JP2955807B2 - Surface mount type electronic component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a choke coil, and more particularly to a surface mount type electronic component characterized by an adhesive structure between a base on which an electronic component main body is provided and a case.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventional surface mount type electronic component, for example, a choke coil, has a choke coil body a.
An adhesive d is applied to a joint c of the pedestal b to which is attached, a case e is joined to the pedestal b, and the pedestal b and the case e are adhered at the joint c.

[0003]

The above-described conventional choke coil has an adhesive d when the case e is joined to the base b.
However, the adhesive d protrudes outside the pedestal b and the case e and is unsightly in appearance, and the protruding adhesive d covers the terminal f provided on the pedestal b and becomes dirty. .

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned disadvantages, and has been made in view of the above. It is intended to provide a manufacturing method.

[0005]

According to the present invention, in order to achieve the above object, a case is bonded to a pedestal on which an electronic component main body is provided, and the electronic component main body is housed inside the case.
In a surface mount electronic component having terminals on a pedestal, the case and the pedestal are bonded to each other with an adhesive adhered to the inner wall of the case and the pedestal. The manufacturing method is such that an adhesive is adhered to the inner wall surface of the case, the case is turned upside down after joining the pedestal to the case, the adhesive is dripped down to the pedestal, and the case and the pedestal are adhered by curing. It is characterized by the following. When the case and the pedestal are bonded with an adhesive, not only the case and the pedestal may be bonded with the adhesive, but also the electronic component body may be bonded to the case and the pedestal.
In this case, the adhesive is attached to the upper part of the electronic component body, the case is joined to the pedestal, the adhesive is pressed by the inner wall surface of the case, and the adhesive hangs down to the pedestal and is hardened. In this way, the case, the electronic component body and the pedestal are bonded to each other, or an adhesive is adhered to the inner wall surface of the case, the pedestal is joined to the case, and then the case is turned over and the adhesive is applied to the electronic component. The case, the electronic component body, and the pedestal are bonded to each other by hanging and curing the pedestal through the main body.

When the electronic component body is, for example, an inductance element body, its winding is covered with an adhesive.

[0007]

In the electronic component according to the first aspect, the pedestal and the case are
Since the inner wall surface of the case and the pedestal are bonded with an adhesive, the adhesive does not protrude outside from the joint surface between the pedestal and the case. According to the manufacturing method of the second, fourth and fifth aspects, the adhesive can be easily and easily attached to the inner wall surface and the pedestal of the case, and the case and the pedestal, and the case, the electronic component main body and the pedestal are cured. Glue securely.
According to the electronic component according to the third aspect and the manufacturing method according to the fourth and fifth aspects, the step of attaching the electronic component body to the pedestal and the step of bonding the case and the pedestal are performed simultaneously. The electronic component according to claims 6 and 7 is an inductance element, and since its winding is covered with an adhesive, the reliability of insulation against an allowable current is improved.

[0008]

Embodiments of the present invention will be described below. FIG. 1 (A)
(F) shows an example of an electronic component according to claims 1 and 2 and a method for manufacturing the same.

As shown in FIG. 1A, a rectangular case 1
Are attached to the inner wall surfaces 4 on the four sides thereof, and adhesives 3, 3,... Are respectively attached to the inner walls 2. Then, as shown in FIG. The pedestal 5 to which the coil body 4 is attached is joined with the choke coil body 4 facing down, and FIG.
Invert as shown in (D). The pedestal 5 has a pair of terminals 6 projecting from the opposite edges thereof, and the terminals 6 of the windings 7 of the choke coil body 4 are tangled and soldered 8.

When inverted as shown in FIG. 1D,
The adhesive 3 is applied to the inner wall surface 2 of the case 1 as shown in FIG.
1F, but gradually hangs down to reach the pedestal 5 as shown in FIG.
In the electronic component shown in FIG. 1F, the adhesive 3 does not adhere to the joint surface 9 between the case 1 and the pedestal 5 and does not protrude from the joint surface 9.

FIGS. 2A, 2B and 2C show a third embodiment.
4 and 4 show an example of an electronic component and a method for manufacturing the same.

As shown in FIGS. 2A and 2B, an electronic component main body, for example, a choke coil main body 4 is placed on a pedestal 5,
An appropriate amount of an adhesive 3, such as an epoxy-based, silicon-based, or polyurethane-based adhesive, is attached to the choke coil body 4. Next, the case 1 is joined to the base 5 so as to cover the choke coil main body 4. When bonding the case 1, the adhesive 3 is pressed by the inner wall surface of the case 1 and adheres to the pedestal 5 as shown in FIG. Therefore, the case 1, the choke coil main body 4 and the pedestal 5 are mutually bonded,
The winding 7 of the choke coil body 4 is integrated with the adhesive 3
Covered.

FIGS. 3A to 3D show an example of a method for manufacturing an electronic component according to a fifth aspect.

