JP2957759B2 - Lead frame transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame transfer device for transferring and setting a lead frame in a resin mold.

[0002]

2. Description of the Related Art Generally, in molding a resin-encapsulated semiconductor, a semiconductor element is wire-bonded to a lead frame, and then the wire-bonded lead frame is automatically transferred to a resin mold. Have been done. Hereinafter, a conventional configuration of a lead frame transport device that automatically transports and sets a wire-bonded lead frame to a resin mold will be described with reference to FIGS.

[0005] First, in FIG. 7, the drawing mainly shows a conveying means 1 and a lead frame holding member 2. The transport means 1 includes a holder 3, an actuator 4 for sliding the holder 3 in the left-right direction in FIG. 1 and a lead frame holding member 2 attached to the upper surface of the holder 3.
Actuator 5 for sliding the slider in the vertical direction in FIG.
It is composed of

[0004] The lead frame holding member 2 provided below the holder 3 is composed of a rectangular plate 6 and a plurality of chucks 7 attached to the lower surface thereof. The plate 6 is connected to the actuator 5 and moves up and down along the guide mechanisms 8 with the operation of the actuator 5.

A guide block 9 is provided on the lower surface of the plate 6. These guide blocks 9 are arranged one by one in the middle of each edge of the plate 6, for a total of four (only three are shown in the drawing). As shown in FIGS. 8 and 9, these guide blocks 9 have a plate shape, and a fitting recess 9a is formed in the center of the guide block 9.
It is fastened and fixed to the plate 6 by 0 and 10.

On the other hand, as shown in FIG. 10, the lower mold 11 has four fitting convex pieces 12 respectively fitted into the fitting concave parts 9a of the guide block 9 (only three are shown in the drawing).
Is provided. In this case, a tapered notch 9 is provided on the open side of the fitting concave portion 9a in order to easily fit the two.
As for b, 9b, tapered notches 12a, 12a are also formed at the tip of the fitting convex piece 12.

According to the above configuration, when the actuator 4 is actuated and the plate 6 reaches a position immediately above the lower mold 11 as shown in FIG.
Operates, and the plate 6 moves down along the guide mechanisms 8. Then, as shown in FIG.
The fitting recess 9a and the fitting convex piece 12 are fitted to each other, and the positioning of the lead frame holding member 2 with respect to the lower mold 11 is performed. Then, a positioning hole (not shown) of the lead frame 14 is inserted into a positioning pin 13 provided in the lower die 11, and in this state, when the chuck 7 is opened, the lead frame 14 moves along the positioning pin 13. It slides down and is placed at a predetermined position on the lower mold 11.

[0008]

However, in reality, there is a slight error in the dimensions and assembly accuracy of the guide block 9 and the fitting convex piece 12, and as shown in FIG. In some cases, a deviation H occurs between the fitting convex piece 12 and the fitting convex piece 12. This shift H is caused by heating and
It changes every time cooling is performed, and it is almost impossible to make the deviation H zero. Therefore, conventionally, the fitting concave portion 9a and the fitting convex piece 12 are forcibly fitted against the displacement H. For this reason, when they are fitted together, an impact or vibration is generated, and the bonding wire is deformed or disconnected by the impact or vibration, and the fitting concave portion 9a and the fitting convex piece 12 are worn, and dust is generated. There was a thing. When the dust is generated as described above, the dust is mixed in the resin molding of the lead frame 14 and the quality of the product is deteriorated.

Furthermore, since the fitting concave portion 9a and the fitting convex piece 12 must be fitted against the displacement H, there is a problem that the pressing force of the actuator 5 must be increased.

The present invention has been made in view of the above circumstances, and an object of the present invention is to minimize the occurrence of vibration, impact, and dust when mounting a lead frame on a resin mold, and furthermore, to minimize the occurrence of an actuator. An object of the present invention is to provide a lead frame transport device capable of reducing a pressing force.

[0011]

In order to achieve the above object, a lead frame transport device of the present invention is provided with a lead frame holding member for holding a lead frame, and has an actuator. Providing a transport means for transporting the lead frame holding member to the resin mold, and fitting a first positioning member provided on the lead frame holding member and a second positioning member provided on the resin mold. Wherein the lead frame holding member is positioned with respect to the resin mold, wherein at least one side of the first positioning member and the second positioning member is positioned relative to the other when they are fitted. It is characterized in that it has a configuration having a rolling member that comes into rolling contact.

[0012]

When positioning the lead frame holding member with respect to the resin mold, the first positioning member and the second positioning member are fitted by the actuator of the transfer means. At least one side of the two positioning members has a rolling member, and the two positioning members are fitted by rolling contact. As a result, generation of vibration, impact and dust can be prevented as much as possible, and the pressing force of the actuator can be reduced.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. First, in FIG. 1, the conveying means 21 includes a holder 22, a first actuator 23 fixed to an appropriate portion on a side of the holder 22, and a second actuator 24 attached to an upper surface of the holder 22.
As will be described later, the lead frame holding member 25 is connected to a lower mold 26 which is a part of a resin mold.
To be transported to Here, the rod 23a of the first actuator 23 slides in the left-right direction of FIG. 1, and accordingly, the holder 22 also moves in the left-right direction of FIG. The rod 24a of the second actuator 24 slides in the vertical direction in FIG.

A lead frame holding member 25 is provided below the holder 22. The lead frame holding member 25 includes a rectangular plate 27 and a plurality of chucks 28 attached to the lower surface of the plate 27. These chucks 28 can be opened and closed so as to hold the lead frame 29. Also, the rod 2 of the second actuator 24 is
4a, the lead frame holding member 25 moves up and down along guide mechanisms 30, 30 provided on the upper surface of the holder 22 as the rod 24a slides in the up and down direction. I have.

