JP2989985B2 - Equipment for examining component placement on wiring boards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a device for studying the arrangement of components on a wiring board.

[0002]

2. Description of the Related Art A wiring board which mounts components such as semiconductor elements on a ceramic substrate or a glass epoxy substrate and connects these components to each other is formed in a multi-layer structure when the wiring density is high. The multilayer wiring board is configured by arranging a plurality of components on an outermost layer on a wiring board composed of a plurality of layers, and connecting these components by wiring formed on an inner-layer wiring board. Wirings formed on the inner layer wiring board are connected via via holes formed on the inner layer wiring board.

[0003] In order to design and manufacture such a multilayer wiring board, the location of the components and the connection paths between the terminals of the components are examined, and then a design drawing is created based on the examination results. The product is manufactured based on the figure. When studying the arrangement of components of such a multilayer wiring board, CAD or the like has been conventionally used.

That is, when studying the arrangement of components and wiring using CAD or the like, the CAD and the like are firstly created in the initial stage of examining where to arrange each component to obtain the most efficient multilayer wiring board. For example, using characteristic information such as a component shape and heat, it is performed automatically or on a screen of a display device. That is, as shown in FIG. 27, the design rules (characteristics of the board, component, wiring, physical structure, etc.) are centered on a display screen called a rat nest in which terminals of components to be connected are connected by the shortest straight line (connection). And restrictions on design, which are determined by manufacturing conditions, etc.), while examining the location of each component and wiring. 27, reference numeral 211 denotes a wiring board.
Reference numeral 12 denotes a component arranged on the wiring board. In this example, seven parts 212 are arranged. Also, part 2
An arrangement margin 213 is provided around the periphery of 12, and a display 214 indicating the location of the first pin is attached. Also, connection 2
15 is a connection 215 connected to a terminal of a component 212
Can be displayed, and all the connections 215 connected to the terminals of all the components 212 can be displayed.

[0005]

However, this conventional device for examining the layout of components on a wiring board restricts wiring related to design rules and characteristics, and warns of optimization in characteristics. Met. Therefore, there is no means for quantitatively evaluating the overall wiring efficiency, layer structure evaluation, wiring order assignment, and the like, which are important for achieving size reduction and cost reduction.

That is, on the display screen of the rat nest,
When the wiring density is high, there is a problem that the display cannot be seen, and it is difficult to evaluate the wiring structure using only this.

On the display screen of the rat nest, when the wirings are multi-layered, the display of the wiring path is significantly different from the actual wiring, and the influence of the via holes in the upper layer is not taken into consideration. There was also a problem that it was not effective at the stage.

In the study for obtaining the most efficient wiring board, the whole wiring is sequentially passed through stages from the evaluation of the connection state of the components mounted on the outermost layer of the multilayer wiring board and the connection of the signal type. Needs to be considered,
In a conventional device for examining the arrangement of components on a wiring board, there is also a problem that there is no means for examining such a stepwise arrangement.

In the design of a high-density and small-sized board, the positions of connection terminals and via holes around a component have a large effect on wiring efficiency. Frequently, the position of terminals and via holes must be changed,
There was also a problem that there was no means for examining this effectively.

Furthermore, in designing a high-density and small-sized substrate, the arrangement of via holes is determined by design rules, wire bonding, face-down bonding, TAB
However, when the mounting condition itself is changed, there is a problem that it is difficult to effectively find an appropriate condition in a short time during the placement study.

[0011]

An apparatus for examining the component arrangement of a wiring board according to the present invention has been made in view of such a problem of the conventional apparatus, and has the features of the invention described in claim 1. The wiring includes an input device for inputting a command, placement trial means for trial placement of components according to a command of the command input from the input device, and a display device for displaying the result of the placement trial. In the board component placement examination device, the connection information is classified according to the conditions set by the placement trial means, the connection information is group-managed according to the conditions, and the connection information for supplying the group-managed connection information to the placement enforcement means is provided. It has a management means, the placement enforcement means performs a placement trial according to the group-managed connection information,
As a result, the display means is to display the connection in a group-managed state. A feature of the invention described in claim 2 is that, in the component placement examining apparatus according to claim 1, when performing placement, a wiring route is searched for,
The present invention further comprises a wiring route / density analyzing means for analyzing the wiring density in a region including the wiring route and displaying the result on the display device. A feature of the invention described in claim 3 is that when performing the placement trial, a via hole satisfying a desired condition is satisfied according to a local design rule relating to a placement of a via hole connected to an input / output terminal of a component. And a via-hole position analyzing means for automatically displaying the results of the determined via-hole arrangement and, if a deviation of the determined via-hole arrangement occurs, a via-hole arrangement uniformizing process. Is to do. Further, a feature of the invention described in claim 4 is that, in the component placement review apparatus according to claim 1, when performing placement, one or more specific areas are designated to perform the specified area. And wiring passing through,
It is characterized by further comprising a wiring route / density analyzing means for extracting a component connected to the wiring and displaying the extracted component on the display device.

[0012]

According to the first aspect of the invention, the number of connections to be processed can be reduced, so that the processing can be performed at a high speed, the display screen can be easily viewed, and an initial stage in which a very small display is unnecessary. It is especially effective for examining. In addition, since the processing amount is reduced, it is possible to perform processing in accordance with the intention of the designer, to easily find a place where the density is likely to be high, to easily find the part at the time of correction, and to determine the wiring order. It is obtained efficiently and effectively. Further, data can be easily extracted for each component, component characteristics, and electrical characteristics of signal lines. Then, the operator looks at the display of the connections in the group-managed state and resets various conditions to the arrangement trial means, whereby the group-managed connection information is re-classified, and the group management is newly performed. The connection can be displayed again in the state where the connection has been made. Further, according to the invention described in claim 2, in addition to the invention described in claim 1, since it is possible to study in a form close to actual wiring, it is easy to study parts and wiring, and
Calculation of wiring density can be performed accurately, and placement evaluation can be performed accurately. In particular, various characteristics can be accurately analyzed and grasped even in the initial stage of examination. According to the third aspect of the present invention, the arrangement of via holes is automatically generated around the multi-terminal component, which is likely to be a bottleneck in wiring, and the arrangement is performed while changing the local design rule. Since the conditions can be determined, it is easy to examine components and wiring, and the calculation of wiring density can be accurately performed, and placement evaluation can be performed accurately. In particular, various characteristics can be accurately analyzed and grasped even in the initial stage of the examination. In addition, when a deviation in density occurs in the determined via hole arrangement, this can be automatically corrected. Furthermore, according to the invention described in claim 4, in addition to the invention described in claim 1, when considering the arrangement for removing the region where the wiring density is expected to be high, the region is screened when considering the arrangement. By specifying the above, it is possible to know the wiring that passes through the area, and it is possible to immediately know the component related to the passing wiring from the wiring information. As a result, it is possible to know the components that affect the wiring density in the passage area, and it is possible to change the arrangement effectively.

