JP2957405B2 - Electric component and its mounting method - Google Patents
Electric component and its mounting methodInfo
- Publication number
- JP2957405B2 JP2957405B2 JP5349962A JP34996293A JP2957405B2 JP 2957405 B2 JP2957405 B2 JP 2957405B2 JP 5349962 A JP5349962 A JP 5349962A JP 34996293 A JP34996293 A JP 34996293A JP 2957405 B2 JP2957405 B2 JP 2957405B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal member
- board
- substrate
- mounting
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品およびその実
装方法に関し、特に、電気部品がターミナル部材によっ
て実装基板に実装される技術に係り、例えば、自動車の
フラッシャー等に使用される電気部品としての電磁継電
器（以下、リレーという。）を実装基板としてのプリン
ト配線基板（以下、基板という。）に実装するのに利用
して有効なものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component and a method for mounting the same, and more particularly, to a technique for mounting an electric component on a mounting board by a terminal member. The present invention relates to an electromagnetic relay (hereinafter referred to as a relay) which is effective for mounting on a printed wiring board (hereinafter referred to as a board) as a mounting board.
【０００２】[0002]
【従来の技術】従来は、自動車のフラッシャー等に使用
されるリレーが基板に実装される場合には次のような実
装方法が、広く採用されている。すなわち、リレーのベ
ースから外面に直角に突出されたターミナル部材が、基
板に開設された挿通孔に挿通される。この挿通状態で、
基板がフローはんだ槽の上を通され、基板の裏面に形成
されたランドとターミナル部材の挿通側端部の間にフロ
ーはんだ付けが実施される。そして、ターミナル部材と
基板とは、このランドとターミナル部材の先端部との間
に形成されたはんだ盛り部によって、電気的かつ機械的
に接続されて実装されることになる。2. Description of the Related Art Conventionally, when a relay used for a flasher or the like of an automobile is mounted on a board, the following mounting method has been widely adopted. That is, a terminal member projecting perpendicularly to the outer surface from the base of the relay is inserted into the insertion hole formed in the board. In this insertion state,
The substrate is passed over the flow solder bath, and flow soldering is performed between the land formed on the back surface of the substrate and the insertion side end of the terminal member. Then, the terminal member and the board are electrically and mechanically connected and mounted by a solder pile formed between the land and the tip of the terminal member.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前記した従来
の電気部品の実装方法においては、電気部品と基板との
間に熱膨張差があるため、冷熱サイクルに伴って電気部
品のターミナル部材間隔と基板との間の熱膨張差によっ
てはんだ盛り部に機械的ストレスが加わった際に、その
ストレスによってはんだ盛り部にクラックが発生し、電
気的接続機能が損なわれるという問題点がある。However, in the above-described conventional method for mounting an electric component, since there is a difference in thermal expansion between the electric component and the substrate, the distance between the terminal members of the electric component is reduced with the cooling / heating cycle. When a mechanical stress is applied to the solder pile due to a difference in thermal expansion between the substrate and the substrate, a crack occurs in the solder pile due to the stress, and the electrical connection function is impaired.
【０００４】そこで、基板の材料としてガラスエポキシ
樹脂材を使用する対策や、基板に開設されたターミナル
部材挿通孔の内周面にはんだ付け面を形成する（所謂、
スルーホールを形成する）対策、および、挿通孔に鳩目
を付与する対策が、講じられている。しかし、このよう
な対策方法においては、いずれもコストアップが招来さ
れるという問題点がある。[0004] Therefore, measures to use a glass epoxy resin material as a material for the substrate, and forming a soldering surface on the inner peripheral surface of the terminal member insertion hole formed in the substrate (so-called,
A countermeasure for forming a through hole) and a countermeasure for providing an eyelet in the insertion hole are taken. However, such a countermeasure method has a problem that the cost is increased.
