JP2980575B2 - Building board thickness measuring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring the thickness of a building board, and more particularly, to a building capable of measuring the thickness of a building board having a surface pattern having a large unevenness and capable of effectively controlling the thickness of the building board. The present invention relates to a plate thickness measuring device.

[0002]

2. Description of the Related Art Conventionally, when measuring the thickness of a building board, it is measured by using a dial gauge at arbitrary several points on one building board as a representative point. According to the result obtained by the measurement, the board having the poor thickness is separated and removed, and only the board within the control range is coated. When the coating is performed by the roll coater method, such thickness data is used as important information for adjusting the height of the application roll.

[0003]

However, in recent years,
With the advent of extrusion boards having high shaping properties and building boards having a deeply carved surface pattern by casting, it has become difficult to apply the conventional thickness measurement method as it is. If there are many flat parts in the uneven surface pattern, it is possible to use a dial gauge, but in such a building board, it is not possible to determine which part is the representative thickness Extremely difficult.

[0004] At present, variations in the thickness of building boards due to variations in raw materials and variations in processing conditions are inevitable. In order to improve product yield, defective boards are not found early and are not subjected to processing. This is very important. An object of the present invention is to provide a thickness measuring device capable of measuring the thickness of a building board having an uneven surface pattern, capable of managing the thickness, and improving productivity.

[0005]

An apparatus for measuring the thickness of a building board according to the present invention measures the thickness of a building board, and can reciprocate the building board in a specific direction within the plane of the building board. Conveying means, a thickness measuring sensor provided on at least one surface side of the building board and measuring the thickness of the building board, and a sensor scanning means for scanning the thickness measuring sensor in a direction intersecting the specific direction, It has.

A first mode in which the sensor scanning means moves the thickness measurement sensor for scanning only when the reciprocating conveyance is turned back, and a first mode in which the thickness measurement sensor is continuously conveyed in one direction in the building board. It is preferable to have the second mode for scanning, because the thickness of the reference building board can be accurately measured and the thickness of the building board to be inspected in the manufacturing process can be quickly measured.

[0007] Further, a sensor control means for controlling the thickness measurement sensor in synchronization with the transport means so that the thickness measurement start position on the outward path and the thickness measurement end position on the return path are linear, may be implemented by interpolation or the like. Since it is advantageous for signal processing in obtaining the thickness distribution of the entire building board,
preferable.

Further, the result obtained by measuring the thickness of the reference building board at a plurality of locations is processed and used as a reference value, and the result obtained by measuring the thickness of the building board to be inspected at a plurality of locations is processed and used as an actual measurement value. Comparing the reference value and the measured value at the corresponding position, having a thickness control means for measuring the overall thickness of the building board is not the absolute thickness of the building board but the reference building board. Measuring the relative thickness is preferable because it is easy to detect only those having a really bad thickness in practical use. In addition, it is preferable that the processing be performed so that a value smaller than a predetermined value is made larger than the original value, since a thinned portion is not mistaken as a defect in the design of the building board.

It is preferable that the processing for the reference value is performed by interpolating between the measurement points because the reference value and the actually measured value can be easily corresponded in position.

In the present invention, since the thickness measuring sensor scans the entire surface of the building board, the thickness of the building board can be automatically measured, and the thickness of the carving which cannot be obtained by the conventional thickness measuring apparatus can be measured. The thickness can be measured for a building board having a deep uneven surface, an uneven surface having no flat portion at all, or a building board having a complicated surface shape such as a curved surface portion. In addition, by using this measuring device, by properly managing the thickness of the obtained data, building boards having a poor thickness can be quickly removed, and the productivity can be greatly improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a side view of a building board thickness measuring apparatus according to the present invention. In FIG. 1, a plurality of conveyors 1 are arranged in a horizontal direction, and a building board 2 whose thickness is to be measured is transferred on the conveyor 1 in both directions. A thickness measuring unit 3 for measuring the thickness of the building board 2 is arranged at an intermediate point of the conveyor 1. Further, transport rollers 8 are arranged on both sides of the thickness measuring section 3. As shown in FIG. 4, the thickness measuring unit 3 is provided with thickness displacement sensor heads 10A and 10B for measuring thickness so as to sandwich the conveyed building board 2 from above and below in a non-contact manner. In addition, the first photoelectric switch 4 and the second photoelectric switch 5
Are provided on both sides of the displacement sensor heads 10A and 10B. Further, in the present measuring apparatus, limit switches 6 and 7 for stopping traveling of the conveyor 1 when the leading end in the traveling direction of the building board 2 hits are respectively disposed on the conveyor 1 provided at the left and right ends. ing.

