JP2987651B2 - Taping of holding body of lead pin and method of mounting holding body using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding body taping of a lead pin to be mounted and mounted on a circuit board such as a printed board or an alumina board, and to a method of mounting a holding body using the same.

In general, a circuit board such as a printed board or an alumina board is mounted such that a plurality of lead pins are led out from predetermined sides for circuit connection.

Conventionally, when mounting the above-described lead pins on a circuit board, the lead pins are handled individually and applied to the board surface of the circuit board, and connected and fixed to a circuit pattern by soldering, welding, bonding, or the like. ing.

[0004] However, this requires not only a great deal of labor and inferior work efficiency, but also it is difficult to mount a plurality of lead pins with high precision by arranging a plurality of lead pins one by one at a predetermined interval.

[0005]

SUMMARY OF THE INVENTION According to the present invention, the handling of lead pins can be made extremely simple, and the lead pins can be efficiently and accurately mounted and fixed on a circuit board. In addition, high speed and continuous processing can be performed, and mass production can be achieved. It is an object of the present invention to provide a lead pin holding body taping and a method for mounting a lead pin holding body using the same.

[0006]

In the taping of the lead pin holding body according to the first aspect of the present invention, a tape provided with through holes for pitch feed and positioning at regular intervals along the longitudinal direction is required. It is configured by holding a plurality of lead pin holding bodies in which a plurality of lead pins are arranged at predetermined intervals and inserted and fixed, in a plurality of rows. Also,
In the taping of the lead pin according to the second aspect, the holding body is formed by a spacer frame of a circuit board to be fixed by laminating a plurality of layers, and in the taping of the lead pin according to the third aspect, the holding body is formed by a circuit board. Are formed of coating pellets for insulatingly coating the circuit forming surface of the above. In the taping of the lead pin holding body according to the fourth aspect, the holding body is positioned and held inside the opening provided at the tape center position.

According to a fifth aspect of the present invention, there is provided a method of mounting a lead pin hold body using taping of a lead pin hold body, wherein a tape having pitch feed and positioning through holes provided at regular intervals along a longitudinal direction. A plurality of lead pin holders in which a required number of lead pins are arranged at predetermined intervals and inserted and fixed are held in a plurality of rows, and the tape is fed at a pitch by punching to intermittently position and transport the lead pin holders. The lead pin hold body is mounted and fixed at a predetermined position on the circuit board by being aligned with the circuit board supplied by (1). Also,
According to a sixth aspect of the present invention, in the method of mounting a lead pin hold body, the hold body is interposed and arranged as a spacer frame of the circuit board between relative surfaces of a plurality of laminated circuit boards. In the mounting method of the lead pin hold body, the hold body is melt-adhered to the circuit forming surface of the circuit board as a pellet for coating the circuit board.

[0008]

According to the first aspect of the present invention, in the taping of the lead pin holding body, a plurality of necessary lead pins are inserted and fixed in the holding body, and are held in multiples by a pitch feedable tape. The body can be sent to the mounting process on the circuit board by tape transport, so it is not only extremely easy to handle, but also the lead body is mounted and fixed on the circuit board in the holding state where a plurality of wires are inserted and fixed at predetermined intervals while being arranged and inserted. As a result, it is possible to quickly and efficiently mount and fix it with high accuracy. In the taping of the lead pin according to the second aspect, the holding body serves as a spacer frame of the circuit board, and in the third aspect, the holding body insulates the circuit forming surface of the circuit board. It can be mounted on a circuit board together with lead pins as a pellet for use. In the holding body taping according to the fourth aspect, since the holding body of the lead pin is positioned and held inside the opening provided at the center position of the tape, the holding body can be covered and protected by winding the tape and the tape can be stably provided. Can feed pitch.

According to a fifth aspect of the present invention, there is provided a method for mounting a lead pin holding body using taping, wherein a holding body in which a plurality of lead pins are inserted and fixed is pitch-fed by a tape and a circuit board and a position supplied by another means are provided. Since the lead pins and the holding body can be attached and fixed to the circuit board at the same time, the circuit board having a predetermined circuit configuration can be assembled with high precision and efficiency, thereby improving the productivity. In the method for mounting a lead pin hold body according to the sixth aspect, a plurality of hold bodies are interposed between the relative surfaces of the circuit boards to be laminated, and the hold body is mounted in the lead pin hold body according to the seventh aspect. The lead pins can be positioned at predetermined positions by being melt-adhered to the circuit forming surface of the circuit board, and can be attached to the circuit board.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view showing a taping body of a lead pin according to an embodiment of the present invention.
Are tapes formed continuously in a belt shape, 2, 2... Are holding bodies of lead pins held in multiples by tape 1, 3, 3,.
Is a lead pin.