[0013]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a block diagram showing an embodiment of an apparatus for examining a component arrangement of a wiring board according to the present invention.
The AD system 2 is a component arrangement study device that operates in conjunction with the CAD system.

First, the CAD system 1 will be described.
3 is an input device such as a keyboard or a mouse, 4 is a man-machine interface means for processing commands input from the input device 3, 5 is a main memory for storing processing results, 6 is design rules, connection information, characteristic specifications, etc. , An access driver means for accessing the CAD database, 8 a display control means for creating display data, 9 a display device such as a graphic display for displaying display data, 10
Is a data interface means for sending a processing result to the outside or taking in data from the outside. The connection information is information indicating the electrical connection relationship between the terminals of the components and the input / output terminals of the board, and information indicating what kind of signal runs on the line. It refers to electrical and thermal conditions that can satisfy the performance that must be provided, and specifically refers to specifications such as signal timing and delay, crosstalk, noise, and the like, heat generation of components and temperature limits. The input device 3 is connected to the main memory 5 via the man-machine interface means 4 and
Are connected to the CAD database 6 via the access driver 7. Data interface means 10
Are also connected to the main memory 5. The display device 9 is connected to the man-machine interface unit 4 via the display control unit 8.
And the main memory 5. In some cases, the application has an application processing unit 11 that performs analysis, graphic processing, and the like according to the purpose.

When an operator inputs a command from the input device 3, the command is analyzed by the man-machine interface unit 4, and when the command is determined to be correct, processing according to the command is performed. When storing the result of the command processing in the memory, the result is stored in the main memory 5. The display controller 8 creates display data and displays the result on the display device 9. When registering or updating the processing result in the CAD database 6, the processing result is passed to the access driver means 7 and stored in the CAD database 6. When data is exchanged with an external device, the data is sent from the main memory 5 to the data interface unit 10. When importing data,
The data sent to the data interface means 10 is sent to the main memory 5 and processed according to the command input from the input device 3.

Next, the arrangement study device 2 will be described. 12 is an input device such as a keyboard or a mouse, 13 is a man-machine interface unit that analyzes a command input from the input device and performs processing corresponding to the command, 14 is a display control unit that processes display data, and 15 is a graphic control unit. A display device 16 such as a display; a data interface means 1 for taking in data from the CAD system 1 or the like and outputting a result obtained by the arrangement study device 2;
7 is an interface data storage means for storing the input / output data processed by the data interface means 16,
Reference numeral 18 denotes an overall control means for performing process management of each function of the arrangement reviewing apparatus 2 and transferring necessary data by an instruction from the input device 12, and 19 designates a wiring path search for searching for a wiring path necessary for finding an optimum arrangement. Means, 20 is a wiring density analyzing means for analyzing a wiring density necessary for finding an optimum arrangement, 21 is an analysis data managing means for managing various data necessary for wiring density analysis and wiring path search, and 22 is a component or An arrangement trial analysis unit 23 for setting conditions and changing conditions when finding the optimal conditions for wiring arrangement, and a placement trial analysis unit 23 for instructing the display device 15 to display the content processed by the arrangement trial analysis unit 22. Data management means 24 is a connection information analysis management means for classifying and managing connection information in accordance with instructions or specifications from the placement trial analysis device 22 in consideration of design specifications and physical characteristics. A. The wiring route searching means 19 and the wiring density analyzing means 20 perform analysis while performing mutual processing via the analysis data managing means 21. The wiring route searching means 19, the wiring density analyzing means 20, and the analysis data managing means 21 constitute a wiring route / density analyzing means 25. The placement trial analysis means 22 and the placement trial data management means 23 constitute a placement trial means 26. The wiring route / density analyzing means 25 and the placement trial means 26 are linked via the control means 18.

In this system configuration example, the CAD system 1 and the arrangement reviewing device 2 are connected using inter-process communication. Thereby, the independence of the database 6 of the CAD system 1 and the database of the arrangement study device 2 is maintained, and the security of the system is enhanced.

Next, the operation of the arrangement reviewing apparatus 2 will be described with reference to the flowchart shown in FIG. In step 1, the CAD system 1 and the placement study device 2 are started, and the C
From the AD system 1, specification data such as design rules, connection information, and characteristic specifications are taken into the placement study device 2. That is, the data specified by the input device 12 is searched, and C
Interface data storage means 1 from AD database unit 6 via data interface means 10 and 16
Take in 7.

In step 2, data conversion is performed. That is, the specification data taken into the interface data storage unit 17 is converted into a form suitable for the internal processing of the arrangement reviewing device 2 and sent to the control unit 18. Specifically, specification data such as design rules, connection information, and characteristic specifications are converted into a format that can be operated by the component placement review device 2.

In step 3, the placement trial analysis means 22
Then, data processing is performed in accordance with conditions such as the wiring layer configuration, wiring order, wiring layer designation, local design rules, reclassification by wiring type (type of signal running through wiring), shortest path, and minimum branching. Note that the wiring layer configuration refers to how many layers are formed as a whole and where a certain component or wiring is arranged, and the wiring order is a case where a certain wiring is arranged at a certain place.
The wiring layer designation at that location refers to the wiring layer designation. The wiring layer designation refers to the layer in which the wiring is arranged. The local design rule refers to, for example, a via hole connected to the input / output around the component. When the density becomes high, the rule that determines specially only for that part. The arrangement trial analysis means 22 has such a condition setting function.

