JP3010840B2 - Mixed nonwoven fabric for low dielectric constant printed circuit boards - Google Patents

Mixed nonwoven fabric for low dielectric constant printed circuit boards

Info

Publication number
JP3010840B2
JP3010840B2 JP27353091A JP27353091A JP3010840B2 JP 3010840 B2 JP3010840 B2 JP 3010840B2 JP 27353091 A JP27353091 A JP 27353091A JP 27353091 A JP27353091 A JP 27353091A JP 3010840 B2 JP3010840 B2 JP 3010840B2
Authority
JP
Japan
Prior art keywords
fiber
nonwoven fabric
printed circuit
dielectric constant
short fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP27353091A
Other languages
Japanese (ja)
Other versions
JPH05247813A (en
Inventor
恵市 加藤
博一 井ノ口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Boseki Co Ltd
Original Assignee
Nitto Boseki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Boseki Co Ltd filed Critical Nitto Boseki Co Ltd
Priority to JP27353091A priority Critical patent/JP3010840B2/en
Publication of JPH05247813A publication Critical patent/JPH05247813A/en
Application granted granted Critical
Publication of JP3010840B2 publication Critical patent/JP3010840B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は繊維補強材とポリエーテ
ルエーテルケトン(以下PEEKと言う)短繊維とから
なる混合不織布に関し、特に、低誘電率を有するプリン
ト基板用に適する混合不織布に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mixed nonwoven fabric comprising a fiber reinforcing material and polyetheretherketone (hereinafter referred to as "PEEK") short fibers, and more particularly to a mixed nonwoven fabric suitable for a printed circuit board having a low dielectric constant.

【0002】[0002]

【従来の技術】周知の通り、最近のプリント基板に要求
される品質特性として誘電率特性がクローズアップされ
てきている。コンピューターの演算速度の高速化に伴
う、信号の伝達スピードの高速化により、高速度演算下
でも信頼性が高い誘電率の低いプリント基板が要求され
るようになってきている。この様な要求に対して樹脂面
ではポリ4フッ化エチレン樹脂,ポリスルホン,ポリエ
チレン,ポリブタジエン等の誘電率の低い熱可塑性樹脂
が検討され、又基材面ではポリ4フッ化エチレン繊維織
物や芳香族ポリアミド繊維織物,クォーツ繊維織物等が
検討されている。しかしこれらの従来技術によるプリン
ト基板は成形加工性やプリント基板としての信頼性及び
価格の点で問題があり、十分にその要求に答えられるほ
どにはなっていない。
2. Description of the Related Art As is well known, dielectric properties have recently come to the fore as quality characteristics required for printed circuit boards. As the operation speed of a computer increases, the transmission speed of a signal increases, so that a printed circuit board having high reliability and a low dielectric constant has been required even under high-speed operation. In response to such demands, thermoplastic resins having a low dielectric constant such as polytetrafluoroethylene resin, polysulfone, polyethylene, and polybutadiene have been studied on the resin side, and polytetrafluoroethylene fiber woven fabric or aromatic resin on the substrate side. A polyamide fiber woven fabric, a quartz fiber woven fabric and the like are being studied. However, these conventional printed circuit boards have problems in molding workability, reliability as a printed circuit board, and cost, and have not been able to sufficiently meet the demands.

【0003】[0003]

【発明が解決しようとする課題】情報処理の高速化に伴
い、信号伝播速度の遅延や信号波形の乱れ等が問題視さ
れるようになり、低誘電率の材料を用いたプリント配線
板が求められるようになってきた。しかしながら、これ
に必要な基板の基材の開発が遅れており、十分な対応が
成されていない。本発明は情報処理の高速演算用プリン
ト配線板として、より汎用性を有する低誘電率特性の求
められるプリント配線板に対応可能なプリント基板用基
材を安価に提供することを目的とする。
With the increase in the speed of information processing, delays in signal propagation speed, disturbances in signal waveforms, and the like have been regarded as problems, and printed wiring boards using low dielectric constant materials have been required. It has come to be. However, the development of the base material required for this has been delayed, and sufficient measures have not been taken. SUMMARY OF THE INVENTION It is an object of the present invention to provide a low-cost substrate for a printed circuit board, which is more versatile and can be used for a printed circuit board requiring low dielectric constant characteristics, as a high-speed arithmetic printed circuit board for information processing.

