be created easily.

By imaging the device under test while illuminating it, the device under test can be satisfactorily used even in a narrow and dark space between the ground metal plate on which the device under test is mounted and the pseudo-ground metal plate located above it. It is possible to measure the pin position.

The center point of the disk electrode of the capacitor is aligned with the cross point of the CRT monitor screen, the coordinate position is specified, and then the contact pin is moved along the disk-shaped upper parallel plate electrode of the capacitor. Thus, the center point coordinate position of the disk electrode of the capacitor located immediately below the contact pin can be specified from the change in capacitance. From the coordinate position of both, the distance (coordinate difference) between the optical axis of the image pickup device (cross intersection of the screen) and the contact pin axis can be measured.

[0017]

【Example】

 An electrostatic breakdown test apparatus according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 5.

FIG. 1 illustrates a probe portion of an electrostatic breakdown test apparatus of this embodiment and a mounting state of a device under test for the probe portion. The probe unit 20 is provided with a pseudo ground metal body 11 that absorbs discharge charges, and a pseudo ground metal plate 15 that is electrically connected to the pseudo ground metal body 11. On the pseudo ground metal plate 15, contact pins 13 that contact and charge / discharge the pins of the device under test are fixed via an insulator 17. The printed board 10 is fixed to the pseudo ground metal body 11 and the pseudo ground metal plate 15, and the printed board 10 includes switches K ₂ and K ₃ , a drive device 14 for the discharge switch K ₁ , and a capacitance change detection circuit. The head portion 16 and the like are mounted. The discharge switch K ₁ is mounted inside the pseudo ground metal body 11 and between the pseudo ground metal body 11 and the contact pin 13.

The contact pins 13 are fixed to a pseudo-ground metal plate 15 such as aluminum via an insulator 17, and contact with each pin of the device under test 21 to perform charging / discharging. That is, the switch K ₂ is closed during charging, and the pin of the device under test is connected to the high-voltage power source E _V through the isolation resistor R ₁ that isolates a high-frequency signal. _{When 1} is closed, the electric charge charged in the device under test is discharged to the pseudo ground metal body 11. The pseudo ground metal plate 15 is made of, for example, an aluminum plate, and when the switch K ₁ is closed to discharge the electric charge of the device under test by the displacement current, it has an action of increasing the discharge capacity of the pseudo ground metal body 11.

The switch K ₁ is a discharge switch for discharging the electric charge charged in the device under test to the grounded metal body through the pseudo-grounded metal body and the pseudo-grounded metal plate. In this embodiment, mercury is used. It is a switch. Since this discharge switch must pass a current of 50 amps or more in 1 ns or less, it is necessary to minimize the lead length and electrostatic / electromagnetic coupling with the driving magnet. Therefore, the structure is to separate the electromagnet and the switch. The two poles of the magnet are arranged close to each other from the back of the figure so as to be orthogonal to the switch.

The resistor R ₁ is a resistor for separating the discharging circuit and the charging circuit at high frequencies. The switch K ₂ is a reed relay for supplying a high voltage power source at the time of charging, and the switch K ₃ is a reed relay for connecting a circuit for detecting a change in capacity. The head portion 16 of the capacitance change detection circuit will be described later. The insulator 17 is used to insulate and attach the contact pin 13 from the pseudo ground metal plate 15.

The probe unit 20 is fixed to an arm unit (not shown). The nail probe portion is attached to an arm portion (not shown) that freely moves in the horizontal and vertical directions through a slide mechanism so that it can freely move in the vertical direction. The CCD camera head 22, the close-up adapter 23, and the CCD camera head fixing device that fixes the lens 24, which is the image pickup device 25, are similarly directly fixed to an arm portion (not shown). As a result, the probe unit 20 and the CCD camera 25 are integrally moved in the horizontal direction (X, Y directions) by the position control mechanism (not shown) via the arm unit. The reason why only the vertical movement of the probe part 20 is allowed is that when the contact pin comes into contact with the device pin under test, the pressure applied to the pin is suppressed to about the weight of the probe part 20 so that the device pin under test is deformed. Or to minimize damage.

The close-up adapter 23 and the lens 24 attached to the optical axis of the CCD camera head 22 are used to obtain a practical focal length and a magnifying power. The CCD camera head transmits an image pickup signal to a CRT monitor (not shown) through the cable 26 and enlarges and displays the imaged image. A cross mark is displayed at the center of the image on the CRT monitor, and the optical axis of the CCD camera is adjusted so as to coincide with the intersection of the cross marks. The pseudo-ground metal plate 15 is provided with a circular hole 18 for observing the pins of the test target device mounted on the ground metal plate 28 with a CCD camera, and a light emitting diode for illumination around the hole 18. There is. This light compensates for the lack of extraneous light when the space between the pseudo-ground metal plate and the ground metal body becomes narrow. An incandescent lamp or the like may be used as the lighting device.