FIG. 2 is a plan view of the thickness measuring apparatus of the present invention. Guides 9 for guiding the building board 2 in the horizontal direction on the conveyor 1 are arranged on both sides in the short direction of the conveyor 1. The building board 2 travels over the building board travel range W (between the left and right building board stop lines S-S) on the conveyor 1, and as shown in the running history of the building board 2 in the drawing C, the right end thereof is dotted. Starting from the position indicated by A, the vehicle changes direction at the position indicated by the point B and travels in the opposite direction, and then reciprocates at the position indicated by the point A again and moves toward the position indicated by the point B. ing.

FIGS. 3 and 4 are a front view of a main part of a building thickness measuring device and a perspective view of the displacement sensor heads 10A and 10B. Referring to FIG. 3 (a), the thickness measuring device includes an upper linear guider 1 held up and down by an engagement member 11.
2A and a lower linear guider 12B. The upper linear guider 12A and the lower linear guider 12B act as displacement sensor moving means for the upper displacement sensor head 10A and the lower displacement sensor head 10B. The upper displacement sensor head 10A and the lower displacement sensor head 10B which is disposed at a position facing the upper displacement sensor head 10B and are tuned are attached to the sliders 15A and 15B, respectively, and are movable in the horizontal and vertical directions. . The upper linear guider 12A and the lower linear guider 12
B has a built-in photoelectric switch (not shown) at positions indicated by S1 and S2 in the drawing to detect a reference position of a built-in timing belt (not shown). FIG.
, Each sensor 13A, 13B has support portions 14A, 14B, sliders 15A, 15B and mounting members 16A, 16B, and the mounting members 16A, 16B are sliders 15A, 15B by the support portions 14A, 14B.
Attached to. The mounting members 16A and 16B include
Displacement sensor heads 10A and 10B and amplifier unit 17
A, 17B, and displacement sensor heads 10A, 10B.
Are provided with, for example, irradiation holes 18A and 18B for visible light lasers and light receiving holes 19A and 19B. FIG. 3B shows a case where the measurement position is φ with a semiconductor laser of 670 nm, for example.
A method of measuring the thickness by irradiating with a spot of 0.1 mm is shown. When the back surface 2b of the building board 2 is completely flat, it is possible to measure the thickness by distance measurement using only the upper displacement sensor 10A. Regardless, the thickness can be measured everywhere.

FIG. 5 is a block diagram showing a control configuration of the building board thickness measuring system. According to this block diagram, the main controller 20 includes a timer 21 and a counter 22. The main controller 20 includes a memory 23, a keyboard 24, and a display 25.
Is connected. Also, the upper displacement sensor head 10A
And the lower displacement sensor head 10B are connected via amplifier units 17A and 17B, respectively. A conveyor controller 26 is connected to the main controller 20. The conveyor controller 26 includes photoelectric switches 4 and 5 for detecting when to start and stop sampling the thickness measurement data, and when to turn the board. Are respectively connected. Further, the conveyor controller 26 drives a transport conveyor driving motor 27 via a driver 28. Further, a rotary encoder 29 is connected to the motor 27 for driving the conveyor. Further, a linear guider controller 30 is connected to the main controller 20. The linear guider controller 30 includes an upper linear guider drive motor 31.
And the lower linear guider driving motor 32 are connected via dedicated controllers 33 and 34 and drivers 35 and 36, respectively, and the dedicated controllers 33 and 34 are connected to a photoelectric switch S1 for detecting the reference positions of the sliders 15A and 15B. And the photoelectric switch S2 are connected.
Also, the upper and lower linear guider driving motors 31, 32
Are connected to rotary encoders 37 and 38, respectively.