【0004】[0004]

【課題を解決するための手段】本願発明者等は、連続繊
維補強材とPEEK短繊維を含む短繊維からなる不織布
であって、前記補強材は一方向に配列されており、不織
布内の繊維間の接点が、バインダーにより接着されてい
る混合不織布により解決可能であることを見出だした。
本発明の混合不織布に使用される連続繊維補強材として
は、ガラス繊維やアルミナ繊維であって、繊維径が5〜
30μmの繊維を200〜1000本集束して得られる
ストランドの形態で使用される。連続繊維補強材は多数
本が平行に引き揃えられた状態で不織布内に保持され
る。引き揃えられた連続繊維補強材層は、不織布内に一
層でも良く、或いは複数層であっても良い。
Means for Solving the Problems The present inventors have made a non-woven fabric comprising a continuous fiber reinforcing material and short fibers containing PEEK short fibers, wherein the reinforcing materials are arranged in one direction, and the fibers in the non-woven fabric are arranged in one direction. It has been found that the contact between them can be solved by a mixed nonwoven bonded by a binder.
The continuous fiber reinforcing material used in the mixed nonwoven fabric of the present invention is a glass fiber or an alumina fiber having a fiber diameter of 5 to 5.
It is used in the form of a strand obtained by bundling 200 to 1000 30 μm fibers. The continuous fiber reinforcement is held in the nonwoven fabric in a state where a large number of continuous fiber reinforcements are aligned in parallel. The aligned continuous fiber reinforcement layer may be a single layer or a plurality of layers in the nonwoven fabric.

【0005】本発明の不織布を構成する短繊維として
は、主としてPEEK繊維が用いられる。又、他の熱可
塑性樹脂繊維でも良いし、PEEK繊維と他の熱可塑性
樹脂繊維との混合であっても良い。PEEK短繊維の繊
維径,長さは特に制限はないが、繊維径で20〜50μ
m、長さが5〜20mm程度のものが好ましい。PEE
K短繊維や他の熱可塑性樹脂短繊維は、混合不織布を用
いて成形した場合、溶融して成形品のマトリックス樹脂
となる。このPEEK短繊維に補強用の短繊維、例え
ば、連続繊維補強材として用いられるガラス繊維等を混
合しても良い。連続繊維補強材や短繊維に使用されるガ
ラス繊維としては、Eガラス繊維,Dガラス繊維,Sガ
ラス繊維等が使用できるが、本発明の趣旨からすると誘
電率の小さいDガラス繊維が最も適する。尚、いずれに
よる場合でも補強材繊維の割合はVol%で30〜65
%で、好ましくは45〜60%である。この範囲であれ
ば成形品の外観が良く、強度もでる。
[0005] As short fibers constituting the nonwoven fabric of the present invention, PEEK fibers are mainly used. Further, other thermoplastic resin fibers may be used, or a mixture of PEEK fibers and other thermoplastic resin fibers may be used. Although the fiber diameter and length of the PEEK short fiber are not particularly limited, the fiber diameter is 20 to 50 μm.
m and a length of about 5 to 20 mm are preferable. PEE
When short K fibers and other thermoplastic resin short fibers are molded using a mixed nonwoven fabric, they are melted to become a matrix resin of a molded product. Short fibers for reinforcement, for example, glass fibers used as a continuous fiber reinforcement, may be mixed with the PEEK short fibers. E glass fiber, D glass fiber, S glass fiber and the like can be used as the glass fiber used for the continuous fiber reinforcing material and the short fiber, but from the point of the present invention, D glass fiber having a small dielectric constant is most suitable. In any case, the ratio of the reinforcing fiber is 30 to 65 vol%.
%, Preferably 45 to 60%. Within this range, the appearance of the molded product is good and the strength is high.

