JP2987976B2 - Optical shutter array - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical shutter array using an electro-optical material such as PLZT, and more particularly, to both sides of a groove-like common electrode formed along the longitudinal direction of a chip of an electrochemical material. In addition, the present invention relates to an optical shutter array in which a plurality of shutter elements defined by grooves crossing the common electrode are provided.

[0002]

2. Description of the Related Art The above-described optical shutter array is used, for example, in a print head of an optical printer, and controls each applied shutter element by controlling a voltage applied between a drive electrode attached to each shutter element and the common electrode. Can change the transmission state of light. Since the voltage application ICs and the like are arranged on both sides of the optical shutter array, the common electrode faces the side of the chip to facilitate electrical connection with the ICs and the like. Are known.

In a conventional optical shutter array, there is a configuration in which the common electrode is extended along the outer peripheral wall of the chip from one end of the chip to one side surface of the chip as a configuration in which the above-mentioned common electrode faces the side of the chip. (See, for example,
No. 55316).

[0004]

However, in the above-mentioned conventional optical shutter array, some of the shutter elements located at the end of the chip have characteristics that are deteriorated as compared with those located at the center of the chip. There was something. As a result of repeated experiments to determine the cause, the following was found. That is, in the above-described conventional optical shutter array,
A conductive film such as aluminum, which is provided to form common electrodes and individual electrodes on the surface of the chip, is also provided on the entire surface and side surfaces of the end of the chip, and the conductive film is used to form the common electrode. I was facing the side of the chip. Therefore, prior to the step of attaching the conductive film, it is necessary to cut the chips into a predetermined shape, and when a force is applied at the time of cutting, the characteristics of the electro-optical material near the end are likely to deteriorate.

The present invention has been made in view of the above circumstances, and provides an optical shutter array in which characteristics of a shutter element located at an end of a chip hardly deteriorate.

[0006]

A feature of the optical shutter array according to the present invention is that a groove-like common electrode formed along the longitudinal direction of a chip made of electro-optical material is disposed on both sides of the common electrode. In one embodiment, the shutter element faces a side of the chip via a conductive portion formed in at least one of the grooves defining the plurality of shutter elements.

[0007]

When the chip is completely cut as a result of repeated experiments on the cutting of the chip and the deterioration of the characteristics of the shutter element, the characteristics of the shutter element are likely to be deteriorated in the vicinity of the cut portion. In contrast, in the case of cutting in which the cutter blade does not penetrate over the front and back of the chip, for example, by forming a groove on the chip, deterioration of the characteristics of the shutter element near the cut point is hardly observed. Not found.

Therefore, the optical shutter array of the present invention utilizes at least one of the grooves for partitioning the shutter element, and forms a conductive portion in the optical shutter array to expose the common electrode to the side of the chip. In this way, it is possible to avoid the deterioration of the characteristics of the surrounding shutter elements by utilizing the portion formed by the processing means of cutting rather than cutting, and to form a groove originally necessary for partitioning the shutter element. By using this, only the portion where the conductive film is formed is subjected to special processing different from other portions so that the common electrode faces the side of the chip, and the conditions for forming each shutter element are the same as possible. It is like that.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIG. 3, an optical shutter array 3 made of PLZT, which is an example of an electro-optical material, and a pair of polarizers 4, 5 positioned on both sides of the optical shutter array 3 are provided between a light source 1 and a photosensitive member 2. And a control device (not shown) for applying a drive voltage for shutter opening / closing drive to each of the shutter elements in pixel units of the optical shutter array 3 according to recording information. With
It constitutes the print head of the optical printer. In the figure, 6 is a charging device, 7 is a developing device, 8 is a transfer separation device, 9
Denotes a static eliminator, and 10 denotes a cleaner.

As shown in FIG. 2, the optical shutter device S has an optical shutter array 3 having a plurality of shutter elements arranged in a row on a glass base plate 12, and the control device is provided on both sides thereof. A drive IC 13 for receiving a control signal from the controller and applying a drive voltage to the shutter array 3 is provided, and a power input unit 14 and a signal input unit 15 are provided at both ends.

As shown in FIG. 1, each optical shutter array 3 is formed by processing a PLZT chip 30 using a micromachining technique, and has a groove-shaped common electrode 16 at the center.
A plurality of shutter elements 17 for transmitting light are divided by the grooves 11 and arranged in units of minute pixels on both sides with the interposed therebetween, and the shutter elements 17 are arranged on the side facing the common electrode 16 with respect to each shutter element 17. An individual electrode 18 for applying a signal voltage corresponding to image information in pixel units is provided between the common electrode 16 and the common electrode 16.

The plurality of shutter elements 17 are arranged in a zigzag pattern when viewed from the front. The two rows of shutter elements 17 are driven with a time difference with respect to the rotation direction of the Exposure can be performed linearly along the longitudinal direction, thereby achieving high resolution with less precision in processing.

