JP2946551B2 - IC handling equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention performs IC handling in an IC test system for automatically performing electrical measurement of ICs when selecting ICs (integrated circuits). It relates to a handling device (hereinafter, referred to as a handler).

[Conventional technology]

Conventionally, in this type of handler, as shown in the schematic plan view of FIG. 7, a transfer transfer (supply transfer 11a) for supplying an IC to the measurement section and a transfer transfer for storing the IC from the measurement section. (Measurement unit storage transfer 11b) are separately provided, and hand units 14a and 14b having chucking units 12a and 12b are attached to each of them. Also, the pusher portion 21 of the contact unit 18
Only the pusher for contacting the IC with the IC socket 16 was provided, and the chucking portion was not provided. Further, an IC supply part positioning stage 10a and a storage part positioning stage 10b are separately provided. It has a supply unit loader 1 for supplying and storing trays, an empty tray standby unit loader / unloader 23, and a defective product storage unit unloader 25. These trays or tray-shaped ICs are transported and stored. Chucking section 6 attached to transfer 5
Is performed by the hand unit 8 having

[Problems to be solved by the invention]

In the above-described conventional handler, the measurement unit supply transfer 11a and the measurement unit storage transfer 11b are configured separately, so that the supply of the IC to the measurement unit and the storage of the IC from the measurement unit can be performed simultaneously. There is a drawback that the index time becomes longer (the number of processes per unit time decreases).

Further, since the measuring section supply transfer 11a and the measuring section accommodating transfer 11b have different configurations, there is a disadvantage that the size of the apparatus is increased and productivity per unit floor is deteriorated.

In contrast to the above-described conventional handler, the present invention provides a single transfer for supplying the IC to the measuring unit and for supplying the IC from the measuring unit.
And the storage is simultaneously performed.

[Means for solving the problem]

In the handler according to the present invention, the transfer transfer for supplying the IC to the measuring section and storing the IC from the measuring section is one transfer, and the IC is provided on the upper surface of the hand section of the transfer transfer.
An IC storage stage for storing the IC is provided, a chucking portion for chucking the IC is provided on the lower surface, and a chucking surface for chucking the IC is provided on a surface of the pusher portion of the contact unit that contacts the IC. .

〔Example〕

 Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view of a first embodiment of the present invention, and FIG. 2 is a schematic side view of the first embodiment. The supply unit loader 1, empty tray standby unit loader / unloader 3, supply / storage transfer 5,
It comprises a positioning stage 10, a measuring section transfer 11, an IC socket (measuring section) 16, a contact unit 18, a good product storing section unloader 23, a defective product storing section unloader 25, and a handler base 27.

FIG. 3 is a schematic cross-sectional view of the hand unit 14 of the measuring unit transfer 11, in which the suction pad 52 is used for the chucking unit 12, and the suction pad 51 is provided below the hand unit base 50.
(Attached to the suction pad indicating section 52 connected to the pipe 55, and has a degree of freedom in the vertical direction by the E-ring 53 and the spring 54) and the protection block 57 (IC storage stage of the hand section 14 of the measuring section transfer 11) Supply measured IC from above
When the chucking unit 6 of the hand unit 8 attached to the storage transfer 5 attracts the wafer, it contacts the positioning stage 10 and receives a load applied to the hand unit 14 of the measuring unit transfer 11). A stage 56 is provided.

In the first embodiment, the tray 2 containing the IC is stored in the supply unit loader 1 and the chucking unit 6 of the handler 8 attached to the supply / storage transfer 5 (the hand unit 8 is attached to the upper and lower cylinders 7 such as an air cylinder). The upper and lower cylinders 7 are attached to the supply / storage transfer 5 by the brackets 9).
It is transported to the positioning stage 10, where it is placed to position the IC. On the other hand, the top tray 2 of the supply unit loader 1
Is empty, it is adsorbed by the chucking unit 6 of the supply / storage transfer 5, transported to the empty tray standby unit loader / unloader 3, and stored there.

Next, the hand unit attached to the measurement unit transfer 11
14 chucking unit 12 (hand unit 14 is a vertical cylinder
13 and the upper and lower cylinders 13 are attached to the measuring section transfer 11 by brackets 15).
The IC on the positioning stage 10 is sucked, transported to the IC socket (measurement unit) 16, and placed there. Then, the pusher portion 21 attached to the contact unit 18 (the pusher portion 21 is attached to the upper and lower cylinders 20 and the upper and lower cylinders 20 are attached to the contact unit 18 by the brackets 22) by machining the upper and lower cylinders 20 ,
IC on IC socket 16 and IC socket 16 (IC socket 16
Via the test board 17, which is electrically connected to a measuring instrument (not shown).
An electrical measurement of the IC is performed by a measuring device (not shown).

When the measurement is completed, the chucking section of the pusher section 21
19 sucks the IC, and then raises the upper and lower cylinders 20 and removes the IC from the IC socket 16. Then, the measuring unit transfer 11 is moved to the positioning stage 10 (by the chucking unit 6 of the hand unit 8 of the supply / storage transfer 5 on the positioning stage 10, the chucking unit of the hand unit 8 of the transfer 5 on the supply unit loader 1 is previously determined). By 6,
The IC on the tray 2 on the supply unit loader 1 is picked up and stored beforehand by the chucking unit 12 of the hand unit 14 and then moved to the position of the IC socket 16. Thereafter, the positioning stage 10 is supplied with
The chucking unit 6 of the hand unit 8 of the storage transfer 5 sucks and transports one IC by the tray 2 of the supply unit loader 1. At the same time as setting the IC in the IC socket (measurement unit) 16, the suction of the measured IC that has been sucked by the chucking unit 19 of the pusher unit 21 is released, and the IC storage stage 56 is released.
put on top. Then, the measurement unit transfer 11 moves to above the positioning stage 10. The IC set in the IC socket 16 is measured by the operation described above.

