JP2943774B2 - Semiconductor device external shape holding member, semiconductor device, and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to an inexpensive and easy-to-use outer shape holding member for a ball grid type semiconductor device using a flexible tape carrier. And a semiconductor device using the same.

[0002]

2. Description of the Related Art As a ball grid type semiconductor device using a flexible tape carrier, for example, Japanese Patent Application Laid-Open No. 7-32157 discloses a film carrier having a chip size substantially equal to a package size, and a semiconductor device using the same. Has been proposed. The above publication describes, as Example 7, an example in which a part of an external connection pad is formed not only on a semiconductor bare chip mounting portion of a film carrier but also on a peripheral portion of the chip. Molding is introduced as a method for manufacturing a pad-forming area larger than the chip size while securing the area.

The transfer mold is for sealing a semiconductor device with a resin by injecting a resin into a mold, and is excellent in terms of holding an outer shape. However, transfer molds require large and expensive equipment and dies.

FIG. 3 is a diagram showing an example of a conventional mold formation. In FIG. 3, when the resin is aged, warpage occurs due to a difference in thermal expansion retention between the semiconductor device (chip) 1 and the resin 9, and coplanarity failure occurs.

The transfer mold is inferior in heat dissipation, and a metal cap and a ring may be adhered to a semiconductor device and its periphery in order to secure heat dissipation.

[0006] The metal caps and rings are disclosed in
By sticking to a flexible tape carrier as described in JP-A-32157, the surface is kept flat, and a ball bump or the like is formed thereon, thereby realizing a ball grid type semiconductor device. Also,
By adhering to the semiconductor device, its heat dissipation is ensured.

FIG. 4 is a view showing an example of a conventional metal ring. Referring to FIG. 4, in the conventional metal ring 11, the inner side surface of the metal ring 11 is the semiconductor device 1.
In order to prevent interference with the semiconductor device 1, the opening dimension l _R is, in addition to the width l of the semiconductor device 1, the surface roughness ± x of the inner side surface of the metal ring 11, and the processing accuracy of punching the inside of the metal ring 11 (of the opening width). ± y, metal ring 11 to tape carrier 3
Considering the accuracy of the device for thermocompression bonding (eg, image recognition and machine) ± z, l _R = l + x + 2y + 2z.

Accordingly, the maximum gap width between the metal ring 11 and the semiconductor device 1 is x + 2y + 2z, and it is difficult to form an external connection pad in this region.

[0009]

The above-mentioned conventional film carrier semiconductor device has the following problems.

[0010] The metal cap or ring for heat dissipation needs to have a high external dimension in order to avoid being damaged by interference with the device itself when mounted around the semiconductor device. Alternatively, it is necessary to increase the dimensional tolerance of the fitting.

However, in order to realize a high external dimension, it is generally necessary to rely on machining means such as electric discharge machining, so that it is impossible to keep the cost of members low.

In addition, when the dimensional tolerance is increased, the gap between the semiconductor device and the metal cap or ring becomes large, and there is a high possibility that sufficient flatness cannot be maintained.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device using a flexible tape carrier, in which an external connection pad is provided not only on a semiconductor bare chip mounting portion but also on a chip peripheral portion. As a means for producing a pad-formable area larger than the chip size while ensuring flatness to form a part of a part, a contour holding member that is cheaper and easier than transfer mold, a metal cap, and a ring. Another object of the present invention is to provide a semiconductor device using the outer shape holding member and a method of manufacturing the same.

[0014]

In order to achieve the above object, a semiconductor device according to the present invention comprises a semiconductor device and a semiconductor device.
A flexible tape carrier having a continuous wiring pattern, and external terminals arranged in a grid,
The semiconductor device has one core on the tape carrier.
The adhesive on the tape.
Is the on the tape carrier, the semiconductor device is mounted in a region other than the mounted area, the semiconductor
Along the edge of the tape carrier among the four sides of the body device
And an outer shape holding member made of a metal plate having an edge, which faces two sides other than the two sides .

