JP2939731B2 - Partially plated product and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0101]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a partially plated product which is plated only where it is required, not the entire surface of a resin molded product, and a three-dimensional molded circuit component produced by the method for producing a partially plated product. It is about.

[0092]

2. Description of the Related Art Conventionally, a masking method is the most common method for producing a partially plated product. In this method, a resin that is not plated in a standard plating step of a product to be plated, mainly a vinyl chloride-based resin, is sprayed onto unnecessary portions of the plating to prevent plating. Further, there is a partial plating method by two-color molding, which is mainly used for manufacturing three-dimensional molded substrates and circuit components. At present, there are mainly three methods, one of which is a method using a resin containing a catalyst such as palladium as an easily plating resin. In this method, the catalyst is not applied in the plating step, so that the catalyst does not adhere to the difficult-to-plate resin, and it is possible to selectively plate only the resin containing the catalyst with high selectivity (Japanese Patent Application Laid-Open No. 63-5048
2). Another method is to perform the primary molding of an easily-plated resin until the steps of etching and applying a catalyst, and after drying, perform the secondary molding with a second resin so as to expose a portion requiring plating. . In this method, similarly to the method of the catalyst-containing resin, the two-color molded body does not go through the catalyst application step, so that the plating is selectively adhered only to the exposed portion of the primary molded body (Japanese Patent Publication No. 6-66538). ). Finally, primary molding is performed with an easily plating resin, and
There has also been reported a method of plating a molded article formed by performing secondary molding by exposing a part of the next molded article in a step of plating an easily plating resin (JP-A-57-108138).

[0093]

However, in the above-mentioned prior art, the masking method requires a coating step of a masking material, and it is difficult to accurately give up the masking coating. Precise closing is almost impossible. A photoresist method is available to make up for this drawback, but has the drawback that the equipment is large and the mass productivity is poor, and it is not suitable for extremely three-dimensional objects. In addition, in the method using a catalyst-containing resin, the catalyst-containing resin itself is expensive, and the catalyst contained in the resin must be evenly diffused in the resin molded product, and molding is very difficult. . 6-6653
In the method of No. 8, since there is much movement between the steps, a time loss occurs with the movement. Furthermore, the surface of the resin that has been etched and catalyzed is very sensitive, so it is highly possible that defects such as non-adhesion of plating or peeling of the plating film may occur due to scratches and dirt on the surface. high. When plating is performed in a plating step of an easily-platable resin in a molded article simply formed by two-color molding, adhesion of plating is also observed on a hard-to-plate resin. This is due to the fundamental factor that the hard-to-plate resin is not easily applied with a durable (adhesive) plating and is not absolutely not applied. In addition, a cationic surface conditioner (conditioner) mainly used in engineering plastics facilitates plating on hard-to-plate resins.

The present invention has been made to solve the above problems, and an object of the present invention is to use an easily-platable resin and a resin which is difficult to be plated in the step of plating the easily-plateable resin. By plating a two-color molded product that exposes the platable resin to an arbitrary shape, the use of expensive catalyst-containing resin can be used to minimize the movement between processes and minimize the adhesion of scratches and dirt. It is an object of the present invention to provide a method of manufacturing a partially plated product that can selectively prevent plating and selectively form only a portion requiring plating in any formable three-dimensional object, and a three-dimensional molded circuit component obtained by the method. .

[0056]

Means for Solving the Problems In order to solve the above problems, the present invention uses an easily-plateable resin and a resin that is difficult to plate in the plating step of the easily-plateable resin (hereinafter referred to as a difficult-to-plate resin). The easy-plating resin is molded in two colors so as to be exposed in an arbitrary shape, and after the catalyst is applied in the plating process of the easy-plating resin or after the activation of the catalyst, the catalyst containing an oxidizing agent as a main component is removed or the catalyst is inactivated. The gist of the present invention is to add an oxidation step (hereinafter referred to as an oxidation step), and a partially plated product and a three-dimensionally formed circuit component are provided by the above-described plating method.