【0006】本発明の混合不織布は次のようにして得ら
れる。繊維径20〜50μmからなるPEEK長繊維
を、適当な長さの短繊維(チョップドストランド)とす
る。この時の短繊維の長さは5〜20mmとすることが
好ましい。その理由は、後述するように短繊維を水中に
分散させた際の分散性が良いからである。次に、このP
EEK短繊維を水中に投入し、攪拌しながらフィラメン
ト状に開繊し分散させる。ここで、短繊維を水中に良好
に分散させ、かつ分散状態に保つため、適当な分散剤を
用いることが好ましい。分散剤としては、一般に市販さ
れている界面活性剤系の分散剤、例えば、マーポマーセ
PT或いはゾンデスKV(いずれも松本油脂工業(株)
製)を使用でき、その濃度は0.1〜0.3%が適当で
ある。PEEKの分散濃度としては、0.02〜0.2
%、好ましくは0.05〜0.1%が良い。尚、不織布
を構成する短繊維中にPEEK短繊維以外の短繊維を混
入させたい場合には、その短繊維も水中に投入し分散さ
せる。
[0006] The mixed nonwoven fabric of the present invention is obtained as follows. The PEEK long fiber having a fiber diameter of 20 to 50 μm is used as a short fiber (chopped strand) having an appropriate length. At this time, the length of the short fiber is preferably 5 to 20 mm. The reason is that the dispersibility when short fibers are dispersed in water is good as described later. Next, this P
EEK staple fiber is put into water, and it is opened and dispersed in a filament while stirring. Here, it is preferable to use an appropriate dispersant in order to disperse the short fibers well in water and to keep the dispersed state. As the dispersant, a surfactant-based dispersant which is generally commercially available, for example, Marpomerse PT or Sondes KV (both from Matsumoto Yushi Kogyo Co., Ltd.)
And its concentration is suitably from 0.1 to 0.3%. The dispersion concentration of PEEK is 0.02 to 0.2
%, Preferably 0.05 to 0.1%. When it is desired to mix short fibers other than PEEK short fibers into the short fibers constituting the nonwoven fabric, the short fibers are also introduced into water and dispersed.

【0007】次に、この分散液中のPEEK短繊維を抄
紙技法を利用して瀘水性基材上に堆積し、繊維マツトを
形成する。この工程はバッチ式,連続式のいずれでも可
能であるが、図1に示す抄紙器を用いたバッチ式を例に
とって説明する。全体を参照符号1で示す抄紙器は、分
散液2を収容するようになった抄紙器本体3と、その抄
紙器本体3をヒンジ4によって回転可能に保持した底部
5と、抄紙器本体3を底部5に固定する固定部材6と、
底部5上面に取り付けられた瀘水性基材7と、底部5の
下端に接続された排液パイプ8及びバルブ9などを有し
ている。この抄紙器1に前記分散液を投入し、PEEK
短繊維が水中に均一に分散している状態で、バルブ9を
開いて排液する。これにより、投入された分散液2中の
水は瀘水性基材7を通過し、排液パイプ8から排出さ
れ、PEEK短繊維は瀘水性基材7上に補足される。か
くして、抄紙器1に投入された分散液2中の水がほぼ完
全に瀘水性基材7を通過した時には、瀘水性基材上には
PEEK短繊維からなる繊維マットが均一に形成され
る。ここで、使用する瀘水性基材7としては、小さい網
目を多数備えたネットを使用することが好ましい。ネッ
トとしては、使用するPEEK短繊維の長さおよび繊維
径によっても異なるが、繊維径20〜50μm、繊維長
5〜20mmに対して、網目の大きさが0.26〜0.
30mmくらいで、その開口率が50〜60%くらいが
適当である。網目が大きすぎると、ネットを通過する液
の速度が大きくなり、繊維マットの形成速度が大きくな
るが、網目を通過する短繊維量が多くなって歩留まりが
低下し、又水流の発生によりネット上に形成される繊維
マットが不均一になる。一方、網目が小さすぎると、ネ
ットがめづまりを起こしやすく、繊維マットの形成に時
間がかかる。更に、分散液中に比重の異なる短繊維を混
合し分散させていた場合には、繊維マットの形成に時間
がかかると、比重の大きい短繊維が分散液の下層に多く
なり、形成される繊維マット中でも、繊維マットの下層
に比重の大きい短繊維の占める割合が高くなる。従っ
て、これらの欠点が生じないように、網目の大きさを選
定する。
[0007] Next, the PEEK staple fibers in this dispersion are deposited on a drainage substrate using a papermaking technique to form fiber mats. This process can be performed by either a batch system or a continuous system. The batch system using a paper machine shown in FIG. 1 will be described as an example. A paper machine generally designated by reference numeral 1 comprises a paper machine main body 3 adapted to accommodate a dispersion 2, a bottom 5 holding the paper machine main body 3 rotatably by a hinge 4, and a paper machine main body 3. A fixing member 6 fixed to the bottom 5,
It has a drainage substrate 7 attached to the upper surface of the bottom 5 and a drain pipe 8 and a valve 9 connected to the lower end of the bottom 5. The dispersion is charged into the paper machine 1 and PEEK
With the short fibers uniformly dispersed in water, the valve 9 is opened to drain the liquid. As a result, the water contained in the dispersion liquid 2 passes through the drainage substrate 7 and is discharged from the drainage pipe 8, and the PEEK short fibers are captured on the drainage substrate 7. Thus, when the water in the dispersion liquid 2 charged into the paper machine 1 has almost completely passed through the filterable base material 7, a fiber mat composed of PEEK short fibers is uniformly formed on the filterable base material. Here, as the drainage base material 7 to be used, it is preferable to use a net having many small meshes. Although the net varies depending on the length and the fiber diameter of the PEEK short fiber used, the size of the mesh is 0.26 to 0.2 mm for a fiber diameter of 20 to 50 μm and a fiber length of 5 to 20 mm.
It is suitable that the aperture ratio is about 30 mm and the aperture ratio is about 50 to 60%. If the mesh is too large, the speed of the liquid passing through the net increases, and the speed of forming the fiber mat increases.However, the amount of short fibers passing through the mesh increases, and the yield decreases. The resulting fiber mat becomes uneven. On the other hand, if the mesh is too small, the net tends to be clogged, and it takes time to form the fiber mat. Furthermore, when short fibers having different specific gravities are mixed and dispersed in the dispersion, if the formation of the fiber mat takes a long time, the short fibers having a large specific gravity increase in the lower layer of the dispersion, and the fibers to be formed are formed. Among the mats, the proportion of short fibers having a large specific gravity in the lower layer of the fiber mat increases. Therefore, the size of the mesh is selected so that these disadvantages do not occur.

