JP2969716B2 - Multilayer ceramic capacitors - Google Patents
Multilayer ceramic capacitorsInfo
- Publication number
- JP2969716B2 JP2969716B2 JP1133390A JP1133390A JP2969716B2 JP 2969716 B2 JP2969716 B2 JP 2969716B2 JP 1133390 A JP1133390 A JP 1133390A JP 1133390 A JP1133390 A JP 1133390A JP 2969716 B2 JP2969716 B2 JP 2969716B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- external electrode
- multilayer ceramic
- alloy layer
- internal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、内部電極と外部電極とに卑金属を用いた積
層セラミックコンデンサに関するものである。Description: TECHNICAL FIELD The present invention relates to a multilayer ceramic capacitor using a base metal for an internal electrode and an external electrode.
従来の技術 今日、積層セラミックコンデンサは、軽薄短小化の要
望を満たすため、ますますその需要が高まっており、ま
たそれに伴い改善すべき技術課題も種々上げられてい
る。2. Description of the Related Art Today, multilayer ceramic capacitors have been increasingly demanded to meet demands for lighter, thinner and smaller devices, and accordingly, there have been various technical problems to be improved.
その改善すべき項目の一つとして、内部電極に使用さ
れるパラジウムなどの材料が高価なため、それを低価格
の材料に置き換え、製品価格を低下させようとの試みが
ある。そして、このような点から、Niを内部電極材料に
使用することが提案されており、一部実施されている。
この内部電極にNiを用いた場合、外部電極材料にもNiな
どの卑金属が用いられている。これは通常用いられるAg
よりなる外部電極では、Niよりなる内部電極との十分な
接合強度が得られないためである。As one of the items to be improved, there is an attempt to reduce the product price by replacing expensive materials such as palladium used for the internal electrodes with low-cost materials. From such a point, it has been proposed to use Ni as an internal electrode material, and some of them have been implemented.
When Ni is used for the internal electrode, a base metal such as Ni is also used for the external electrode material. This is the commonly used Ag
This is because a sufficient bonding strength with an internal electrode made of Ni cannot be obtained with an external electrode made of Ni.
発明が解決しようとする課題 しかし、このように内部電極材料にNiを使用し、外部
電極材料にもNiを用いた構成では、外部電極を900℃電
後で焼付けた場合、Niの融点が1453℃であることから、
外部電極のNiは未焼結となり、外部電極ペースト中にガ
ラスフリットを含有させるだけでは、素体と外部電極と
の接着強度が十分に得られなかった。However, in the configuration in which Ni is used for the internal electrode material and Ni is also used for the external electrode material, when the external electrode is baked after 900 ° C. electrolysis, the melting point of Ni is 1453. ° C,
Ni of the external electrode became unsintered, and merely adding glass frit to the external electrode paste did not provide sufficient adhesive strength between the element body and the external electrode.
本発明はこのような問題点を解決するもので、Niを内
部電極とした素体と外部電極との接着強度を十分にとれ
る構成とした積層セラミックコンデンサを提供すること
を目的とするものである。An object of the present invention is to solve such a problem, and an object of the present invention is to provide a multilayer ceramic capacitor having a structure capable of sufficiently obtaining an adhesive strength between a body having Ni as an internal electrode and an external electrode. .
課題を解決するための手段 この目的を達成するために本発明の積層セラミックコ
ンデンサは、外部電極が、Niよりなる前記内部電極と接
続される第１層がNi−Zn合金層、その上に設けられる第
２層がNi金属層、最外部に位置する第３層がSn−Pb合金
層より構成し、前記第１層のNi−Zn合金層のNi−Zn比率
が重量部にして100:1〜100:50よりなる構成としたもの
である。Means for Solving the Problems To achieve this object, a multilayer ceramic capacitor according to the present invention has an external electrode, a first layer connected to the internal electrode made of Ni, a first layer provided on a Ni-Zn alloy layer, The second layer is composed of a Ni metal layer, the outermost third layer is composed of an Sn-Pb alloy layer, and the Ni-Zn ratio of the first Ni-Zn alloy layer is 100: 1 by weight. 100100: 50.