Next, the IC on the IC storage stage 56 of the hand unit 14 of the measuring unit transfer 11 transported onto the positioning stage 10 is:
It is sucked by the chucking unit 6 of the hand unit 8 of the supply / storage transfer 5, and based on the measurement result, the tray 24 on the good product storage unit unloader 23 or the defective product storage unit unloader 25
Classified and stored in the upper tray 26. At this time, simultaneously, the chucking unit 12 of the hand unit 14 of the measurement unit transfer 11
The IC on the positioning stage 10 is sucked. on the other hand,
When the top tray 24 of the non-defective product storage unit unloader 23 or the top tray 26 of the defective product storage unit unloader 25 becomes full, the empty tray is operated by the chucking unit 6 of the hand unit 8 of the supply / storage transfer 5. Standby loader / unloader 3
The uppermost tray 4 is sucked, and an empty tray is set on the full unloader.

 The following operation repeats the operation described above.

The second embodiment is a hydra in which each chucking portion chucks an IC with a finger instead of a suction pad.

FIG. 5 is a schematic cross-sectional view of the hand unit 14 of the measuring unit transfer 11, in which a finger 58 is used for the chucking unit 12, and a finger 58 (the finger 58 is an air cylinder or the like) is provided below the hand unit base 50. Is fixed to the opening / closing cylinder 59 with a nut 60), and an IC storage stage 56 is provided at the upper part. FIG. 6 is a schematic sectional view of the pusher portion 21 of the contact unit 18, in which a pusher base (2) 70b is provided below the pusher base (1) 70a, and a pusher 71 is provided below the pusher base (2) 70b. An opening / closing cylinder 78 is attached to the pusher base (2) 70b, and a finger 77 is attached to the opening / closing cylinder 78 by a nut 79.

The operation method is exactly the same as that of the first embodiment.
In the first embodiment, chucking is performed by suction, whereas in the second embodiment, chucking of a finger is performed by opening and closing an opening and closing cylinder.

〔The invention's effect〕

As described above, the present invention provides the supply of the IC to the measurement unit,
Transport transfer and IC for storing IC from measuring unit
In a handler having a contact unit for making contact with an IC socket, an IC storage stage for storing ICs on an upper surface of a hand unit of the transfer transfer, a chucking unit for chucking ICs on a lower surface, and Of the pusher part of the contact unit
By providing a chucking section for chucking the IC on the surface where the IC contacts the IC socket, the supply of the IC to the measurement section and the storage of the IC from the measurement section can be performed simultaneously, and the index time can be reduced. Since the length can be shortened, there is also an effect of improving the processing capacity per unit time.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a first embodiment of the present invention, FIG. 2 is a schematic side view of the first embodiment, FIG. FIG. 4 is a schematic sectional view of a pusher portion of the contact unit of the first embodiment, FIG. 5 is a schematic sectional view of a hand portion of the measuring unit transfer of the second embodiment, and FIG. 6 is a contact unit of the second embodiment. FIG. 7 is a schematic plan view of a conventional example. 1 ...... Supply unit loader, 2 ... tray, 3 ... empty tray standby unit loader / unloader, 4 ... tray, 5 ... supply
Storage transfer, 6 ... Chucking part, 7 ... Vertical cylinder, 8 ... Hand part, 9 ... Bracket, 10 ...
… Positioning stage, 10a… Positioning part positioning stage, 10b …… Storage part positioning stage, 11… Measurement part transfer, 11a …… Measurement part supply transfer, 11b…
Measuring unit storage transfer, 12, 12a, 12b ... chucking unit, 13 ... vertical cylinder, 14, 14a, 14b ... hand unit,
15 Bracket, 16 IC socket, 17 Test board, 18 Contact unit, 19 Chucking part, 20 Vertical cylinder, 21 Pusher part, 22
... Bracket, 23 ... Unloader for non-defective product storage, 24 ... Tray, 25 ... Unloader for defective product storage, 26 ... Tray,
27… Handler base, 50… Hand base, 51…
Suction pad, 52 ... Suction pad support, 53 ... E-ring, 54 ... Spring, 55 ... Piping, 56 ... IC storage stage,
57 …… Protective block, 58… Finger, 59 …… Opening / closing cylinder, 60 …… Nut, 70 …… Pusher base, 70
a ... pusher base (1), 70b ... pusher base (2), 71 ... pusher, 72 ... suction pad, 73 ...
... Suction pad support, 74 ... E-ring, 75 ... Spring, 76
…… Piping, 77… Finger, 78… Opening / closing cylinder,
79 ... nut.

Claims (1)

(57) [Claims] An IC provided to a determination unit and a transfer transfer for supplying the IC to the measurement unit and storing the IC from the measurement unit.
Has a contact unit to contact the socket
In the IC handling device, a storage stage for storing the IC is provided on the upper surface of the hand portion of the transfer transfer,
An IC handling device comprising: a chucking portion for chucking an IC provided on a lower surface; and a chucking portion for chucking an IC on a surface of the contact unit which contacts the IC in a pusher portion of the contact unit.