【０００５】本発明の目的は、コストアップを回避しつ
つ、はんだ盛り部におけるクラックの発生を防止して電
気的かつ機械的接続機能を確保することができる電気部
品およびその実装方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electric component capable of preventing the occurrence of cracks in a solder pile and securing an electrical and mechanical connection function while avoiding an increase in cost, and a method of mounting the same. It is in.
【０００６】[0006]
【課題を解決するための手段】本発明に係る電気部品
は、実装基板への実装面からターミナル部材が突設され
ており、このターミナル部材が実装基板に電気的に接続
される電気部品において、前記ターミナル部材は先端面
にすり割が切設されているとともに、このすり割の両脇
には前記基板の実装面に係合する基板係合部が形成され
ており、さらに、この基板係合部よりも基端側の位置に
は治具を係合される治具係合部が形成されていることを
特徴とする。The electric component according to the present invention has a terminal member protruding from a mounting surface on a mounting substrate, and the terminal member is electrically connected to the mounting substrate. The terminal member is provided with a slit on the front end surface, and a board engaging portion for engaging with the mounting surface of the board is formed on both sides of the slit. A jig engaging portion for engaging the jig is formed at a position closer to the base end than the portion.
【０００７】[0007]
【作用】前記した手段に係る電気部品が実装基板に実装
されるに際しては、実装基板に開設されているターミナ
ル部材挿通部にターミナル部材が挿通されて、基板係合
部がターミナル部材挿通部の開口縁辺に係合される。ま
た、ターミナル部材の治具係合部に治具が係合される。
この状態で、すり割にかしめ工具が圧入されて外向きに
押し拡げられ、このターミナル部材のすり割の両脇部に
よって形成されたかしめ加工部と基板係合部との間で基
板の挿通部開口縁辺部が挟持される。When the electric component according to the above-described means is mounted on the mounting board, the terminal member is inserted into the terminal member insertion section opened on the mounting board, and the board engaging section is opened by the opening of the terminal member insertion section. The edge is engaged. Also, the jig is engaged with the jig engaging portion of the terminal member.
In this state, the crimping tool is press-fitted into the slit and pushed outward, and the substrate insertion portion is formed between the crimping portion formed by both sides of the slit of the terminal member and the substrate engaging portion. The edge of the opening is clamped.
【０００８】このようにして前記した手段によれば、タ
ーミナル部材を実装基板にかしめ加工部によって機械的
に接続（固定）させることができるため、電気部品と実
装基板との間の熱膨張差に起因するはんだ盛り部におけ
るクラックの発生は、電気部品と実装基板との機械的接
続強度が向上することにより防止されることになる。そ
の結果、電気部品と実装基板との間の熱膨張係数差を無
くすための対策や、ターミナル部材をスルーホールにて
はんだ付けする対策を講ずる必要が無くなるため、コス
トアップを未然に回避することができる。According to the above-described means, the terminal member can be mechanically connected (fixed) to the mounting board by the caulking portion, so that the difference in thermal expansion between the electric component and the mounting board can be reduced. The occurrence of cracks in the solder pile caused by the above is prevented by improving the mechanical connection strength between the electric component and the mounting board. As a result, there is no need to take measures to eliminate the difference in the coefficient of thermal expansion between the electrical component and the mounting board, or to solder the terminal members with through holes, thus avoiding cost increases. it can.
【０００９】[0009]
【実施例】図１（ａ）〜（ｄ）は本発明の一実施例であ
る電気部品の実装方法を示す各工程の拡大部分断面図で
ある。図２は分解斜視図である。1 (a) to 1 (d) are enlarged partial sectional views of respective steps showing a method for mounting an electric component according to an embodiment of the present invention. FIG. 2 is an exploded perspective view.