FIG. 2 shows the tape 1 from the side. The tape 1 is formed of a carrier tape 10 serving as a base tape and a cover tape 11 for fixing the lead pins 3 to the carrier tape 10. The tape 1 is provided with through holes 12 for pitch feeding and positioning of the tape 1 at regular intervals in the longitudinal direction.
Are positioned with reference to the through holes 12, 12,..., And the opening 13, as a space for disposing the holding members 2, 2,.
13 are provided at predetermined intervals. The tape 1 is preferably formed using heat-resistant paper, and the holding members 2, 2,...
3 can be formed inexpensively as being attached and fixed to the circuit board by heat welding or laser-fixing.

The holding body 2 shown in FIG. 3 is used as a spacer frame of the circuit boards 4 and 5 which are stacked in a plurality of layers and assembled three-dimensionally, and has an outer shape slightly larger than the plane area of the circuit boards 4 and 5. Is formed of a quadrilateral frame having Along the four sides, step portions 2a into which the circuit board 4 can be fitted and fixed are provided on the upper and lower frame surfaces.
The holding body 2 can be formed of a thermosetting resin having heat resistance and insulation properties.
By inserting..., Injection molding can be applied.

The lead pins 3, 3... Are fixed to the holding body 2 by inserting a plurality of them into necessary sides by separating them at predetermined intervals in accordance with a circuit pattern provided on the board surface of the circuit board 4. ing. The lead pins 3, 3,... Shown in FIG.

The lead pin holding members 2, 2,... Are positioned inside openings 13, 13,... Provided in the carrier tape 10, and the outer axes of the respective lead pins 3, 3,. And is fixed in multiples by the tape 1.

[0015] By using the holding body taping of the lead pins, a conveying step of feeding the holding body taping of the lead pins at a pitch in parallel with the manufacturing process of the circuit board can be arranged to perform the pitch feeding to the mounting position with respect to the circuit board. it can. At the mounting positions of the lead pins, the holding members 2, 2 are positioned by the through holes 12, 12,.
And the lead pins 3, 3 are applied to the circuit board 4 supplied by another means, and the circuit boards 4, 5 are fitted into and fixed to the steps 2a, 2b of the holding body 2 as shown in FIG. Circuit board 4 on which a plurality of layers 2 are laminated
5 as a spacer frame. At the same time, each of the lead pins 3, 3,... Is positioned and mounted on a predetermined position on the circuit board, and is fixed to a predetermined circuit pattern on the circuit board by soldering, welding, bonding, or the like via a jumper wire or the like to the circuit board. Can be connected. After the connection and fixation, the outer ends of the lead pins 3, 3... Are cut off from the tape 1 by a cutter or the like to produce a circuit board in which a plurality of layers are laminated by the hold body 2, or to be continued thereafter. Alternatively, the circuit board may be post-processed by pitch feeding, and then cut off from the tape 1 in the final step.

FIG. 5 shows a modification of the holding body 2 held by taping according to the present invention.
Is used as a spacer frame of a circuit board as in the case described above. A plurality of lead pins 3, 3,..., Which are attached side by side, are fixed to the holding body 2 by being vertically inserted into the frame portion.

The holding bodies 2, 2,...
Can be adhered and fixed to the carrier tape 10 by connectors 2c, 2c, which are attached by using burrs or adhesive tape generated at the time of molding of 2 or use the adhesive tape itself. Using these connectors 2c, 2c, it is sufficient to fix them at about two or four relative sides depending on the shape of the holding bodies 2, 2,. Also, instead of connectors such as burrs and adhesive tape,
The runner branches generated during the molding of the holding bodies 2, 2,... May be attached with an adhesive tape.

FIG. 6 shows a state in which the circuit boards 4 and 5 are stacked and fixed using the holding body 2 shown in FIG. 5, and the lead pins 3, 3. Positioning holes 4a of substrates 4 and 5
The circuit boards 4 and 5 can be positioned and fixed by fitting them into the respective circuit boards 5a. The lead pins 3, 3,... Can be connected and fixed to a circuit pattern as jumper wires for connecting the circuit boards 4, 5 to each other.

