JP3005568B1 - Tray for semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a semiconductor device tray which prevents swing of a semiconductor device and is hardly damaged. A tray body having a recess for housing the semiconductor device, a holding member for holding the semiconductor device housed in the recess, and an elastic member for urging the holding member to hold the semiconductor device; With a take-out jig that displaces the holding member against the biasing force of the elastic body,
The semiconductor device is prevented from swinging and is not easily damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device tray capable of safely transporting and storing semiconductors in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art Conventionally, various devices have been proposed so as not to damage a semiconductor device during a manufacturing process. For example, Japanese Patent No. 2587089 discloses a semiconductor device in which a lead portion of a semiconductor device housed in a tray is covered with a wax and solidified. As another example, Japanese Patent Application Laid-Open No.
In the semiconductor device tray disclosed in Japanese Patent No. 3784,
A suction cup is provided on the tray to prevent the suction cup from pressing and deforming the semiconductor device when each tray is stacked.

Further, in the electronic component tray and the like disclosed in Japanese Patent Application Laid-Open No. 5-335787, a tongue-like piece is pushed into a storage recess so that a semiconductor device in the tray does not dance in the storage recess. The holding rod is provided with an adhesive layer to prevent the semiconductor device from jumping out of the tray, displacing, deforming and damaging the lead wire.

[0004]

The method of transporting a semiconductor device disclosed in the specification of Japanese Patent No. 2587089 disclosed in the first prior art has a drawback that the processing of brazing material and ice is complicated. Were present. The reason is that a device for pouring or melting the brazing material or the like and taking out the semiconductor device becomes large-scale.

[0005] Japanese Patent Laid-Open No. 3-1337 shown in the second prior art example
In the semiconductor device tray disclosed in Japanese Patent Publication No. 84-84, a suction cup is provided on the tray, but as in the present invention, a BGA (Ball Grind) using solder balls instead of lead wires is used.
In the case of semiconductor devices such as d Array), there is a possibility that the solder balls may be damaged, and proper holding cannot be performed.

Furthermore, the electronic component tray and the like disclosed in Japanese Patent Application Laid-Open No. 5-335787 have the disadvantage that the structure is complicated and the device is easily deteriorated and damaged. The reason is that a dedicated mounter or the like is required.

An object of the present invention is to improve the above-mentioned disadvantages of the prior art, to suppress a thin and lightweight semiconductor device,
It is an object of the present invention to provide a semiconductor device tray in which a portion where a pressing portion is exposed to the outside is small, and is hardly damaged by an unexpected external force.

[0008]

In order to achieve the above-mentioned object, the present invention employs the following basic technical structure. That is, a first aspect of the present invention, a pair of recesses for accommodating a semiconductor device, in order to suppress the semiconductor device housed in the concave portion, of the left and right recesses
And pressing member provided at the center, the presser member housed
A tray body having an elastic member for urging in a direction to press the right and left of a semiconductor device, distribution in the center of the left and right recess
And a take-out jig for displacing the holding member against the urging force of the elastic body.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor device tray of the present invention comprises:
In order to solve the above-mentioned problems in the prior art, a pair of left and right recesses for accommodating a semiconductor device are provided at the center of the left and right recesses for holding down the semiconductor device accommodated in the recesses.
A pressing member that is, the tray body having an elastic member for urging in a direction to press the right and left <br/> semiconductor device in which the pressing member is accommodated, it is arranged in the center of the left and right recesses, before
Since the ejecting jig for displacing the holding member against the urging force of the elastic body is provided, the vibration of the semiconductor device can be suppressed and the holding member can be prevented from being damaged.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a tray for a semiconductor device according to the present invention. FIG. 1 is a longitudinal sectional view showing a configuration of a semiconductor device tray according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing an operation state of the semiconductor device tray of the present invention. Here, the tray main body 10 includes a concave portion 12 for storing the semiconductor device 11, a pressing member 13 for pressing the semiconductor device 11 stored in the concave portion 12, and an elastic member for urging the pressing member 13 in a direction for pressing the semiconductor device 11. And a coil spring 14.

The holding member 13 is supported by the tray body 10 so as to be rotatable about a shaft 15, and an operation piece 16 extends on the opposite side of the shaft 15. The tip of the holding member 13 is bent so as to be substantially horizontal when it is pressed by the coil spring 14 and projects from the support member 17. At this time, the operating piece 16 is also inclined with respect to the perpendicular of the shaft 15. Further, the pressing member 13 may be a plate-like member or a linear member. The elastic member may be a leaf spring, a synthetic resin, or the like instead of the coil spring 14.

The operating piece 16 protrudes into an insertion hole 18 which is opened facing the lower surface of the tray body 10. Further, a pin member 20 having a sharp tip is provided upright on the take-out jig 19. In the example shown in FIG. 1, concave portions 12 for housing the semiconductor device are formed on both sides of the support member 17. Also,
The pressing members 13 also protrude from both sides of the supporting member 17 and can press the semiconductor devices 11 housed in the respective concave portions 12.

FIG. 3 is an enlarged plan view of a main part showing a holding member of the semiconductor device tray of the present invention. Here, the holding member 13 is provided in a space 21 formed in the support member 17 and is supported by the shaft 15 so as to be freely rotatable. Axis 1
5 is attached so as to cross the space 21. The coil spring 14 arranged in the space 21 is
The pressing member 13 is urged so as to protrude from the window 22 toward the concave portion 12. Therefore, the tip of the pressing member 13 protrudes from the window 22 in the no-load state (see FIG. 4).

