JP2942468B2 - Information processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information processing apparatus.

[0002]

2. Description of the Related Art With the recent increase in the speed and density of information processing devices, the amount of heat generated by the information processing devices has been increasing. It's getting harder.

FIG. 15A shows a heat radiation method in a conventional small information processing apparatus. The small-sized information processing apparatus includes a main body 20 having a built-in arithmetic element such as an MPU and a keyboard matrix or the like arranged on a surface thereof, and a display unit rotatably supported by the main body 20. A heating element 50 such as an MPU is mounted on a printed board 21 disposed in the inside 20 with the heat sink surface facing downward.
On the other hand, a heat transfer rubber sheet 22a and a heat radiating plate 22b are laminated on the housing of the main body 20, and a heat radiating sheet 22c is interposed between the heat generating element 50 and the heat radiating plate 22b.

In the conventional example shown in FIG. 15B, a heat radiating sheet 22c is interposed between the bottom wall of the heating element 50 and the printed circuit board 21, and the heat generated by the heating element 50 is
Printed circuit board 21, heat radiating sheet 22c, heat radiating plate 22b,
The heat is radiated to the device housing 23 via the heat transfer rubber sheet 22a. In FIG. 15, reference numeral 51 denotes a lead for mounting on the printed circuit board 21.

However, in the above-described conventional example, if the amount of heat generated by the heating element 50 increases in the future, the main body 2
0, the temperature rise of the device housing 23 becomes large, and the main body 20 has a large gap between the back surface, that is, the heat radiating surface and the installation surface of the desk or the like. It is conceivable that the temperature rise becomes large.

Further, since both the heat generating portion and the heat radiating portion 40 are in the body portion 20 and are close to each other, the inside of the body portion 20 is warmed,
There is also a disadvantage that the cooling of the heating element 50 is not complete.
In a small to large-sized information processing device, a heat sink device equipped with a fan device 42 is mounted for each element in order to cool the heating element 50 in a spot manner. As a result, the temperature inside the housing rises, and the disadvantage that the intended cooling performance cannot be exhibited has been pointed out.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and an information processing apparatus having improved heat radiation efficiency by disposing a heat generating portion and a heat radiating portion separately from each other. The purpose is to provide.

[0008]

Means for Solving the Problems] The present invention of the above object, according includes a main body receiving member is mounted on the heating element, the rear
A display unit having a heat radiating portion, a good thermally conductive
It is formed of a material, and is fixed on the main unit side and the display side.
Hinge member that connects the fixed part and the fixed part so that they can rotate mutually by a pivot
And the hinge member is fixed to the main body-side fixing portion.
Display side fixed part by flange provided on pivot
As well as the flange and the display-side fixing part.
Between the heat receiving member and the main body.
The body side fixing part, the heat radiation part and the display side fixing part
Linked by a heat transfer body made of a material with good thermal conductivity
This is achieved by providing a linked information processing device.

[0009]

According to the present invention, the heating element 50 in the main body 20 is provided.
The heat receiving member 60 mounted on the display unit 30 and the heat radiating unit 40 formed on the back surface of the display unit 30 are connected by a heat transfer body 70, and the heat generated by the heating element 50 is radiated by the display unit 30. By performing the heat radiating portion on the display unit 30 remote from the heating element 50, the heat radiating efficiency is improved.

By using the hinge member 10 in the heat transfer path between the heat receiving member 60 and the heat radiating section 40, the operational feeling of the display section 30 is improved as compared with the case where a special heat transfer element is provided. In addition, problems such as breakage of the heat transfer element due to the opening / closing operation of the display unit 30 can be prevented.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, an information processing apparatus according to the present invention has a main body 20 including a heating element 50 such as an MPU.
And a display unit 30 rotatably supported by the main unit 20 by the hinge member 10. Main unit 2
In order to cool the heating element 50 inside the heating element 50, a heat receiving member 60 formed of a material having good thermal conductivity, such as a heat sink, is mounted on the heating element 50.

One end of the heat receiving member 60 and the heat radiating portion 40 is fixed to a heat transfer member 70 having good heat conductivity, such as copper, aluminum, or a heat pipe. The ends are the body 20 and the display 30
Are fixed to a hinge member 10 connecting the two.