【0008】上記したようにして瀘水性基材7上に繊維
マットを形成した後、その繊維マットの上に、図2に示
すように、アルミ枠10に多数本のガラス繊維ストラン
ド等の連続繊維補強材11を一方向に配列し、張り付け
たものを乗せ、再び、前記短繊維分散液を抄紙器1に投
入する。この時、先に形成されている繊維マットが、分
散液の再投入により破壊しないよう、抄紙器1の壁に沿
って静かに投入するなどの注意を払う必要がある。分散
液の投入後、再びバルブ9を開いて排液する。これによ
り、瀘水性基材上に一方向に配列された連続繊維補強材
が上下のPEEK短繊維によりサンドイッチ状に挟まれ
た繊維マットが形成される。このようにして形成される
積層シートの目付量としては、乾燥後において、50〜
500g/m2 の範囲で可能である。なお、アルミ枠1
0にセットする連続繊維補強材11は、低Tex、又は
十分に開繊されたものが好ましい。瀘水性基材7上に連
続繊維補強材を挟み込んだ繊維マットを形成した後、抄
紙器本体3をヒンジ4を中心に矢印の方向に回転させ、
瀘水性基材7と共に繊維マットを取り出す。そして、そ
の繊維マットから過剰な水分を除去し、繊維マットが幾
分水分を含んでいる状態のときに、バインダーを均一に
スプレーする。ここで使用するバインダーは水系のバイ
ンダーのほうが幾分水分を含んでいる繊維マットに対し
て浸透性が良いために好ましい。その後、この繊維マッ
トを乾燥させ水分を除去して、PEEK短繊維と一方向
配列の連続繊維補強材の混合した不織布が得られる。以
上、本発明の混合不織布の製法についてバッチ式による
方法を説明したが、抄紙機の設備を利用することにより
連続式によることも可能である。
After the fiber mat is formed on the drainage substrate 7 as described above, a continuous fiber such as a large number of glass fiber strands is placed on the aluminum frame 10 on the fiber mat as shown in FIG. The reinforcing materials 11 are arranged in one direction, and the reinforcing material 11 is placed thereon, and the short fiber dispersion is put into the paper machine 1 again. At this time, it is necessary to pay attention such as gently feeding the fiber mat along the wall of the paper machine 1 so that the previously formed fiber mat is not broken by the re-feeding of the dispersion liquid. After charging the dispersion, the valve 9 is opened again to drain the liquid. As a result, a fiber mat is formed in which the continuous fiber reinforcement arranged in one direction on the drainage base material is sandwiched between upper and lower PEEK short fibers. The weight per unit area of the laminated sheet thus formed is 50 to 50% after drying.
It is possible in the range of 500 g / m 2 . The aluminum frame 1
It is preferable that the continuous fiber reinforcing material 11 set to 0 has low Tex or is sufficiently opened. After forming a fiber mat in which a continuous fiber reinforcement is sandwiched on the drainage base material 7, the paper machine body 3 is rotated about the hinge 4 in the direction of the arrow,
The fiber mat is taken out together with the drainage substrate 7. Then, excess moisture is removed from the fiber mat, and the binder is sprayed uniformly when the fiber mat contains some water. The binder used here is preferably an aqueous binder because it has better permeability to a fiber mat containing some water. Thereafter, the fiber mat is dried to remove water, and a nonwoven fabric in which PEEK short fibers and a unidirectionally arranged continuous fiber reinforcing material are mixed is obtained. As described above, the method of producing the mixed nonwoven fabric according to the present invention is described by using a batch method. However, it is also possible to employ a continuous method by utilizing the equipment of a paper machine.