In step 4, according to the conditions set in step 3, the connection information analysis management means 24 separates the connection information into a form suitable for the placement study, and creates a work data table (a data array in which the information is classified and arranged). Group). That is, the information sent to the connection information analysis management means 24 can be group-managed for each condition such as connection information and characteristic conditions. In this way, by performing group management for each condition such as connection information and characteristic conditions, it is possible to quickly evaluate a proper arrangement with high precision at the time of arrangement study without performing actual wiring.
The details of step 4 will be described later.

In step 5, the wiring layer configuration is analyzed. That is, a wiring layer configuration table is created based on the design rule and the work data table. In step 5, the wiring layer configuration is analyzed based on the first analysis command sent from the control means 18 in FIG. When the second analysis instruction is sent, step 5 is performed only when the wiring layer configuration or the wiring rule is changed.

In step 6, the placement trial means 26 tries the optimal placement. That is, the analyzed connection information is displayed in whole or in part on the display device 15 in real time, and the placement trial is performed while the placement trial is performed while changing the via hole around the component. Designation and change of local design rule settings are performed as needed during placement trials. The details of step 6 will be described later.

In step 7, in response to the placement trial and the setting of the wiring conditions in step 6, a wiring route search and a wiring density analysis for the specified connection are performed. Upon completion, the process moves to step 8 where the analysis result is displayed on the display device 15. The progress of the analysis is also displayed on the display device 15 at any time, and the operator determines whether or not the analysis has been completed. In the present embodiment, the processing in step 7 is performed based on the group-managed connection information, and the analysis result is displayed as a graphic on the display device 15 (step 8).

When the placement trial is completed, the process proceeds to step 9, where the placement result is returned to the interface means 6 and converted into the data format of the CAD system 1A.
A series of operations is completed by storing the result in A.

In the embodiment, in these processes, an instruction to each processing means is realized under an object-oriented concept and environment.

FIG. 3 is a flowchart showing the operation of the connection information analysis management means 24 shown in FIG. 1, and is a diagram showing details of step 4 in FIG. Steps 1 to 3 are the same as those in the flowchart of FIG.

In step 41, a first connection table is created in accordance with the conditions set in step 3. The first connection table is a table in which equipotential nets (electrically connected lines) are grouped. Details of the first connection table will be described later.

In step 42, a second connection table is created based on the conditions set in step 3 and the first connection table created in step 41. The second connection table is obtained by decomposing the data of the first connection table into data for each terminal pair. Details of the second connection table will be described later.

Next, based on the display or the like, it is determined whether or not the operator changes the conditions such as the connection method of the arrangement / execution analysis means.
If the conditions are changed by the determination, step 47
Then, the process returns to step 41 via step 48 and proceeds to step 43 if not changed. The decision as to whether or not to change the condition is made by the operator inputting a command using the input device.

In step 47, reclassification is performed according to the signal type, connection list, characteristic specifications, etc.
Then, a command to change the placement trial condition is issued.

In step 43, conditions for bundling the equipotential nets by grouping them for the same parts and connections having the same properties are set.

In step 44, based on the conditions set in step 3, connection information, information such as characteristic conditions, and the first connection table created in step 41, according to the conditions set in step 43, Create a first bundle table. Details of the first bundle table will be described later.

In step 45, based on the conditions set in step 3, information such as connection information and characteristic conditions, and the second connection table created in step 42, according to the conditions set in step 43, Create a second bundle table. Details of the second bundle table will be described later.

In step 46, the first bundle table created in step 44 and the second bundle table created in step 45 are used as databases to facilitate the updating and retrieval of data. Register in the memory of.

The above steps 41, 42, 44 and 4
An example of the work data table created in step 5 is shown in FIGS. FIG. 4 is an example in which the databases created in steps 41 and 42 of FIG. 3 are displayed in a hierarchical structure. In this example, a first connection table is created based on a net list (connection list), and a second connection table is created based on the first connection table. Equipotential nets are allocated to the first connection table, and the first connection tables for the number of connections are set. Also, a pin pair is assigned to the second connection table, and the second connection table for the pin pair is set. In the implementation, in order to increase the processing speed and increase the flexibility of setting, it is realized under the object-oriented concept and environment.

FIG. 5 is an example of the first connection table in FIG. The first connection table has, for each net (connection), a net number, a connection terminal row of components, and a characteristic table number, and is assigned a signal type based on a rule of a net list. As a result, the net to be examined is arbitrarily extracted, and the contents to be processed are determined by referring to the first connection table. Further, at the time of processing, display, and analysis, the second connection table of FIG. 6 to which the net NO of the first connection table points can be referred to.

FIG. 6 is an example of the second connection table in FIG. 5 created in step 42 of FIG. In the second connection table, the equipotential net is decomposed for each pair of terminals (pin pairs), and has information (display flag and display color) of analysis and display of each connection portion. That is, in this example, the information of the wiring route obtained by the wiring route search is held in a row of bending points (coordinates of bending points), and is updated as needed according to the arrangement conditions of components and wiring. In addition, since the connection terminal row of the first connection table in FIG. 5 can indicate the component in the component shape table (not shown), the connection from which part of which component is made, the shape of the component and the via hole near the component can be determined. Is immediately reflected in post-processing such as wiring density analysis.

FIG. 7 shows an example in which the databases created in steps 44 and 45 of FIG. 3 are displayed in a hierarchical structure. In this example, a first bundle table and a second bundle table are created based on the first connection table and the second connection table. An equipotential net (first table) for group management is allocated to the first bundle table, and the same number of first tables as the group are set. Also, a bundle pin pair table is allocated to the second bundle table, and the second bundle table for the bundle pin pair is set. In the implementation, an example using an object-oriented concept and environment for the purpose of speeding up processing and increasing flexibility in setting will be described.