In the optical shutter array 3, the common electrode 16 is extended to a position facing the side of the chip 30 through a conductive portion 19 formed by using the groove 11 for partitioning the shutter elements 17, This conducting part 19 is
It is connected to a conductive pattern 21 for a common electrode formed on the base plate 12 via a conductive paste 20. In addition, the individual electrodes 18 are connected via bonding wires 22.
It is connected to a conductor pattern 23 for individual electrodes formed on the base plate 12. In addition, the above-mentioned conductor patterns 21 and 23
Are connected to the driving IC 13 although not shown.

Next, a process for producing the above-described optical shutter array 3 will be described with reference to FIGS.

First, as shown in FIG. 4, a polyimide film 31 having a thickness of 2 micrometers is formed on the surface of a PLZT chip 30 having a thickness of about 500 micrometers.
Next, as shown in FIG. 5, precision cutting is performed using a diamond blade (not shown). By this processing, a first groove 32 extending along the longitudinal direction of the chip 30 and serving as the common electrode 16 later, and a second groove 33 intersecting with the first groove 32 are formed in a central portion of the chip 30. I do.

Subsequently, as shown in FIG. 6, an aluminum film 34 is formed on the entire surface of the chip 30 by sputtering. The aluminum film at the end and side is removed. Thereafter, the polyimide film 31 is removed by lift-off to obtain the one shown in FIG.

Next, as shown in FIG. 8, a groove 35 is formed by cutting to partition each shutter element 17. Further, as shown in FIG. 9, portions outside the shutter elements 17 located at both ends are removed so that each shutter element 17 has the same partition shape and forming conditions. The optical shutter array 3 in this state is connected to the conductor patterns 21 and 23 on the base plate 12 to obtain the mounting structure shown in FIG.

As described above, the common electrode 16 is connected to the chip 30
Since the grooves 11 and 35 for partitioning the shutter element 17 are used to face the side of the
Can be processed not before forming the aluminum film 34 but in the final stage in which each shutter element 17 is partitioned. In the conventional configuration using the aluminum film at the end of the chip 30, In contrast to the fact that the chip was cut into the final shape before the formation of the aluminum film 34, the shutter element 17 at the end was likely to malfunction, whereas the optical shutter array of the present invention Shutter characteristics can be made uniform, and a good recorded image can be obtained.

Next, another embodiment of the present invention will be listed.

<1> The one shown in FIG.
Is connected to a connecting portion 36 formed at a position facing the side of the chip 30 through a conductive portion 19 formed in the groove 11, and the optical shutter array 3 is connected to a conductor on the base plate 12. When connecting to the patterns 21 and 23, FIG.
As shown in FIG. 1, the connection portion 36 is connected to the conductor pattern 21 for the common electrode, and the individual electrode 18 is connected to the conductor pattern 23 for the individual electrode via bonding wires 37 and 22.

<2> The specific shape of the chip 30, the number of shutter elements 17 formed on one chip 30, the means for forming the aluminum film 34, and the like are not limited to those in the above-described embodiment, and various changes may be made. It is possible.

[0023]

As described above, in the optical shutter array according to the present invention, the common electrode is made to face the side of the chip by utilizing the groove for partitioning the shutter element. The conditions for forming the shutter element can be made substantially uniform over the whole, and the characteristics thereof can be made uniform. As a result, uniform light transmission characteristics can be obtained from end to end of the optical shutter array. For example, in an optical printer or the like incorporating the optical shutter array, an effect that a high quality recorded image can be obtained is obtained. is there.

[Brief description of the drawings]

FIG. 1 is a perspective view of an optical shutter array in a mounted state.

FIG. 2 is a plan view of an optical shutter array device.

FIG. 3 is a schematic configuration diagram of an optical printer.

FIG. 4 is a perspective view of a first step of manufacturing an optical shutter array.

FIG. 5 is a perspective view of a second step of manufacturing the optical shutter array.

FIG. 6 is a perspective view of a third step of manufacturing the optical shutter array.

FIG. 7 is a perspective view of a fourth step of manufacturing the optical shutter array.

FIG. 8 is a perspective view of a fifth step of manufacturing the optical shutter array.

FIG. 9 is a perspective view of a sixth step of manufacturing the optical shutter array.

FIG. 10 is a perspective view of another embodiment.

FIG. 11 is a perspective view of a mounted state of an optical shutter array according to another embodiment.

[Explanation of symbols]

 11, 13 groove 16 common electrode 17 shutter element 19 conductive part 30 chip

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-135520 (JP, A) JP-A-1-155316 (JP, A) JP-A-2-501680 (JP, A) (58) Survey Field (Int.Cl. ⁶ , DB name) G02F 1/00-1/055 505 G09F 9/30 373 B41J 2/445

Claims (1)

(57) [Claims] 1. An optical shutter array in which a plurality of shutter elements defined by grooves intersecting the common electrode are disposed on both sides of a groove-shaped common electrode formed along the longitudinal direction of a chip made of electro-optical material. An optical shutter array in which the common electrode faces a side of the chip via a conductive portion formed in at least one of the grooves.