[0086]

According to the above arrangement, a two-color molded product obtained by exposing the easy-plating resin to an arbitrary shape using the easy-plating resin and the hard-plating resin is provided in the easy-plating resin plating step. After etching, applying a catalyst, or activating the catalyst, treatment with a plating solution containing an oxidizing agent as a main component removes or inactivates a small amount of the catalyst weakly adsorbed on the difficult-to-plate resin. After the etching process,
In some cases, a process of surface conditioning (conditioner) for improving catalyst adsorption may be added to a resin that does not easily adsorb the catalyst. After that, the one which has been subjected to the catalyst application step is activated with a catalyst, and is subjected to chemical plating, and if necessary, various electroplating, whereby a partially plated product can be manufactured. In addition, a three-dimensional molded circuit can be formed by forming the exposed portion of the easily-plated resin into an electric circuit shape by the above-described method.

007

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a partially plated product according to the present invention will be described below with reference to the accompanying drawings. The drawings illustrate conceptually one example of the features of the present invention, and do not limit the shape or the like in practice.

First, a description will be given of a first embodiment. FIG.
Acrylonitrile-butadiene-
Using styrene copolymer (ABS) and polyethylene terephthalate (PET) as a hard-to-plate resin
It is a color molded product. First, a primary molded body 3 having a substantially T-shaped protrusion is formed from ABS resin. Next, wrap the other so as to expose the substantially T-shape with PET resin.
The next molded body 2 is molded in two colors with the second resin PET. Since the two-color molding technique is a known technique, a detailed description is omitted here.

The two-color molded body 1 is plated in a standard ABS plating process. The standard plating process for ABS is: 1. Degreasing process for removing dirt, dust, etc. on the molded product surface 2. An etching step of chemically roughening the ABS surface with a mixed acid of chromic acid and sulfuric acid. 3. A neutralization step of removing chromic acid adhering to the product surface with hydrochloric acid. 4. A catalyst providing step of providing a catalyst for depositing chemical plating. 5. Catalyst activation step of activating the applied catalyst Chemical plating is roughly performed as described above, and electroplating is performed after chemical plating according to the application. In the method for producing a partial plating according to the present invention, an oxidation step containing an oxidizing agent as a main component is added between the steps 4 and 5 or between the steps 5 and 6 in the above steps. In the oxidation step, the catalyst adhered to the resin surface is inactivated or removed by the oxidizing agent, so that the catalyst adhered to ABS, which is an easily plating resin with a large amount of adhered catalyst, remains, and only a small amount of the catalyst adheres. The catalyst on PET, which is a hard-to-plate resin, is removed.

As the oxidizing agent, various oxidizing agents such as potassium permanganate, hydrogen peroxide solution, formaldehyde, ammonia and the like can be used.
20 to 50 ° C.
The treatment is preferably performed for 5 seconds to 5 minutes. For example, in the case of potassium permanganate, 25 g at 0.01 g / L.
Particularly good results were obtained when the treatment was performed at a temperature of 1 ° C. for 1 minute. Since this condition in the present embodiment changes depending on the ABS molding condition and the etching condition, particularly the liquid composition and the condition in the catalyst application step, it is better to conduct a trial production in advance.
After passing through the oxidation step, the remaining standard steps are performed and chemical plating is performed, and then decorative plating such as electrolytic copper, nickel, and chromium plating is performed. It becomes a partially plated product with

In the above embodiment, AB is used as the easily plating resin.
S, PET was used as the hard-to-plate resin, but any easily-plateable resin material may be used as long as it is a resin that can be plated. Any resin may be used as long as uniform plating is difficult in the process. In this case, the standard plating step is different from the above ABS plating step, but an oxidation step may be added after the catalyst application step or the catalyst activation step of the plating resin resin step to be selected.

As a second embodiment, a three-dimensional molded circuit component in which the exposed portion of the easily-plateable resin is formed into an electric circuit will be described. FIG. 5 shows a simple three-dimensional molded circuit component 6. This part 6 is formed by forming a primary molded product 8 with an easily plating resin, and coating the secondary molded product 7 with a difficult-to-plate resin so as to expose the primary molded product 8 to a desired circuit shape. It is a color molded product. In this embodiment, a liquid crystal polymer for plating (LCP) is used as the easily-platable resin, and polyphenylene sulfide (PPS) is used as the hard-to-plate resin.