【００１０】本実施例において、本発明に係る電気部品
は、自動車のフラッシャー等に使用されるリレーとして
構成されている。このリレー１０は電磁コイルや開閉ス
イッチ等のリレー機能部品（図示せず）をパッケージン
グするためのパッケージ１１を備えており、パッケージ
１１はリレー機能部品が搭載されているベース１２と、
ベース１２に搭載されたリレー機能部品を被覆するよう
にベース１２に被せ付けられているカバー１３とにより
構成されている。In the present embodiment, the electric component according to the present invention is configured as a relay used for a flasher or the like of an automobile. The relay 10 includes a package 11 for packaging a relay function component (not shown) such as an electromagnetic coil and an open / close switch. The package 11 includes a base 12 on which the relay function component is mounted,
A cover 13 is provided on the base 12 so as to cover the relay function component mounted on the base 12.
【００１１】ベース１２にはターミナル部材１４が４
本、パッケージ１１の内側から外側へ貫通されて外面に
対して直角にそれぞれ突設されている。各ターミナル部
材１４は互いに同一構造に構成されて略長方形の薄板形
状に形成されており、４本のターミナル部材１４は正方
形の各コーナー部に対応した４箇所において、互いに平
行になるようにそれぞれ配設されている。そして、パッ
ケージ１１の内部において、各ターミナル部材１４には
電磁コイルの端末や開閉スイッチおよびサージ電圧吸収
素子等のリレー機能部品が電気的に接続されている。The base 12 has four terminal members 14.
The package 11 is penetrated from the inside to the outside of the package 11 and protrudes at right angles to the outer surface. The terminal members 14 have the same structure and are formed in a substantially rectangular thin plate shape, and the four terminal members 14 are arranged in parallel with each other at four locations corresponding to the respective corners of the square. Has been established. Then, inside the package 11, terminals of the electromagnetic coil, an open / close switch, and a relay functional component such as a surge voltage absorbing element are electrically connected to each terminal member 14.
【００１２】本実施例において、ターミナル部材１４の
突出側端にはすり割１５が所定の深さに切設されてお
り、すり割１５の先端部には迎え角部１６が左右で一
対、それぞれ左右外側方向に屈曲されて形成されてい
る。また、ターミナル部材１４の左右の両端辺部には基
板係合部１７がすり割１５の底部に対向する高さ位置に
配されて、端辺に直角の肩形状にそれぞれ形成されてい
る。すなわち、ターミナル部材１４の左右方向の幅は基
板係合部１７の位置にて大小に変更されている。さら
に、ターミナル部材１４には治具係合部としての治具挿
通孔１８が、基板係合部１７に対してすり割１５と反対
側の位置に配されて厚さ方向に開設されており、治具挿
通孔１８は後記する保持治具が挿通可能な長方形の孔形
状に形成されている。In this embodiment, a slit 15 is cut at a predetermined depth at the protruding end of the terminal member 14, and a pair of attack angles 16 are provided at the front end of the slit 15 on the left and right sides. It is formed to be bent left and right outward. Further, board engaging portions 17 are arranged on both left and right side edges of the terminal member 14 at a height position facing the bottom of the slit 15, and are formed in shoulder shapes perpendicular to the edges. That is, the width in the left-right direction of the terminal member 14 is changed to be large or small at the position of the board engaging portion 17. Further, a jig insertion hole 18 as a jig engaging portion is provided in the terminal member 14 at a position opposite to the slit 15 with respect to the substrate engaging portion 17 and is opened in the thickness direction. The jig insertion hole 18 is formed in a rectangular hole shape through which a holding jig described later can be inserted.
