JP2987698B2 - Surface heating element - Google Patents
Surface heating elementInfo
- Publication number
- JP2987698B2 JP2987698B2 JP9179111A JP17911197A JP2987698B2 JP 2987698 B2 JP2987698 B2 JP 2987698B2 JP 9179111 A JP9179111 A JP 9179111A JP 17911197 A JP17911197 A JP 17911197A JP 2987698 B2 JP2987698 B2 JP 2987698B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- conductive
- surface heating
- conductive band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Resistance Heating (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、パネルヒーター等
の面発熱体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface heating element such as a panel heater.
【0002】[0002]
【従来の技術】浴室のような湿気の多い場所に設置する
鏡や、室内外の温度差が大きい窓ガラス(車輛の窓ガラ
ス等)はその表面が曇り易く、適切な使用が出来なくな
ることがある。2. Description of the Related Art A mirror installed in a humid place such as a bathroom, or a window glass having a large temperature difference between the inside and outside (a vehicle window glass, etc.) is liable to be cloudy on the surface, and cannot be used properly. is there.
【0003】このような状態に対応する手段として、基
板の表面側に導電性素材を貼付け加工し、基板の裏面側
に電源との接続部を形成した面発熱体を、鏡の裏面側に
取付けることにより鏡面の温度を高めて曇りを防止する
手段が既に知られている。In order to cope with such a situation, a surface heating element in which a conductive material is attached to the front surface of the substrate and a connection portion with a power supply is formed on the rear surface of the substrate is attached to the rear surface of the mirror. Means for increasing the temperature of the mirror surface to prevent fogging are already known.
【0004】鏡の裏面等に設置される面発熱体において
は、高温、多湿の場所に設置するために、面発熱体の裏
面側に設ける電源との接続部が腐食したり絶縁不良を起
こしたりしないようにする必要がある。[0004] In the case of a surface heating element installed on the back surface of a mirror or the like, since the surface heating element is installed in a high-temperature, high-humidity place, a connection portion with a power supply provided on the back side of the surface heating element may corrode or cause insulation failure. You need to avoid it.
【0005】このような面発熱体の導電線接続部の接続
構造が本願発明者によって既に提案されている(実公平
7−51753)。The connection structure of the conductive wire connection portion of such a surface heating element has already been proposed by the present inventor (Japanese Utility Model Publication No. 7-51753).
【0006】図5は、既に提案されている面発熱体にお
ける導電線接続部の接続構造を示した断面図である。FIG. 5 is a sectional view showing a connection structure of a conductive wire connection portion in a surface heating element that has already been proposed.
【0007】図5に示すように、基板1の表面側(図で
は下側)には発熱層が形成されている導電性フィルム1
1が層状に貼着されており、この基板1および導電性フ
ィルム11からなる発熱体aは絶縁性を確保するための
外皮bによって被覆されている。導電性フィルム11の
発熱層の電極部に貼着している導電テープ等の導電帯1
2の一部は、基板1を挿通して基板1の裏面側に至り、
電源用のリード線3に接続している。41は端子カバー
本体、42は内枠であり、51は接着力の強い内部充填
剤、52はリード線3の被覆材との接着性に優れ且つ内
部充填剤51を水分や湿気から保護する性能を有する外
部充填剤である。As shown in FIG. 5, a conductive film 1 on which a heating layer is formed is formed on the front side (lower side in the figure) of a substrate 1.
The heating element a composed of the substrate 1 and the conductive film 11 is covered with an outer skin b for ensuring insulation. Conductive band 1 such as a conductive tape adhered to the electrode portion of the heat generating layer of conductive film 11
A part of 2 penetrates the substrate 1 and reaches the back side of the substrate 1,
It is connected to the power supply lead wire 3. 41 is a terminal cover body, 42 is an inner frame, 51 is an internal filler having a strong adhesive force, 52 is an excellent adhesiveness to the covering material of the lead wire 3 and a performance of protecting the internal filler 51 from moisture and moisture. Is an external filler having
【0008】[0008]
【発明が解決しようとする課題】以上のような導電線接
続部の接続構造を有する面発熱体においては、発熱層が
形成されている導電性フィルム11の外側の基板1に導
電帯12の挿通孔を設ける必要があるために、基板1の
裏面側(図5では上側)に設置する端子カバー本体41
の取付位置を、図6または図7に示したように導電性フ
ィルム11の外側にしなければならなかった。In the surface heating element having the above-described structure for connecting the conductive wires, the conductive band 12 is inserted into the substrate 1 outside the conductive film 11 on which the heat generating layer is formed. Since the holes need to be provided, the terminal cover body 41 installed on the back surface side (the upper side in FIG. 5) of the substrate 1
Has to be located outside the conductive film 11 as shown in FIG. 6 or FIG.
