JP2960097B2 - Semiconductor device measurement method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for measuring characteristics of a semiconductor device.

[Conventional technology]

2. Description of the Related Art In recent years, semiconductor devices having various functions and semiconductor devices having characteristics of high accuracy and high performance have been developed with the development of semiconductor technology. In many of these semiconductor devices, adjustment is performed after a semiconductor device manufacturing process is completed for the purpose of operating a desired function or improving characteristics. Adjustment of these semiconductor devices involves measuring the characteristics of the semiconductor device under certain conditions, calculating adjustment values based on the measured data, and setting conditions in the condition setting means provided inside the semiconductor device or in a peripheral circuit. It was done in. When an adjustment value for setting a condition of a semiconductor device is calculated based on a plurality of measurement data measured under a plurality of different conditions, the adjustment value is calculated only when all necessary measurement data are collected. An adjustment value is obtained according to the result, and condition setting is performed. Hereinafter, a conventional measurement method for a semiconductor device in which measurement data under a plurality of conditions is necessary for adjustment will be described with reference to the drawings.

FIG. 2 is a block diagram showing a configuration of a system used for measuring a semiconductor device under a plurality of conditions, which has been conventionally performed. In FIG. 2, 1 is a semiconductor device having an identification number storage unit 11 and a condition setting unit 12, 2 is a measuring device,
3 is an arithmetic unit, 4 is an adjusting device, 5 is a storage device, 6 is an identification number recognition device, and 7 is a control device.

Next, as a method of measuring a semiconductor device having the above configuration, a method of measuring a semiconductor device in which measurement conditions are measured under n kinds of temperature conditions of T1, T2,.

In the measurement condition of T1, an identification number read signal r1 is output from the control device 7 to the identification number recognition device 6, and a measurement start signal e1 is output to the measurement device 2 and the semiconductor device 1. Upon receiving the measurement start signal e1, the semiconductor device 1 starts operating and outputs an output signal O1. When receiving the identification number read signal r1, the identification number recognition device 6 reads the identification number i1 of the semiconductor device 1 stored in the identification number storage means 11 and replaces the identification number i1 with the identification code id1.
And outputs it to the control circuit 7. Upon receiving the measurement start signal e1, the measuring device 2 measures the output signal O1, and generates measurement data d1 based on the output signal O1,
Output to the control device 7. The control device 7 outputs the identification code id1 and the measurement data d1 to the storage device 5, and the storage device 5 outputs the identification code id1 and the measurement data d1.
Are stored in association with each other.

Hereinafter, the same measurement as in the above measurement environment T1 is performed up to the measurement conditions T2, T3,..., Tn-1. At this time, the storage device 5 stores the measurement data d2, d corresponding to the identification code id.
3,... Dn-1 are stored.

Then, in the last measurement condition Tn, the control device 7 outputs an identification number read signal r1 to the identification number recognition device 6, and outputs a measurement start signal e1 to the measurement device 2 and the semiconductor device 1. The semiconductor device 1 outputs an output signal On when receiving the measurement start signal e1. The identification number recognition device 6
Receives the identification number read signal r1, reads the identification number i1 of the semiconductor device 1 stored in the identification number storage means 11, encodes the identification number i1 into an identification code id1, and sends the identification number i1 to the control device 7. Output. Upon receiving the measurement start signal e1, the measuring device 2 measures an output signal On, generates measurement data dn based on the output signal On, and outputs it to the control device 7. When the measurement is completed as described above, the control device 7 outputs the measurement data readout signal s1 and the identification code id1 to the storage device, and the operation start signal c
1 and the measurement data dn are output to the arithmetic unit 3.
When the storage circuit 5 receives the measurement data read signal s1, the measurement data d1, d2,... D corresponding to the identification code id1.
n−1 is output to the arithmetic unit 3. When the arithmetic unit 3 receives the arithmetic start signal c1, it calculates the measurement data d1, d2,... Dn to calculate the condition setting data k1, and outputs it to the adjusting unit 4. The adjustment device 4 generates an adjustment signal b1 based on the condition setting data k1 and outputs it to the condition setting means 12. The condition setting of the semiconductor device 1 is completed when the condition setting means 12 sets the condition by the adjustment signal b1.

[Problems to be solved by the invention]

According to the above-described conventional method, it is possible to determine a setting condition based on measurement data under a plurality of different conditions and adjust the semiconductor device. However, in the above-described conventional method, it is necessary to store the measurement data in the storage device until the measurement of all data is completed. conventionally,
A method of storing measurement data in an external storage device and performing calculation and setting after measurement of all data is completed has been adopted. When such a method is used, a one-to-one correspondence between the semiconductor device to be measured and the measured data is indispensable, and for that purpose, a means must be used so that each semiconductor device can be recognized. Further, the storage device for the measurement data may require a large-scale storage device depending on the amount of the measurement data and the production quantity, and furthermore, the measurement conditions, that is, the measurement environment, the measurement time, the measurement interval, the measurement place, and the like are widely varied. In this case, the load and equipment for maintenance and management of the measurement data increase. An object of the present invention is to provide an efficient method for measuring the characteristics of a semiconductor device by eliminating the above-mentioned disadvantages.