FIG. 7 shows a case where the holding body 2 held by taping of the present invention is formed as a pellet for coating. The coating pellet 2 is made of a thermosetting resin having an insulating property such as an epoxy resin, and when formed as an exterior coating, a powder mixture of the thermosetting resin and a curing agent is semi-cured (B-staged). To form a pellet. After the application of the coating pellets, the coating pellets formed as the outer coating are connected to the lead pins 3 and 3.
Can be easily cut off by cutting off the off-axis end side of the tape 1 from the tape 1 of the coating pellet series, and cutting the used tape 1 as unnecessary taping parts. Instead, the electronic component covered with the coating pellets 2, 2,... Is supported by the coating pellet continuous tape 1, so that the tape 1 can be used as a circuit component continuous tape.

In the coating pellets 2, 2,...
As shown in FIG. 1, the lead pins 3, 3... Can be inserted and fixed to the flange portion of the coating pellet 2 by projecting outward from the inside of the cap shape.

Using the taping of the coating pellets, the tape can be fed to the coating position of the electronic component by arranging the tape transporting step of the coating pellets in parallel with the circuit board manufacturing process. At the coating position of the electronic component, the coating pellet 2 is positioned by the through holes 12, 12,... Of the tape 1, and the coating pellet 2 is guided to the feeding side of the circuit board or the feeding side of the circuit board is guided to the feeding side of the coating pellet 2, 2,. By coating them with a roll or the like, they can be combined, and the coating pellets 2, 2,. At the time of the fusion attachment, it is preferable that the inner ends of the lead pins 3, 3... To which solder is previously attached are soldered and fixed to the circuit pattern of the circuit board by beam irradiation or the like. The coating pellets 2, 2,... Can be formed into a predetermined shape by pressing the heated and welded pellets from the left and right with a mold as necessary.

[0022]

As described above, according to the lead pin holding body taping and the mounting method of the lead pin holding body using the same according to the present invention, not only can the lead pin and the holding body be easily handled, but also a plurality of necessary lead pins and the holding body can be provided. The lead pins and the holding body can be attached to the circuit board by pitch-feeding the holding bodies with the lead pins inserted and fixed in a line by a low-cost taping method. Therefore, the lead pins can be easily attached, and the lead pins can be attached to the circuit board at high speed. Thus, it is possible to perform the process efficiently and with high accuracy, and the circuit board assembling process can be streamlined.

[Brief description of the drawings]

FIG. 1 is a plan view showing taping of a lead pin holding body according to an embodiment of the present invention.

FIG. 2 is a side view showing the taping.

FIG. 3 is a perspective view showing a lead pin hold body of FIG. 1;

FIG. 4 is an explanatory view showing a laminated structure of a circuit board using the lead pin hold body of FIG. 1;

FIG. 5 is a plan view showing a taping body of a lead pin according to another embodiment of the present invention.

FIG. 6 is a perspective view showing the lead pin hold body of FIG. 5;

FIG. 7 is an explanatory view showing a laminated structure of a circuit board using the lead pin hold body of FIG. 5;

FIG. 8 is a sectional view showing a lead pin hold body held by taping according to still another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape 12,12 ... Through-hole for pitch feed and positioning 13,13 ... Opening 2,2 ... Lead pin hold body 3,3 ... Lead pin 4,5 Circuit board

Claims (7)

(57) [Claims] 1. A tape having a plurality of through-holes for pitch feed and positioning at regular intervals along a longitudinal direction, and a plurality of lead pin holding bodies in which required plural lead pins are arranged and fixed at predetermined intervals. Hold taping of lead pin characterized by being held in a continuous shape. 2. The taping body according to claim 1, wherein said holding body is a spacer frame of a circuit board to be fixed by laminating a plurality of layers. 3. The taping body according to claim 1, wherein said holding body is a coating pellet for insulatingly covering a circuit forming surface of a circuit board. 4. The taping body for a lead pin according to claim 1, wherein said holding body is positioned and held inside an opening provided at the center of the tape. 5. A tape in which through holes for pitch feed and positioning are provided at regular intervals along the longitudinal direction, and a plurality of holding bodies in which a plurality of necessary lead pins are arranged and fixed at predetermined intervals are inserted. The tape is fed in pitches through the through-holes to intermittently position and transport the lead pin holding body, and is aligned with the circuit board supplied by another means. A method of mounting a lead pin hold body, wherein the lead pin hold body is mounted and fixed at a predetermined position on a substrate. 6. A method according to claim 5, wherein said holding body is interposed and arranged as a spacer frame of the circuit board between the opposing surfaces of a plurality of laminated circuit boards. 7. The method according to claim 5, wherein said holding body is applied as a pellet for coating the circuit board on a circuit forming surface of the circuit board by melting.