FIG. 8 is an example of the first bundle table created in step 44 of FIG. The first bundle table is a table in which connections having the same route are assigned as one group. The first bundle table has a net number, a connection terminal row of components, and a characteristic table number indicating the characteristics of the reference characteristic table, is assigned a signal type based on a rule of the net list, and is group-managed. Nets of the same type are bundled for each component and for each signal type, and are given a bundle number. As a result, a group of nets to be considered can be arbitrarily extracted, and the first
The contents to be processed are determined by referring to the bundle table. For further processing, display and analysis, the second bundle table of FIG. 9 pointed to by the bundle number of the first bundle table can be referred to.

FIG. 9 is an example of the second bundle table created in step 45 of FIG. This second bundle table stores a series of equipotential nets in a terminal pair (pin pair).
Each group has information on analysis and display of each connection part as a group. In this example, the information of the wiring route obtained by the wiring route search is stored in a row of bending points (coordinates of bending points), and is configured to be updated as a group at any time according to the arrangement conditions of components and wiring. In addition, which part of which part is connected is determined by determining whether the connection terminal row of the first bundle table has a part in a part shape table (not shown) held by the part shape display instruction means 22B in FIG. Since the instruction can be given, if the shape of the component or the via hole near the component is changed, it can be immediately reflected in post-processing such as wiring density analysis.

The first connection table, the second connection table, the first bundle table, and the second bundle table can also be managed at the same time. It is possible to perform a hierarchical trial in which a study is performed and a detailed evaluation is sequentially performed. In this way, by performing group management of the connection information and the characteristic conditions in accordance with the design conditions, it is possible to quickly and accurately evaluate a proper arrangement at the time of arrangement study before performing actual wiring.

FIG. 10 is a diagram for explaining step 5 of FIG. 2, and is a wiring layer configuration table created based on the analysis result of the wiring layer configuration of FIG. The analysis of the wiring layer configuration is performed by the wiring layer configuration display instruction means 23 in FIG. This is an example when an object of a bundle group management unit is generated. The wiring order is assigned for each equipotential net or for each bundle managed in a group. The priority level is set to, for example, 10 levels, but is set to 5 in the example of FIG. In this example, the priority wiring layer for which a layer to be arranged is desired is, for example, the sixth layer. Since the wiring layer configuration table of FIG. 10 is linked to the first bundle table of FIG. 8, the wiring order can be determined at the time of placement trial.

FIG. 11 is a diagram for explaining step 6 of FIG. 2 in detail, and is a diagram for explaining the arrangement trial means 26 of FIG. 1 in detail. The placement trial unit 26 includes the placement trial analysis unit 22 and the placement trial data management unit 23 as described above. The arrangement trial analysis unit 22 includes an instruction unit 22A for displaying a component layout, an instruction unit 22B for displaying a component shape, an instruction unit 22C for displaying a wiring layer configuration, and an instruction unit 22D for displaying an analysis result.
It consists of. In addition, the data management unit 23 of the placement trial
Is composed of group-managed connection selection means 23A, connection terminal and via hole setting / change means 23B near the component, and wiring layer configuration, design rules, and wiring layer condition setting / change means 23C.

Instruction means 22 for displaying the layout of parts
A instructs to display the layout of the components and the wiring paths connecting the terminals of these components. The display of the wiring route is performed based on the analysis result sent from the wiring route / density analyzing means 25. The display screen displayed based on the instructing means 22A for displaying the layout of this part is substantially the same as the screen of the conventional rat nest shown in FIG. 27. In the present embodiment, however, an instruction for displaying the layout of this part is provided. The means 22A is a group-managed connection data 23A.
Can be handled. That is, on the display device 15, instead of the individual connections, the connections of the wiring paths of the bundle managed in the group are displayed.

The instruction means 22B for displaying the shape of the part
It instructs the display device 15 to display the dimensions of the components, the positions of the terminals, and the like. Instruction means 2 for displaying the shape of this part
2B is a setting / changing means for judging whether the positions of the connection terminals and via holes around the component are appropriate when the shortage of the wiring area is expected before or during the study of the layout, and changing the position if inappropriate. 23B. Since the positions of the connection terminals and via holes around the component serve as basic data when analyzing the wiring path and the wiring density, when the positions of the connection terminals and via holes around the component are changed, FIG. The block table is updated, and the wiring layer configuration conditions are changed.

The instructing means 22C for displaying the wiring layer configuration includes:
This section is for setting the overall layer configuration and the configuration of each layer, and specifies a wiring layer configuration, a design rule, and a wiring layer (which layer is to be arranged in what layer) according to design specifications. However, the wiring layer configuration, design rules, and wiring layers set by the instructing means 22C for displaying the wiring layer configuration can be arbitrarily added or deleted by the condition setting / change means 23C. -Simultaneously transmitted to the density analysis means 25.

The instructing means 22D for displaying the analysis result instructs to display the analyzed connection on the display device 15 in real time in order to quantitatively grasp the evaluation of the placement trial.

In the above-described embodiment, in order to efficiently perform the placement trial of the parts and the connection and to transmit the evaluation result, in addition to the conventional rat nest placement examination screen, the instruction means 22B for displaying the shape of the parts, It has an instruction means 22C for displaying the wiring layer configuration and an instruction means 22D for displaying the analysis result.
The information is simultaneously reflected on all display instruction means via the control means 18. Further, the control means 18 manages the design rules fetched from another processing device (such as the CAD system 1A shown in FIG. 1) or the design rules set by the display instruction means 22A to 22D described above, and Sending data to the density analysis means 25,
The structure is such that the analysis result of the wiring route / density analyzing means 25 is managed. In order to refer to these functions at the same time, each display instruction means has means for displaying on a display window, and the display device 15 is configured to be operated as a multi-window on a workstation. More specifically, the operator repeatedly performs operations based on the data displayed on the screen until various wiring conditions such as design rules are satisfied.

In these processes, instructions to each processing means are as follows:
It is realized under the object-oriented concept and environment.

FIG. 12A shows an example of the bundle display screen in the above embodiment. This display screen is an example in which the wiring route group 121 managed in groups along the route obtained by the wiring route analysis is displayed with the bundle width set according to the number. In FIG. 12A, reference numeral 120 denotes a component.