In the structure of FIG. 1, when the horizontal position (X, Y axis) and the vertical position (Z axis) are adjusted by the position control mechanism to focus on the reference pin (for example, pin 1) of the device under test. The image on the CRT monitor is, for example, as shown in FIG. Further, by finely adjusting the horizontal position, the position on the pin of the device under test to which the charge / discharge pin (contact pin) should be brought into contact is accurately adjusted to the cross point of the cross on the CRT monitor. The values (X _m , Y _m ) are registered in the computer. If the computer stores in advance the coordinate difference (X _o , Y _o ) between the center point of the optical axis of the CCD camera (the intersection of the above crosses) and the contact pin, the contact pin is brought into contact with the reference pin. The X and Y coordinate values of can be calculated immediately by (X _m + X _o , Y _m + Y _o ). Therefore, the contact pin can be accurately brought into contact with the reference pin by moving the contact pin position to the coordinates (X _m + X _o , Y _m + Y _o ) by the position control mechanism and lowering the probe part in the vertical direction. .

Next, a method for obtaining the horizontal distance (coordinate difference) between the center point of the optical axis of the CCD camera and the contact pin axis will be described. However, this coordinate difference does not change once the CCD camera head is fixed until it is removed, so there is no need to repeat it frequently. Instead of the device under test of FIG. 1, the printed circuit board 30 shown in FIG. 3 is placed at approximately the center of the movable area of the contact pin. The mounting position at this time does not have to be exactly the center of the movable area, but it is desirable that it can be mounted at a reproducible position. For that purpose, a dedicated jig is prepared. The printed circuit board 30 has a disk-shaped gold-plated copper foil surface 31 with a diameter of about 10 mm on both sides, and a hole or mark 32 with a diameter of about 0.1 mm is attached to the center thereof. Make up.

The printed circuit board 30 shown in FIG. 3 includes a cross pattern (which may be formed of copper foil or silk printing) in the upper right portion. The parallel plate capacitor 33 is used when determining the coordinate difference between the optical axis of the CCD camera and the contact pin axis, as described in detail below. The cross-shaped character on the upper right is a pattern for adjusting the rotation angle when the CCD camera 25 is fixed to the movable arm on the test apparatus side. Since the CCD camera has a circular cross section, it is necessary to properly adjust and fix the relationship between the vertical and horizontal directions on the CRT monitor screen and the front, back, left and right on the table on which the device under test is mounted, depending on the rotation angle when the position is fixed. The relationship is shifting. Since the CCD camera observes the device under test from directly above, the left and right direction of the device under test is left and right on the CRT monitor screen, the front side of the device under test is down on the CRT monitor screen, and the back side of the device under test is The CCD camera's rotation angle is fixed and fixed so that it is exactly on top of the CRT monitor screen so that the ten characters are parallel to each other in the X and Y directions. Perform the following steps to find the coordinate difference between a point and a contact pin.

First, the optical axis of the CCD camera is aligned with the center mark 32 of the parallel plate capacitor 33 shown in FIG. 3, and this is adjusted to the position of the intersection of the cross marks of the CRT monitor. The X and Y coordinate values (X _om , Y _om ) indicated by the position control mechanism at this time are registered in the computer.

After that, the test apparatus side is switched to the switch K.₃ Closed and the capacitance change detection mode (switch K₂ Is left open), and the parallel plate capacitor 33 shown in FIG. 3 is scanned in the X direction (from left to right, the Y coordinate is fixed) while sequentially contacting the contact pins 13 on the surface of the substrate 30. . The capacitance change before and after contacting the printed board is extremely small until the contact pin 13 contacts the gold-plated portion 31, but when the contact pin 13 contacts the gold-plated portion, the capacitance change before and after becomes about 2 pF, and in the capacitance change detection mode, This change can be detected. When the contact pin 13 is further moved to the right, the gold-plated portion 31 ends. X coordinate of this boundary point₁, X₂And Since the contact pin actually contacts the parallel plate capacitor here, these X₁, X₂  Is the actual coordinates of the contact pin. Next, with the X coordinate fixed, the contact pin 13 is moved in the Y direction (toward the back), and similarly, the coordinates of the boundary point of the gold-plated portion 31 are obtained.₁, Y₂And

From the above measurement, the coordinates (X _c , Y _C ) of the center point of the parallel plate capacitor can be calculated by the following equation. X _c = (X ₁ + X ₂ ) / 2 Y _c = (Y ₁ + Y ₂ ) / 2 From the above, the difference X _O and Y _O in the coordinate value between the contact pin axis and the center point of the optical axis of the CCD camera is Can be calculated by By _{X O = X om -X c Y} O = Y om -Y c registering this value to the computer, performing a positioning pin of the device under test by the enlarged image in a CRT monitor screen by the CCD camera 25 Then, the position control mechanism horizontally moves the arm position (not shown) by this coordinate difference. Then, by moving the probe unit in the vertical direction, the contact pin 13 can be brought into accurate contact with the device pin to be tested.