【0009】従ってこのような面発熱体においては、端
子カバー本体41を導電性フィルム11の外側に位置さ
せなければならず、端子カバー本体41の取付位置が限
定されるとともに、面発熱体の周辺寸法を導電性フィル
ム11の周辺寸法より端子カバー本体41の分だけ大き
くしなければならなかった。Therefore, in such a surface heating element, the terminal cover body 41 must be located outside the conductive film 11, so that the mounting position of the terminal cover body 41 is limited and the area around the surface heating element is limited. The dimensions have to be larger than the peripheral dimensions of the conductive film 11 by the size of the terminal cover body 41.
【0010】本発明の目的は、発熱層が形成されている
導電性フィルムの面発熱体における占有率を高くし、裏
面側に設けられる導電線接続部の設置位置を所望の位置
に選ぶことができる構造を有する面発熱体を提供するこ
とにある。[0010] It is an object of the present invention to increase the occupancy of the conductive film on which the heat generating layer is formed in the surface heating element, and to select a desired position of the conductive wire connecting portion provided on the back side. An object of the present invention is to provide a surface heating element having a structure that can be performed.
【0011】[0011]
【課題を解決するための手段】以上の目的を達成するた
めに本発明は、発熱層が形成された導電性フィルムを基
板の表面側に層状に貼着して発熱体とし、当該発熱体の
表裏両面を外皮によって被覆した面発熱体において、一
端が前記発熱層に接続され他端が前記基板の裏面側で電
源からのリード線に接続される導電帯であって、前記基
板の端縁部に沿って屈曲して前記基板の表面側から裏面
側に至る導電帯と、当該導電帯の前記他端を前記リード
線との接続部を残して覆う保護カバーとを具えたことを
特徴とするものである。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a heating element in which a conductive film having a heating layer formed thereon is laminated on the surface side of a substrate to form a heating element. In a surface heating element in which both front and back surfaces are covered with a skin, one end is connected to the heat generation layer, and the other end is a conductive band connected to a lead wire from a power supply on the back surface side of the substrate, and an edge of the substrate. A conductive band bent from the front side to the back side of the substrate, and a protective cover for covering the other end of the conductive band except for a connection portion with the lead wire. Things.
【0012】[0012]
【発明の実施の形態】以下、図面を用いて本発明の実施
形態を説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0013】図1は本発明の一実施形態の構成を示した
断面図であり、図2は導電線接続部の構成を示した拡大
図である。FIG. 1 is a cross-sectional view showing a configuration of an embodiment of the present invention, and FIG. 2 is an enlarged view showing a configuration of a conductive line connecting portion.
【0014】図1および図2において、図5と同一符号
のものは同一のものを示している。ここで、30は端子
カバーのゴム製の上蓋である。1 and 2, the same reference numerals as those in FIG. 5 indicate the same components. Here, reference numeral 30 denotes a rubber upper cover of the terminal cover.
【0015】図1に示したように、本実施形態において
は、基板1の表面側(図1では下側)で、導電性フィル
ム11に形成された発熱層に一端が接続された2本の導
電帯12が、それぞれ基板1の端縁部に沿って屈曲して
基板1の裏面側(図1では上側)に配設されている。As shown in FIG. 1, in the present embodiment, on the front side of the substrate 1 (the lower side in FIG. 1), two heat generating layers formed on the conductive film 11 are connected at one end. The conductive strips 12 are disposed on the rear surface side (the upper side in FIG. 1) of the substrate 1 by bending along the edge of the substrate 1.
【0016】図3は端子カバー本体を取り付ける前の本
実施形態の裏面側から視た平面図である。図3に示した
ように、裏面側に位置する2本の導電帯12の端部は近
接した位置に配設されており、この位置で、図1に示し
たようにリード線3に接続する。FIG. 3 is a plan view of the present embodiment viewed from the back side before the terminal cover body is attached. As shown in FIG. 3, the ends of the two conductive strips 12 located on the back surface side are arranged at close positions, and at this position, they are connected to the lead wires 3 as shown in FIG. .
【0017】このように本実施形態においては、基板1
の端縁部に沿って屈曲させて導電帯12を基板1の裏面
側に配設する構成となっているために、基板1に穴開等
の加工を施こすことなく各導電帯12の長さや配置位置
を選ぶことにより、使用者の所望する基板1上の位置に
容易に導電線接続部を設けることができる。As described above, in the present embodiment, the substrate 1
The conductive strips 12 are bent along the edges of the conductive strips 12 so as to be disposed on the back side of the substrate 1. By selecting the position of the sheath, the conductive wire connection portion can be easily provided at a position on the substrate 1 desired by the user.