FIG. 12B shows an example of a display screen when a multi-window is displayed. On this display screen,
A component layout screen 41 for displaying the layout of the components and a wiring route for connecting the terminals, a first component shape screen 42 for displaying the dimensions of the components, a second component shape screen 43 for displaying the positions of the terminals of the components, a back surface And an analysis result display screen 45 for displaying data of analysis results at the same time.
In the example shown in FIG. 12, there is no screen for displaying the wiring layer configuration. The operator gives an instruction for the optimal arrangement while referring to this display screen. Further, there is a mechanism in which any screen change is reflected on all screens via the control means 18 shown in FIGS. The position and size of each screen can be freely changed, and the screen to be displayed can be selected.

Next, an embodiment of the present invention will be described with reference to FIGS. FIGS. 13 and 14 are diagrams for explaining step 7 in FIG. 2 in detail, and show the wiring route / density analysis unit 25 shown in FIG.
6 is a flowchart showing the operation of the embodiment. FIG. 13 is a flow chart showing an example of searching for a wiring route of only the wiring group to be examined, and FIG. In the initial stage of the component placement study, usually, a wiring route search for only the study target wiring group shown in FIG. 13 is performed, and as the component placement study progresses,
A wiring route search is performed in consideration of the existing wiring shown in FIG.

First, description will be made with reference to FIG. Step 7
In step 1, block division processing for analyzing a local routable area based on the placement information table 125A based on the placement trial is performed. A detailed description of the block division is given in FIGS.
6 is performed.

In step 72, the number of routable channels is calculated in consideration of the wiring layer configuration, local design rules, component shape information such as via holes near the components, and the design rule 126A, and the number of routable channels in the block table of FIG. Be updated.

Next, it is determined whether or not the existing wiring is taken into consideration. When the existing wiring is considered, the process proceeds to step 76 shown in FIG.

In step 73, a wiring route search is performed.
At this time, the wiring density is also analyzed by the wiring density analyzing means 14 shown in FIG. A detailed description will be given later.

At step 74, the block occupancy is analyzed.

In step 75, the result is displayed on the display device 1.
5 is displayed.

The operator determines whether or not the arrangement condition is satisfied. If the operator is satisfied, the process ends. If the operator is not satisfied, the process returns to step 6.

Next, a case where the existing wiring is taken into consideration will be described with reference to FIG.
It will be described based on. In step 76, the wiring layer configuration table shown in FIG. 10 is read, and steps 77 to 80 are repeated according to the priority level of the group-managed wiring.
The processing in steps 77 and 78 is the same as that in step 7 described above.
Same as 3, 74.

In step 79, the occupancy of the block is added and totalized for each processing of the net (connection).

In step 80, the analysis results of steps 77 and 78 are created as an existing wiring database.

In step 81, the data in the block table of FIG. 16 is updated.

In step 82, the processing contents are displayed on the display device 1.
5 is displayed.

FIG. 15 is a conceptual diagram of the block division performed in step 71 of FIG. FIG. 15 shows a form in which the divided blocks 156 are formed in the XY directions with respect to the drawer portions 154 and 155 and the back surface of the components for three components (bold line portions) 151, 152 and 153. Each rectangle corresponds to one block, and the possible wiring amount can be calculated for each block 156, which is the basis of the wiring route search on the substrate. The created blocks are managed in the form of a block management table shown in FIG.

FIG. 16 shows an example of the block management table. This block management table is composed of a block matrix table that changes with placement trials and a block table linked to the block matrix table. The block table is
Position coordinates indicating the size and position of the block, and the number of routable channels determined by the design rule are provided for each of the x and y directions. Also, the number of existing wires in the block is set. In the initial state, the number of routable channels is a value calculated by the standard rule, and the number of already laid channels is zero.

FIG. 17 is a flowchart when the wiring route search of step 73 shown in FIG. 13 is performed, and FIG.
FIG. 5 is a conceptual diagram of a method of searching for a wiring route. In FIG. 18,
A bold line indicates a wiring route, and a square indicates a part. Step 17
1, the first bundle table of FIG. 8 and the second bundle table of FIG.
Read bundle table data. The subsequent processing is performed based on this data. Here, the embodiment at the bundle level is shown in consideration of the high-speed processing, but the processing can be performed for each equipotential net or for each specific signal.

At step 172, a basic route is determined, and FIG.
Then, a process of writing to the second connection table of FIG. 9 and the second bundle table of FIG. 9 is performed. That is, group-managed data
Initially, there are many possible wiring routes, of which
Consider a characteristic specification, physical shape, process, etc., and determine a lean route. Here, as the first stage, FIG.
As shown in (1), the base of the wiring route 181 (the thick line portion) is determined between the components 180 by the shortest route processing. This part can be determined to be, for example, the path of the minimum branch or an arbitrary path according to the purpose and the will of the designer. The result of the processed route is written in the second bundle table of FIG. 9, and then the block management table of FIG. 16 is also updated.

In step 173, a search is made for a wiring route assuming actual wiring. Here, a line segment search is performed for each bundle pair along the unit of the second bundle table in FIG.

In step 174, an intersection is obtained by performing a search in the X and Y directions from the end point for each bundle pair.
At this time, the searched block is extracted. Since the bundle has the number, the bundle width corresponding to the number is calculated from the design rule.

In step 175, the width of the wiring area is determined based on this width, and blocks belonging to the wiring area are extracted.

In step 176, the wiring occupancy is calculated in block units for each wiring direction. In this case, the X direction,
Since the number of routable channels in the Y direction is stored in the block management table of FIG. 16, the wiring occupancy can be calculated in block units for each wiring direction. The maximum occupancy can be defined as a function of the number of routable layers. For example, as shown in FIG. 19, when the number of possible layers of the wiring 191 in the X direction is five, the occupancy is defined with 500% of the number of block channels as the maximum value. These definitions can define necessary coefficients and functions according to the operator's experience and the algorithm of the target wiring tool.

Next, when it is determined that the obtained wiring occupancy of each block is only the block having the designated value or less, the processing is terminated.

If there is a block exceeding the designated occupancy, the process proceeds to step 177. In step 177, the intersection is obtained by extending the line segment in the X and Y directions from the starting point and the ending point of the wiring. In other words, in this case, as shown in FIG. 18B, two paths (A) and (A) are formed, and of the two paths (A) and (A), the one 182 having the lower block wiring occupancy ratio Select

At step 178, the largest occupied block of the selected block row corresponding to the wiring path is detected.

