JP2946930B2 - Heat sink cooling fin with excellent heat dissipation characteristics and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for a single-chip or multi-chip module, for example, a multi-chip module in which a plurality of heat-generating chips such as large-scale integrated circuits (LSIs) are brought close together and sealed together. The present invention relates to a heat sink cooling fin used for cooling MCM) and a method of manufacturing the same.

[0002]

2. Description of the Related Art In response to a rapid increase in the amount of information processing and a demand for faster information processing, electronic components such as ICs and LSIs have been increasingly integrated by miniaturizing electronic circuits in a chip. The use of multi-chip modules (MCMs), which enclose a plurality of highly integrated chips in close proximity and collectively, is rapidly increasing.

FIG. 1 (a) is a schematic perspective view of the multi-chip module before sealing, and FIG. 1 (b) is a cross-sectional view after sealing.
As shown in FIG. 1 (c), a plurality of LSI chips 12 are mounted on a multilayer ceramic circuit board (MLS) 11 and a cap 1 is mounted.
3 is hermetically sealed to form a multi-chip module package 15 and input / output pins 14 are used to input and output electric signals.

Since a plurality of chips 12 each having a high degree of integration are mounted, both the heat generation density and the heat generation are the same as those of a conventional single IC.
Since the number of chips has increased dramatically compared with that of packages and the like, it is necessary to cool each chip so as to keep the temperature below the allowable temperature in order to secure the circuit operation speed and improve the reliability. Therefore, in order to efficiently dissipate the heat generated from the chip 12 to the outside, as shown in FIG. 1C, a structure in which a heat sink 16 is attached to a multi-chip module package 15 has been devised. (Hakuhodo Shuppan, '87, edited by The Japan Society of Mechanical Engineers, Electronic Equipment Cooling Technology, pp. 30-32). A cooling working fluid is forcibly supplied to the heat sink 16 to cool it.

The cap 13 and the chip 12 are made of materials having the same linear expansion coefficients. The chip 12 die-bonded to the cap 13 transfers the heat generated from the die bonding material 17 to the cap 13 and the heat sink 16. Through the heat transfer of the heat sink 16 and through the heat transfer from the heat sink 16 to the working fluid.

Conventionally, as this cooling method, forced air cooling, in which air is forcedly supplied as a working fluid to a heat sink, has been frequently used because the structure of the cooling device is simple and easy. As a shape of the heat sink used for the forced air cooling, as shown in a perspective view in FIG. 2A, a channel fin type heat sink 23 having a parallel plate type heat radiating fin 22 (hereinafter referred to as a heat radiating plate) on a bottom plate 21 is used. Alternatively, as shown in FIG. 2B, a pin fin type heat sink 25 in which pin type fins 24 (hereinafter referred to as heat radiation pins) are arranged on a bottom plate 21 is representative. In the drawing, white arrows indicate the flow of air as a working fluid.

In order to cope with the cooling of a heating element having a large heat value and a large heat density such as a multi-chip module by using these conventional heat sinks, it is necessary to increase the heat radiating area of the heat sink and the air flow rate passing through the heat sink. It is necessary to improve the heat radiation ability by increasing the heat dissipation. Therefore, in order to increase the heat radiation area with the same exclusive volume without increasing the size of the heat sink, the fin pitch and the fin interval must be reduced.

However, the conventional method of manufacturing a heat sink is a method using extrusion, cutting, die casting, or the like, and it is difficult to obtain a necessary heat radiation area by such a method.

Further, in the conventional cooling method, FIG.
As shown in (a), cooling is performed by supplying air as a working fluid to the heat sink in a direction parallel to the bottom plate 21 or in a direction perpendicular to the bottom plate 21 as shown in FIG. 2 (b). Therefore, simply reducing the fin pitch and the fin spacing causes an increase in flow path pressure loss due to frictional resistance of the radiator plate or radiator pin, and most of the supplied air flows bypassing the heat sinks 23 and 25, No longer contributes to cooling. In addition, if an attempt is made to increase the flow rate of air passing through the heat sink, the flow path pressure loss due to frictional resistance increases almost in proportion to the second to third powers of the flow velocity, so that a large-output blower having a sufficient blowing capacity is required. This causes problems of space and noise. From the above, it is very difficult to cool the multi-chip module below the allowable temperature by a conventional cooling method using a heat sink.