【００１３】他方、前記構成に係るリレー１０が実装さ
れる基板２０は、絶縁性を有する材料が使用されて所望
の形状および大きさの板体に形成されている。この基板
２０の厚さは、前記ターミナル部材１４における先端か
ら基板係合部１７までの高さよりも薄くなるように設定
されている。基板２０における指定された位置にはター
ミナル部材挿通孔２３が４個、それぞれ４個のターミナ
ル部材１４に対応する位置に配されて、各ターミナル部
材１４を挿通可能なようにターミナル部材１４の横断面
形状よりも若干大きめに開設されている。基板２０にお
ける一方の主面（以下、第１主面とする。）２１には各
ランド２４が、４個のターミナル部材挿通孔２３の開口
縁辺部にこれを取り囲むように配されてそれぞれ形成さ
れている。ランド２４は導電性を有する材料が用いられ
て、スクリーン印刷法やリソグラフィー処理法等の適当
な手段によって形成されている。ランド２４には同様の
手段によって形成された電気配線（図示せず）が電気的
に接続されており、この電気配線によってランド２４は
電源装置等（図示せず）に電気的に接続されるようにな
っている。On the other hand, the substrate 20 on which the relay 10 according to the above configuration is mounted is formed of a plate having a desired shape and size by using an insulating material. The thickness of the substrate 20 is set to be smaller than the height from the tip of the terminal member 14 to the substrate engaging portion 17. Four terminal member insertion holes 23 are arranged at designated positions on the substrate 20, and are disposed at positions corresponding to the four terminal members 14, respectively, and the cross section of the terminal member 14 is inserted so that each terminal member 14 can be inserted. It is slightly larger than the shape. On one main surface (hereinafter, referred to as a first main surface) 21 of the substrate 20, each land 24 is formed on the periphery of the opening of the four terminal member insertion holes 23 so as to surround it. ing. The land 24 is made of a conductive material and is formed by an appropriate means such as a screen printing method or a lithography processing method. Electrical wiring (not shown) formed by similar means is electrically connected to the land 24 so that the land 24 is electrically connected to a power supply device or the like (not shown) by the electrical wiring. It has become.
【００１４】次に、本発明の一実施例であるリレーの実
装方法を、前記構成に係るリレーが前記構成に係る基板
に実装される場合について説明する。Next, a method of mounting a relay according to an embodiment of the present invention will be described for a case where the relay having the above configuration is mounted on a substrate having the above configuration.
【００１５】リレー１０が基板２０に実装されるに際し
て、図１（ａ）に示されているように、基板２０に開設
されている各ターミナル部材挿通孔２３に各ターミナル
部材１４が基板２０の第２主面２２側から挿入され、タ
ーミナル部材１４の基板係合部１７が基板２０の第２主
面２２における挿通孔２３の開口縁辺部に係合される。
この状態において、各ターミナル部材１４の先端部に形
成された迎え角部１６は挿通孔２３から基板２０の第１
主面２１側に突出した状態になっている。When the relay 10 is mounted on the board 20, as shown in FIG. 1A, each terminal member 14 is inserted into each terminal member insertion hole 23 opened in the board 20. The board engaging portion 17 of the terminal member 14 is inserted from the side of the second main surface 22, and is engaged with the edge of the opening of the insertion hole 23 in the second main surface 22 of the substrate 20.
In this state, the angle-of-attack 16 formed at the tip of each terminal member 14 extends from the insertion hole 23 to the first position of the substrate 20.
It is in a state protruding toward the main surface 21 side.
【００１６】また、図１（ａ）に示されているように、
各ターミナル部材１４に開設された治具挿通孔１８には
保持治具３１が直角方向から挿入される。ちなみに、保
持治具３１がターミナル部材１４の治具挿通孔１８に挿
入された後に、ターミナル部材１４を基板２０の挿通孔
２３に挿通させてもよい。Further, as shown in FIG.
A holding jig 31 is inserted into the jig insertion hole 18 formed in each terminal member 14 from a right angle direction. Incidentally, after the holding jig 31 is inserted into the jig insertion hole 18 of the terminal member 14, the terminal member 14 may be inserted into the insertion hole 23 of the substrate 20.