Next, proceeding to step 179, a similar search is performed from the immediately preceding block, and (d) in FIG.
The path 183 is determined as shown in FIG.
Write to the bundle table.

By repeating this, the wiring path can be determined. In this example, the processing is performed up to three times in consideration of the nature, accuracy and processing time of the wiring tool.

FIG. 20 is a display example of the wiring density during the placement study. In the example of FIG. 20, the density of the paths of the connection lines of the five parts is divided into five levels of density and displayed. The denseness of the connection lines of the components is represented by the colors, figures, symbols, and the like of the display device 15, so that it is possible to quantitatively evaluate and evaluate the layout of the wiring board in multiple layers, and reduce the number of man-hours for the placement and wiring. Quality can be greatly improved.

The embodiments of the present invention described in claims 1 and 2 have been specifically described with reference to the embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say, the present invention is suitably used, for example, in a component layout examination apparatus for a single-layer wiring board.

Next, an embodiment of the present invention will be described. FIG. 21 is a flowchart for explaining an embodiment of the invention described in claim 3, and is a diagram for explaining another mode of step 6 in FIG. FIG. 12 is a flowchart for determining an appropriate via-hole arrangement while determining and changing the arrangement of via-holes around a component among the functions described in FIG. 11, which is performed by the via-hole position analyzing unit 24 in FIG. 11.

First, in step 301, a component mounting mode such as wire bonding or face down bonding is selected. That is, it is specified for a set of components such as a resistor, a capacitor, and a transistor, or a single or a plurality of specific multi-terminal component groups.

In step 302, the minimum generation area is determined based on the design rules that have already been set, and an algorithm according to the implementation is started.

In step 303, the coordinate values of the via holes are automatically calculated in consideration of the gap between the via holes and the number of wires that can pass between the via holes so as to satisfy the design rule. The details of this step 303 will be described later.

At step 304, the calculation of the wirable channel taking the via hole position into consideration is performed.

In steps 305 and 306, FIGS.
6, the wiring path analysis and the wiring density display are performed by the method described above. If there is no area where the distribution of the wiring density exceeds the routable channel, the operation is terminated and the next step is performed.

If there is a region where the distribution of the wiring density exceeds the routable channel, at step 307, another possible mounting mode is selected or the design rule is changed.

Steps 308, 309, and 310
Is a process similar to steps 301, 302, and 303 described above, but differs in design rules and mounting conditions. This is repeated to reach a layout condition of a level at which wiring is possible.

FIG. 22 shows an example of via hole generation for each component mounting mode. FIG. 22A shows an example of generation of via holes of a wire bonding type, and FIG. 22B shows an example of generation of via holes of a face-down bonding type.

In the wire bonding type shown in FIG. 22A, the via holes take a zigzag arrangement to secure a wiring area. By designating the area of the zigzag arrangement as a variable (distance a), by designating the gap rule between via holes and the minimum number of wiring passages between via holes, it is possible to uniquely determine the minimum necessary interval. In addition, when the density of the once determined array is shifted, an array homogenization process is automatically performed. That is, for a portion having a small gap, a certain amount of gap addition is performed, and the sequence is calculated again. The addition gap at this time is, for example, an initial value of 10% added, and is automatically repeated until the via hole distribution becomes uniform. The uniformity of via holes is determined by performing area division and comparing the average distance between via holes for each region.

The bonding method using a TAB tape can be performed in the same manner as the wire bonding type.

The face-down bonding type shown in FIG. 22B is based on a matrix arrangement.
The design of the matrix pitch and the number of wires that can be wired between the matrices is a basic design rule. Based on this, the number of arrayed via holes is sequentially generated from the outside to the inside, and the arrangement is advanced until the matrix is full. If the required number of via holes is satisfied on the way, the process ends at that point. Also, if there is an input / output terminal that is not used for the part, information that the input / output terminal is not used is obtained in advance from the connection list.
The matrix portion corresponding to the input / output terminal is automatically removed from the via hole generation location.

By locating via holes in the vicinity of a component by calculation in consideration of design rules in this way, it is possible to simulate the arrangement of via holes, which has conventionally been complicated and inaccurate, at high speed, and to implement various mounting methods. It is possible to consider the optimal arrangement of via holes depending on the form, and to directly reflect this in the appropriate arrangement of the wiring board. As a result, it is possible to accurately examine the proper arrangement of the multilayer wiring board in a short time.

Next, an embodiment for examining the wiring density in the vicinity of the multi-terminal component in consideration of the arrangement of the via holes will be described. FIG. 23 is a view for explaining an embodiment for examining the wiring density near the multi-terminal component in consideration of the arrangement of the via holes. It is a figure for explaining. In FIG. 23, 241, 242, 24
Circles indicated by 3, 244, 245, and 246 are via holes. First, the position of the first via hole 241 is determined. Here, an example in which the position is set to the end of the wiring area and the process is started will be described. That is, from the corner Z of the wiring area to 4
It is set inside the minimum gap rule of the via hole from ZK on the line of 5 degrees. Starting from here, the value of the minimum distance L of the via hole to be arranged can be expressed by the following equation from the minimum gap between the via holes and the design rule of the wiring pitch. L = XGAP + F * COS (ANG) * N where XGAP is the angle AN with respect to the minimum distance ZGAP.
G (= TAN D / A), ZGA
P is the design rule between via holes, F
Is the design rule between lines, and N is the number of lines that can pass.

Next, the vertical position of the via hole in the figure is determined with reference to the input / output terminals of the component or the pitch of the wire bonding. For example, when the pitch of the wire bonding is determined, it is obtained from the center coordinates of the pad of the wire bonding. Although it depends on the geometric design rule of wire bonding, a simple case is the wire bonding pitch D. This D is
Depending on the design rule of wire bonding, the coefficient may be continuously changed depending on the location and a coefficient may be applied at the same time.

The positions of the adjacent via holes 242 can be determined based on the above L, D, N, and F. In the same way, the positions of the via holes are determined one after another.
The calculation is performed while checking the arrangement area width A, and A (M
When 2) protrudes, it occurs on the plus side.