[0010]

SUMMARY OF THE INVENTION The main object of the present invention is to supply a working fluid for cooling to the inlet of a heat sink passage and to contribute to cooling when cooling a multi-chip module having a large heat generation density and a large amount of heat generation. An object of the present invention is to provide a heat sink cooling fin and a method for manufacturing the same, which are capable of exhibiting epoch-making heat radiation performance by recovering a heated working fluid near a heat sink flow path outlet.

A further object of the present invention is to divert a working fluid due to a pressure loss caused by frictional resistance in a flow path despite having a much larger heat dissipation area than conventional channel fins and pin fins having the same occupied volume. In addition, the fluid used for cooling is not heated in other parts of the heat sink, and does not stagnate in the vicinity of the flow path of the heat sink, thereby enabling efficient cooling. An object of the present invention is to provide a cooling fin and a manufacturing method thereof.

More specifically, an object of the present invention is that when used under forced air cooling, it is several to several tens times more than conventional channel fin heat sinks and pin fin heat sinks used under the same forced air cooling. An object of the present invention is to provide a heat sink cooling fin having extremely high heat dissipation performance and a method for manufacturing the same.

[0013]

In order to solve the above-mentioned problem, the present inventors have provided one kind of hollow portion in the center of a fin row composed of a plurality of unit fin elements, that is, a heat radiating plate and a heat radiating pin. The inventors have found that it is effective to arrange a plurality of such fin rows or to arrange them in a staggered or at random manner, and have completed the present invention.

Here, the gist of the present invention resides in that a bottom plate and a hollow body formed upright on the bottom plate and integral with the bottom plate are formed. The heat sink cooling fins are formed of a fin row composed of a plurality of parallel plate fins or pin fins standing upright on the bottom plate.

[0015] Also, from the other side, a bottom plate and a hollow projecting shape formed upright on the bottom plate and integral with the bottom plate are formed, and the peripheral wall of the hollow projecting shape is placed on the bottom plate. A heat sink cooling fin formed of a fin row composed of a plurality of upstanding parallel plate fins or pin fins, and supplying or sucking a working fluid from a hollow portion of the hollow projecting body.

Further, from the other side, a bottom plate, a hollow body formed upright on the bottom plate and integral with the bottom plate, and a part of the bottom plate provided around the hollow body. A peripheral wall of the hollow projection-shaped body is formed from a fin row composed of a plurality of parallel plate-type fins or pin-shaped fins standing upright on the bottom plate. A heat sink cooling fin characterized in that a working fluid is supplied or sucked from a hollow portion and a working fluid is sucked or supplied from the non-projecting portion which is an outer peripheral portion of the fin row.

Further, according to the present invention, there is provided a material having a bottom plate and a hollow projecting shape formed integrally with the bottom plate and standing upright on the bottom plate, and stretching the projecting shape at the same pitch as a required fin pitch. The wire row is provided, and the wire row and the material are pressed in a state where a working fluid containing abrasive grains is interposed between the wire row and the material, and the material is ground by the grinding action of the abrasive grains. Forming a parallel groove row or a parallel pin row having a predetermined depth and width on the hollow protrusion-shaped body. The heat sink cooling fins may be configured by arranging a plurality of sets of the plurality of fin rows separated from each other.

In yet another aspect, the present invention provides a bottom plate,
A material having a plurality of hollow protrusions formed integrally with the bottom plate, standing upright on the bottom plate, is prepared, and a wire row stretched over the protrusions at the same pitch as the required fin pitch is provided. At the same time, the wire row and the material are pressed in a state in which a working fluid containing abrasive grains is interposed between the wire row and the material, and the material is pressed into the hollow projection shape by the grinding action of the abrasive grains. A method of manufacturing a heat sink cooling fin, comprising forming a parallel groove row or a parallel pin row having a predetermined depth and width.