[Means for solving the problem]

A configuration of the present invention for achieving the above object is to measure a semiconductor device having an IC chip under a plurality of different environments such as a temperature change and to calculate the semiconductor device based on operation data calculated from the plurality of measurement data. In the characteristic measurement of the semiconductor device for performing the condition setting and the selection, the semiconductor device is provided with a measurement data storage unit for storing the measurement data, and the calculation data is a plurality of measurement data stored in the measurement data storage unit. It is characterized in that it is used to calculate.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First
FIG. 2 is a block diagram showing the configuration of a system for implementing the method of measuring a semiconductor device according to the present invention. Elements having the same reference numerals as those in FIG. 2 indicate the same elements, and a duplicate description will be omitted.

In FIG. 1, reference numeral 10 denotes a semiconductor device, 13 denotes measured data storage means, and 8 denotes a writing / reading device.

Next, a method for measuring the semiconductor device 10 having the above configuration will be described. As an example, a method of measuring a semiconductor device in which measurement conditions are measured under n kinds of temperature conditions of T1, T2,..., Tn as in the conventional example shown in FIG. Under the measurement condition of T1, the measurement start signal e1 is sent from the control device 7 to the measurement device 2
And output to the semiconductor device 10. The semiconductor device 10 starts operating when receiving the measurement start signal e1, and outputs the output signal O1.
Is output. When receiving the measurement start signal e1, the measurement device 2 measures the output O1, generates measurement data d1 based on the output signal O1, and outputs the measurement data d1 to the control device 7. The control device 7 outputs the measurement data d1 and the data write signal dw1 to the write / read device 8. Upon receiving the data write signal dw1, the writing / reading device 8 writes and stores the measurement data d1 in the measurement data storage means 13. This completes one measurement, and the following measurement conditions T2, T3,
.. Up to Tn−1, the same measurement as in the above measurement condition T1 is performed, and the measurement result is stored in the measurement data storage unit 13. At this time, the measurement data d2, d3,... Dn-1 are written and stored in the measurement data storage means 13.

Finally, under the measurement condition of Tn, the measurement start signal e1 is sent from the control device 7 to the measurement device 2 and the semiconductor device 10.
The semiconductor device 10 outputs an output signal On, and the measuring device 2 generates measurement data dn based on the output signal On and outputs it to the control device 7, thereby completing the measurement. Outputs the data read signal dr1 to the write / read device 8 and the measurement data dn and the operation start signal c1 to the arithmetic device 3 when the measurement is completed. When the write / read device 8 receives the data read signal dr1, the write / read device 8 receives the measurement data d1, d2,.
1 to the arithmetic unit 3, and when the arithmetic unit 3 receives the operation start signal c1, the measurement data d1, d2,.
Calculates and outputs the condition setting data k1 according to. As a result, the adjustment device 4 outputs an adjustment signal b1 based on the adjustment condition setting data k1, and the condition setting of the semiconductor device 10 is completed when the condition setting means 12 sets the condition by the adjustment value b1.

〔The invention's effect〕

As described above, according to the present invention, in the measurement of a semiconductor device under a plurality of conditions, the measurement data under each condition is stored inside the semiconductor device, whereby the measurement data as seen in the conventional example is stored. At the time of holding, there is no need to have a recognition means for establishing a one-to-one correspondence between the measurement data and the semiconductor device, and it is not necessary to provide an identification number storage means and an identification number recognition device for each semiconductor device.
Further, since it is not necessary to store the measurement data under a plurality of conditions in an external storage device until all the measurements are completed, the load for maintenance and management of the measurement data is reduced, and a storage device is provided. Since there is no need, there is no need to change the capacity of the external storage device according to the production quantity. In addition, since each semiconductor device has its own measurement data, there is no possibility that the measurement data is lost when a failure occurs in an external storage device. Therefore, measurement of the semiconductor device can be performed efficiently.

[Brief description of the drawings]

FIG. 2 is a block diagram showing a conventional method for measuring a semiconductor device, and FIG. 1 is a block diagram showing a measuring method according to one embodiment of the present invention. 1, 10 semiconductor device, 2 measurement device, 3 arithmetic device, 4 adjustment device, 5 storage device, 6 identification number recognition device, 7 control device, 8 writing Readout device, 11: identification number storage means, 12: condition setting means, 13: measurement data storage means.

Claims (1)

(57) [Claims] 1. A semiconductor device which measures a semiconductor device having an IC chip under a plurality of different conditions such as a temperature change, and sets and sorts the conditions of the semiconductor device based on data calculated from the plurality of measurement data. In the characteristic measurement, the semiconductor device is provided with measurement data storage means for storing the measurement data, and the operation data is calculated using a plurality of data stored in the measurement data storage means. Semiconductor device measurement method.