Next, referring to FIG. 24, a description will be given of a method of calculating the wiring channel in step 304 described above. FIG.
The circles indicate the positions of the via holes. First, a case in which the X-direction wiring is considered will be described. Assuming that the interval between the via holes as viewed from the X direction is A, the value of A can take various values (B or C) depending on the arrangement of the via holes, but the number of routable wires at each interval is calculated according to the design rule. Here, a case will be described in which the number of wirings that can pass between via holes is predetermined with respect to the projection value A from the X method. For example, consider a case where a via hole is generated according to the rule of passing two wires between the via holes. A
Is small and does not satisfy the line-to-line design rule (B), the minimum value of the via hole interval B can be set, for example, by the following equation. B = inter-line pitch + minimum gap of via hole + line width If the value of A is larger than that (C), the minimum rule of the wiring pitch can be applied, and the number of via holes divided by the wiring pitch is set. . Number of channels = (C−S) / line pitch Here, S is a design rule of a line and a via hole gap.

Further, at this time, it is possible to calculate the more accurate number of channels from the projection angle in consideration of the relative positional relationship with the adjacent via hole.

In this way, it is possible to calculate the wirable channel based on the projection distance of the via hole in the X direction and the design rule.

Next, an embodiment of the present invention will be described. FIG. 25 is a flowchart for explaining the embodiment of the invention described in claim 4, and is a diagram for explaining step 8 in FIG. 2 in detail.

First, in step 401, a region to be analyzed is specified by a mouse or tablet as an input / output device based on the wiring density of each region on the substrate displayed in step 7 of FIG. In this case, a study target area is displayed on the display device 15 so that the designated area can be confirmed, as described later (see FIG. 26A).

Next, when the area to be examined is designated, the process proceeds to step 402, and the bundle in the designated area is extracted based on the designated coordinate values.

The extracted bundle already has a table described in detail with reference to FIGS. 4 to 9, and by referring to this table, the parts to which the extracted connection is connected and the number of each connection are obtained. (Step 403).

Next, the process proceeds to step 404, and by displaying the processing result on the display device, it is possible to know the parts having a large relationship with the connection passing through the examination target area, and to know the magnitude of the influence. It becomes possible. As a result, it is possible to quickly determine which part is to be moved and whether the design rule is appropriate, and it is also possible to automatically display an appropriate destination.

FIG. 26A is a diagram showing an example of a display screen of the examination target area designated in step 401. FIG.
In the middle, reference numeral 501 denotes a display of a study target area, and another rectangle 502.
Indicates the area and color classification of the wiring density display described with reference to FIGS. 15 and 20.

FIG. 26B is a diagram showing a display screen example of the analysis result processed in step 404. In FIG. 26b,
FIG. 26A shows a state in which five connected parts that have passed through the area specified in FIG. 26A are displayed in descending order of the number of passing wirings (511, 512, 513, 514, 51).
5). Also, based on the result, by analyzing the wiring density and the connection route of the other area, it is possible to display the destination area where the wiring density of the specified area can be kept low (510, 51).
6, 517, 518). The above-mentioned method of estimating an appropriate destination is, for example, to set a certain standard for the wiring possibility capacity based on the wiring possibility which is expected from the wiring density, determine the magnitude of the wiring size, and determine the relevant bundle obtained in this process. By performing a simulation at the time of arrangement with respect to the arrangeable area, it is possible to narrow down and display an appropriate area. In addition to the above, it is possible to consider characteristics that the substrate should have, wiring length, substrate shape, mounting conditions, and the like, and various conditions can be added according to the characteristics of the substrate. As a result, the number of man-hours for placement and routing can be reduced, and the quality can be greatly improved.

[0107]

As described above, according to the first aspect of the present invention, the connection information is classified according to the condition set by the placement trial means, and the connection information is group-managed and group-managed according to the condition. A connection information management unit that supplies connection information to the placement execution unit, the placement execution unit performs a placement trial according to the group-managed connection information, and as a result,
Since the display means displays the connections in a group-managed state, the number of connections to be processed can be reduced, so that the processing can be performed at a high speed, the display screen is easy to see, and a very small display is unnecessary. This is particularly effective for the early stage of the study. In addition, since the processing amount is reduced, it is possible to perform processing in accordance with the intention of the designer, to easily find a place where the density is likely to be high, to easily find the part at the time of correction, and to determine the wiring order. It is obtained efficiently and effectively. Further, data can be easily extracted for each component, component characteristics, and electrical characteristics of signal lines. Then, the operator looks at the display of the connection in a state where the group is managed, and instructs the placement trial means to
By resetting the various conditions, the connection information managed by the group is re-classified, and the connection can be re-displayed in a newly group-managed state, so that the simulation capability is excellent. Also, according to the invention described in claim 2, according to claim 1
In addition to the invention described in the above, in performing the placement and execution, a wiring path is searched, and a wiring density in an area including the wiring path is analyzed, and the result is displayed on the display device. Since the analysis means is further provided, it can be examined in a form close to the actual wiring, so that it is easy to examine components and wiring, and the calculation of the wiring density can be accurately performed, and the placement evaluation can be accurately performed. In particular, various characteristics can be accurately analyzed and grasped even in the initial stage of examination. According to the third aspect of the present invention, when performing the placement trial, the location of the via hole that satisfies the desired condition is searched for according to the local design rule regarding the location of the via hole connected to the input / output terminal of the component. Then, the result is displayed on the display device, and if the determined via hole arrangement is shifted in density, the via hole arrangement is automatically uniformed, which becomes a bottleneck in wiring. Via placement is automatically generated around easy multi-terminal components,
Since the placement conditions can be determined while changing the local design rule, it is easy to examine components and wiring, and the calculation of wiring density can be accurately performed, and placement evaluation can be performed accurately. In particular, various characteristics can be accurately analyzed and grasped even in the initial stage of the examination. Also, in the determined via hole arrangement,
If a density deviation occurs, it can be automatically corrected, which is very effective in examining an optimum via hole arrangement. Furthermore, according to the invention described in claim 4, in addition to the invention described in claim 1, when performing placement, one or more specific areas are designated, so that wiring that passes through the designated area is specified. And extracting the parts connected to this wiring and displaying them on the display device,
When examining the arrangement to remove the area where the wiring density is expected to be high, by specifying the area on the screen, it is possible to know the wiring that passes through the area, The component to be connected can be immediately known from the wiring information. As a result, it is possible to know the components that affect the wiring density in the passage area, and it is possible to effectively change the arrangement. In particular, various characteristics can be accurately analyzed and grasped even in the initial stage of the examination.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment of a wiring board arrangement studying apparatus according to the present invention.