The semiconductor device according to the present invention comprises a semiconductor device and a flexible tape carrier having a wiring pattern connected thereto, ball bumps arranged in a grid, and an L-shaped metal plate outer shape holding member. The semiconductor device is mounted on one side of the tape carrier via an adhesive on the tape, and the L-shaped metal plate is mounted on the other side of the semiconductor device at the opposite corner with the adhesive on the tape. The gap between the semiconductor device and the outer shape holding member of the L-shaped metal plate is sealed with a potting resin for the purpose of preventing coplanarity defects. .

Further, in the method of manufacturing a semiconductor device according to the present invention, when sealing with a potting resin, a tape carrier surface between a semiconductor device and an outer shape holding member of an L-shaped metal plate, which can be generated by volatile component curing of a potting table. In order to prevent a step that significantly impairs coplanarity generated in the above, a different weight is placed on the semiconductor device and on the outer shape holding member of the L-shaped metal plate during curing, and the tape carrier surface is held flat. I do.

[0017]

Embodiments of the present invention will be described. In a preferred embodiment of the semiconductor device of the present invention, a semiconductor device (1 in FIG. 1) and a flexible tape carrier (3 in FIG. 1) having a wiring pattern connected thereto are arranged in a grid. The semiconductor device (1 in FIG. 1) includes a ball bump (4 in FIG. 1) and an outer shape holding member (2 in FIG. 1) formed of an L-shaped metal plate. 3) An outer shape holding member (2 in FIG. 1) which is mounted on the tape via an adhesive on one of the upper corners and is made of an L-shaped metal plate
Is mounted on a tape carrier (3 in FIG. 1) via an adhesive on the other side diagonally to the semiconductor device (1 in FIG. 1). Then, in the embodiment of the present invention, preferably, a gap between the semiconductor device (1 in FIG. 1) and the outer shape holding member (2 in FIG. 1) is sealed with a potting resin (5 in FIG. 1). .

According to the embodiment of the present invention, in a ball grid array type semiconductor device comprising a flexible tape carrier, a part of an external connection pad is easily formed not only on a semiconductor bare chip mounting portion but also on a chip peripheral portion. The flatness can be maintained as much as possible, and the heat generated from the semiconductor device is better dissipated than the mold formation.

In a preferred embodiment of the manufacturing method of the present invention, when sealing with a potting resin (5 in FIG. 1), a volatile component of the potting resin is cured on the semiconductor device (1 in FIG. 1). And weights having different shapes are placed on an outer shape holding member (2 in FIG. 1) made of an L-shaped metal plate, and a tape carrier (3 in FIG. 1)
Keep the surface flat.

[0020]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;

FIGS. 1A and 1B are views showing the configuration of an embodiment of the present invention, wherein FIG. 1A is a top view, FIG. 1B is a bottom view, and FIG. Referring to FIG. 1, a semiconductor device according to the present embodiment includes a semiconductor device (bare chip) 1, a flexible tape carrier 3 having a wiring pattern connected thereto, ball bumps 4 arranged in a grid, and a planar shape. Consists of an L-shaped metal plate outer shape holding member 2. The semiconductor device 1 is mounted via an adhesive on a tape 3 so as to approach a certain corner on a tape carrier, and the L-shaped metal plate 2 The other diagonal to the semiconductor device 1 is similarly mounted on the tape 3 via an adhesive. The gap between the semiconductor device 1 and the L-shaped metal plate 2 is sealed with a potting resin 5 for the purpose of preventing coplanarity defects.

In this embodiment, the L-shaped metal plate 2 conforming to the shape other than the portion on which the semiconductor bare chip 1 is mounted is made of, for example, 42 alloy material, aluminum, or copper.

Then, it is formed by punching or electric discharge machining with a metal mold, and is subjected to a polishing treatment (file sanding or chemical polishing) in order to arrange a portion to be in contact with the semiconductor device 1 as necessary.

The outer shape holding member made of the L-shaped metal plate 2 is attached to a flexible tape carrier 3 on which the semiconductor device 1 is already mounted and the wiring of the electrode pad and the tape carrier is bonded (bonded), for example, by a thermoplastic resin. Adhesive 3a such as polyimide or thermosetting epoxy
Are bonded by thermocompression bonding.

At this time, the order of mounting and bonding of the semiconductor device 1 and thermocompression bonding of the outer shape holding member 2 can be arbitrarily changed.

Thereafter, in order to prevent a step or unevenness that may occur in a flexible tape carrier portion between the semiconductor device 1 and the outer shape holding member 2 of the L-shaped metal plate, the semiconductor device 1 and the L-shaped metal The space between the outer shape holding members 2 of the plate is sealed.

Thereafter, the potting resin cures the volatile components. At this time, the above-mentioned steps and irregularities may occur due to the shrinkage of the resin. On the holding member 2, FIG.
(A), FIG. 2 (B), and FIG. 2 (C), different weights 6, 7, and 8 are respectively placed as shown in a sectional view of FIG. correct. FIG.
Referring to (D), the protruding part of the weight 8 is the lower layer weight 7.
The weight 7 contacts the surface of the external shape holding member 2 through the opening of the chip 1.

Thereafter, a ball bump electrode 4 is formed in the pad formation region of the tape carrier 3. Since the surface on which the ball bump electrodes 4 are formed is the chip surface and the flatness is ensured by the L-shaped metal plate outer shape holding member 2, coplanarity defects and the like are small.

In the conventional mold formation described with reference to FIG. 3, warpage occurs due to the difference in thermal expansion retention between the semiconductor device and the resin during aging of the resin, and coplanarity failure occurs. In the example semiconductor device, the coplanarity defect due to the warpage does not occur.

In the conventional molding shown in FIG. 3, the semiconductor device is covered with resin, so that the heat radiation characteristics are generally not good. In the present embodiment, the chip back surface of the semiconductor device 1 is used. Are exposed to the outside and a part is surrounded by the L-shaped metal plate outer shape holding member 2, so that the heat dissipation is superior to that of the conventional example.

Further, by adopting a positive cooling structure such as an air-cooling fan or a radiating fin for the outer shape holding member 2, it is possible to further enhance the heat radiation effect.

The present embodiment is superior to the conventional metal ring structure described with reference to FIG. 4 in the required external dimensions and the dimensional tolerance of the alignment when being bonded to the tape carrier.

As described above, in the conventional metal ring shown in FIG. 4, in order to prevent the inner side surface of the metal ring from interfering with the semiconductor device, the opening dimension l _R is added to the width l of the semiconductor device and the inner side surface of the metal ring. Considering the surface roughness ± x, the processing accuracy ± y for punching the inside of the metal ring (of the opening width) ± y, and the accuracy of the equipment for thermocompression bonding the metal ring to the tape carrier (eg, image recognition and machine) ± z , L _R = l +
x + 2y + 2z, and the maximum gap width between the metal ring 11 and the semiconductor device 1 is x + 2y + 2z, making it difficult to form external connection pads in this region.

On the other hand, since the outer shape holding member of the L-shaped metal plate according to the present embodiment does not require the processing accuracy of punching the inside of the metal ring (the opening width), the gap width with the semiconductor device is maximum. x + 2z, which is advantageous by 2y compared to the metal ring shown in FIG.

[0035]

As described above, according to the present invention, the following effects can be obtained.

The first effect of the present invention is to realize good heat radiation characteristics while securing flatness.

The reason is that, in the present invention, the back surface of the chip of the semiconductor device is exposed to the outside, and a part other than the part on which the chip on the tape carrier is mounted is provided with an outer shape holding member of an L-shaped metal plate. It depends. Further, when a positive cooling structure is employed for the external holding member, it is possible to further enhance the heat radiation effect.

Further, the present invention is superior to the conventional metal ring structure in the required external dimensions and the dimensional tolerance for alignment when being bonded to the tape carrier. No processing accuracy is required, and cost reduction is achieved.