According to a preferred aspect of the present invention, there is provided a raw material having a bottom plate and a plurality of aligned or staggered hollow protrusions formed on the bottom plate and integral with the bottom plate, When the protrusion-shaped body is subjected to abrasive grinding with a wire saw, the wire may be detoured at a non-projection portion.

[0020]

Next, the present invention will be described in more detail with reference to the accompanying drawings. 3 (a), (b) and (c) show an example of a heat sink cooling fin according to the present invention by a plan view, a side view and a sectional view, respectively. FIG. 4 is an enlarged view of a portion B in FIG.

The illustrated heat sink 35 has a bottom plate 31 made of a good heat conductor, a hollow region 32 thereon, that is, an upright hollow protruding body 36 having a hollow portion, and a hollow region surrounding the hollow region 32. And a radiating fin row 34 made of a good conductor of heat standing upright on the bottom plate 31 forming the protruding body 36. The radiating fin row 34 is composed of a plurality of unit fin elements 33 (a radiating plate in the illustrated example). A plurality of sets of radiating fin rows 34 are arranged on the bottom plate 31 (in this case, 6 ×
6 = 36 sets).

In this heat sink 35, the bottom plate dimension W
× L × T, fin height H, the cross-sectional dimensions 1 ₁ × 1 ₂ on the bottom plate surface of the hollow region, the dimensions a ₁ × a ₂ fin column spacing c ₁ of the fin rows between, c _2, the heat radiating plate thickness t and the heat sink pitch p can be set as appropriate. FIG. 4 is a view for explaining an example of a forced air cooling method using the heat sink according to the present invention using the heat sink shown in FIG. 3, wherein FIG. FIG. 3 is a sectional view taken along line BB, and FIG.

In the illustrated embodiment, a top plate 41 is attached to the heat sink 35, and the top plate 41 is provided with an opening at a position corresponding to a hollow portion of the radiating fin row.
As a result, the top plate is mounted on the upper surface of the heat radiating plate in close contact with the heat radiating plate so as to form a rectangular cross-sectional flow path together with the bottom plate 31 and the heat radiating fin row 34. The heat generated from the chip, which is a heating element, is transmitted by heat conduction to the radiation fin row 34 through the bottom plate 31 of the heat sink. On the other hand, cold air for cooling is supplied to the hollow region 32 of the fin row from the opening 42 in the center of the top plate, and thereafter, flows through the rectangular cross-section channel surrounded by the bottom plate 31, the radiation fin row 34, and the top plate 41. While passing, heat is taken from the radiating fin row 34. The air thus deprived of heat and heated is sucked and collected from the non-projecting portions around the radiation fin row 34.

In this method, cooling air is supplied to the periphery of the radiating fin row 34, and the air is sucked through the opening 42 at the center of the top plate.
The flow direction of the cooling air may be reversed for recovery. In the present invention, the case where the working fluid is supplied or sucked from the hollow portion of the hollow protrusion-shaped body and the working fluid is sucked or supplied from the outer peripheral portion of the fin row, that is, the non-projection portion has been described as an example. The same effect as described above can be obtained simply by supplying or sucking the working fluid from the hollow portion of the shape.

FIG. 10 to be described later shows an example thereof.
(A) is a sectional view taken along line AA, FIG. 10 (B) is a sectional view taken along line BB,
FIG. 10C is a cross-sectional view taken along the line CC, and FIG.
It is an enlarged view of D part of (b). Heat sink shown in Figure 10
103 shows a resin top plate 10 as a heat insulating material as shown in FIG.
4 was attached. The radiating fin rows 101 provided on the bottom plate 102 are arranged in a line, and air as a working fluid is sucked from the hollow portion, that is, the opening of the top plate 104 provided at a position corresponding to the hollow region 105. You.

Similarly, FIG. 11, which will be described later, shows a case where air is supplied from the hollow region 115 and air is sucked from a non-projecting portion around the radiation fin row 111. FIG.
FIG. 11 (b) is a sectional view taken along line BB, and FIG.
FIG. 11 (d) is an enlarged view of a portion D in FIG. 11 (b).