In the standard plating process of LCP, etching, neutralization, surface adjustment, and catalyst application are performed, and an oxidation process is added. Then, catalyst activation and electroless plating in the standard process are performed. Here, even if the oxidation step is added after the activation of the catalyst, not after the application of the catalyst, the same result can be obtained. As the oxidizing agent used in the oxidizing step, various oxidizing agents can be used as in the first embodiment. In this embodiment, as the oxidizing agent,
By performing treatment with 10% hydrogen peroxide solution at room temperature for 5 minutes, selective plating with particularly good selectivity to LCP was performed. This is L
This is because the amount of the catalyst attached to the CP is much larger than the amount of the catalyst attached to the PPS, so that the catalytic power on the PPS is lost. However, the LCP contains a sufficient amount of catalyst to deposit electroless plating.

By plating the three-dimensional molded circuit component 6 as described above, the primary molded product 8 exposed from the secondary molded product 7
Plating can be selectively applied only to the circuit shape of FIG.
In this embodiment, LCP was used as the easily-platable resin and PPS was used as the hard-to-plate resin. However, any resin that satisfies the performance as in the first embodiment may be used. FIG. 8 shows a conceptual diagram of the plating step according to the present invention. In FIG. 8, the surface adjustment (e) can be omitted depending on the resin used, and steps such as pre-etching and post-etching (post-rinsing) may be added before and after the etching (c).

The present invention is not limited to the above-described embodiment, and may be implemented by appropriately changing a part of the configuration without departing from the spirit of the invention.

As described above in detail, according to the partially plated product and the method of manufacturing the same of the present invention, it is not necessary to use an expensive resin such as a resin containing a catalyst, so that the product is inexpensively moved between processes. To minimize the occurrence of scratches, dirt, etc., thereby reducing serious malfunctions that occur over time.
It is possible to perform selective selective plating only on portions requiring plating of any three-dimensionally shaped object that can be formed, and to provide an excellent effect of providing a novel method for manufacturing a three-dimensionally formed circuit component.

[Brief description of the drawings]

FIG. 1 shows a second embodiment of the present invention.
Front view of color molded product

FIG. 2 is a sectional view taken along line AA of FIG. 1 in a first embodiment (before etching).

FIG. 3 is a cross-sectional view of the first embodiment taken along line AA of FIG. 1 (after etching);

FIG. 4 is a cross-sectional view of the first embodiment taken along line AA of FIG. 1 (after decorative plating).

FIG. 5 is a front view of the three-dimensional molded circuit component in the first embodiment.

FIG. 6 is a sectional view taken along line BB of FIG. 1 (before electroless plating) in the first embodiment.

FIG. 7 is a cross-sectional view taken along line BB of FIG. 1 (after electroless plating) in the first embodiment.

FIG. 8 is a conceptual diagram of a plating step of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Two-color molded product 2 ... Secondary molded product 3 ... Primary molded product 4 ... Etched surface 5 ... Plating film 6 ... Three-dimensional molded circuit component 7 ... Secondary molded product 8 ... Primary molded product 9 ... Through fall 10 ... Plating film

Claims (2)

(57) [Claims] 1. An easy-to-plate resin that can be durable and a resin that is difficult to be plated in a standard plating step of the easy-to-plate resin are used to expose the surface of the easily-plateable resin molded article to an arbitrary shape. Two-color molding (two-shot molding)
After removing the catalyst containing the oxidizing agent as a main component after the catalyst applying step or the catalyst activating step of the standard plating step of the easy-plating resin, or adding the catalyst inactivating step, the easy-plating resin A method of manufacturing a partially plated product, wherein only a portion is plated reliably, and the resin which is difficult to plate is not plated reliably. 2. A molded article formed by two-color molding of an easily-plateable resin capable of durable plating and a resin which is difficult to be plated in a standard plating step of the easily-plateable resin, wherein an exposed portion of the easily-plateable resin is removed. A three-dimensional molded circuit component configured to have a desired electric circuit shape and plated by the method for manufacturing a partially plated product according to claim 1 and having an electric circuit shape by a plating film.