JP2934373B2 - Resin sealing device for semiconductor device and method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device for a semiconductor device which is resin molded by using a transfer molding press, and a method for manufacturing a semiconductor device using the resin sealing device.

[0002]

2. Description of the Related Art Generally, as a resin sealing device for a semiconductor device, a resin tablet melted in a transfer pot is pressure-fed into a cavity by a plunger and then molded after clamping two upper and lower molds. It has been known.

Usually, a resin-sealing device for a semiconductor device of this type includes a fixed-side chase having a transfer pot in which a pressurizing plunger of a resin tablet melted in the center advances and retreats and a cavity forming one package. A platen section to which a block is fixed, a platen section to which a movable-side chase block having a cavity forming the other package and fixed to a movable side provided below the chase block of the platen section is fixed; An apparatus having an ejector mechanism having ejector pins which advance and retreat into respective cavities provided in the chase block on the board portion and the chase block on the fixed side is used.

The above-described resin sealing device for a semiconductor device will be described more specifically with reference to, for example, FIGS.
According to each figure, a conventional resin sealing device for a semiconductor device includes a runner 1, a plurality of cavities 2 arranged on each side of the runner 1, and a plurality of cavities 2 arranged between the cavities 2, 2. Each frame positioning pin 3 is arranged, a chase block 4 having the same, and a platen 7 to which the chase block 4 is fixed by bolts 6 via fixing members 5. When the semiconductor device is sealed with resin, the lead frame 8 is mounted on the chase block 4 in a state where the lead frame 8 is positioned via the frame positioning pins 3.

In recent years, resin-sealed semiconductor devices have been diversified, and various forms of resin sealing have been adopted. Therefore, the chase block 4 is replaced according to the form of the sealing resin of the semiconductor device, and each product is manufactured. It is common to deal with it. Conventionally, in order to quickly replace the chase block 4, the chase block 4 is fixed to the surface plate 7 by the bolt 6 via the fixing tool 5 as described above, or the chase block is Is fixed to the surface plate.

Further, since the use of an automatic machine for mounting the lead frame 8 and the resin tablet on the chase block 4 is increasing year by year, the operation efficiency of the resin sealing device or the operation efficiency of the resin sealing device is increased in accordance with the automation. The requirements for mounting accuracy are becoming more and more severe.

[0007]

However, in the case of a conventional resin sealing device for a semiconductor device, as shown in FIGS. 3 and 4, frame positioning pins 3 for positioning the two lead frames 8, 8 respectively. However, since both are arranged along the runner 1 side, when the lead frame 8 is placed on the chase block 4 by an automatic machine or the like, one of the lead frames 8 is inverted by the inversion mechanism of the automatic machine and In the case of an automatic machine that does not have a uniform orientation or a reversing mechanism, when setting the lead frame 8 in the automatic machine, it is necessary to change the direction every other lead frame 8 and set it alternately. However, there is a problem that the operation is complicated.

[0008] The present invention has been made to solve the above problems, a resin sealing apparatus and a resin sealing the semi-conductor device that can be simplified the structure of an automatic machine for placing a lead frame It is an object of the present invention to provide a method for manufacturing a semiconductor device using the device.

[0009]

According to a first aspect of the present invention, a resin sealing device for a semiconductor device includes a plurality of chase blocks for mounting lead frames in parallel and in the same direction.

According to a second aspect of the present invention, in a method of manufacturing a semiconductor device, a plunger is used to form a pot in a cavity of a resin sealing device having a plurality of chase blocks on which lead frames are placed in parallel and in the same direction. The resin melted in the step is pressure-fed and molded.

According to a third aspect of the present invention, there is provided a resin sealing device for a semiconductor device, comprising a plurality of chase blocks for alternately disposing a pot into which a resin is inserted and a lead frame.

According to a fourth aspect of the present invention, in a method of manufacturing a semiconductor device, a plunger is provided in a cavity of a resin sealing device having a plurality of chase blocks in which pots for inserting a resin and lead frames are alternately arranged. The resin melted in the pot is pressed and molded.

[0013]

According to the first aspect of the present invention, a lead frame can be placed on a plurality of chase blocks in parallel and in the same direction, so that the lead frame can be placed on the chase block without being inverted. .