【0018】図2および図1において、20は導電帯1
2の先端部分を、リード線3との接続部のみを露出させ
た状態で覆っている保護カバーである。In FIG. 2 and FIG.
2 is a protective cover that covers the front end portion of the lead wire 2 with only the connection portion with the lead wire 3 exposed.
【0019】この保護カバー20は、ポリプロピレンフ
ィルム・ポリエステルフィルム等の硬質性の合成樹脂材
料によって構成されており、接着剤や両面テープ等によ
って導電帯12および基板1に接着している。The protective cover 20 is made of a hard synthetic resin material such as a polypropylene film or a polyester film, and is adhered to the conductive band 12 and the substrate 1 with an adhesive or a double-sided tape.
【0020】このように本実施形態においては、裏面側
に位置する導電帯12の端部が保護カバー20によって
基板1に強固に固定されているために、外皮bの装着過
程等の製造過程において導電帯12の端部が所定位置か
ら動くことはない。As described above, in the present embodiment, since the end of the conductive band 12 located on the back surface side is firmly fixed to the substrate 1 by the protective cover 20, the manufacturing process such as the mounting process of the outer cover b is performed. The end of the conductive strip 12 does not move from a predetermined position.
【0021】次に、本実施形態の製造方法について説明
する。Next, the manufacturing method of this embodiment will be described.
【0022】先ず、発熱層を形成した導電性フィルム1
1を基板1の表面側に貼着し、2本の導電帯12の一端
をそれぞれ導電性フィルム11の発熱層に接続する。こ
の2本の導電帯12をそれぞれ基板1に沿って配設し、
次いで基板1の端縁部に沿って屈曲させてその先端部が
基板1の裏面側の所定の場所に位置するように配設す
る。2本の導電帯12の先端部を、リード線3との接続
部を露出させた状態で保護カバー20によって基板1上
に固定する。First, the conductive film 1 on which the heating layer is formed
1 are attached to the front surface side of the substrate 1, and one ends of the two conductive strips 12 are connected to the heat generating layer of the conductive film 11, respectively. The two conductive strips 12 are arranged along the substrate 1 respectively,
Next, the substrate 1 is bent along the edge, and is disposed such that the front end thereof is located at a predetermined position on the back side of the substrate 1. The distal ends of the two conductive strips 12 are fixed on the substrate 1 by the protective cover 20 in a state where the connection portion with the lead wire 3 is exposed.
【0023】以上のような状態で外被bを装着し、導電
線接続部の外被bを切除して窓部60を設ける(図3参
照)。窓部60内に露出している導電帯12の接続部
に、ハンダ等でリード線3を接続する。このリード線3
と導電帯12の接続部に端子カバー本体41および内枠
42を配設し、内枠42内に内部充填剤51を充填し、
端子カバー本体41内に外部充填剤52を充填した後、
ゴム製の上蓋30を装着する。(図5参照)。The jacket b is mounted in the above-described state, and the jacket b of the conductive wire connection portion is cut off to provide the window 60 (see FIG. 3). The lead wire 3 is connected to the connection part of the conductive band 12 exposed in the window part 60 by soldering or the like. This lead wire 3
A terminal cover main body 41 and an inner frame 42 are disposed at a connection portion of the conductive band 12 and the inner band 42, and an inner filler 51 is filled in the inner frame 42,
After filling the terminal cover body 41 with the external filler 52,
A rubber upper lid 30 is attached. (See FIG. 5).
【0024】以上のようにして本実施形態の製造は行な
われる。ここで、外被bを切除して窓部60を設ける
際、導電帯12の先端部は硬質性の保護カバー20によ
って保護されているために、窓部60の形成過程で導電
帯12が切断されることはない。The manufacturing of this embodiment is performed as described above. Here, when the window b is cut and the window 60 is provided, since the tip of the conductive band 12 is protected by the hard protective cover 20, the conductive band 12 is cut off in the process of forming the window 60. It will not be done.
【0025】なお、外被bの所定の位置にあらかじめ窓
部60を設けてき、その窓部60が形成された外被bを
発熱体aに装着するという製造方法も考えられるが、こ
のような製造方法では、窓部60と発熱体aとの位置合
せに精度が要求され製造効率が著しく低下するので、こ
のような製造方法は好ましくない。A manufacturing method is also conceivable in which a window 60 is provided in a predetermined position of the jacket b in advance, and the jacket b having the window 60 is attached to the heating element a. In the manufacturing method, precision is required for the alignment between the window 60 and the heating element a, and the manufacturing efficiency is significantly reduced. Therefore, such a manufacturing method is not preferable.