【００１７】次いで、ターミナル部材１４の治具係合孔
１８に保持治具３１が係合された状態で、図１（ｂ）に
示されているように、先端が三角形に形成されたかしめ
工具３２が各ターミナル部材１４のすり割１５に先端側
から圧入されて行く。このとき、すり割１５の先端部に
迎え角部１６が左右に拡開するように形成されているた
め、かしめ工具３２はすり割１５内に確実に迎え入れら
れることになる。また、かしめ工具３２のすり割１５へ
の圧入力はターミナル部材１４を介して保持治具３１に
よって受けられる。すなわち、かしめ工具３２の圧入力
についての反力はターミナル部材１４を介して保持治具
３１に求められる。Next, in a state where the holding jig 31 is engaged with the jig engaging hole 18 of the terminal member 14, as shown in FIG. 32 is pressed into the slit 15 of each terminal member 14 from the front end side. At this time, since the angle-of-attack 16 is formed at the tip of the slit 15 so as to expand left and right, the swaging tool 32 is reliably received in the slit 15. The press input of the swaging tool 32 to the slit 15 is received by the holding jig 31 via the terminal member 14. That is, the reaction force for the press input of the caulking tool 32 is obtained by the holding jig 31 via the terminal member 14.
【００１８】かしめ工具３２がすり割１５に基板２０の
第１主面２１に対向する深さ程度に圧入されると、図１
（ｃ）に示されているように、かしめ工具３２の傾斜面
によってターミナル部材１４のすり割１５の両脇部が左
右方向外側にそれぞれ押し拡げられるため、左右で一対
のかしめ加工部１９が左右対称に形成される。このかし
め加工部１９は左右に押し拡げられるとともに、基板２
０を直角に押す分力を発生するため、かしめ加工部１９
は基板２０をターミナル部材１４の基板係合部１７に押
し付ける状態になる。この状態は、かしめ加工部１９と
基板係合部１７との間で基板２０のターミナル部材挿通
孔２３の開口縁辺部が挟持された状態であるため、ター
ミナル部材１４は基板２０に固定された状態になる。つ
まり、リレー１０は各ターミナル部材１４を介して基板
２０に機械的に接続された状態になる。When the caulking tool 32 is press-fitted into the slit 15 to a depth facing the first main surface 21 of the substrate 20, FIG.
As shown in (c), both sides of the slot 15 of the terminal member 14 are pushed outward in the left-right direction by the inclined surface of the caulking tool 32, so that the pair of caulking portions 19 on the left and right is formed. It is formed symmetrically. The caulking portion 19 is expanded right and left and the substrate 2
In order to generate a component force for pressing 0 at a right angle, the caulking portion 19
Is in a state of pressing the substrate 20 against the substrate engaging portion 17 of the terminal member 14. This state is a state in which the edge of the opening of the terminal member insertion hole 23 of the substrate 20 is sandwiched between the caulking portion 19 and the substrate engaging portion 17, so that the terminal member 14 is fixed to the substrate 20. become. That is, the relay 10 is in a state of being mechanically connected to the substrate 20 via each terminal member 14.
【００１９】その後、かしめ工具３２が各かしめ加工部
１９から離脱され、保持治具３１が各治具挿通孔１８か
ら引き抜かれると、図１（ｄ）に示されているように、
リレー１０は基板２０に各ターミナル部材１４を介して
機械的に接続された実装状態になる。この後に、リレー
１０のターミナル部材１４と基板２０のランド２４とは
フローはんだ付けにより電気的に接続されることにな
る。Thereafter, when the caulking tool 32 is detached from each caulking portion 19 and the holding jig 31 is pulled out from each jig insertion hole 18, as shown in FIG.
The relay 10 is in a mounted state in which it is mechanically connected to the substrate 20 via each terminal member 14. Thereafter, the terminal member 14 of the relay 10 and the land 24 of the board 20 are electrically connected by flow soldering.