FIG. 2 is a flowchart illustrating an operation of the arrangement studying device.

FIG. 3 is a flowchart showing an operation of a connection information analysis management unit.

FIG. 4 is a diagram showing a database created in steps 31 and 32 in a hierarchical structure.

FIG. 5 is a diagram showing a first connection table created in step 31;

FIG. 6 is a diagram showing a second connection table created in step 32;

FIG. 7 is a diagram showing a database created in steps 35 and 36 in a hierarchical structure.

FIG. 8 is a diagram showing a first bundle table created in step 35;

FIG. 9 is a view showing a second bundle table created in step S36.

FIG. 10 is a diagram illustrating a wiring configuration table created based on a wiring configuration analysis result.

FIG. 11 is a diagram for explaining an arrangement trial unit in detail.

12A and 12B are diagrams illustrating an example of a display screen, wherein FIG. 12A is an example of a bundle display screen, and FIG. 12B is an example of a display screen displayed in a multi-window.

FIG. 13 is a flowchart illustrating an example of searching for a wiring route of only a wiring group to be considered;

FIG. 14 is a flowchart in a case where a wiring order is further considered for a wiring group to be considered;

FIG. 15 is a diagram illustrating an example of a block division process.

FIG. 16 is a diagram illustrating an example of a block management table.

FIG. 17 is a flowchart when a wiring route search in step 133 is performed.

FIG. 18 is a conceptual diagram of a wiring route search method.

FIG. 19 is a diagram illustrating a method of calculating a wiring occupancy.

FIG. 20 is a display example of a wiring density under consideration for placement.

FIG. 21 is a flowchart for explaining the embodiment of the invention described in claim 3;

22A and 22B are diagrams illustrating examples of via hole generation for each component mounting mode, in which FIG. 22A illustrates an example of a wire bonding type via hole and FIG. 22B illustrates an example of a face down bonding type via hole.

FIG. 23 is a diagram illustrating an example for examining the wiring density near the multi-terminal component in consideration of the arrangement of via holes.

FIG. 24 is a diagram for explaining a method for calculating a wiring channel in step 304 in FIG. 21;

FIG. 25 is a view for explaining an embodiment of the invention described in claim 4;

FIG. 26 is a diagram showing an example of a display screen in the embodiment of the invention described in claim 4; FIG.
FIG. 11 is a diagram showing an example of a display screen of a study target area indicated by 01;
(B) is a figure showing an example of a display screen of an analysis result processed at Step 404.

FIG. 27 is a diagram illustrating an example of a display screen of a conventional arrangement study device.

[Explanation of symbols]

1 ... CAD system, 2 ... Place study device, 3 ...
..Input device, 4 ... Man-machine interface means, 5 ... Main memory, 6 ... CAD database, 7 ... Access driver means, 8 ... Display control means, 9 ... Display device , 10 data interface means, 12 input device, 13 man-machine interface means, 14 display control means, 1
5 ... display device, 16 ... data interface means, 17 ... interface data storage means, 1
8 ... control means, 19 ... wiring route search means, 20 ... wiring density analysis means, 21 ... analysis data management means, 22 ... arrangement trial analysis means, 23 ...
Data management means for placement trial, 24 ... Connection information analysis management means, 25 ... Wiring path / density analysis means, 26 ...
-Placement trial means.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-247578 JP, A) JP-A-4-54676 (JP, A) JP-A-4-151774 (JP, A) JP-A-4-220770 ( JP, A) JP-A-6-120344 (JP, A) JP-A-5-342304 (JP, A) JP-A-6-124320 (JP, A) JP-A-3-252774 (JP, A) JP JP-A-1-286080 (JP, A) JP-A-1-219955 (JP, A) JP-A-61-208169 (JP, A) JP-A-60-142472 (JP, A) (58) Fields investigated (Int) .Cl. ⁶ , DB name) G06F 17/50 H05K 13/04 H05K 3/00

Claims (4)

(57) [Claims] 1. An input device for inputting a command, an arrangement trial unit for performing an arrangement trial of a component in accordance with a command of the command input from the input device, and a display device for displaying a result of the arrangement trial. In the component placement examination device for the wiring board, the condition set by the placement trial unit is
Therefore, the connection information is classified and the connection information is
Group management and connection management for group management
With connection information management means for supplying
The stage performs a placement trial according to the connection information managed by the group, and
Result, the display means component placement examined and wherein the this <br/> for displaying the connection in a state of being group management. 2. A component arrangement study apparatus according to claim 1, wherein
Te, when performing arrangement enforcement, while searching for a wiring route,
A component layout examination device further comprising a wiring route / density analyzing means for analyzing a wiring density in an area including the wiring route and displaying the result on the display device. 3. An input device for inputting a command, an arrangement trial means for arranging a component in accordance with a command of the command input from the input device, and a display device for displaying a result of the arrangement trial. In the component placement examination device of the wiring board, when performing the placement trial, in accordance with local design rules regarding the placement of via holes connected to the input / output terminals of the component, search for via hole placement that satisfies desired conditions, display Then co results on the display device
Density deviation occurs in the determined via hole arrangement
In this case, a component arrangement examination device for a wiring board, comprising: a via-hole position analyzing means for automatically performing a process of equalizing the arrangement of via-holes . 4. A component arrangement review apparatus according to claim 1, wherein
Te, when performing arrangement enforcement, by specifying one or more specific areas, the wiring passing through the designated region,
A component layout examining apparatus further comprising a wiring route / density analyzing means for extracting a component connected to the wiring and displaying the extracted component on the display device.