As described above, according to the present invention, the cooling effect of the radiating fin array can be made uniform and efficient by sucking and supplying the working fluid from the hollow region of the hollow projecting body. Further, if the working fluid is a liquid, it is natural that a further effect is obtained.

The radiating fin row of the heat sink is not limited to a specific form, and as shown in FIG. 5A, the radiating fin row standing upright on the bottom plate 31 in two directions around the hollow region 51.
52, as shown in Fig. 5 (b), hollow area
A radiating fin row 54 standing upright on the bottom plate 31 around the bottom plate 31, a radiating fin row 56 standing upright on the bottom plate 31 around the hollow area 55 as shown in FIG. As shown in FIG. 5 (d), even when a heat radiation pin array 58 that stands upright on the bottom plate 31 is arranged around the hollow area 57,
It is possible to apply the cooling method according to the invention on the same principle. Also in this case, it is desirable that the bottom plate, the radiating fin row, and the radiating pin row are good conductors of heat.

According to the structure of the present invention, all of the supplied cooling air uniformly flows into the plurality of flow paths in the heat sink formed by the bottom plate, the radiating fin array, and the top plate.
Since the cooling air passes through, the cooling air does not flow around the outside of the heat sink unlike the conventional cooling method, and efficient cooling can be performed with a small air flow rate. For this reason,
Unlike the conventional case, the fin pitch and the fin interval are reduced in order to increase the heat radiation area of the heat sink. Next, a method for manufacturing a heat sink cooling fin according to the present invention will be described.

FIG. 6 is a perspective view showing, as an example of a starting material for manufacturing the heat sink cooling fins according to the present invention, a workpiece which is a starting material of the heat sink shown in FIG.

This work piece has a cross section (1 ₁ × 1 ₂ ) and a plane size (a) of the bottom 31 having the same dimensions (W × L × T) as the heat sink shown in FIG. ₁ x a
₂ ) It is composed of a plurality of protrusions 61 having a mouth-shaped horizontal cross section and having a height H and made of a material having a high thermal conductivity such as copper or an aluminum alloy. Distance c _1, c ₂ of each projection 61 is identical to the spacing c _1, c ₂ of the fin rows between the aforementioned.

The workpiece itself may be formed, for example, by cold forging a plate having a plane dimension W × L and a thickness greater than T and smaller than T + H, or a plane dimension W × L and a thickness T
+ H plate is removed by machining, EDM, etc.
Furthermore plane dimension W × L, cross-sectional dimensions on the bottom plate surface of the hollow region in the plate thickness is T ₍₁ 1 × 1 ₂₎ and the planar dimensions (a ₁
× a ₂ ) is formed by a method of attaching a frame material of height H having a mouth-shaped horizontal cross section by brazing or the like.

7A and 7B illustrate a method of manufacturing the heat sink shown in FIG. 3. FIG. 7A is a schematic perspective view of a wire saw processing portion, and FIG. 7B is a front view thereof. The wire 70, which is, for example, a piano wire, sent from a wire feeding device (not shown) from the left hand direction in the drawing, has groove rollers 72a,
The wire is wound around the wires 72b, 72c, 72d to form a wire row 71 having a predetermined pitch and width. At this time, the wire row 71a that comes into contact with the projection of the workpiece 74 and is involved in the processing is 4
Around the groove rollers 72a, 72b, 72c, 72d,
The wire row 71b not involved in the processing includes three groove rollers 72.
It is desirable that only the a, 72b, and 72d go around in a triangular shape to bypass the non-projecting portion. This prevents the wire row of the non-working part from hitting each radiating pin element formed by vibration etc. and falling down or cutting the bottom plate, and the abrasive particles and foreign matter in the working fluid are brought in between the groove roller and the wire and This is to prevent the occurrence of derailment and disconnection.