A first positioning member 31 is provided on a lower surface of the lead frame holding member 25. 2 and 3
As shown in the figure, the first positioning member 31
In the middle of each of the edges in FIG. 7, four in total are provided, one each, and are in a state of facing each other in the left-right direction and the up-down direction in FIG. As shown in FIGS. 4 and 5, the first positioning member 31 is configured such that a short cylindrical roller 33, 33 serving as a rolling member is pin-connected to a U-shaped portion of a U-shaped guide block 32. 34, and is fixed to the plate 27 by screws 35.

As shown in FIG. 1, the lower mold 26, which is a part of the resin mold, is provided with four second positioning members 36 formed in a convex shape (only three are shown). .
Each of the second positioning members 36 is fitted between the rollers 33 and 33 of the first positioning member 31. To facilitate the fitting, a tapered tip portion is provided. Notches 36a, 36a are formed. Then, by fitting these two, the positioning of the lead frame holding member 25 with respect to the lower mold 26 is performed.

A plurality of positioning pins 37 are erected on the lower die 26. By inserting the insertion holes (not shown) of the lead frame 29 into the positioning pins 37, the lead frame 29 falls along the positioning pins 37 and is placed at a regular position on the lower mold 26. Has become.

Next, the operation of the above configuration will be described.
When the semiconductor element is wire-bonded to the lead frame, first, the wire-bonded lead frame 29 is gripped by the chuck 28. Then, the first
Is operated so as to slide the rod 23a to the right, and the holder 22 moves with the second actuator 24 and the lead frame holding member 25.

Then, as shown in FIG. 1, when the lead frame holding member 25 is positioned immediately above the lower mold 26, the second actuator 24 is operated, and
The lead frame holding member 25 moves downward in FIG. 1 along the guide mechanisms 30, 30. Then, as shown in FIG. 6, the notch 36 a of the second positioning member 36 enters between the rollers 33 and 33 of the first positioning member 31, and the first positioning member 31 moves down. The rollers 33, 33 rotate, that is, they are completely fitted by rolling contact. For this reason, even when there is a deviation H between the first positioning member 31 and the second positioning member 36, the frictional resistance at the time of fitting can be minimized.

When the first positioning member 31 and the second positioning member 36 have been fitted, the positioning of the lead frame holding member 25 with respect to the lower mold 26 has been completed.
The positioning holes (not shown) of the lead frame 29 are inserted into the positioning pins 37 provided on the lower die 26. When the chuck 28 is opened in this state, the lead frame 29 slides down along the positioning pins 37 and is placed at a predetermined position on the lower die 26.

According to the above configuration, the following effects can be obtained. That is, the first positioning member 31 has a roller 33 as a rolling member, and when positioning the lead frame holding member 25 with respect to the lower mold 26, the second positioning member 36 is provided between the rollers 33 and 33. The two positioning members 3 are fitted by rolling contact.
Even if there is a deviation H between 1 and 36, the frictional resistance at the time of fitting is reduced, and as a result, generation of vibration, impact and dust can be prevented as much as possible. The pressing force of the second actuator 24 can also be reduced.

In the above embodiment, the first positioning member 31 has a roller 33 as a rolling member.
The second positioning member 36 fitted to this is formed in a convex shape. Conversely, the second positioning member 36 is configured to have a rolling member, and the first positioning member 31 is formed in a convex shape. Is also good.

In the above embodiment, the short cylindrical roller 33 is used as the rolling member. However, the roller 33 may be formed in a spherical shape.

[0024]

As is apparent from the above description, according to the lead frame transfer device of the present invention, the first positioning member provided on the lead frame holding member and the second positioning member provided on the resin mold are provided. The lead frame holding member is positioned with respect to the resin mold by fitting the member with the member.
Since at least one side of the positioning member and the second positioning member has a rolling member that is in rolling contact with the other when they are fitted, even if there is a deviation between the two positioning members, In addition, the resistance at the time of fitting is reduced, and as a result, the generation of vibration, impact and dust can be prevented as much as possible, and the pressing force of the actuator for fitting both positioning members can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a front view showing a transport unit and a lead frame holding member.

FIG. 3 is a bottom view showing the lead frame holding member.

FIG. 4 is an enlarged front view showing a first positioning member.

FIG. 5 is an enlarged side view showing a first positioning member.

FIG. 6 is a front view showing a first positioning member and a second positioning member in a facing state;

FIG. 7 is a front view showing a lead frame holding member in a conventional example.

FIG. 8 is an enlarged front view showing a guide block.

FIG. 9 is an enlarged side view showing a guide block.

FIG. 10 is a front view showing the entire configuration.

FIG. 11 is a diagram corresponding to FIG. 6, showing the guide block and the fitting convex piece in the facing state;

[Explanation of symbols]

In the drawing, 21 is a conveying means, 23 and 24 are actuators, 25 is a lead frame holding member, 26 is a lower mold (resin mold type), 29 is a lead frame, 31 is a first positioning member, and 33 is a roller (rolling). ) And 36 indicate a second positioning member.

Claims (1)

(57) [Claims] 1. A lead frame holding member, comprising: a lead frame holding member for holding a lead frame; and conveying means having an actuator, for conveying the lead frame holding member to a resin mold based on the operation of the actuator. Wherein the positioning of the lead frame holding member with respect to the resin mold is performed by fitting a first positioning member provided on the resin mold with a second positioning member provided on the resin mold. A lead frame transport device, characterized in that at least one side of the first positioning member and the second positioning member has a rolling member that comes into rolling contact with the other when they are fitted.