【0009】本発明に使用される繊維補強材は、その表
面に成形後マトリックス樹脂となる熱可塑性樹脂と相溶
性ないし親和性を有する集束剤を塗布されていることが
必要である。集束剤としては、ガラス繊維の場合は被膜
形成成分としてエポキシ樹脂をアミンやエチレンオキサ
イド付加により変性したものなどが適し、これにシラン
カップリング剤と潤滑剤及びソフナーを配したものが用
いられる。シランカップリングザイとしては、エポキシ
シラン,アミノシラン,メタクリルシラン,ビニルシラ
ン,カチオニックシラン,クロルシラン等から適宜選択
される。又、本発明の不織布に使用されるバインダーは
マトリックス樹脂と相溶性ないし親和性を有し、最終製
品であるプリント基板の各種特性に悪影響を及ぼさない
ことが要求される。上記条件を満たすものであれば特に
限定を必要としないが、エポキシ樹脂をアミンやエチレ
ンオキサイドの付加により水溶性化したものなどはこの
条件を満たす。
It is necessary that the fiber reinforcing material used in the present invention has a surface coated with a sizing agent having compatibility or affinity with the thermoplastic resin to be the matrix resin after molding. As the sizing agent, in the case of glass fiber, a material obtained by modifying an epoxy resin as a film forming component by addition of an amine or ethylene oxide is suitable, and a material provided with a silane coupling agent, a lubricant, and a softener is used. The silane coupling zy is appropriately selected from epoxy silane, amino silane, methacryl silane, vinyl silane, cationic silane, chlorosilane and the like. Further, it is required that the binder used in the nonwoven fabric of the present invention has compatibility or affinity with the matrix resin and does not adversely affect various characteristics of the printed circuit board as a final product. There is no particular limitation as long as it satisfies the above conditions, but those obtained by adding epoxy or amine oxide to water-soluble epoxy resin satisfy this condition.

【0010】[0010]