From this, it is apparent that a wire row which is not involved in the processing may be circulated only by the two groove rollers 72a and 72b. As described above, the three groove rollers are used in order to reduce the force as much as possible.
It is desirable to go around 72a, 72b and 72d.

The wire wound around the groove roller to form a wire row in this manner is wound rightward as viewed in the drawing by a wire winding device (not shown). At least one of the four groove rollers 72a, 72b, 72c, 72d is rotationally driven to move the wire array in one direction. A workpiece 74 mounted on the mounting table 73 and fixed so that two sides of the wire are parallel to the traveling row of wires is pressed together with the mounting table by lifting the same, and By supplying the working fluid 76 containing abrasive grains from the nozzle 75, only the portion of the workpiece to which the wire row of projections is pressed by the grinding action of the abrasive grains is scraped off.

More specifically, the concrete processing operation of the heat dissipating fin row composed of the heat dissipating plate or the heat dissipating pins will be further described. First, taking the heat sink of the embodiment shown in FIG. 3 as an example, as shown in FIG. After the mounting table is raised by a predetermined height H of the radiating fin row from a position where the wire row starts to contact with the above-described wire row, a plurality of groove rows are formed on two opposing sides of the hollow projection-shaped body. Is temporarily separated from the wire row, and the work piece 83 is pressed against the wire row 82 in the direction where the groove row 81 and the wire row 82 are orthogonal to each other and ground in the same manner to form a fin row including a plurality of heat sinks. You.

As shown in FIGS. 9 (a) and 9 (b), the wire 91a, 91b
Are set in two directions perpendicular to each other, and the workpiece 92
It is possible to form the hollow protrusion 93 into a required fin row by the same principle. At this time, the orthogonal wire rows 91a and 91
Since b cannot be set at the same height, the depth of the groove to be cut slightly differs in the two orthogonal directions, but the difference is at most about the wire diameter, so there is no practical problem.

In the present invention, the case has been described where the fin rows are arranged at predetermined intervals on the bottom plate. However, it is needless to say that the fin rows can be arranged in a staggered or even at random manner. . In addition, it cannot be overemphasized that the size of each hollow protrusion-shaped body may be different. Next, the operation of the present invention will be described more specifically with reference to examples.

[0039]

[Embodiment 1] As shown in FIG. 3, there are 36 radiating fin rows 34 made of pure aluminum arranged on a bottom plate 31 in an array of 6.times.6 = 36. W = 100 mm, a
_{1 = a 2 = 10.0mm, c} 1 = c 2 = 7.0 mm, 1 1 = 1 2 =
5.05mm, T = 2.0mm, H = 10.0mm, p = 0.4mm, t = 0.
Using a cooling device in which a resin top plate 41 as a heat insulating material was attached to a heat sink 35 having a size of 15 mm as shown in FIG. 4, a sheet-like heater was attached to the back surface of the heat sink, and a cooling performance test was performed. At this time, the cooling air is supplied to the hollow portion of each fin row as shown in FIG. 4 and is sucked from the non-projecting portion on the outer peripheral portion of each fin row.

When the calorific value and the air flow rate were changed at a cooling air inlet temperature of 25 ° C., the calorific value was 180 W, and the cooling air flow rate was
Under the conditions of 6000 cc / sec (cooling air flow rate supplied per set of fins is 165 cc / sec, and the flow velocity in the flow path between the heat sink cooling fins is 1.5 m / sec), the pressure loss at the heat sink is about 1080 Pa, The resistance value showed a cooling performance of about 0.3K / W.

This makes it possible to cool down to 1.8 W / cm ² in terms of heat generation density. In the conventional forced air cooling, the heat generation amount of a package alone is about 15 W at the maximum, and the heat generation density is about 1 W at the maximum.
Considering that / cm ² was the limit at which cooling was possible, it can be seen that it exhibited an epoch-making cooling performance.