【0026】以上説明した実施形態においては、導電線
接続部は端子カバー本体41、内枠42、内部充填剤5
2および外部充填剤51によって構成されているが、こ
の構成は本発明を限定するものではなく、どのような構
成の導電線接続部であってもよい。また、外皮bは、発
熱体aや導電帯12の絶縁性を確保するために必要不可
欠なものであるが、具体的には、面発熱体が使用される
状況に応じて、例えば防水性、防湿性等の様々な性質を
有する材料を適宣用いて構成されるものである。In the embodiment described above, the conductive wire connecting portion is composed of the terminal cover body 41, the inner frame 42, and the inner filler 5.
2 and the external filler 51, but this configuration does not limit the present invention, and the conductive wire connection portion may have any configuration. Further, the outer skin b is indispensable to ensure the insulation of the heating element a and the conductive band 12, but specifically, depending on the situation where the surface heating element is used, for example, waterproof, It is constituted by suitably using materials having various properties such as moisture proof properties.
【0027】[0027]
【発明の効果】以上説明したように本発明によれば発熱
層が形成されている導電性フィルムの面発熱体における
占有率を高くし、裏面側に設けられる導電線接続部の設
置位置を所望の位置に選ぶことができる。As described above, according to the present invention, the occupation ratio of the conductive film on which the heat generating layer is formed in the surface heating element is increased, and the installation position of the conductive wire connecting portion provided on the back side is desired. You can choose the position.
【図1】本発明の一実施形態の構成を示す断面図であ
る。FIG. 1 is a sectional view showing a configuration of an embodiment of the present invention.
【図2】図1に示した断面図の要部拡大図である。FIG. 2 is an enlarged view of a main part of the sectional view shown in FIG.
【図3】図1に示した実施形態の裏面側の構成の説明図
である。FIG. 3 is an explanatory diagram of a configuration on a back surface side of the embodiment shown in FIG. 1;
【図4】図1に示した実施形態の裏面側の構成を示す平
面図である。FIG. 4 is a plan view showing a configuration on the back surface side of the embodiment shown in FIG. 1;
【図5】従来の面発熱体の導電線接続部の構成を示す断
面図であるFIG. 5 is a cross-sectional view showing a configuration of a conductive wire connecting portion of a conventional surface heating element.
【図6】従来の面発熱体の説明図である。FIG. 6 is an explanatory view of a conventional surface heating element.
【図7】従来の面発熱体の説明図である。FIG. 7 is an explanatory view of a conventional surface heating element.
1 基板 3 リード線 11 導電性フィルム 12 導電帯 20 保護カバー 30 端子カバーの上蓋 41 端子カバー本体 42 内枠 51 内部充填剤 52 外部充填剤 60 窓部 a 発熱体 b 外皮 DESCRIPTION OF SYMBOLS 1 Substrate 3 Lead wire 11 Conductive film 12 Conductive band 20 Protective cover 30 Terminal cover top lid 41 Terminal cover main body 42 Inner frame 51 Internal filler 52 External filler 60 Window a Heating element b Outer shell
Claims (2)
板の表面側に層状に貼着して発熱体とし、当該発熱体の
表裏両面を外皮によって被覆した面発熱体において、一
端が前記発熱層に接続され他端が前記基板の裏面側で電
源からのリード線に接続される導電帯であって、前記基
板の端縁部に沿って屈曲して前記基板の表面側から裏面
側に至る導電帯と、当該導電帯の前記他端を前記リード
線との接続部を残して覆う保護カバーとを具えたことを
特徴とする面発熱体。1. A heating element in which a conductive film having a heating layer formed thereon is adhered in a layer on the surface side of a substrate to form a heating element, and both sides of the heating element are covered with outer skins. A conductive band that is connected to a layer and the other end of which is connected to a lead wire from a power supply on the back side of the substrate, and that bends along the edge of the substrate from the front side to the back side of the substrate. A surface heating element comprising: a conductive band; and a protective cover that covers the other end of the conductive band except for a connection portion with the lead wire.
記基板に接着していることを特徴とする請求項1に記載
の面発熱体。2. The surface heating element according to claim 1, wherein the protective cover is bonded to the conductive band and the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9179111A JP2987698B2 (en) | 1997-06-20 | 1997-06-20 | Surface heating element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9179111A JP2987698B2 (en) | 1997-06-20 | 1997-06-20 | Surface heating element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1116662A JPH1116662A (en) | 1999-01-22 |
JP2987698B2 true JP2987698B2 (en) | 1999-12-06 |
Family
ID=16060215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9179111A Expired - Fee Related JP2987698B2 (en) | 1997-06-20 | 1997-06-20 | Surface heating element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2987698B2 (en) |
-
1997
- 1997-06-20 JP JP9179111A patent/JP2987698B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1116662A (en) | 1999-01-22 |
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