【作用】本発明の混合不織布を複数枚積層し、更にその
両側に銅箔を重ねて加熱プレスすることにより、PEE
K繊維は溶融しマトリックス樹脂となり、一方向に配列
された連続繊維補強材層を有するプリント基板を得るこ
とができる。この様にして得られたプリント基板は誘電
率の小さいPEEK樹脂をマトリックスとし、繊維補強
材として誘電率の小さいDガラス繊維を使用することに
より、基板全体として誘電率を小さくすることができ
る。又、このプリント基板は一方向に配列された連続繊
維補強材層を有しているが、補強材のVol%を30〜
65%の範囲にコントロールされているため、補強材層
が流されたり、歪んだりすることが起こりにくい。連続
繊維補強材層の両側に補強材の短繊維を配することによ
り一層連続繊維補強材の変形を抑えることができる。混
合不織布を積層する際に一方向に配列された連続繊維補
強材の方向を一層ごとに直角方向にずらすことにより、
成形基板内の連続繊維補強材の配列方向を基板の縦方
向,横方向に配列することができ、基板の機械的特性の
方向性を少なくすることができる。又、耐熱性の優れて
いるPEEKをマトリックス樹脂としているため耐熱性
の良いプリント基板が得られる。更に、連続繊維補強材
層の両側に補強材の短繊維を配した場合には、この短繊
維がフィラメント状態で層を形成しているため成形基板
の表面平滑性を良くすることが出来る。
The PEE is obtained by laminating a plurality of the mixed nonwoven fabrics of the present invention, further laminating copper foils on both sides thereof, and hot pressing.
The K fibers are melted to become a matrix resin, and a printed board having a continuous fiber reinforcing material layer arranged in one direction can be obtained. The printed circuit board obtained in this manner can reduce the dielectric constant of the entire substrate by using PEEK resin having a small dielectric constant as a matrix and using D glass fiber having a small dielectric constant as a fiber reinforcing material. The printed circuit board has a continuous fiber reinforcing material layer arranged in one direction.
Since it is controlled in the range of 65%, it is unlikely that the reinforcing material layer is washed away or distorted. By arranging short fibers of the reinforcing material on both sides of the continuous fiber reinforcing material layer, the deformation of the continuous fiber reinforcing material can be further suppressed. By shifting the direction of the continuous fiber reinforcement arranged in one direction in the direction perpendicular to each layer when laminating the mixed nonwoven fabric,
The arrangement direction of the continuous fiber reinforcing materials in the molded substrate can be arranged in the longitudinal direction and the lateral direction of the substrate, and the directionality of the mechanical properties of the substrate can be reduced. Further, since PEEK having excellent heat resistance is used as the matrix resin, a printed circuit board having good heat resistance can be obtained. Further, when short fibers of the reinforcing material are arranged on both sides of the continuous fiber reinforcing material layer, the short fibers form a layer in a filament state, so that the surface smoothness of the molded substrate can be improved.

【0011】プリント基板の製造は、一般に補強繊維の
織物をエポキシ樹脂やポリイミド樹脂などの樹脂ワニス
に含浸し、プリプレグを作り、これを積層、加熱プレス
することにより行われているが、本発明の混合不織布を
用いれば、織物の製織工程が要らず、プリプレグ工程も
不要となり、更に、加熱プレスの時間も硬化反応でない
ために短縮することが可能である。要するに、従来のプ
リント基板とほぼ同等の性能を有し、且つ、低誘電率特
性をも有するプリント基板が工程を省略した形で容易に
得ることができる。
The production of a printed circuit board is generally carried out by impregnating a woven fabric of reinforcing fibers with a resin varnish such as an epoxy resin or a polyimide resin to form a prepreg, laminating the prepreg, and heating and pressing the prepreg. If a mixed nonwoven fabric is used, the weaving step of the woven fabric is not required, the prepreg step is not required, and the time of the heating press can be shortened because it is not a curing reaction. In short, a printed circuit board having substantially the same performance as a conventional printed circuit board and also having low dielectric constant characteristics can be easily obtained in a form in which steps are omitted.

【0012】[0012]