[Embodiment 2] As shown in FIG. 10, a radiating fin array 101 made of aluminum alloy is provided on a bottom plate 102 with 4 × 4 = 16.
It is arranged in a set alignment, and the size of each part is L = 60m
m, W = 70 mm, a ₁ = 12.2 mm, a ₂ = 9.5 mm, c ₁ = 2.5
mm, c ₂ = 4.0 mm, ₁₁ = 2.3 mm, T = 2.0 mm, H = 1
A cooling device in which a resin top plate 104 as a heat insulating material is attached to a heat sink 103 having a thickness of 0.0 mm, p = 0.5 mm, and t = 0.2 mm, and a sheet-like heater is attached to the back of the heat sink to provide cooling performance. The test was performed. At this time, the cooling air is sucked from the hollow portion 105 of each fin row 101 and flows into the inter-fin flow path from the outer periphery of each fin row.

When the calorific value and the air flow rate were changed at a cooling air inlet temperature of 25 ° C., the calorific value was 100 W, and the cooling air flow rate was 3200.
cc / sec (cooling air flow rate supplied per set of fins)
Under the conditions of 200 cc / sec and the flow velocity in the flow path between the heat sink cooling fins was 1.4 m / sec), the cooling performance of the heat sink showed a pressure loss of about 900 Pa and a thermal resistance of about 0.4 K / W.

This makes it possible to reduce the heat generation density to 2.4 W / cm ² , and in the conventional forced air cooling, the heat generation amount of the package alone is about 15 W at the maximum, and the heat generation density is about 1 W / cm ^2.
Considering that was the limit of cooling, it shows an epoch-making cooling performance.

[Embodiment 3] As shown in FIG. 11, a fin array 111 made of copper is composed of radiating pins.
They are arranged in a set alignment, and the dimensions of each part are L = W =
100 mm, a ₁ = a ₂ = 12.3 mm, c ₁ = c ₂ = 4.0 mm, 1
₁ = 1 ₂ = 3.1 mm, T = 1.0 mm, H = 5.0 mm, p = 0.5
A cooling performance test was performed by using a cooling device in which a resin top plate 114 as a heat insulating material was attached to a heat sink 113 having a thickness of 0.2 mm and t = 0.2 mm, and a sheet-like heater was attached to the back surface of the heat sink. At this time, the cooling air is supplied from the hollow portion 115 of each fin row 111 and is sucked from the outer periphery of each fin row.

When the calorific value and the air flow rate were changed at a cooling air inlet temperature of 25 ° C., the calorific value was 250 W, and the cooling air flow rate was 6000.
cc / sec (cooling air flow rate supplied per set of fins)
Under the condition of (165 cc / sec), the cooling performance showed a pressure loss of about 2200 Pa and a thermal resistance of about 0.25 K / W in the heat sink.

This makes it possible to cool down to 2.5 W / cm ² in terms of the heat generation density. In the conventional forced air cooling, about 15 W in the heat generated by the package alone and about 1 W / cm ² in the heat generation density are obtained. Considering that it was a possible limit, it shows epoch-making cooling performance.

[0048]

The heat sink cooling fin according to the present invention has a much larger heat radiation area per the same occupied volume than the conventional heat sink, and all the working fluid for cooling passes through the heat radiation part at a relatively small flow rate. As a result, compared with the conventional cooling method, it is possible to remarkably improve the cooling capacity while suppressing an increase in pressure loss due to flow path friction. For this reason, it is possible to cool a multi-chip module having an extremely large heat generation amount and heat generation density to an allowable temperature by forced air cooling using a conventional small blower. Further, the heat sink cooling fins according to the present invention can be applied not only to cooling of a multi-chip module but also to cooling of a single-chip module.

[Brief description of the drawings]

FIGS. 1A, 1B, and 1C are a perspective view, a cross-sectional view, and a side view, respectively, illustrating the outline of a multichip module and a cooling method thereof.

FIGS. 2 (a) and 2 (b) each illustrate a conventional cooling mode in which a working fluid is supplied to a forced air cooling radiator plate and a fin array.

FIGS. 3 (a), (b), (c) and (d) are a plan view, a side view, a sectional view, and a partial view, respectively, of a heat sink for a multi-chip module using the cooling fins of the present invention. It is an enlarged view.