As shown in FIG. 3 (A), the case 1 is arranged with the opening facing upward, and the adhesive corresponding to the amount of the adhesive 3 shown in FIG. The agent 3 is attached. Next, as shown in FIG. 3 (B), the pedestal 5 is put into the case 1 with the temporarily fixed choke coil main body 4 facing down and joined to the case 1, and FIG. 3 (C) to FIG. 3 (D). Invert as shown. Therefore, the adhesive 3 attached to the case 1 hangs down and attaches to the choke coil main body 4 and the pedestal 5 as shown in FIG. At this time, the winding 7 of the choke coil main body 4 is covered with the adhesive 3.

FIG. 4 shows an example of an electronic component applied to a choke coil.

In FIG. 1, the choke coil main body 4 is
The winding 7 is wound around a ring core 10, and is temporarily fixed to the pedestal 5 by fitting the ring core 10 to a core positioning shaft 11 protruding from the center of the pedestal 5. A choke coil is produced by the manufacturing method shown in FIG. 2 or FIG.

[0017]

According to the electronic component and the method of manufacturing the same according to the first and second aspects, the adhesive for bonding the case and the pedestal provided with the electronic component main body does not protrude to the outside and becomes unsightly in appearance. The terminal provided on the pedestal has the effect of preventing the occurrence of poor conduction due to the adhesion of the adhesive. Claims 3 to 5
According to the described electrical component and its manufacturing method, in addition to the above-described effects, the process of attaching the electrical component to the pedestal and the process of bonding the case and the pedestal are performed simultaneously, thereby reducing man-hours.
This has the effect of reducing costs. According to the electronic component and the manufacturing method thereof according to claims 6 and 7, since the winding of the inductance element body is further covered with the adhesive,
This has the effect of improving the reliability of insulation against the allowable current.

[Brief description of the drawings]

1 (F) is a partially cutaway front view of an example of the electronic component according to the first embodiment, and FIGS. 1 (A) to 1 (E) are perspective views and front views showing steps of an example of the manufacturing method according to the second embodiment. Figure and partially cut front view

2 (C) is a partially cutaway front view of an example of an electronic component according to claims 3 and 6, and FIGS. 2 (A) and 2 (B) are a plan view and a front view showing steps of an example of a manufacturing method according to claim 4. FIG. Figure

FIGS. 3A to 3D are perspective views and front views showing steps of an example of the manufacturing method according to claim 5;

FIG. 4 is a partially cutaway front view of an example of an electronic component manufactured by the manufacturing method according to claim 4;

FIG. 5C is a perspective view of a conventional electronic component, and FIG.
(B) is a plan view of the base and a front view showing the process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 2 Inner wall surface 3 Adhesive 4 Choke coil main body 5 Pedestal 6 Terminal 7 Winding 9 Joining surface

Claims (7)

(57) [Claims] 1. A surface-mount type electronic component having a case attached to a pedestal on which an electronic component main body is provided and containing the electronic component main body inside the case and having terminals on the pedestal, wherein the case and the pedestal are connected to the inner wall of the case. A surface-mounted electronic component, wherein the surface-mounted electronic component is adhered to the pedestal with an adhesive. 2. A method for manufacturing a surface mount electronic component comprising a case bonded to a pedestal on which an electronic component main body is provided, the electronic component main body accommodated inside the case, and a terminal on the pedestal. A surface-mounted electronic device, wherein an adhesive is attached to the case, and the pedestal is joined to the case, and then the case is turned upside down, the adhesive is dripped down to the pedestal, and the case and the pedestal are adhered by curing. The method of manufacturing the part. 3. A surface mount electronic component having a case attached to a pedestal provided with an electronic component main body and housing the electronic component main body inside the case and having terminals on the pedestal. A surface-mounted electronic component, wherein a case, an electronic component main body, and a pedestal are mutually bonded by an adhesive continuously attached to the main body and the pedestal. 4. A method of manufacturing a surface mount electronic component comprising a case attached to a pedestal on which an electronic component main body is provided, the electronic component main body being housed inside the case, and having a terminal on the pedestal. Adhesive is attached to the upper part, the case is joined to the pedestal, the adhesive is pressed by the inner wall surface of the case, the adhesive hangs down to the pedestal, and the case is hardened,
A method of manufacturing a surface mount electronic component, wherein an electronic component main body and a base are bonded to each other. 5. A method for manufacturing a surface-mount type electronic component, comprising a case adhered to a pedestal on which an electronic component main body is provided, an electronic component main body housed inside the case, and a terminal on the pedestal, wherein the inner wall surface of the case is provided. Adhesive is attached to the case, the pedestal is joined to the case, the case is turned upside down, the adhesive is dripped down to the pedestal via the electronic component main body, and the case, the electronic component main body and the pedestal are mutually bonded. A method for manufacturing an electronic component, comprising: 6. The surface-mounted electronic component according to claim 3, wherein the electronic component body is an inductance element body, and the adhesive covers a winding of the inductance element body. 7. The method according to claim 4, wherein the electronic component body is an inductance element, and the adhesive covers a winding of the inductance element.