作用 この構成によれば、所定の焼付温度（後述する900℃
付近）で第１層のNi−Zn合金層の焼付けを行う過程で、
状態図によると、Ni−Zn合金はNi金属に比べ融点が低い
ため焼結しやすく、外部電極が緻蜜になり、内部電極と
外部電極とが合金化しやすくなり、素体と外部電極（Ni
−Zn合金層）との接着強度が強くなる。Action According to this configuration, a predetermined baking temperature (900 ° C.
In the process of baking the first Ni-Zn alloy layer
According to the phase diagram, the Ni-Zn alloy has a lower melting point than Ni metal, so it is easy to sinter, the external electrode becomes fine, the internal electrode and the external electrode are easily alloyed, and the element body and the external electrode (Ni
-Zn alloy layer).
実施例 以下、本発明の一実施例について説明する。Example Hereinafter, an example of the present invention will be described.
まず、Ni100重量部に対して、Zn1〜40重量部となるよ
うにNi金属粉、Zn金属粉を配合し、それにバインダ，溶
剤，ガラスフリットを入れて混合し、Ni−Znペーストを
作製した。次に、このペーストを素体の両端面に塗布
し、乾燥し、900℃中性雰囲気中で焼付けを行った。次
いで、電解メッキ法によりその上にNiメッキを行い、Ni
の金属層を形成し、その後、電解メッキ法によりNi金属
層の上にSn−Pbメッキを行い、Sn−Pb金属層を形成し、
積層セラミックコンデンサとした。First, Ni metal powder and Zn metal powder were blended so as to be 1 to 40 parts by weight of Zn with respect to 100 parts by weight of Ni, and a binder, a solvent, and a glass frit were added and mixed to prepare a Ni-Zn paste. Next, this paste was applied to both end surfaces of the element body, dried, and baked in a neutral atmosphere at 900 ° C. Next, Ni plating is performed thereon by electrolytic plating, and Ni plating is performed.
Forming a metal layer of, after that, Sn-Pb plating is performed on the Ni metal layer by electrolytic plating to form a Sn-Pb metal layer,
This was a multilayer ceramic capacitor.
ここで、前記素体とは、本実施例により得られた積層
セラミックコンデンサを示す第１図に示される通り、誘
電体１とNiよりなる内部電極２とが交互に積層されてな
るものであり、かつ前記内部電極２は相異なる端面のNi
−Zn合金層３に一層おきに接続されている。また、第１
図において４はNi金属層、５はSn−Pb合金層である。Here, as shown in FIG. 1 showing the multilayer ceramic capacitor obtained by the present embodiment, the element body is formed by alternately laminating dielectrics 1 and internal electrodes 2 made of Ni. And the internal electrodes 2 are made of Ni having different end faces.
-Every other layer is connected to the Zn alloy layer 3. Also, the first
In the figure, 4 is a Ni metal layer, and 5 is a Sn-Pb alloy layer.
ここで、本発明において外部電極として、第２層のNi
金属層4,第３層のSn−Pb合金層５を設けている理由は、
従来と同様に半田付け性向上のために第３層のSn−Pb合
金層５を設けており、また第２層のNi金属層４は半田耐
熱性を向上させるために設けられている。Here, in the present invention, the Ni of the second layer is used as the external electrode.
The reason for providing the metal layer 4 and the third Sn—Pb alloy layer 5 is as follows.
As in the conventional case, a third Sn—Pb alloy layer 5 is provided for improving solderability, and a second Ni metal layer 4 is provided for improving solder heat resistance.