The above scanning step for measuring the boundary position of the parallel plate capacitor should be performed with the highest resolution (minimum feed step) of the position control mechanism. Because the resolution is X_O, Y_OThis is because it determines the expected error in the calculated value of. By the way, in the electrostatic breakdown test apparatus manufactured by the applicant, the minimum feeding step is 10 μm. Practically, X can be performed in a constant step of 10 μm.₁ , X₂ , Y₁ , Y ₂ Since it takes a very long time to search for, a so-called successive approximation method is adopted in which steps are stepped little by little and the boundary is finally moved by moving 10 μm.

As described above, one example of calculating the difference in coordinate value between the contact pin axis and the optical axis of the CCD camera using the parallel plate capacitor having the circular parallel plate electrodes has been described. To calculate the difference, it is not necessary to limit to a parallel plate capacitor having circular parallel plate electrodes, the shape of the upper electrode surface is known in advance, and the mutual position of the boundary and the position mark imaged by the CCD camera Anything can be used as long as it is decided. For example, it may be a square, a rectangle, an oval, or the like, and the number of center point marks is not limited to one, and there may be one in the X direction and one in the Y direction. Further, if the positional relationship with the boundary of the electrode surface is determined, it may not be the center point. Further, considering that it is used by placing it on the grounded metal body, the lower surface electrode may be omitted.

Next, a method of detecting the contact between the contact pin and the parallel plate capacitor or the device pin to be tested by sensing a change in minute capacitance will be described. An electrostatic breakdown tester having such a function is disclosed by the applicant in Japanese Patent Application No. 6-5356 (utility model registration No. 3003306), but it is detected in the embodiment of the present invention. The circuit has been modified.

FIG. 5 shows a circuit diagram thereof. The portion surrounded by the wavy line portion in FIG. 5 is mounted on the head portion 16 of the capacitance change detection circuit on the printed circuit board 10 of the probe portion 29 in FIG. The head portion 16 is composed of a bridge circuit composed of four capacitors C ₁ , C ₂ , C ₃ and C ₄ and four diodes D ₁ , D ₂ , D ₃ and D _4. It is a combination of bridge type rectifier circuits. If the capacitance C _X including the stray capacitance of the circuit connected to the contact pin via the switch K ₃ and the resistor R ₁ in FIG. 1 is zero, the bridge formed by C _{1 to} C ₄ is in a balanced state and AB The potentials are the same. Actually, the capacitance C _X is not zero, and when the tip of the contact pin comes into contact with the electrode (gold-plated portion) of the flat plate capacitor shown in FIG. 3 or the device pin to be tested, the capacitance changes before and after that. . This capacitance change is detected as a change in signal amplitude between AB. With a normal bridge without diodes D _{1 to} D ₄ (only C _{1 to} C ₄ ), this change appears as a change in the amplitude of the AC signal, but in the present invention, the change in the amplitude of the AC signal is bridge rectified. Therefore, it is obtained as a DC potential difference with an AC component superimposed. The low pass filter is used to remove the AC component in it. Further, the potential difference between A and B is detected by a differential amplifier, converted into a numerical value by an analog digital (AD) converter, and read by a computer. The computer knows the amount of change in the value read from the AD converter, and either the tip of the contact pin contacts the electrode part 31 of the parallel plate capacitor (Fig. 3), or there is no electrode (other than gold plating). Part) can be recognized. Alternatively, during the actual test, it is possible to identify whether the contact pin contacts the pin of the device under test. The sine wave oscillator used has an output frequency of 50 kHz and an output amplitude of about 2 V. However, if the band of the low pass filter is set appropriately, the frequency value is not a big problem. With respect to the output amplitude, it is desirable to set the amplitude to such an extent that the temperature fluctuation of the forward voltage drop of the diodes D _{1 to} D ₄ does not have a great influence. The resistors R ₁ and R ₂ are isolation resistors for preventing the wiring of the low pass filter from affecting the operation of the bridge.