【００２０】以上説明してように、本実施例によれば、
リレー１０は基板２０に各ターミナル部材１４を介して
機械的に強固に接続されることになる。このことによ
り、リレー１０と基板２０との間の熱膨張差に起因する
はんだ盛り部におけるクラックの発生は、リレー１０が
基板２０に機械的に強固に接続されていることで防止さ
れるので、電気的接続が損なわれることはない。その結
果、ターミナル部材と実装基板との間の材料相互の熱膨
張係数差を無くすための対策や、ターミナル部材をスル
ーホールによってはんだ付けする対策、および、鳩目に
よってターミナル部材と挿通孔との接続を補強する対策
等を講ずる必要が無くなるため、コストアップを未然に
回避することができる。As described above, according to this embodiment,
The relay 10 is mechanically and firmly connected to the substrate 20 via each terminal member 14. As a result, the occurrence of cracks in the solder pile due to the difference in thermal expansion between the relay 10 and the board 20 is prevented by the mechanically strong connection of the relay 10 to the board 20. The electrical connection is not impaired. As a result, measures to eliminate the difference in thermal expansion coefficient between the materials between the terminal member and the mounting board, measures to solder the terminal member through holes, and connection between the terminal member and the insertion hole by eyelets Since there is no need to take measures to reinforce, it is possible to avoid an increase in cost.
【００２１】なお、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。It is needless to say that the present invention is not limited to the above embodiment, but can be variously modified without departing from the gist thereof.
【００２２】例えば、治具係合部は図３（ａ）、（ｂ）
に示されているように構成してもよい。図３（ａ）に示
されている治具係合部は、円形の挿通孔１８Ａとして構
成されている。図３（ｂ）に示されている治具係合部
は、ターミナル部材１４Ｂの左右両端辺に切設された切
欠部１８Ｂとして構成されており、保持治具３１Ｂが左
右の切欠部１８Ｂ、１８Ｂに左右方向から挿入されて係
合されるようになっている。For example, the jig engaging portion is shown in FIGS.
May be configured as shown in FIG. The jig engaging portion shown in FIG. 3A is configured as a circular insertion hole 18A. The jig engaging portion shown in FIG. 3B is configured as a notch portion 18B cut out at both left and right sides of the terminal member 14B, and the holding jig 31B is formed with the left and right notch portions 18B, 18B. And is engaged from the left and right.
【００２３】すり割１５の入口に形成された迎え角部１
６は省略することができる。Attack angle portion 1 formed at the entrance of slit 15
6 can be omitted.
【００２４】前記実施例ではリレーの場合について説明
したが、本発明はこれに限らず、ターミナル部材によっ
て基板に実装される電気部品およびその実装方法全般に
適用することができる。In the above embodiment, the case of a relay has been described. However, the present invention is not limited to this, and can be applied to electric components mounted on a substrate by terminal members and a general mounting method thereof.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によれば、
コストアップを回避しつつ、はんだ盛り部におけるクラ
ックの発生を防止して電気的かつ機械的接続機能を確保
可能な電気部品およびその実装方法を提供することがで
きる。As described above, according to the present invention,
It is possible to provide an electric component and a method of mounting the same that can prevent the occurrence of cracks in the solder pile portion and secure an electrical and mechanical connection function while avoiding an increase in cost.
【図１】（ａ）〜（ｄ）は本発明の一実施例である電気
部品の実装方法を示す各工程の拡大部分断面図である。FIGS. 1A to 1D are enlarged partial cross-sectional views of respective steps showing a method for mounting an electric component according to an embodiment of the present invention.
【図２】分解斜視図である。FIG. 2 is an exploded perspective view.
【図３】（ａ）、（ｂ）は治具係合部の変形例を示す各
拡大部分正面図である。FIGS. 3A and 3B are enlarged partial front views showing a modification of the jig engaging portion.
１０…リレー（電気部品）、１１…パッケージ、１２…
ベース、１３…カバー、１４…ターミナル部材、１５…
すり割、１６…迎え角部、１７…基板係合部、１８…治
具挿通孔（治具係合部）、１８Ａ…円形の治具挿通孔
（治具係合部）、１８Ｂ…切欠部（治具係合部）、１９
…かしめ加工部、２０…基板（実装基板）、２１…第１
主面、２２…第２主面、２３…ターミナル部材挿通孔
（ターミナル部材挿通部）、２４…ランド、３１…保持
治具、３２…かしめ工具。10 relays (electric parts), 11 packages, 12
Base, 13 ... Cover, 14 ... Terminal member, 15 ...