FIGS. 6 and 7 show the main controller 20.
It is a control flow in FIG. First, it is determined whether or not the system power has been turned on (S100). If the system power has been turned on, the system is initialized (S101). If NO, wait until the power is turned on. Next, measurement standby control is instructed to the conveyor controller 26 and the linear guider controller 30 (S102). Next, it is determined whether there is a response from each of the controllers 26 and 30 (S1).
03) If there is a response, the controller 26 and 30 are instructed to start measurement control (S104). NO
In the case of, wait for a response. Then, the building board 2, which has been waiting on the right side of the thickness measuring device, is sent to the thickness measuring unit 3. Based on the detection time of the building board 2 by the photoelectric switch 4 (S10
5) The timer 21 is started (S106), and a predetermined time t for defining the first sampling point by the timer 21 is set.
After determining that 1 has elapsed (S107), the building board 2
The sampling of the thickness data is sequentially started for one measurement line in the longitudinal direction (S108). At this time, the measurement line number i is set to 1 (S109). Then, the timer 21 is reset (S110), and data sampling is performed on the measurement line (S11).
1). Thereafter, it is determined whether the building board 2 has passed by the photoelectric switch 4 (S112). If NO
The data sampling is continued, and if YES, the sampling is interrupted (S113). Here counter 2
The measurement line number of No. 2 is incremented from i to i + 1 (S11
4). Next, it is determined whether or not the building board 2 running in the right direction is detected by the photoelectric switch 5 (S115).
If S, the timer 21 is started (S116),
If NO, the detection by the photoelectric switch 5 is waited. Next, the timer 21 determines whether a predetermined time t2 defining the first sampling point in the next sampling line has elapsed (S117), and if it has elapsed, data sampling is restarted (S118). If NO, wait until the time t2 elapses. Next, the timer 21 is reset (S119). Thus, the predetermined moving distance W
The building board 2 that has traveled to the left over (see FIG. 2)
It hits the limit switch 6 on the left stop line S and stops. Subsequently, the building board 2 travels in the opposite direction at the same speed and is sent to the thickness measuring unit 3 again, and the thickness data of the next measuring line in the longitudinal direction is used as the detection timing of the building board 2 by the photoelectric switch 5. The timer 21 is started again as a reference point, and after the timer 21 determines that the predetermined time t2 has elapsed, the thickness data is sequentially sampled for the next measurement line in the longitudinal direction of the building board 2 (S
120). Next, the counter 22 is incremented to i + 2 (S1
21). Next, it is determined whether or not data sampling is completed based on whether or not i = p (p is the number of all samples) (S122).
Instructs 6, 30 to end the measurement control (S123). N
If it is O, the process returns to S105. By repeating such an operation, all the thickness data on all the measurement lines to be measured are sampled. The data obtained here is arranged (S124) and subjected to data processing (S125). These data sampling will be described in detail with reference to FIG. 8 and 9 are control flows of the conveyor controller 26. The conveyor controller 26 controls the conveyor 1 on which the building board 2 runs.
First, it is determined whether the system power has been turned on (S
200). If the determination is YES, initialization is performed (S20).
1) If NO, wait until the power is turned on.
In step S202, it is determined whether or not there is an instruction for the measurement standby control from the main controller 20, and when the instruction is given, the power of the transport conveyor driving motor 27 is turned on (S203). Then, the measurement standby control (V) for driving the conveyor 1 to move the building board 2 to the standby position is performed (S204). This measurement standby control (V) is performed as follows. When there is an instruction of the measurement standby control from the main controller 20, the direction in which the building board 2 goes to the standby position (the right stop line S in FIG. 2) is designated to the transport conveyor driving motor 27 (S205), and a predetermined number of pulses are output. Then, the conveyor driving motor 27 is rotated (S206). This rotation is performed until the limit switch 7 is turned on (S2
07), the conveyor 1 is driven and moves to the standby position, and when the limit switch 7 is turned on, the conveyor 1 stops (S208). Then, the measurement standby OK is notified to the main controller 20 (S209). When the limit switch 7 is not turned on, the conveyor drive motor 27 rotates until the building board 2 hits the limit switch 7. Next, it is determined whether or not there is a measurement control start instruction from the main controller 20 (S210).
If it is ES, measurement control (VI) is performed (S211). NO
If so, it waits for a measurement start instruction (S210). This measurement control (VI) is performed as follows. The direction in which the building board 2 moves toward the limit switch 6 is designated to the transport conveyor driving motor 27 (S212), and the counter is incremented by 1 (S212).
213). Subsequently, the number of pulses to be supplied to the transport conveyor driving motor 27 is increased so that the building board 2 becomes a constant speed before entering the measurement area (S214). Thereafter, after the pulse number reaches a certain value, the pulse number is maintained (S
215). It is determined whether or not the building board 2 has passed the photoelectric switch 4 or 5 (S216). If the building board 2 has passed, the number of pulses supplied to the conveyor driving motor 27 is reduced (S217). The building board 2 is a photoelectric switch 4 or 5
If the pulse does not pass, the pulse number is maintained. Thereafter, when the limit switch 6 or 7 is turned on by the building board 2 (S218), the rotation of the transport conveyor driving motor 27 is stopped (S219), and the transport conveyor driving motor 27 is instructed to reverse the rotation direction (S219). S22
0). While the limit switch 6 or 7 is not turned on, the number of pulses supplied to the motor 27 for driving the conveyor is reduced. In step S221, when the counter value is smaller than m as compared with the number m of the measurement lines set,
That is, in the case of NO, the process is repeated from step S213. In the case of YES, in step S222, it is determined whether or not there is an instruction to end the measurement control from the main controller 20, and if there is an instruction, the power of the conveyor driving motor 27 is turned off (S223). If there is no instruction, wait for the end instruction.