In the electrostatic breakdown test apparatus of this embodiment, after the contact pin is lowered with respect to the device pin to be tested, the contact is confirmed using the capacitance detection circuit described above. Then, after confirmation, the device under test is charged and then discharged to measure the discharge withstand voltage. After confirmation, the device under test is charged, then discharged and the discharge withstand capability is measured. As described above, since the device has the function of confirming the presence or absence of contact based on the change in capacitance, it is possible to provide an electrostatic breakdown test device with extremely high reliability.

In the present embodiment, an example in which the position control mechanism moves the arm side on which the probe unit and the CCD camera are mounted has been described, but it goes without saying that the ground metal body side on which the device to be tested is mounted may be moved. Good. Alternatively, a CCD camera may be arranged outside the pseudo-ground metal plate to directly image the device under test without going through the opening of the pseudo-ground metal plate. As described above, various modifications can be made without departing from the spirit of the present invention.

[0036]

[Effect of device]

 As described above, according to the present invention, it is possible to simplify the work of aligning the contact pin on the test device side with the device pin to be tested in the electrostatic breakdown test device, and in order to deal with a device with a large discharge current, a pseudo test is performed. The ground metal plate can be placed close to the top of the device to ensure reliable alignment even when it is difficult to see it. Furthermore, the contact between the contact pin and the device pin under test during the actual test can be reliably detected electrically by determining the change in capacitance.

[Brief description of drawings]

FIG. 1 is an explanatory diagram around a probe unit of an electrostatic breakdown test apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an example of an image captured by the image capturing apparatus.

FIG. 3A is a top view of a parallel plate capacitor, and FIG.

FIG. 4 is an explanatory diagram for calculating a coordinate difference between an optical axis of the image pickup device and an axis of a charge / discharge pin.

FIG. 5 is a circuit diagram of a capacitance change detection circuit.

FIG. 6 is a circuit diagram showing the principle of electrostatic breakdown withstand measurement by a device charging model.

[Explanation of symbols]

 11 Pseudo Ground Metal Body 13 Contact Pins 15 Pseudo Ground Metal Plate 20 Probe Part 21 Device Under Test 25 Imaging Device (CCD Camera) 27 Illumination Device

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical display location G01R 31/28 (72) Creator Katsuo Matsuura 6442 Taniho, Ichiho, Tokyo Metropolitan Government Daiichi Sanei Building Within Trading Co., Ltd. (72) Inventor Isofuku Satoshi Toru Satoshi Tokyo National City City, Ippei 6442, Daiichi Niseki Building Tokyo Electronic Trading Co., Ltd.

Claims (4)

[Scope of utility model registration request] 1. An electrostatic breakdown of the device under test by charging and discharging the device under test from the device under test by contacting a pin of the device under test with a charge / discharge pin of the device under test. In an electrostatic breakdown test apparatus for measuring withstand voltage, an image pickup apparatus capable of picking up an image of the device under test is provided, and an enlarged screen imaged by the image pickup apparatus is used to connect an optical axis between the image pickup apparatus and the charge / discharge pin. A means for calculating a distance is provided, and the pin of the device under test and the charge / discharge pin on the side of the test device are aligned from the pin position on the enlarged image of the device under test captured by the imaging device. Electrostatic breakdown test equipment. 2. An electrostatic breakdown of the device under test by charging a pin of the device under test with a charge / discharge pin of the device under test, charging the device under test from the side of the device under test, and then discharging the device. In an electrostatic breakdown test apparatus for measuring withstand voltage, an image pickup apparatus capable of picking up an image of the device under test is provided, the optical axis of the image pickup apparatus is parallel to the charge / discharge pins, and is kept at a constant horizontal distance, A device for calculating the position of the charging / discharging pin from the pin position on the enlarged image of the device under test captured by the imaging device to perform alignment with the device under test, and an optical axis of the imaging device. The horizontal distance from the axis of the charging / discharging pin is an insulating substrate provided with a metal pattern on the surface and fixed on a ground metal plate, and charging / discharging along with the movement of the charging / discharging pin moving on the insulating substrate. An electrostatic breakdown test device characterized by being calculated using a means for detecting a change in capacitance as seen from an electric pin. 3. A pseudo-ground metal plate which is formed by sandwiching a device under test fixed on a grounded metal plate between the device and the installation metal plate, and an opening for taking an image of the device under test via the pseudo-grounded metal plate. The electrostatic breakdown test apparatus according to claim 1 or 2, further comprising: a section, further comprising an illuminating device around the section, and imaging with the imaging device while illuminating the device under test. 4. An image pickup means for aligning a charge / discharge pin on the test apparatus side with a pin of a device under test fixed on a grounded metal plate and a contact between the pins after alignment is detected as a capacitance change. And a means for charging the device under test through the charging / discharging pin, and a device for discharging the electric charge charged in the device under test.