Slotting, 16: Angle of attack, 17: Board engaging part, 18: Jig insertion hole (Jig engaging part), 18A: Circular jig inserting hole (Jig engaging part), 18B: Notch (Jig engaging portion), 19
... Caulking part, 20 ... Substrate (mounting board), 21 ... First
Main surface, 22: second main surface, 23: terminal member insertion hole (terminal member insertion portion), 24: land, 31: holding jig, 32: caulking tool.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 13/04 Ｈ０５Ｋ 13/04 Ｚ (56)参考文献 実開 昭57−6171（ＪＰ，Ｕ) 実開 昭54−122385（ＪＰ，Ｕ) 実開 平４−127973（ＪＰ，Ｕ) 実開 昭61−176780（ＪＰ，Ｕ) 実開 昭61−157273（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01R 9/16 ────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 6 Identification symbol FI H05K 13/04 H05K 13/04 Z (56) References Japanese Utility Model Showa 57-6171 (JP, U) Japanese Utility Model Showa 54-122385 ( JP, U) JP-A 4-127797 (JP, U) JP-A 61-176780 (JP, U) JP-A 61-157273 (JP, U) (58) Fields investigated (Int. Cl. 6 , (DB name) H01R 9/16
Claims (2)
が突設されており、このターミナル部材が実装基板に電
気的に接続される電気部品において、 前記ターミナル部材は先端面にすり割が切設されている
とともに、このすり割の両脇には前記基板の実装面に係
合する基板係合部が形成されており、さらに、この基板
係合部よりも基端側の位置には治具を係合される治具係
合部が形成されていることを特徴とする電気部品。A terminal member protrudes from a mounting surface on a mounting board, and in an electric component electrically connected to the mounting board, the terminal member is provided with a slit at a tip end surface. A board engaging portion for engaging with the mounting surface of the board is formed on both sides of the slit, and a jig is provided at a position closer to the base end than the board engaging portion. An electric component, wherein a jig engaging portion is formed to be engaged with the electric component.
実装する電気部品の実装方法であって、 前記実装基板に開設されているターミナル部材挿通部に
前記ターミナル部材が挿通されて前記基板係合部がター
ミナル部材挿通部の開口縁辺に係合され、また、ターミ
ナル部材の前記治具係合部に治具が係合され、 次いで、前記すり割にかしめ工具が圧入されて外向きに
押し拡げられ、このターミナル部材のすり割の両脇部に
よって形成されたかしめ加工部と前記基板係合部との間
で前記基板の挿通部開口縁辺部が挟持されることを特徴
とする電気部品の実装方法。2. A method for mounting an electrical component according to claim 1, wherein the electrical component is mounted on a mounting board, wherein the terminal member is inserted through a terminal member insertion portion opened on the mounting board, and the board is mounted on the mounting board. The engaging portion is engaged with the opening edge of the terminal member insertion portion, the jig is engaged with the jig engaging portion of the terminal member, and then a crimping tool is press-fitted into the slit and outwardly. An electric component, wherein the edge portion of the opening of the substrate is sandwiched between the swaged portion formed by both sides of the slit of the terminal member and the substrate engaging portion. How to implement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5349962A JP2957405B2 (en) | 1993-12-28 | 1993-12-28 | Electric component and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5349962A JP2957405B2 (en) | 1993-12-28 | 1993-12-28 | Electric component and its mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07201389A JPH07201389A (en) | 1995-08-04 |
| JP2957405B2 true JP2957405B2 (en) | 1999-10-04 |
Family
ID=18407291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5349962A Expired - Fee Related JP2957405B2 (en) | 1993-12-28 | 1993-12-28 | Electric component and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2957405B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE502005007322D1 (en) * | 2004-06-09 | 2009-07-02 | Andreas Veigel | press-fit |
| JP2008091610A (en) * | 2006-10-02 | 2008-04-17 | Sumitomo Wiring Syst Ltd | Printed-circuit board |
-
1993
- 1993-12-28 JP JP5349962A patent/JP2957405B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07201389A (en) | 1995-08-04 |
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