次に、素体と外部電極との接着強度を評価するために
実験を行った。ここでは、誘電体１としてBaTiO3系材料
を使用し、有効誘電体層を５層として実験を行った。そ
の結果を下記の第１表に示す。また、測定は外部電極の
第１層にNi金属を用いた従来の積層セラミックコンデン
サと、Ni−Zn合金層を用いた本発明の積層セラミックコ
ンデンサにおける端子引張り強度試験（試料数10個の平
均値）で調べた。もちろん実験は外部電極を構成する第
２層のNi金属層、第３のSn−Pb合金層を設けた状態のも
のである。Next, an experiment was performed to evaluate the adhesive strength between the element body and the external electrode. Here, an experiment was performed using a BaTiO 3 material as the dielectric 1 and five effective dielectric layers. The results are shown in Table 1 below. In addition, the measurement was performed on the terminal tensile strength test (average value of 10 samples) of the conventional multilayer ceramic capacitor using Ni metal for the first layer of the external electrode and the multilayer ceramic capacitor of the present invention using the Ni-Zn alloy layer. ). Of course, the experiment was conducted in a state where the second Ni metal layer and the third Sn-Pb alloy layer constituting the external electrode were provided.
この第１表に示す通り、本実施例のように外部電極の
第１層にNi−Zn合金層を用いた場合、端子引張り強度が
強くなっている。しかし、Ni100重量部に対してZnが55
重量部を超えると、Ni−Zn合金層が酸化し、メッキがつ
かなくなる。 As shown in Table 1, when the Ni-Zn alloy layer was used for the first layer of the external electrode as in the present example, the terminal tensile strength was high. However, Zn is 55
If the amount exceeds the weight part, the Ni-Zn alloy layer is oxidized and plating cannot be performed.
発明の効果 以上のように本発明によれば、Niを内部電極材料に使
用した積層セラミックコンデンサにおける外部電極にNi
に代えてNi−Zn合金層を用いることにより、素体と外部
電極との接着強度が増す効果が得られる。Effect of the Invention As described above, according to the present invention, Ni is used for the external electrode in the multilayer ceramic capacitor using Ni as the internal electrode material.
By using a Ni—Zn alloy layer instead of the above, an effect of increasing the adhesive strength between the element body and the external electrode can be obtained.
第１図は本発明の一実施例による積層セラミックコンデ
ンサを示す断面図である。 １……誘電体、２……内部電極、３……Ni−Zn合金層、
４……Ni金属層、５……Sn−Pb合金層。FIG. 1 is a sectional view showing a multilayer ceramic capacitor according to one embodiment of the present invention. 1 ... dielectric, 2 ... internal electrode, 3 ... Ni-Zn alloy layer,
4 ... Ni metal layer, 5 ... Sn-Pb alloy layer.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01G 4/12 361 H01G 4/30 301 H01G 1/147 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01G 4/12 361 H01G 4/30 301 H01G 1/147
Claims (1)
つ前記内部電極と接続される外部電極を両端面部に有す
る構成を具備し、かつ前記外部電極が、Niよりなる前記
内部電極と接続される第１層がNi−Zn合金層、その上に
設けられる第２層がNi金属層、最外部に位置する第３層
がSn−Pb合金層より構成し、前記第１層のNi−Zn合金層
のNi−Zn比率が重量部にして100:1〜100:50である積層
セラミックコンデンサ。1. A structure in which a dielectric and an internal electrode are alternately laminated, and an external electrode connected to the internal electrode is provided at both end portions, and the external electrode and the internal electrode are made of Ni. The first layer to be connected is composed of a Ni-Zn alloy layer, the second layer provided thereon is composed of a Ni metal layer, the outermost third layer is composed of a Sn-Pb alloy layer, and the first layer is composed of Ni. A multilayer ceramic capacitor in which the Ni-Zn ratio of the Zn alloy layer is 100: 1 to 100: 50 by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133390A JP2969716B2 (en) | 1990-01-19 | 1990-01-19 | Multilayer ceramic capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133390A JP2969716B2 (en) | 1990-01-19 | 1990-01-19 | Multilayer ceramic capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03214715A JPH03214715A (en) | 1991-09-19 |
| JP2969716B2 true JP2969716B2 (en) | 1999-11-02 |
Family
ID=11775107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133390A Expired - Fee Related JP2969716B2 (en) | 1990-01-19 | 1990-01-19 | Multilayer ceramic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2969716B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3363369B2 (en) * | 1998-01-30 | 2003-01-08 | 京セラ株式会社 | Multilayer ceramic capacitors |
-
1990
- 1990-01-19 JP JP1133390A patent/JP2969716B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03214715A (en) | 1991-09-19 |
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