FIGS. 10 and 11 show the control flow of the linear guider controller 30. FIG. First, it is determined whether the system power is on (S300).
Initial settings are made (S301), and if NO, the process waits until the system power is turned on. In step S302,
It is determined whether or not an instruction for measurement standby control has been issued from the main controller 20 (S302). If YES, the upper and lower linear guider driving motors 31 and 32 are turned on (S303), and then measurement standby is performed. The control (VII) is executed (S304). That is, the upper and lower linear guider driving motors 31 and 3
2 to drive the upper and lower linear guiders 12A and 12B to move the upper and lower displacement sensor heads to a reference position, that is, standby positions S1 and S2. This measurement standby control (VII) is controlled as follows. The slider 15 is moved to the reference position S1 with respect to the upper linear guider 12A.
A is instructed to move A (S305). Next, an instruction is given to move the slider 15B to the reference position S2 facing the lower linear guider 12B (S306).
Next, it is determined whether or not the measurement standby is OK (S30).
7) If NO, wait until OK, and if YES, notify main controller 20 of measurement standby OK (S308). Next, in step S309, an instruction to start measurement is awaited from the main controller 20, and when there is an instruction, measurement control (VIII) is performed (S310). In the measurement control (VIII), it is determined whether the building board 2 has been detected based on whether the photoelectric switch 4 or 5 has been turned on (S).
311) If YES, that is, if detected, the counter is incremented by 1 (S312). In case of NO, building board 2
Wait until detecting. When the building board 2 has passed and the photoelectric switch 4 or 5 has been turned off, the determination in step S313 is YES, and the sliders 15A and 15B are moved by a predetermined distance with respect to the upper and lower linear guiders 12A and 12B, and the next measurement line is set. (S314). If NO, the apparatus stands by until the building board 2 passes. Step S31
At 5, when compared with the number m of measurement lines for which the counter value has been set, if it is smaller than m, that is, if NO,
Repeat from step S311. If YES, an instruction to stop motor control is issued (S316). Next, step S
In 317, it is determined whether or not there is an instruction to end the measurement control from the main controller 20.
The power of the motors 31 and 32 is turned off (S318). If there is no instruction, it waits for an instruction to end the measurement control.