According to a second aspect of the present invention, when a semiconductor device is manufactured by the resin sealing device for a semiconductor device of the first aspect, the semiconductor device is mounted on a plurality of chase blocks without turning over the lead frame. The device can be manufactured.

According to the third aspect of the present invention, since the pot for inserting the resin and the lead frame are alternately arranged, the automatic machine for inserting the resin tablet and the automatic machine for mounting the lead frame are unitized. The automatic machine can be made compact.

According to the fourth aspect of the present invention, when the semiconductor device is manufactured by using the resin sealing device for a semiconductor device according to the third aspect, the lead frame and the resin tablet are securely connected.
A semiconductor device can be manufactured by setting the semiconductor device in a plurality of chase blocks.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. In each of the drawings, FIG. 1 is a plan view showing an embodiment of a resin sealing device for a semiconductor device according to the present invention, and FIG. 2 is a side view of the resin sealing device for a semiconductor device shown in FIG.

As shown in FIG. 1, the resin sealing device for a semiconductor device of this embodiment has a chase block 10 formed in a rectangular shape, and the chase block 10 is fixed to the chase block 10 from both sides in the longitudinal direction via a fixture 5. A surface plate 7 fixed by bolts 6 to form a lower die. On the surface of the chase block 10, runners 11 and sub-runners 12 are formed in a comb shape in the lateral direction, and a pot 13 for inserting a resin tablet (not shown) is formed at the center of the runner 11. , Each of the sub-runners 1
A cavity 14 is formed at each of the extended ends of the two. Further, positioning pins 3 for positioning the lead frame 8 are formed near the tips of the sub-runners 12, respectively. Then, a plurality of chase blocks 10 are placed on the base plate 7 in a vertical direction from the lower side to the upper side in FIG. Accordingly, the lead frames 8 placed on the respective chase blocks 10 are arranged in the longitudinal direction on the surface plate portion 7 and are arranged in the same direction, whereby the pots 13 and the lead frames 8 are alternately arranged. It is in a state of being left.

As shown in FIG. 2, for example, a chase block 10 is attached to the rear end of the platen 7 from the platen 7.
Is provided. A space 16 is formed in the retaining block 15, and a pressing mechanism 17 for pressing the chase block 10 from the rear end is provided in the space 16. The pressing mechanism 17 includes a spring 17 </ b> A housed in the space 16.
A push rod 17B and a screw 17C respectively attached to both ends of the spring 17A;
And a dial 17D attached to an outer end of the dial 17D. The push rod 17B of the pressing mechanism 17 projects from the space 16 toward the chase block 10, and
The screw 17 </ b> C protrudes from the space 16 to the side opposite to the chase block 10. The dial 17D attached to the projecting end of the screw 17C is configured to appropriately adjust the spring force from outside the retaining block 15.
Further, the retaining block 1 is provided at the front end of the base 7.
5 is provided with a receiving block 18 for receiving the chase block 10 pressed by the pressing mechanism 17, and a gap 19 is formed between the rear end chase block 10 and the retaining block 15. Surface plate part 7
A pin 20 is attached to the rear end of the
Thereby, the pressing mechanism 17 of the retaining block 15 functions.

Next, the operation will be described. A plurality of chase blocks 10 are sequentially placed on the surface plate 7 in the same direction, and finally the retaining block 15 is placed on the surface plate 7. The locked retaining block 15 and the receiving block 18 prevent the falling off from the base 7. In this state, the chase block 10 is fixed to the platen 7 from both sides using the fixtures 5 and the bolts 6. Then, the lead frames 8 can be placed on the respective chase blocks 10 in parallel in the same direction. Therefore, when performing the resin sealing, all the lead frames 8 can be placed on the respective chase blocks 10 in the same direction, and it is not necessary to change the direction of the lead frames 8 every other as in the related art. , Lead frame 8
Can be eliminated. Also, the lead frame 8 and the resin tablet are chase block 10 by an automatic machine.
When mounted on the chase block 10, the pressing mechanism 1
7 and is placed in a predetermined position.

As described above, according to this embodiment, the lead frames 8 can be placed in parallel in the same direction on the chase block 10, so that there is no need to provide a reversing mechanism in the automatic machine, and Can be simplified, and a setting error due to an inversion error of the lead frame 8 can be eliminated.