FIGS. 4A, 4B, and 4C are cross-sectional views of a heat sink using the cooling fin according to the present invention,
It is sectional drawing, sectional drawing.

FIGS. 5 (a), (b), (c) and (d) are perspective views of cooling fin rows of the heat sink of the present invention.

FIG. 6 is a perspective view of a workpiece used to form heat sink cooling fins according to the present invention.

FIGS. 7A and 7B are explanatory diagrams of a method for manufacturing a wire saw and a heat sink cooling fin of the present invention.

FIG. 8 is an explanatory diagram of a positional relationship between a wire row of a processed portion and a workpiece.

FIGS. 9A and 9B are explanatory diagrams of a positional relationship between a wire row of a processed portion and a workpiece. FIG.

FIGS. 10 (a), (b), (c), and (d) are a cross-sectional view, a cross-sectional view, a cross-sectional view, and a partially enlarged view, respectively, of another example of the heat sink cooling fin of the present invention. .

11 (a), (b), (c), (d) are cross-sectional views, three-sided views, cross-sectional views, and partially enlarged views of still another example of the heat sink cooling fin of the present invention. is there.

[Explanation of symbols]

 31: Bottom plate 32: Hollow area (hollow area) 33: Unit fin element 34: Fin row 35: Heat sink 36: Hollow projection

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-259324 (JP, A) JP-A-5-129485 (JP, A) JP-A-5-253216 (JP, A) 144291 (JP, U) Hira 2-82091 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 7/20 B24B 27/06 H01L 23/36 H01L 23/467

Claims (7)

(57) [Claims] 1. A bottom plate and a plurality of hollow plate-shaped fins or pins formed on the bottom plate and integrally formed with the bottom plate, and a plurality of parallel plate fins or pins formed upright on the bottom plate on the peripheral wall of the hollow plate-shaped protrusion. A heat sink cooling fin characterized by forming a fin row composed of fins. 2. A bottom plate, and a plurality of parallel plate-type fins or pins formed on the bottom plate and formed with a hollowed-out protrusion integrally formed with the bottom plate. A heat sink cooling fin, wherein a fin row composed of fins is formed, and a working fluid is supplied or sucked from a hollow portion of the hollow projection-shaped body. 3. A bottom plate, and a plurality of parallel plate fins or pin-type fins formed on the bottom plate and formed on the bottom plate and formed on the peripheral wall of the formed hollow projection formed integrally with the bottom plate. A fin row composed of fins is formed, and a working fluid is supplied or sucked from a hollow portion of the hollow projection-shaped body, and a working fluid is sucked or supplied from an outer peripheral portion of the fin row, that is, a non-projection portion. Heat sink cooling fins. 4. A wire row stretched at the same pitch as a required fin pitch on a bottom plate and a projection having a hollow projection formed integrally with the bottom plate on the bottom plate. The wire row and the material are pressed in a state in which a working fluid containing abrasive grains is interposed between the wire row and the material, and a predetermined shape is formed on the hollow body of the material by the grinding action of the abrasive grains. 4. The method according to claim 1, wherein a parallel groove row or a parallel pin row having a depth and a width is formed. 5. A heat sink cooling fin comprising a plurality of sets of the heat sink cooling fins according to claim 1, 2 and 3, which are spaced apart from each other. 6. A projection formed of a material having a bottom plate and a plurality of hollow projections formed integrally with the bottom plate on the bottom plate,
The wire train stretched at the same pitch as the pitch of the required fins is caused to travel, and the wire train and the material are pressed in a state in which a processing liquid containing abrasive grains is interposed between the wire train and the material, 6. The method of manufacturing a heat sink cooling fin according to claim 5, wherein a parallel groove row or a parallel pin row having a predetermined depth and width is formed on the hollow protrusion-shaped body of the material by the grinding action of the abrasive grains. 7. A wire is diverted at a non-projection portion when a projection is formed from a material having a bottom plate and a plurality of hollow projections formed integrally with the bottom plate on the bottom plate using a wire saw. The method for manufacturing a heat sink cooling fin according to claim 5, wherein: