JP2972176B1 - Board inspection equipment - Google Patents

Abstract

An object of the present invention is to provide a board inspection apparatus capable of obtaining an accurate measurement value without removing a probe pin and without disposing a relay. A board inspection apparatus for mounting a device under test 2 such as a printed circuit board and accurately injecting a signal into the device under test 2 with a probe pin 121 to establish a circuit operation condition, wherein the fixture unit is provided. When a plurality of the probe pins 121 are pressed in a direction in which the probe pins 121 are pressed against the device under test 2, of the probe pins 121,
Only the first pin 131, which is most likely to be affected, is pressed against the contact portion 2a of the device under test 2 and further pressurized, so that the second pin 132, which is less affected than the first pin 131, becomes the first pin. 131 can be pressed against the contact portion 2 a of the test object 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board test of a device under test such as an electronic device, for example, a function tester or an in-circuit tester used for a wide range of functional tests of elements and wirings mounted on a printed circuit board. It concerns the device.

[0002]

2. Description of the Related Art In a conventional electronic device manufacturing process,
Various functional tests have been performed to assure the quality of various test objects, such as various printed circuit boards, which constitute the test object. A board inspection apparatus for performing these functional tests mounts a device under test such as a printed circuit board, and presses a probe pin chip against the device under test to accurately inject a signal and establish conditions. (A jig) for the test and various test sections via connecting members to obtain information on whether or not the device under test functions normally as a result.

In such an existing board inspection apparatus, the number of probe pins required for performing a functional test on the probe to be pressed against the test object is mounted on a fixture part (jig).
Generally, when a probe pin is pressed against a flat test object,
All the probe pins are in contact with the contact portion of the test object.

In addition, a plurality of functional tests are performed on one device under test, so that various test probe pins are simultaneously arranged on the same fixture (jig) in advance.

[0005]

However, when testing various test objects, for example, when the impedance of a probe pin at a measurement point is high, an unnecessary probe pin causes an antenna effect, and There is a need for improvements such as the fact that the emitted electromagnetic energy is liable to be disturbed by the emitted electromagnetic energy and the like, and true measurement values are detected incorrectly, so that unnecessary probe pins must be removed.

In some cases, a relay is provided in such a high-impedance circuit so that the above-described problem does not occur. When the stray capacitance is likely to increase or when susceptible to disturbance noise, the probe pins are electrically disconnected. In this case, the correct answer can be obtained and the probe pin does not need to be removed, but it is expensive not only for the relay,
Since the relay lead wire itself is required, there is a new problem that electromagnetic radiation is generated from the lead wire, and an improvement is required also in this respect.

The present invention provides a board inspection apparatus capable of obtaining accurate measured values without removing a probe pin and arranging a relay in order to solve such problems of the conventional technology. It is.

[0008]

In order to solve the above-mentioned problems, a first object of the present invention is to mount a device under test, such as a printed circuit board, and accurately inject a signal into the device under test with probe pins. A board inspection apparatus comprising: a fixture unit for constructing a circuit operation condition; and various test units for outputting a circuit operation result from the device under test, wherein a plurality of the fixture units are provided. When the probe pin is pressed in a direction in which it is pressed against the DUT, the probe pin having the highest impedance among the probe pins
Only the first pin is a high measurement point is pressed against the contact portion of the test object, that is further pressurized, than the first pin Lee
The second pin, which is a low impedance measurement point, can be pressed together with the first pin against the contact portion of the test object.

According to the first aspect of the present invention, it is most preferable that the probe pin is brought into contact with the contact portion of the device under test.
Since only the first pin, which is a high impedance measurement point, has a lower impedance measurement point than the first pin.
A certain second pin realizes an electrically disconnected state despite the absence of a relay. That is, an accurate measurement value can be obtained by contacting only the first pin. Also, the impedance of the second pin
Since the dance is low , there is no need to remove the probe pins, and the number of steps required for the test is reduced.

According to a second aspect of the present invention, in the substrate inspecting apparatus according to the first aspect, the first pin of the probe pins is provided at a position closest to a contact portion of the device under test. The second pin is provided at a position further away from the contact portion than the first pin.

According to the second aspect of the present invention, the first pin or the second pin can be changed only by changing the length of the probe pin.
Since a pin can be selected, only the level of impedance needs to be considered when arranging the fixture part.

According to a third aspect of the present invention, there is provided the board inspection apparatus according to the first or second aspect, wherein the probe pin is configured such that the probe pin moves up and down on the fixture portion and / or the lower pin. It is characterized by being arranged on a board.

According to the third aspect of the present invention, the probe pins may move closer to or away from the device under test due to vertical movement of the upper pin board and / or the lower pin board of the fixture. Therefore, the position of the contact portion of the test object can be easily determined, and the arrangement of the probe pins is easy.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described with reference to FIGS. Reference numeral 1 denotes a substrate inspection apparatus, which is a fixture unit (jig) for mounting a device under test 2 such as a printed circuit board and injecting a signal accurately into the device under test 2 to construct a circuit operating condition. ) 3, a base 4 for holding the fixture unit (jig) 3, and various test units for outputting a circuit operation result from the DUT 2 through a first joint connector 5. And a function board 6.

The functional board 6 is collectively housed in a case 7 supported by the base 4, and the first joint connector 5 is disposed on the front of the case 7.

The first joint connector 5 is made of a rigid joint PCB.

The fixture part (jig) 3 includes a casing 10 formed in three sides on the side and the back side, and the casing 1
0, and a lower pin board 12 of a transparent acrylic plate mounted on the upper part of the housing 10
And a second joint connector 13 arranged on the rear housing 10 and an upper pin board 14 made of a transparent acrylic plate supported by an arm 25 described later.

The operating device 11 includes up / down switches 111 and 112, an emergency stop switch 113 for urgently stopping vertical movement, an enter switch 114 of the operating device 11 itself, an LCD display 115, the up / down switch It comprises a first LED 116 that lights up when the buttons 111 and 112 are pressed, and a second LED 117 that lights up when the enter switch 114 is pressed.

The up / down switches 111 and 112
Turns on the first function in which the upper pin board 14 does not descend to the vicinity of the device under test 2 unless the up / down switches 111 and 112 are pressed together, and turns on one of the up / down switches 111 and 112 for a predetermined time or more. If it is left as it is, it has a second function of not accepting a lowering operation command of the upper pin board 14. The first function is, in other words, the push-down switches 111, 112 are pressed within a predetermined time after pressing one of the up-down switches 111, 112.
If the other is not pressed, the lowering operation command of the upper pin board 14 is not accepted.

To raise the upper pin board 14, one of the up / down switches 111 and 112 may be pressed.

As shown in FIG. 3, the lower pin board 12 has copper foils and leads for testing the device under test 2.
For example, 120
1st probe pin 121 pushing up with force of gram
And a position regulating block 1 for regulating the position of the device under test 2
22 and 123; positioning guide pins 124 which are inserted into the holes 2b of the DUT 2 so that the DUT 2 can freely move up and down and hold the left and right movements;
4 and a guide rod 125 that can be inserted into and removed from a through hole 141 described later.
2 is fixed to the upper surface.

The probe pins 121 are held by the lower pin board 12, but the holding means is appropriate. However, in order not to conduct with the probe pin 121,
The lower pin board 12 is not limited to the acrylic resin as described above, and may be any non-conductive synthetic resin. Of course, bakelite or the like may be used to improve reusability. It is not necessary that the lower pin board 12 be transparent, but if it is transparent, the probe pins 12
There is an advantage that it is possible to visually check whether or not 1 matches the contact portion 2a.

As shown in FIG. 5, a plurality of the probe pins 121 are provided on the lower pin board 12 of the fixture section 3, and the probe pins 121 are pressed against the contact section 2 a of the device under test 2. when composed pressurized in the direction of, among the probe pins 121, most impedance
Only the first pin 131 having a higher measurement point is pressed into contact with the contact portion 2a of the DUT 2 and is further measured to have a lower impedance than the first pin 131. The second pin 132 is pressed together with the first pin 131 against the contact portion 2a of the device under test 2 and further pressed, so that the third pin 133 having lower impedance than the second pin 132 becomes the first and second pins. It can be pressed against the contact portion 2 a of the test object 2 together with 131 and 132.

That is, of the probe pins 121, the first pin 131 is provided at a position closest to the contact portion 2 a of the device under test 2, and the second pin 132 is more than the first pin 131. The third pin 133 is provided at a position separated from the contact portion 2a by the dimension L1, and the third pin 133 is
2 is provided at a position separated from the contact portion 2a by the dimension L2. The dimensions L1 and L2 are both 1 mm.

Therefore, as shown in FIG. 6, when the device under test 2 is pressed downward from the state shown in FIG.
Only one chip 134 is in contact with the contact portion 2a, and both the chip 134 of the second pin 132 and the chip 134 of the third pin 133 are separated from the contact portion 2a and are in an electrically insulated state. is there.

As shown in FIG. 7, when the device under test 2 is further pressed downward from the state shown in FIG.
The tip 134 of the second pin 132 contacts the contact portion 2a, and only the tip 134 of the third pin 133 is separated from the contact portion 2a and is in an electrically insulated state.

The first to third pins 131, 132, 1
33, the tip 134 is the plunger 13 as described above.
The plunger 135 is supported by a barrel 136 so as to be vertically movable, and the tip 134 is lifted upward by a coil spring 138 via a ball 137. This coil spring 138
Is about 120 grams, as described above. Sign 1
Reference numeral 39 denotes a terminal electrically connected to a contact member (not shown).

The second joint connector 13 is fitted to the first joint connector 5 provided on the front surface of the case 7 so that the function board 6 and the control means provided on the operating device 11 are electrically connected. To be joined.

As shown in FIGS. 3 and 4, a holding rod 142 capable of pressing the device under test 2 from above is hung on the upper pin board 14, and the lower surface of the upper pin board 14 is screwed with screws 143. Stick to it.

The upper pin board 14 is held on the lower surface of the arm 25 of the base 4 as described above, but the arm 25 itself of the base 4 is connected to the bracket 24 supported by the case 7 by the lower side. Rod 2 bridged to block 21
3 is supported by an upper block 22 capable of moving up and down with a stroke of about 100 mm, and a reinforcing bracket 26 erected between the upper blocks 22 and 22 is moved up and down by the driving means 8 to move up and down. Movement.

The overhang amount of the arm 25 with respect to the rod 23 is 265 mm.

At the tip of the upper pin board 14 supported by the arm 25, it is assumed that all the loads of the probe pins 121, for example, one probe pin 121 has an upward pressing force of about 120 grams. If ten probe pins 121 are provided on the lower pin board 13, a load of 1.2 kg will be applied, and it is predicted that a maximum of 1000 probe pins 121 will be provided. In order to be able to apply a kilogram load, the upper block 22 has a vertical dimension of 120 millimeters, and the lower block 21 has a vertical dimension of 60 millimeters to withstand.

As shown in FIG. 2, the rightmost function board 6 connected to the work power source 40 is
Although it is an essential function board, the other 11 function boards 6 can be appropriately selected as described above.

Reference numeral 38 in FIG. 2 denotes a connector, which is electrically connected to the function board 6 in which an appropriate test circuit is incorporated. Reference numeral 40 denotes a work power supply, and 41 denotes a system power supply.

As described above, the probe pin 121 is brought into contact with the contact portion 2a of the device under test 2 by the probe
Of the pins 121, the measurement point having the highest impedance
Since only the first pin 131 that, second, third pins 132, 133 despite the state of being cut in the electrical relay is not a low measurement point impedance compared to the first pin 131 Has been realized. That is, the first pin 131
Accurate measurements can be obtained with only contact. Also, the second and third pins 132 and 133 are at measurement points with low impedance.
Since, there is no need to remove the probe pins 121 from the lower pin board 12, so that fewer man-hours required for the test.

By simply changing the length of the probe pin 121, ie, changing the plunger 135 to the plunger 135a and the plunger 135b, the first pin 131, the second pin 132, and the third pin 133 can be selected. When arranging in No. 3, only the influence has to be considered.

The probe pins 121 can move closer to or away from the device under test 2 by moving the upper pin board 14 and / or the lower pin board 12 of the fixture 3 up and down. DUT 2
The position of the contact portion 2a can be easily determined, and the arrangement of the probe pin 121 is easy.

[0038]

According to the first aspect of the present invention, it is most preferable that the probe pin is brought into contact with the contact portion of the test object.
Since there is only the first pin which is a measurement point having a high impedance, a measurement point having a low impedance compared to the first pin
The second pin is has a state of being cut in the electrical realized despite the absence relay. That is, an accurate measurement value can be obtained by contacting only the first pin. In addition, the second pin Inpi
Low dance, no need to remove the probe pin,
The number of man-hours required for the test is reduced.

According to the second aspect of the present invention, the first pin or the second pin can be changed only by changing the length of the probe pin.
Since a pin can be selected, only the level of impedance needs to be considered when arranging the fixture part.

According to the third aspect of the present invention, the probe pins may move closer to or away from the device under test due to vertical movement of the upper pin board and / or the lower pin board of the fixture. Therefore, the position of the contact portion of the test object can be easily determined, and the arrangement of the probe pins is easy.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a board inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a system block diagram of FIG. 1;

FIG. 3 is a schematic view of a fixture part, and is a cross-sectional view of a state before a test object is pressurized.

FIG. 4 is a sectional view showing a state after pressurization in FIG. 3;

FIG. 5 is a schematic diagram showing a relationship between probe pins having different heights and a test object.

FIG. 6 is a schematic diagram showing a state where a contact portion is in contact with only a first pin of FIG. 5;

FIG. 7 is a schematic diagram showing a state where a contact portion is in contact with a first pin and a second pin of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board inspection apparatus 2 Test object, such as a printed circuit board 2a Contact part of a test object 3 Fixture part (jig) 4 Base 5 First joint connector as a connection member 6 Various test parts 7 Case 12 Lower pin Board 14 Upper pin board 121 Probe pin 131 First pin 132 Second pin 133 Third pin

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Toshifumi Tamiya 1-9-15 Kanumadai, Sagamihara-shi, Kanagawa 310 Inside Bren Child Co., Ltd. (56) References Open-ended 58-39574 (JP, U) Kaihei 1-168882 (JP, U) JP-A 4-64784 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01R 31/28 G01R 1/06 G01R 31/02

Claims (3)

(57) [Claims] 1. A fixture for mounting a device under test such as a printed circuit board and accurately injecting a signal into the device under test with a probe pin to establish a circuit operating condition, and a circuit from the device under test. A board inspection apparatus comprising: various test sections that output operation results, wherein a plurality of probe pins provided in the fixture section are pressed in a direction in which the probe pins are pressed against the device under test. , The highest impedance of the probe pins
Only the first pin is measured point is pressed against the contact portion of the test object, that is further pressurized, than the first pin Inpi
A substrate inspection apparatus , wherein a second pin, which is a measurement point having a low dance, can be pressed against a contact portion of a device under test together with a first pin. 2. The substrate inspection apparatus according to claim 1, wherein, of the probe pins, the first pin is provided at a position closest to a contact portion of the device under test, and the second pin is The board inspection apparatus is provided at a position farther from the contact portion than the first pin. 3. The substrate inspection apparatus according to claim 1, wherein the probe pins are disposed on an upper pin board and / or a lower pin board that moves up and down of the fixture unit. A board inspection apparatus characterized by the above-mentioned.