JP3010034B2 - Cathode equipment for automatic plating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cathode apparatus for continuously plating a plate-like object such as a printed circuit board in a continuous plating apparatus.

[0002]

2. Description of the Related Art Conventionally, in order to plate a plate-like object to be plated, a plurality of objects to be plated are attached one by one to a frame connected to a cathode with a fixing tool, and after plating is completed, one by one is removed. ing. This is a troublesome operation, and is one of the factors that hinder the efficiency of the plating operation.

[0003] In recent years, in recent years, the work to be fixed to the frame has been avoided, and the objects to be plated have been individually and continuously supplied one by one into the plating tank, and the inside of the plating tank has been moved horizontally.
A method of continuously and efficiently plating has been proposed.

[0004] However, the size of the object to be plated varies in size, and in order to evenly plate all of them, the arrangement of electrodes, adjustment of liquid level, current density, etc.
It is difficult to finely adjust the plating conditions. Therefore, the present inventor has developed a method of vertically supplying an object to be plated earlier and continuously supplying the object to a plating tank, and has solved the above problems.

[0005]

To vertically transfer a plate-shaped object to be plated in a plating tank, for example, as shown in FIG.
As shown in FIG. 1, a lower end of a plate-shaped workpiece 3 is placed on a rail 2 having a V-shaped cross section extending in a direction perpendicular to the sheet of paper at a central bottom in a plating tank 1, and a plurality of vertical rollers ( The object to be plated 3 is transported by a driving roller while being held by both members (not shown). Reference numeral 4 denotes an anode, which is vertically movable by a cylinder 5 according to the size of the object 3 to be plated. Reference numeral 6 denotes a cathode rod, and reference numeral 7 denotes a power supply roller attached to the cathode rod 6, which forms a cathode in contact with the object 3 to be plated. However, the method of vertically transferring and plating the object to be plated is effective for various kinds of plate-shaped objects to be plated having different sizes. Depending on the type, the force of contact of the power supply roller 7 with the plate-like workpiece 3 changes, and in some cases, poor conduction may occur, which may hinder uniform plating. An object of the present invention is to improve this point and to always ensure the contact between the object to be plated and the conductive roller to obtain a uniform plating layer.

[0006]

SUMMARY OF THE INVENTION The present invention relates to an apparatus for plating while transferring a plate-like object to be plated vertically mounted on a rail provided in a plating tank. The present invention is a cathode apparatus for automatic plating, wherein a power supply roller for supplying a current in contact with a plate-shaped object to be plated is provided, and a pressing means for pressing the power supply roller against the plate-shaped object is provided. One example of the pressing means is such that a pressing body by a spring action is slidably provided on a wheel provided in the middle of the cathode bar, especially on the lower side. The reason why the position of the pressing body is as low as possible below the cathode bar is that it works effectively on objects to be plated of various sizes. The electrode rods can be arranged on either one side or both sides of the plate-shaped object to be plated according to the purpose. In the case of one side, a corresponding receiving roller may be arranged on the other side.

According to the present invention, the contact between the object to be plated and the power supply roller becomes dense, the flow of current to the object to be plated becomes smooth, and a uniform plating layer can be formed. Even if a plating object having a different plate thickness is transferred, the pressing body adjusts the pressing force by a spring action to maintain the contact between the plating object and the power supply roller.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of one example, and FIG. 2 is a plan view in the side direction. The plate-shaped workpiece 3 is placed vertically on a rail 2 arranged in a plating tank, and is transported while being held by a vertical roller 8 including a driving roller. Reference numeral 6 denotes a cathode rod vertically disposed on both sides of the object 3 to be plated, and a power supply roller 7 provided at an appropriate position thereof is brought into contact with the surface of the object 3 to conduct electricity. Reference numeral 9 denotes a wheel provided at an appropriate position of the electrode rod 6, which is pressed toward the plating object 3 by the action of the pressing body 10 by the action of the spring 11. This pressing force is transmitted to the power supply roller 7, ensures the contact between the power supply roller 7 and the object 3, and makes the flow of electricity to the surface of the object 3 uniform. Therefore, the plating film on the surface of the plating object 3 becomes uniform. The location where the pressing body 10 is provided can be appropriately changed or increased according to the size of the device or the like.

[0009]

According to the present invention, the flow of current to the object to be plated becomes uniform, and a uniform plating surface can be obtained. Further, even plating objects having different thicknesses can be continuously processed, and the plating capacity can be increased.

[Brief description of the drawings]

FIG. 1 is a front view of an embodiment of the present invention.

FIG. 2 is a plan view of a side surface of FIG.

FIG. 3 is a conceptual diagram of a vertical feed type continuous plating apparatus that forms the basis of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plating tank 2 Rail 3 (plate) to-be-plated object 4 Anode 5 Cylinder 6 Cathode bar 7 Power supply roller 8 Vertical roller 9 Wheel 10 Pressing body 11 Spring

Claims (2)

(57) [Claims] An apparatus for plating while transferring a plate-like object vertically placed on a rail provided in a plating tank, wherein the plate-like object is brought into contact with a cathode rod vertically provided along the rail. A power supply roller through which current flows, and a pressing means for pressing the power supply roller against a plate-shaped object to be plated. 2. The pressing means comprises a wheel provided in the middle of the cathode bar and a pressing body slidably provided thereon.
A cathode device in the automatic plating described above.