FIG. 2 shows a state in which the heat receiving member 60 is attached to the heating element 50. The heat receiving member 60 is formed of a material having good thermal conductivity such as aluminum, and is fixed to or bonded to the heating element 50 by means such as adhesion or the like, and is fixed on the base member 61. The cover 62 is formed by the cover body 62 sandwiching the front end portion of the heat transfer body 70 in cooperation with the above. The holding structure at the distal end of the heat transfer body 70 can be variously deformed.
After a concave groove is formed in which the front end of the cover member 0 can be fitted and the heat transfer body 70 is fitted in the concave groove, the cover body 62 is fixed to the base member 61 or the cover body 62 is The heat transfer body 70 is configured to be inserted into an insertion hole formed in the base member 61 without using it.

The shape of the tip of the heat transfer body 70 is shown in FIG.
(B) As shown in FIG.
In the case of 0, the heating element 50 has a linear shape, and
As shown in (c) and (d), in the case of multi-chip mounting, it is desirable to determine that the heat transfer body 70 is located above the chip in the heating element 50. In addition,
In FIG. 2, reference numeral 52 denotes a chip sealed in the heating element 50.

Removably fixing the heat transfer member 70 from the heat receiving member 60 is an effective deformation to enable the replacement of the heating element 50 and the like. When the heat transfer member 70 is formed of a rigid body, As shown in FIG. 3, a turning node is formed at the distal end of the heat transfer body 70. That is, in the modification shown in FIG. 3, the heat transfer body 70 fixed to the heating element 50 is rotatably supported by the relay block 71, and
After removing 2 (not shown), the heat transfer element 70 is rotated in the direction of the arrow to remove it from the heating element 50. FIG. 3 shows an example of the attachment / detachment structure in the case where the heat transfer body 70 is formed of a rigid body, but the entire heat transfer body 70 or only the fixing portion to the heat receiving member 60 is made of a flexible material. In the case of forming with, the detachment can be performed without configuring a special detachment mechanism.

The heat transfer body 70 having one end fixed to the heat receiving member 60 as described above is connected to the hinge member 10 via an appropriate route in the main body 20. In order to prevent a short circuit between the heat transfer body 70 routed inside the main body 20 and the printed circuit board 21 or the like, it is preferable to apply a resin coating or the like to the surface of the heat transfer body 70 to form an insulating layer. Desirably, in order to prevent the temperature inside the main body 20 from rising due to heat transfer and heat radiation of the heat transfer body 70, a heat insulating layer and a heat radiation rate for suppressing a rise in surface temperature are provided on the outer surface of the heat transfer body 70. A metal film for reduction is formed.

In this embodiment, the hinge member 10 is
As shown in FIG. 4, the main body-side fixing portion 11 and the display-side fixing portion 12 are connected by a pivot 13 so as to be mutually rotatable. In order to provide an appropriate sliding resistance between the display-side fixing portion 12 and the main-body-side fixing portion 11, the pivotal support portion of the display-side fixing portion 12, as shown in FIG. The leaf spring 14 is sandwiched between the provided flanges 13a, and a leaf spring 14 is interposed between the flange 13a and the pivotal part.

The hinge member 10 includes a main body-side fixing portion 11
Is fixed to the fixed seating surface 24 of the main body 20 by being fixed thereto, and the other end of the heat transfer body 70 is sandwiched between the main body side fixing portion 11 and the fixed seating surface 24, and is fastened and fixed together. One end of a heat transfer body 70 disposed in the display unit 30 is fixed to the display-side fixing unit 12.

In order to thermally connect the heat transfer body 70 in the display section 30 and the heat transfer body 70 on the main body section 20 side with a small thermal resistance, the components 11 and 12 constituting the hinge member 10 are formed.
Is formed of a material having good thermal conductivity.
A lubricant having high heat conductivity or excellent heat resistance is used.

FIG. 6 shows the structure of the heat radiating section 40 formed on the back of the display section 30. The heat radiating portion 40 is formed of a plate material having good thermal conductivity, and desirably, a thin corrugated sheet metal is brazed as shown in FIGS. Or a honeycomb in which a thin base sheet metal is joined to a honeycomb as shown in FIG. Air gap 4 of the above honeycomb etc.
1 is a vertical direction of the display unit 30, more specifically, the gap 41 communicates in the vertical direction with the display unit 30 standing, so that the air warmed in the gap 41 does not stay in the gap 41. Is done.

In order to transfer the heat from the heating element 50 to the heat radiating portion 40, a heat transfer member 70 connected to the hinge member 10 extends inside the heat radiating portion 40. Heat transfer element 7
0 does not need to be spread over the entire area of the heat radiating section 40, and it is sufficient to insert an appropriate number of them through the heat radiating section 40 as shown in FIG. 7.

The heat radiating section 40 can be used to radiate a display panel 31 such as a liquid crystal built in the display section 30. However, the display panel 31 may be heated by the heat generated by the heat radiating section 40. In this case, it is desirable to form a heat insulating layer 32 at the boundary between the display panel 31 and the heat radiating section 40 as shown in FIG. As the heat insulating layer 32, as shown in FIG.
An air layer 3 is formed between the display panel 31 and the display panel 31 by bringing a low thermal conductor having ridges 32a, 32a,.
3, or a porous heat conductive material such as a low heat transfer foam is used.

Further, when the temperature rise in the heat radiating section 40 is large, as shown in FIG. 9A, the heat insulating layer 32 is interposed between the heat radiating section 40 and the outer shell of the display section 30, Alternatively, it is desirable that the outer shell itself function as the heat insulating layer 32. In this case, as the heat insulating layer 32, the same heat insulating structure as that for the display panel 31 described above is used. Further, as shown in FIG.
It is also possible to cover the whole with a heat insulating layer 32 and to simultaneously perform heat insulation to the display panel 31 and heat insulation to the outside.

Therefore, in this embodiment, the heat generated by the heat generating element 50 absorbed by the heat receiving member 60 is transmitted to the hinge member 10 via the heat transfer member 70 and is radiated from the hinge member 10 to the display unit 30. Is done. By using the hinge member 10 as a heat transfer element from the main body 20 to the display unit 30, the operational feeling of the display unit 30 is improved as compared with the case where a special heat transfer element is provided, and the display unit 30 Troubles such as rupture of the heat transfer element due to the opening / closing operation of the device can be prevented.

FIG. 10 shows a second embodiment of the present invention. In the following description of the embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals in the drawings, and description thereof will be omitted. In this embodiment, a heat receiving member 60 is mounted on the heating element 50 mounted on the printed circuit board 21, and one end of the heat transfer body 70 is fixed by the same means.

On the other hand, the heat radiating portion 40 is formed by mounting a fan device 42 on a heat sink 43 formed of a material having good heat conductivity, and is disposed near an air inlet 81 of a device main body 80. The heat radiating portion 40 and the heat receiving member 60 are connected by a heat transfer member 70, and the heat of the heat generating element 50 absorbed by the heat receiving member 60 is transferred to the heat radiating portion 40 via the heat transfer member 70. The heat is radiated in the radiator 40. In FIG. 10, arrows indicate the direction of the cooling air blown by the cooling fan (not shown).

Therefore, in this embodiment, the heat radiating portion 40 is provided with the heat generating element 5 as compared with the case where a heat sink in which the fan device 42 is mounted directly on the heat generating element 50 is mounted.
Since the fan device 42 is located at a position distant from zero and the fan device 42 is supplied with air outside the device main body 80, a decrease in cooling efficiency due to re-intake of warm air discharged from the heat sink 43 is prevented.

Immediately exhausting the warm air from the fan device 42 to the outside is an effective means for preventing the temperature inside the device main body 80 from rising. For this reason, as shown in FIG. Exhaust port 82 at the top of intake port 81 to 40
Is desirably provided. Further, the intake port 81 may be provided with a downward louver 81a and the exhaust port 82 may be provided with an upward louver 82a so that the exhausted hot air is not taken in again by the fan device 42.

When the heating element 50 is mounted on the printed circuit board 21 disposed in the shelf, FIG.
As shown in (1), the heat transfer body 70 is arranged along the printed circuit board 21, and the heat radiating section 40 is provided for each printed circuit board 21 or each heating element 50. FIG. 12 (a)
, The arrow indicates the direction of the air blown by the cooling fan (not shown).

FIG. 13 shows a third embodiment of the present invention. In this embodiment, a heat receiving member 60 is mounted on the heat generating element 50 mounted on the printed circuit board 21, and one end of the heat transfer body 70 is fixed. The heat transfer body 70 is extended to the front of an overall cooling fan 90 for sending cooling air into the apparatus main body 80, and the heat radiating portion 40 is configured.

As shown in FIG. 14, the heat radiating portion 40 is formed of a plurality of rods made of a material having good thermal conductivity. The heat is transferred to the heat radiating portion 40 and is radiated at the heat radiating portion 40.
In addition, the heat transfer body 70 is subjected to insulation treatment on the outer surface thereof in order to prevent a short circuit with an element or the like on the printed circuit board 21, prevents heat radiation into the apparatus main body 80, and increases the temperature inside the apparatus main body 80. In order to prevent this, a heat insulating layer 32 is formed.

[0032]

As is apparent from the above description, according to the present invention, the heat generated by the heating element can be efficiently radiated at the display unit.

Further, since the heat radiating portion is arranged at a position where the outside air can be taken in, cooling is performed without being affected by the warm air generated by the heat generating portion, so that the cooling efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a view showing the present invention, wherein (a) is a side view and (b) is an enlarged view of a hinge member.

2 (a) is a side view, FIG. 2 (b) is a plan view showing a shape of a heat transfer body with respect to a single-chip heating element, and FIGS. It is a top view which shows the shape of the heat conductor with respect to the heating element of a multi-chip.

3A and 3B are diagrams showing a heat transfer member attaching / detaching operation, in which FIG. 3A is a perspective view and FIG. 3B is a side view.

FIG. 4 is a view showing a hinge member.

5A and 5B are front views of the hinge member, and FIG. 5B is an enlarged view of a portion A in FIG.

FIG. 6 is a sectional view of a heat radiating unit.

FIG. 7 is a diagram showing a display unit, (a) is a front view,
(B) is an enlarged view of a B portion of (a).

FIG. 8 is a diagram showing heat insulation for a display panel.
(A) is an overall view, (b), (c) is an enlarged sectional view of a main part.

FIGS. 9A and 9B are diagrams showing heat insulation of a heat radiating unit, where FIG.
(B) is sectional drawing which shows the modification of (a).

FIG. 10 is a diagram showing a second embodiment of the present invention.

FIG. 11 is a diagram showing an exhaust state of warm air.

12A and 12B are diagrams showing an arrangement in a shelf, wherein FIG. 12A is a front view, and FIG. 12B is a side view showing a main part.

FIGS. 13A and 13B are views showing a third embodiment of the present invention, wherein FIG. 13A is a plan view, and FIG.

FIG. 14 is an enlarged view of a main part of FIG.

FIG. 15 is a diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Hinge member 20 Main part 30 Display part 31 Display panel 32 Heat insulation layer 40 Heat radiating part 41 Air gap 42 Fan device 50 Heat generating element 60 Heat receiving member 70 Heat transfer body 80 Device main body 81 Inlet 81a Louver 82 Exhaust 82a Louver 90 For overall cooling fan

Continuation of the front page (56) References JP-A-4-354010 (JP, A) JP-A-2-162754 (JP, A) JP-A-4-266091 (JP, A) JP-A-4-162497 (JP) JP-A-4-290107 (JP, A) JP-A-8-76892 (JP, A) JP-A-3-32487 (JP, U) JP-A-5-15487 (JP, U) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/34-23/473 G06F 1/00 H05K 7/20

Claims (3)

(57) [Claims] 1. A main body in which a heat receiving member is mounted on a heating element.
And a display unit having a heat radiating unit on the back surface, formed of a material having good thermal conductivity,
The display side fixed part is linked to the display side so that it can rotate
A hinge member provided on a pivot fixed to the body-side fixing portion.
Clamp the display side fixing part by the flange
And a plate between the flange and the display-side fixing part.
The heat receiving member and the main body side fixing portion, and the heat radiating portion and the display are formed with a spring interposed therebetween.
The lay-side fixing part is made of a material with good thermal conductivity.
Information processing devices connected by a heat transfer body . 2. The display according to claim 1, wherein said heat radiating portion is formed in a hollow shape having a plurality of gaps communicating with each other in a vertical direction.
Protrude between the panel and the radiator to the display panel side.
A low thermal conductor with strips against the display panel
The information processing apparatus according to claim 1, wherein a heat insulating layer is provided. 3. A heat receiving member mounted on a heating element and a heat sink formed of a material having good thermal conductivity.
A heat dissipating part formed by mounting a fan device on the top, and a heat transfer body having good thermal conductivity connecting the heat receiving member and the heat dissipating part
The heat receiving member is formed of a material having good heat conductivity,
A base that is fixed or joined to the thermal element by bonding or other means
And a heat transfer member fixed on the base member and cooperating with the base member.
Formed by a cover body that clamps the tip of the
An information processing device , wherein the heat radiating unit is disposed near an air inlet of the device main body .