JP2933427B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device,
In particular, the present invention relates to a tape sticking device for protecting the surface of a semiconductor wafer.

[0002]

2. Description of the Related Art A conventional semiconductor device manufacturing apparatus is
As shown in FIG. 4, a tape attaching portion including a tape attaching shaft 3 for attaching the tape 2 to the transferred wafer 1, a peeling film winding shaft 4, a sticking roller 5, and a tape winding shaft 6, and an outer periphery of the wafer. And a cutting section having a cutter 7 for cutting the tape. When the wafer is transported and arrives at the application roller 5, the tape peeling shaft 3, the peeling film winding shaft 4, the tape winding shaft 6
Is operated, the tape is fed out, and the tape and the wafer 1 are peeled off by the pressure of the peeling roller.
All operations are controlled by the controller unit 11.

The tension of the tape is determined only by the rotation speed of the peeling film winding shaft 4 and the tape winding shaft 6. The shaft with tape peeling has a certain load but no motor.

[0004]

In a conventional semiconductor manufacturing apparatus, the strength of the tape is determined only by the rotation speed of the peeling film winding shaft and the tape winding shaft. Because the tape is attached, if the tape tension is large, the tape shrinks and becomes smaller than the diameter of the wafer. There was a point.

[0005]

The semiconductor device manufacturing apparatus of the present invention comprises a tape thickness measuring section for measuring the tape tension and a control section for controlling the tape tension based on the tape thickness data. Have.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view of an apparatus according to an embodiment of the present invention.

[0008] A first tape chuck 13 for adjusting the tension of the tape and a second tape chuck 14 are provided between the guide roller 16 and the dropping roller 12,
Grab the tape. The capacitance-type thickness measuring unit 11 for measuring the tension of the tape is moved so as to be near the center of the semiconductor wafer 1, and the thickness of the area surrounded by the four tape chucks is measured at one or more points. The controller unit performs field-back of the data of the tape thickness so that the tape thickness and the tape tension become the same, and controls the four tape chucks. (FIGS. 1 and 2A). Next, the semiconductor wafer 1 is conveyed to the tape attaching part ((b) of FIG. 2),
In order to increase the degree of adhesion between the semiconductor wafer 1 and the tape 2, the tape is traversed on the semiconductor wafer by the tape holding roller 17 ((c) in FIG. 2). ((D) of FIG. 2).

FIG. 3 is a flowchart of the above operation.

[0010]

As described above, according to the present invention, since the tape tension is measured as the tape thickness and there is a control unit for controlling the tape tension from the tape, the tape used completely covers the wafer surface. In addition, by specifying the tape thickness that does not shrink, the tape can always be stuck with a constant tension, and the wafer surface can be reliably protected.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing one embodiment of the present invention.

FIGS. 2A and 2B are diagrams for explaining the operation of one embodiment of the present invention, in which FIGS. 2A and 2B are plan views, and FIGS.
Is a front view.

FIG. 3 is a flowchart of the operation.

FIG. 4 is a schematic view showing a conventional manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Tape 3 Tape sticking axis 4 Peeling film winding shaft 5 Sticking roller 6 Tape winding shaft 7 Cutter 8 Table 9 Tape separator wedge 10 Peeling film 11 Controller part 12 Dropping roller 13 First tape chuck 14 Second Tape chuck 15 Thickness measuring unit 16 Guide roller 17 Tape holding roller

Claims (1)

(57) [Claims] 1. A semiconductor device, comprising: a tape attaching device for protecting a surface of a semiconductor wafer, a tape thickness measuring unit for measuring a tape tension, and a mechanism for controlling the tape tension. Manufacturing equipment.