【実施例】フィラメント径30μmで繊維長6mmのP
EEK短繊維を、分散剤マーポマーセPT(松本油脂工
業(株)製)を0.1%溶解した水中に、このPEEK
短繊維を2.2g投入して約0.1%の分散液を作成
し、この分散液を図1に示す抄紙器1に投入する。抄紙
器1の瀘水性基材7としては、65メッシュのステンレ
ス製ネットで、目開きが0.28mm、開口率が51
%、大きさが22cm×22cmのものを使用した。バ
ルブ9を開け、瀘水性基材7を通過する水を排液パイプ
を通して排水し、瀘水性基材7上にPEEK短繊維を堆
積させて繊維マットを形成した。次に、図2に示すよう
にアルミ枠10に連続繊維補強材11として、18.4
Texのガラス繊維ストランド(D−ガラス:日本電気
硝子(株)製)を528本、22cm幅に渡ってセット
したものを準備し、これを先に抄紙した繊維マット上に
乗せ、更にもう一度注意深くPEEK短繊維2.2gを
含んだ分散液を投入し、前回と同様にしてPEEK短繊
維を堆積させた。これにより、連続繊維補強材が上下面
からPEEK短繊維でセットされたサンドイッチ状の一
方向補強繊維マットを得た。この繊維マット形成後、エ
ポキシ樹脂(エピコート828:シェル化学(株)製)
にジエタノールアミンを1モル付加し水溶性化したエポ
キシ樹脂を有効成分で1%とする水溶液をバインターと
して繊維マツトに均一にスプレーし乾燥した。以上のよ
うな方法により得た混合不織布を3枚積層しつぎの条件
で加熱プレスし積層板を得た 温 度 390℃ 圧 力 10kg/cm2 時 間 10分
EXAMPLE A P having a filament diameter of 30 μm and a fiber length of 6 mm was used.
The EEK staple fiber was dissolved in water in which 0.1% of a dispersant Marpomerse PT (manufactured by Matsumoto Yushi Kogyo Co., Ltd.) was dissolved.
2.2 g of short fiber is charged to prepare a dispersion of about 0.1%, and this dispersion is charged to the paper machine 1 shown in FIG. The drainage substrate 7 of the paper machine 1 is a 65 mesh stainless steel net having an opening of 0.28 mm and an opening ratio of 51.
%, A size of 22 cm × 22 cm was used. The valve 9 was opened, the water passing through the drainage substrate 7 was drained through a drain pipe, and PEEK staple fibers were deposited on the drainage substrate 7 to form a fiber mat. Next, as shown in FIG.
A set of 528 glass fiber strands (D-Glass: manufactured by Nippon Electric Glass Co., Ltd.) over a width of 22 cm was prepared, placed on the fiber mat previously made, and then carefully again PEEK. A dispersion containing 2.2 g of short fibers was charged, and PEEK short fibers were deposited as in the previous case. Thus, a sandwich-like one-way reinforcing fiber mat in which the continuous fiber reinforcing material was set with PEEK short fibers from the upper and lower surfaces was obtained. After forming the fiber mat, an epoxy resin (Epicoat 828: manufactured by Shell Chemical Co., Ltd.)
An aqueous solution containing 1% of an epoxy resin made water-soluble by adding 1 mol of diethanolamine to the water-soluble epoxy resin as an active ingredient was used as a binder to uniformly spray and dry the fiber mat. Three mixed nonwoven fabrics obtained by the above method were laminated and heated and pressed under the following conditions to obtain a laminated plate. Temperature 390 ° C Pressure 10 kg / cm 2 Time 10 minutes

【0013】[0013]

【比較例】18.4Texのガラス繊維糸(D−ガラス
繊維:日本電気硝子(株)製)を織り密度 経方向 6
0本/25mm,緯方向 58本/25mmにより製織
した織物を、ポリイミド樹脂(ケルイミド#601:日
本ポリイミド(株)製)と試薬N−メチル−2−ピロリ
ドンを50:50で混合したポリイミドワニスに含浸
し、プリプレグを作成。このプリプレグを5枚積層し、
加熱加圧し積層板を得た。
Comparative Example 18.4 Tex glass fiber yarn (D-glass fiber: manufactured by Nippon Electric Glass Co., Ltd.) weaving density Warp direction 6
A woven fabric woven at 0/25 mm and 58/25 mm in the weft direction is applied to a polyimide varnish obtained by mixing a polyimide resin (Kelimide # 601: manufactured by Nippon Polyimide Co., Ltd.) and a reagent N-methyl-2-pyrrolidone at 50:50. Impregnated to make prepreg. Five prepregs are laminated,
Heat and pressure were applied to obtain a laminate.

【0014】実施例と比較例で得られた積層板の誘電率
を測定した。測定結果を表1に示す。
The dielectric constants of the laminates obtained in Examples and Comparative Examples were measured. Table 1 shows the measurement results.