The reason is that, in the present invention, the outer shape holding member of the L-shaped metal plate does not require the processing accuracy of punching the inside of the metal ring (the opening width), and the tolerance of the gap width with the semiconductor device is limited. This is because it is more advantageous than the conventional metal ring.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of one embodiment of the present invention, and FIG.
Is a top view, (B) is a bottom view, and (C) is a cross-sectional view.

FIGS. 2A to 2C are diagrams for explaining a method of manufacturing a semiconductor device according to an embodiment of the present invention. FIGS. FIG. 4D is a plan view of the weight on which the weight is placed, and FIG. 4D is a cross-sectional view showing a step of placing the weight and keeping the surface of the tape carrier flat.

3A and 3B are diagrams showing a conventional semiconductor device formed by molding, wherein FIG. 3A is a top view, FIG. 3B is a bottom view, and FIG. 3C is a cross-sectional view.

4A and 4B are diagrams showing a configuration of a semiconductor device using a conventional metal ring, wherein FIG. 4A is a top view, FIG.
(C) is a sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 L-shaped metal plate outer shape holding member 3 Tape carrier 3a Adhesive 4 Ball bump 5 Potting resin 6 Figure showing state of semi-finished product during assembly process 7 Weight to be placed on L-shaped metal plate during curing 8 Weight placed on semiconductor device during cure 9 Resin

Claims (5)

(57) [Claims] 1. A semiconductor device comprising: a flexible tape carrier having a semiconductor device and a wiring pattern connected thereto; and external terminals arranged in a grid pattern, wherein the semiconductor device is provided at one corner on the tape carrier. The semiconductor device is mounted on an area other than the area where the semiconductor device is mounted on the tape carrier, and two of the four sides of the semiconductor device are arranged along the edge of the tape carrier.
A semiconductor device comprising an outer shape holding member made of a metal plate having an edge, which faces two sides other than the side. 2. A flexible tape carrier having a semiconductor device and a wiring pattern connected to the semiconductor device, ball bumps arranged in a grid, and an outer shape holding member made of a metal plate having an L-shaped planar shape. The semiconductor device is mounted via an adhesive on the tape so as to approach one corner on the tape carrier, and the outer shape holding member made of an L-shaped metal plate is paired with the semiconductor device. A semiconductor device, wherein the other corner is mounted on the tape carrier via an adhesive. Wherein the semiconductor device and the by encapsulating the gap between the outer holding member by a potting resin, a semiconductor device according to claim 1 or 2, wherein the. 4. A semiconductor device, a flexible tape carrier having a wiring pattern connected to the semiconductor device, ball bumps arranged in a grid, and an outer shape holding member made of an L-shaped metal plate. The semiconductor device is mounted via an adhesive on the tape so as to approach one corner on the tape carrier, and the outer shape holding member made of an L-shaped metal plate is paired with the semiconductor device. The other of the corners is mounted on the tape carrier via an adhesive, and a gap between the semiconductor device and the outer shape holding member made of the L-shaped metal plate is sealed with a potting resin. A method of manufacturing a semiconductor device, comprising: a step of curing a volatile component of a potting resin when sealing with the potting resin; A method of manufacturing a semiconductor device, wherein weights having different shapes are placed on an outer shape holding member made of the L-shaped metal plate, and the surface of the tape carrier is held flat. 5. A semiconductor device comprising: a wiring pattern;
One corner on a flexible tape carrier with
On the tape carrier with an adhesive.
A step of bets, (b) the tape on which the semiconductor device is mounted
The semiconductor device is mounted on a carrier.
The four sides of the semiconductor device
Other than the two sides along the edge of the tape carrier.
Outer shape holding member made of a metal plate having edges facing each other
A step of crimping heat using an adhesive, the gap between the outer holding member and (c) said semiconductor device
A step of sealing with a potting resin , and (d) at the time of curing volatile components of the potting resin,
The semiconductor device and the outer shape holding member have different
(C) placing a weight on the tape carrier and curing the tape carrier.
A method of manufacturing a semiconductor device, comprising: forming a bump electrode .