FIG. 12 is an explanatory diagram of a method of sampling thickness measurement data. First, assuming that the length of the short side of the building board 2, particularly the handle, is M, a is obtained by dividing M by a predetermined divisor m. The predetermined divisor m is determined according to the state of the unevenness of the handle 39. Assuming that the length of the long side of the building board 2 and particularly the long side of the handle 39 is L and the fraction thereof is ΔL, the number of sampled thickness measurement data is n = (L−ΔL) / a per measurement line. Assuming that the time required to run one sheet is T, the traveling speed Lv of the building board 2 is Lv = L / T [m /
sec], and the sampling time interval ts is ts =
a / (L / T) = aT / L [sec]. The detection positions of the building board 2 by the photoelectric switch 4 and the photoelectric switch 5 are both ends of the handle 39 as shown in FIG. For example, in the line l ₂ in FIG. 12, the time required from the time when the building board 2 is detected by the photoelectric switch 5 to the sampling point S ₂₁ is ΔL longer than when the building board 2 is detected by the photoelectric switch 4. The time is set so as to increase by the time corresponding to. In FIG. 12, F represents the sampling direction, that is, the traveling direction of the building board 2. Further, l ₁ , l ₂ , l ₃ and l ₄ are data sampling lines, that is, building board scanning lines of the displacement sensors 13A and 13B. S ₁₁ . . . S _1n is a sampling point in each building board scanning line.

FIG. 13 shows an example of measurement results of thickness data,
FIG. 9 is a diagram for explaining correction of measurement data.
FIG. 13 (a) shows time on the horizontal axis and thickness on the vertical axis, and shows a sectional view of the building board 2 below. In order to obtain information on the tendency of the thickness change of the building board 2 in the longitudinal direction, for example, the following correction is performed on the thickness measurement data of the female real part 41 and the groove part 42 formed in a predetermined shape. Need to do. First, as an example of correcting the thickness measurement data of the groove, FIG.
As shown in FIG. 3 (b), the measured data is the thickness d _{2 of the} groove 42.
In the case of the vicinity, correction is made so that the groove depth d ₁ becomes ４ or ５. In addition, for the thickness measurement data of the female real part 41, the measured thickness data includes the real part thickness (design value) d ₃
Correction to add the length of.

FIG. 14 shows a subroutine (I) (I) shown in FIG.
It is a figure which shows the control content of I) (III). In the data sampling (I), the sampling column number j of Sij is incremented by one, and a sampling number is assigned by an increment method.
3 (S400). In step S401, the sampling data is stored in an odd-numbered row at the measurement line No. In the data sampling (II), a sampling number is assigned by a decrement method in which the sampling column number j of Sij is decreased by one, and the sampling data is transferred to the memory 23 by a last-in first-out method (S402). In step S403, the sampling data is stored in an even-numbered row at the measurement line No. The data collected in this manner is converted from one-dimensional array data into two-dimensional array data in data reduction (III). This conversion is performed by storing the read data Sij in the column direction as array elements. That is, in step S404, i is set to 1 and j is set to 1, and Sij is read (S40).
5) The read Sij is stored in Tij as an array element in the column direction (S406). In step S407, i is sequentially increased to i + 1 and j is increased to j + 1. In step S408, it is determined whether i = m and j = n, and if YES, the array data is stored (S409). If NO, the process returns to the step of reading Sij.

FIG. 15 is a diagram showing the control contents of the subroutine (IV) shown in FIG. Here, the data sampled is simply arranged and stored. Before that, the groove 42
And the female part 41 is corrected. Here, as an example, when the measurement data is near the thickness d _{2 of the} groove 42, the array element T
Find the elements of _{d 2 + α ≧ Tij ≧ d} 2 -α from the ij, corrected to _{Tij ← d 2 + 3d 1/} 4 (S500),
Correct the groove depth d ₁ to _１ ／. Next, when the measurement data of the female part 41 is in the vicinity of d ₂ , an element of d ₂ + α ≧ Ti 1 ≧ d ₂ −α is searched from the array element Ti 1, and Ti 1 ←
Ti1 + d ₃ to corrected (S501), performs correction by adding the length of the real thickness (design value) d ₃ to the measured thickness data. Spline interpolation is executed for each row of the corrected array element Tij (S502). In step S503, the interpolation data is stored. Thereafter, it is determined whether the stored data is further processed for online thickness measurement management (S
504) If YES, the saved data is processed and saved for online thickness measurement (S505). If NO, this control ends. The mode for measuring the reference thickness of the building board 2 has been described above.

FIG. 16 illustrates a mode in which the thickness of a building board to be inspected is measured online. When measuring the thickness of the building board 2 online, the rotation of the stepping motor is performed so that the measurement sensor moves at a constant speed on a scanning line perpendicular to the running direction with respect to the building board 2 running in the direction of the arrow. When the number and direction are controlled and reciprocated, the building board 2 is running, so that the scanning lines O are zigzag as shown in FIG. The sampling point on the scan line is
It is set to be a point P that intersects the sampling line measured in advance. That is, the displacement sensor heads 10A and 10B are set to move at a speed at which the movement of Y becomes a in the time required for the building board 2 to move X. By comparing the actual measurement value at the sampling point (corrected for the groove 42 and the female real part 41) with the reference value spline-interpolated for the reference building board 2 at the position corresponding to this sampling point, Comprehensive thickness management is performed on the building board 2 having a severe surface pattern. Here, the reference value is obtained in advance as online thickness measurement management data shown in FIG. 15 and stored in a table. The reference value is determined every time the sampling time elapses after determining the time from when the building board 2 is detected by the photoelectric switch 4 to when the first sampling point is reached. In FIG. 16, C is an acceleration section of the displacement sensor heads 10A and 10B, E is a constant velocity section, and D is a deceleration section.

FIG. 17 is a diagram showing a control operation of the main controller 20 showing an example of thickness management. In this thickness management control, the measured value Te of the thickness data at each sampling point is compared with the reference thickness data, and the result is displayed on a display. Here, e is a sampling counter variable and is in the range of e = 0 to p. f is a counter that counts points where the measured thickness is large, g is a counter that counts points where the measured thickness is small, and h is a counter that counts measurement failure points. Further, c represents reference thickness data derived from a measured thickness value of a reference building board, and β represents a control range. More specifically, in step S600, e, f, g, and h are each set to 0. Step S6
01, it is determined whether or not c + β ≧ Te ≧ c−β,
If YES, in step S602, e ← e +
In step S603, it is determined whether or not e ≧ p (p is all sampling numbers). Here YES
If so, the status of the abnormality is displayed on the display based on the counter values of f, g, and h (S604). Step S603
If the answer is NO, the process returns to. If NO in step S601, it is determined whether or not Te> c + β (S605). If YES, the measured value of the thickness is determined to be large, and f ← f + 1 is set (S606), and the process returns to S606. If NO in step S605, it is determined whether or not Te <c−β (S607). If YES, the measured value of the thickness is determined to be small, g ← g + 1 is set (S608), and the process returns to S608.
If NO in step S607, it is determined that the measurement is defective, h ← h + 1 (S609), and the process returns to step S609.

[0023]

As described above, according to the present invention,
Simple equipment for architectural boards with a deeply carved uneven surface that was impossible with conventional thickness measuring devices, uneven surface without any flat parts, and architectural boards with complicated surface shapes such as curved parts The thickness can be automatically measured at high speed. In addition, by properly managing data obtained by online thickness measurement, building boards having a poor thickness can be quickly removed, and productivity can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a side view of a thickness measuring device according to the present invention.

FIG. 2 is a plan view of a thickness measuring device according to the present invention.

3A is a front view of a thickness measuring device according to the present invention, and FIG. 3B is a diagram illustrating a measuring method using the thickness measuring device according to the present invention.

FIG. 4 is a perspective view of a thickness displacement sensor head according to the present invention.

FIG. 5 is a block diagram of the entire control system of the thickness measuring device of the present invention.

FIG. 6 is a control flowchart of the main controller 20.

FIG. 7 is a control flowchart of the main controller 20.

FIG. 8 is a control flow chart of the conveyor controller 26.

FIG. 9 is a control flow chart of the conveyor controller 26.

FIG. 10 is a control flow chart of the linear guider controller 30;

FIG. 11 is a control flow chart of the linear guider controller 30;

FIG. 12 is a diagram illustrating a thickness sampling method by the device of the present invention.

FIG. 13 is a diagram illustrating an example of a measurement result of thickness data.

FIG. 14 is a control flowchart of subroutines (I), (II), and (III) shown in FIG. 7;

FIG. 15 is a control flowchart of a subroutine (IV) shown in FIG. 7;

FIG. 16 is a diagram illustrating scanning lines of a thickness displacement sensor head in online thickness measurement.

FIG. 17 is a control flowchart of the main controller 20 showing thickness management.

[Explanation of symbols]

1 ... Conveyor, 2 ... Building board, 3 ... Thickness measuring unit, 4,5 ...
Photoelectric switch, 6, 7 limit switch, 8 transport roller, 9 guide, 10 thickness displacement sensor head, 11
... engaging member, 12 ... linear guider, 13 ... sensor, 14
... Support part, 15 ... Slider, 16 ... Mounting member, 17
... Amplifier unit, 18 ... Irradiation hole, 19 ... Light receiving hole, 20
... Main controller, 21 ... Timer, 22 ... Counter, 23 ... Memory, 24 ... Keyboard, 25 ... Display, 26 ... Conveyor controller, 27 ... Conveyor drive motor, 30 ... Linear guide controller, 3
1, 32: motor for driving the upper and lower linear guides, 33, 34
... Dedicated controller, 35 ... Driver 1, 36 ... Driver 2

Claims (6)

(57) [Claims] 1. A building board thickness measuring device for measuring the thickness of a building board, comprising: transport means capable of reciprocating the building board in a specific direction within the plane of the building board; and at least one surface of the building board. A thickness measuring sensor provided on the side and measuring the thickness of the building board, and a sensor scanning means for scanning the thickness measuring sensor in a direction intersecting the specific direction, and measuring the thickness of the building board. apparatus. 2. A first mode in which the sensor scanning means moves the thickness measurement sensor for scanning only when turning back and forth in the reciprocating conveyance, and a first mode in which the thickness measurement sensor is continuously conveyed in one direction on the building board. The building thickness measuring apparatus according to claim 1, further comprising a second mode for scanning. 3. A sensor control means for controlling a thickness measurement sensor in synchronization with said transport means so that a thickness measurement start position on an outbound path and a thickness measurement end position on a return path are aligned on a straight line. Item 3. The thickness measuring device for building boards according to Item 1. 4. A result obtained by measuring the thickness of a reference building board at a plurality of locations is processed and used as a reference value, and a result obtained by measuring the thickness of a building board to be inspected at a plurality of locations is processed and used as an actual measurement value. 2. The building board thickness measuring apparatus according to claim 1, further comprising a thickness management unit for comparing the reference value at the corresponding position with the actually measured value to measure the overall thickness of the building board. 5. The building board thickness measuring apparatus according to claim 4, wherein the processing is to increase a value smaller than a predetermined value to a value larger than an original value. 6. The building board thickness measuring apparatus according to claim 4, wherein the processing for the reference value is performed by interpolating between measurement points.