【表1】 積層板の厚さ 誘電率(1MHz) 実 施 例 0.48mm 3.26 比 較 例 0.51mm 4.04 [Table 1] Laminate thickness Dielectric constant (1 MHz) Example 0.48 mm 3.26 Comparative Example 0.51 mm 4.04

【0015】[0015]

【発明の効果】繊維補強材としてD−ガラス繊維を用い
た本発明の混合不織布を積層し、加熱加圧して得られる
プリント基板は、従来、低誘電率基板として用いられて
いるD−ガラス・ポリイミド系のプリント基板と比較し
て、更に誘電率を低くすることができる。又、PEEK
樹脂をマトリックス樹脂としているため耐熱性も高く、
更に、工程的にも製織工程やプリプレグ工程を必要とせ
ず、容易にかつ安価に低誘電率プリント基板を得ること
ができるという利点も有する。
The printed circuit board obtained by laminating the mixed nonwoven fabric of the present invention using D-glass fiber as a fiber reinforcing material, and applying heat and pressure to the laminate is made of D-glass, which has been conventionally used as a low dielectric constant substrate. The dielectric constant can be further reduced as compared with a polyimide-based printed circuit board. Also, PEEK
High heat resistance because the resin is a matrix resin,
Further, there is an advantage that a weaving step and a prepreg step are not required in the process, and a low dielectric constant printed board can be easily and inexpensively obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の混合不織布を製造するための装置の1
例を示す概略断面図。
FIG. 1 shows an apparatus 1 for producing the mixed nonwoven fabric of the present invention.
Schematic sectional view showing an example.

【図2】繊維マット内に入れる連続繊維補強材をアルミ
枠にセットした状態を示す斜視図。
FIG. 2 is a perspective view showing a state in which a continuous fiber reinforcing material to be put in a fiber mat is set in an aluminum frame.

【符号の説明】[Explanation of symbols]

1 抄紙器 2 分散液 3 抄紙器本体 4 ヒンジ 5 底部 6 固定部材 7 瀘水性基材 8 排液パイプ 9 バルブ 10 アルミ枠 11 連続繊維補強材 DESCRIPTION OF SYMBOLS 1 Paper machine 2 Dispersion liquid 3 Paper machine main body 4 Hinge 5 Bottom part 6 Fixing member 7 Filtration base material 8 Drainage pipe 9 Valve 10 Aluminum frame 11 Continuous fiber reinforcement

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 連続繊維補強材とポリエーテルエーテル
ケトン短繊維を含む短繊維からなる不織布であって、前
記連続繊維補強材は一方向に配列されており、不織布内
の繊維間の接点が、バインダーにより接着されているこ
とを特徴とする低誘電率プリント基板用混合不織布。
1. A nonwoven fabric comprising a continuous fiber reinforcing material and short fibers including polyetheretherketone short fibers, wherein the continuous fiber reinforcing material is arranged in one direction, and a contact point between fibers in the nonwoven fabric is: A mixed nonwoven fabric for a low-permittivity printed circuit board, which is bonded with a binder.
JP27353091A 1991-09-26 1991-09-26 Mixed nonwoven fabric for low dielectric constant printed circuit boards Expired - Fee Related JP3010840B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27353091A JP3010840B2 (en) 1991-09-26 1991-09-26 Mixed nonwoven fabric for low dielectric constant printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27353091A JP3010840B2 (en) 1991-09-26 1991-09-26 Mixed nonwoven fabric for low dielectric constant printed circuit boards

Publications (2)

Publication Number Publication Date
JPH05247813A JPH05247813A (en) 1993-09-24
JP3010840B2 true JP3010840B2 (en) 2000-02-21

Family

ID=17529132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27353091A Expired - Fee Related JP3010840B2 (en) 1991-09-26 1991-09-26 Mixed nonwoven fabric for low dielectric constant printed circuit boards

Country Status (1)

Country Link
JP (1) JP3010840B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10318858A1 (en) * 2003-04-25 2004-11-25 Frenzelit-Werke Gmbh & Co. Kg Nonwoven mat, process for its production and fiber composite material
CN106928650B (en) * 2015-12-30 2019-06-14 广东生益科技股份有限公司 A kind of polyaryletherketone composite material containing filler, sheet material and the circuit substrate containing it

Also Published As

Publication number Publication date
JPH05247813A (en) 1993-09-24

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