Next, the operation of the semiconductor device tray of the present invention will be described. First, in the case shown in FIG. 1, the semiconductor device 11 is protected from being protruded by the pressing member 13 urged by the spring in the recess 12 accommodated therein.
At this time, the rejection between the semiconductor device 11 and the holding member 13 is
The thickness is set to about 1 mm in consideration of a thickness tolerance and a margin of the semiconductor device.

When removing the semiconductor device 11, the pin member 20 of the removal jig 19 is inserted through an insertion hole 18 formed in the bottom surface of the tray body 10 (see FIG. 2). The inserted pin member 20 is rotated in the direction of arrow A against the urging force of the coil spring 14 with its tip abutting on the operating piece 16 of the pressing member 13.

When the holding member 13 rotates in the direction of arrow A against the urging force of the coil spring 14, the holding member 13 is completely retracted into the supporting member 17, and the semiconductor device 1
1 can be taken out freely. In this way, the holding member 13 can be opened only by attaching the take-out jig 19 from below, and the operation is easy.

FIG. 5 is an explanatory view showing another embodiment of the semiconductor device tray. In this embodiment, the holding member 23
Is formed of an elastic member, and is fixed to a part of the tray body 23a at the base end 23a. On the other hand, the free end 23b
Project from the support member 24. Pressing member 23
Extend from the left and right and intersect at the center, and the front end protrudes from the left and right opposite directions. The pressing member 23 may be a plate-like member or a linear member. The other parts are the same as in the first embodiment, and the description is omitted.

As shown in FIG. 6, the semiconductor device tray having the above-described configuration is used to remove the pin member 20 of the take-out jig 19.
Is inserted through an insertion hole 25 formed in the bottom surface of the tray body 10. The inserted pin member 20 is rotated in the direction of arrow B against the spring force by the tip contacting the vicinity of the intersection of the pressing member 23.

When the holding member 23 resists the spring force, the arrow B
When pivoted in the direction, the holding member 23 is completely
4, the semiconductor device 11 can be freely taken out.

As described above, in this embodiment, the coil spring 14 and the shaft 15 are unnecessary, and the number of parts can be reduced. When the removal jig 19 is removed, the pressing member 23 projects from the supporting member 24 by its own elastic force.

Incidentally, the present invention is not limited to the above embodiments, and various design changes can be made based on the technical idea of the present invention.

[0022]

The first effect is that there is no fear that the semiconductor device tray falls from the storage recess due to vibration or the like. The reason is that the pressing member automatically presses the upper surface of the semiconductor device.

The second effect is that the holding member for suppressing the vibration of the semiconductor device is small and the portion protruding outward is small, so that there is no external damage. The reason is that the pressing member has few exposed portions and is hardly subjected to external force.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a configuration of a semiconductor device tray according to one embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing an operating state of the semiconductor device tray of the present invention.

FIG. 3 is an enlarged plan view of a main part showing a holding member of the semiconductor device tray of the present invention.

FIG. 4 is a longitudinal sectional view of the semiconductor device tray of the present invention.

FIG. 5 is an explanatory view showing another embodiment of the semiconductor device tray.

FIG. 6 is an operation explanatory view of another embodiment of the semiconductor device tray.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Tray main body 11 Semiconductor device 12 Depressed part 13 Pressing member 14 Coil spring 15 Shaft 16 Working piece 17 Support member 18 Insertion hole 19 Extraction jig 20 Pin member 21 Space 22 Window 23 Pressing member 24 Supporting member 25 Insertion hole

Claims (7)

(57) [Claims] 1. A pair of left and right recesses for accommodating a semiconductor device, and a semiconductor device accommodated in the recesses .
A tray body having a pressing member provided in the center of the left and right recesses, an elastic member for biasing the left and right semiconductor devices in which the pressing members are stored , and a tray body having the left and right recesses;
And a take-out jig disposed at the center of the portion and displacing the holding member against the urging force of the elastic body. 2. The semiconductor device tray according to claim 1, wherein said elastic member is a coil spring. 3. The pressing member is supported by a supporting member so as to be rotatable about an axis, and an operating piece extended from the pressing member is taken out and pressed by a pin member provided upright on a jig. 2. The semiconductor device tray according to claim 1, wherein the tray is displaced against the urging force. 4. The recess for accommodating the semiconductor device is formed symmetrically with respect to a support member for supporting a holding member, and is formed in a jig to be taken out from an insertion hole formed in a bottom portion of the tray. 2. The semiconductor device tray according to claim 1, wherein the right and left pressing members are simultaneously displaced against the urging force by inserting a pin member. 5. A groove formed on the lower surface of the tray main body, in which an operating piece extended from the holding member is rotatably arranged around the shaft. 2. The semiconductor device tray according to claim 1, wherein the pressing member is displaced against a biasing force by inserting a pin member erected on the upper surface of the take-out jig. 6. A pair of left and right recess for accommodating the semiconductor device, <br/> pressing member provided at the center of the left and right recesses with giving al is a biasing force in a direction for pressing the semiconductor device housed in the recess When, along with and a take-out jig which displaces the distal end portion of the presser pressing against the biasing force of the member member, before as well as constituting the pressing member from a plate-like elastic body
A semiconductor device tray disposed at the center of the left and right concave portions . 7. A pair of recesses for accommodating a semiconductor device, <br/> pressing member provided at the center of the left and right recesses with giving al is a biasing force in a direction for pressing the semiconductor device housed in the recess And a take-out jig for displacing the distal end of the holding member against the urging force of the holding member, wherein the holding member is made of a linear elastic body, and
A semiconductor device tray disposed at the center of the left and right concave portions .