Further, according to the present embodiment, since the pot 13 for inserting the resin tablet and the lead frame 8 are alternately arranged, an automatic machine for inserting the resin tablet and an automatic machine for mounting the lead frame 8 are unitized. As a result, the automatic machine itself can be made compact, whereby the resin sealing device for semiconductors can be manufactured at low cost and maintenance becomes easy.

According to the present embodiment, since the chase block 10 is pressed from the end by the pressing mechanism 17 of the retaining block 15, the mold clamping, the mounting of the lead frame 8 and the mold clamping are repeated. The chase block 10 can be fixed at a fixed position even when the
In addition, the placement error of the resin tablet can be reliably eliminated. Further, if the spring 17C of the pressing mechanism 17 deteriorates due to aging, the spring force deteriorated by the dial 17D can be increased to recover the initial spring force.

In the above embodiment, the positioning pin 3 of the lead frame 8 is described as being on the pot 13 side. Similar effects can be expected.

Although one pot 13 is provided for one chase block 10, the same operation and effect as in the above embodiment can be expected even if there are a plurality of pots 13.

Further, the case where the retaining block 15 of the chase block 10 is provided in the lower mold has been described. However, the same operation and effect as in the above embodiment can be obtained even if the retaining block 15 is provided only in the upper mold or in both upper and lower molds. Can be expected.

The pressing mechanism 1 for the retaining block 15
7, one or three or more can achieve the same operation and effect as in the above embodiment.

[0028]

As described above, according to the resin sealing device for a semiconductor device according to the first aspect of the present invention, the lead frames are mounted on a plurality of chase blocks in parallel in the same direction. Since the lead frame can be placed, the lead frame can be placed on the chase block without being inverted, and the structure of the automatic machine for placing the lead frame can be simplified.

According to the method of manufacturing a semiconductor device according to the second aspect of the present invention, the semiconductor device is manufactured by using the resin sealing device for a semiconductor device according to the first aspect of the present invention. There is an effect that a semiconductor device can be efficiently manufactured with a high yield without setting errors.

According to a third aspect of the present invention, there is provided a resin sealing device for a semiconductor device, wherein a plurality of chase blocks for alternately disposing pots and lead frames into which a resin is inserted are provided. An automatic machine for inserting a tablet and an automatic machine for mounting a lead frame can be unitized and manufactured at low cost.

According to the method of manufacturing a semiconductor device according to a fourth aspect of the present invention, the semiconductor device is manufactured by using the resin sealing device for a semiconductor device according to the third aspect of the present invention. There is an effect that a semiconductor device can be efficiently manufactured with a higher yield without setting errors.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a resin sealing device for a semiconductor device of the present invention.

FIG. 2 is a side view of the resin sealing device of the semiconductor device shown in FIG.

FIG. 3 is a plan view showing an example of a conventional resin sealing device for a semiconductor device.

4 is a side view of the resin sealing device of the semiconductor device shown in FIG.

[Explanation of symbols]

10 chase blocks, 11 runners, 12 sub-runners, 13 pots, 14 cavities, 15 retaining blocks.

──────────────────────────────────────────────────の Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/56

Claims (4)

(57) [Claims] 1. A resin sealing device for a semiconductor device in which resin is sealed at a plurality of positions of a lead frame, the semiconductor device comprising a plurality of chase blocks for mounting the lead frames in parallel and in the same direction. Resin sealing device. 2. A semiconductor formed by pressure-feeding resin melted in a pot by a plunger into a cavity of a resin sealing device having a plurality of chase blocks on which lead frames are placed in parallel and in the same direction. Device manufacturing method. 3. A resin sealing device for a semiconductor device in which a resin is sealed at a plurality of portions of a lead frame, wherein a plurality of chase blocks for alternately disposing a pot into which a resin is inserted and the lead frame are provided. A resin sealing device for a semiconductor device. 4. A resin melted in a pot is fed by a plunger into a cavity of a resin sealing device having a plurality of chase blocks in which pots and lead frames into which the resin is inserted are alternately arranged. A method for manufacturing a semiconductor device to be molded.