JP2931193B2 - Electric circuit and method of forming electric circuit - Google Patents

Electric circuit and method of forming electric circuit

Info

Publication number
JP2931193B2
JP2931193B2 JP33618193A JP33618193A JP2931193B2 JP 2931193 B2 JP2931193 B2 JP 2931193B2 JP 33618193 A JP33618193 A JP 33618193A JP 33618193 A JP33618193 A JP 33618193A JP 2931193 B2 JP2931193 B2 JP 2931193B2
Authority
JP
Japan
Prior art keywords
housing
resin
molding
wiring member
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33618193A
Other languages
Japanese (ja)
Other versions
JPH07202452A (en
Inventor
栄之資 足立
治 浜田
享 木村
敏文 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP33618193A priority Critical patent/JP2931193B2/en
Publication of JPH07202452A publication Critical patent/JPH07202452A/en
Application granted granted Critical
Publication of JP2931193B2 publication Critical patent/JP2931193B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電気機器製品における
筺体、配線板、電気部品の組み立て接続構造に係わり、
特にプラスチックモールド筺体等に搭載される大電流用
電気回路および電気回路の形成方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling connection structure of a housing, a wiring board, and an electric component in an electric device product.
In particular, the present invention relates to a high-current electric circuit mounted on a plastic mold housing or the like and a method for forming the electric circuit .

【0002】[0002]

【従来の技術】最近の電子機器はデバイスの高機能化に
伴い、小型化、高密度化が著しく、そのため実装構造が
複雑になり、組み立て、保守に必要以上の工程を要して
いた。図11は公知の配線方法を示した平面図である。
図において、1は配線部材でここではワイヤーハーネス
と呼ばれる圧着端子付電線を示す。2はワイヤーハーネ
ス1を固定するための保持具でここではクランプと呼
ぶ、3は電装部品、4は電装部品組み付け窓、5はこれ
らが実装されている筺体を示す。
2. Description of the Related Art In recent years, electronic devices have been significantly reduced in size and density with the advancement of the functions of the devices, and as a result, the mounting structure has become complicated, and extra steps have been required for assembly and maintenance. FIG. 11 is a plan view showing a known wiring method.
In the drawing, reference numeral 1 denotes a wiring member, which is an electric wire with a crimp terminal, which is called a wire harness here. 2 is a holder for fixing the wire harness 1 and is called a clamp here. 3 is an electrical component, 4 is an electrical component assembling window, and 5 is a housing on which these are mounted.

【0003】上記筺体に組み込まれる回路の製造方法
は、まず筺体5の必要な箇所にワイヤーハーネス1を配
置し、クランプ2により固定する。次に電装部品組み付
け窓4にワイヤーハーネス1を挿入する。最後に筺体5
のワイヤーハーネス1が配線されていない面に取り出さ
れたワイヤーハーネス1の端部に電装部品3を取り付け
る。
[0003] In the method of manufacturing a circuit incorporated in the housing, first, a wire harness 1 is arranged at a necessary portion of a housing 5 and fixed by a clamp 2. Next, the wire harness 1 is inserted into the electrical component assembling window 4. Finally, housing 5
The electrical component 3 is attached to the end of the wire harness 1 taken out on the surface where the wire harness 1 is not wired.

【0004】図12は特公平3−52239号公報に示
された従来の配線方法で、電気機器のリード線の保持方
法を示した部分構成図である。図において1はリード線
からなる配線部材、2はリード線がばらけないよう固定
する保持具、5は筺体を示す。あらかじめリード1を金
型内の必要箇所に固定し、筺体成形時に、金型内に配置
されたリード線1と保持部2を同時に一体成形して、部
分的にリード線を成形材で保持する方法である。
FIG. 12 is a partial configuration diagram showing a conventional wiring method disclosed in Japanese Patent Publication No. 3-52239, showing a method of holding a lead wire of an electric device. In the figure, reference numeral 1 denotes a wiring member made of a lead wire, 2 denotes a holder for fixing the lead wire so as not to be separated and 5 denotes a housing. The lead 1 is fixed to a required portion in the mold in advance, and at the time of molding the housing, the lead wire 1 and the holding portion 2 arranged in the mold are simultaneously molded integrally, and the lead wire is partially held by the molding material. Is the way.

【0005】以上の例は、配線部材としてワイヤーハー
ネス等主として被覆電線を用いた場合の例であるが、ワ
イヤーハーネスを用いない例として例えば、筺体成形時
にフレキシブルプリント基板を配線回路として一体成形
する例も実開平1−112146号公報、特開昭63−
98194号公報等で紹介されている。
The above-mentioned example is an example in which a covered wire such as a wire harness is mainly used as a wiring member. An example in which a wire harness is not used, for example, an example in which a flexible printed board is integrally formed as a wiring circuit at the time of molding a housing. Also, Japanese Utility Model Laid-Open Publication No. 1-112146,
98194.

【0006】また、大電流回路のように発熱を伴う回路
の場合には、放熱のための冷却水路や、回路部に冷却用
のファンを配置することで、放熱対策を講じてきた。
In the case of a circuit that generates heat, such as a large current circuit, measures have been taken to dissipate heat by arranging a cooling water channel for heat dissipation and a cooling fan in the circuit portion.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、このよ
うな方法による回路形成方法、特に上記の公知の方法で
は、ワイヤーハーネスの組み付けが必要であり、その作
業に手間がかかるだけでなく、ワイヤーハーネス固定用
クランプや、保護用プロテクタなどが必要となり部品点
数が多くなる。また、最近では高密度実装化がさらに進
んでおり、ワイヤーハーネスの配線路を確保することが
難しくなっている。さらに特公平3−52239号公報
の例によれば、あらかじめリード線を金型内の必要箇所
に固定し、筺体成形時に金型内に配置されたリード線を
保持するための保持部を一体成形して部分的にリード線
を成形材で保持する方法であるため、保持部で固定され
る箇所以外のリード線部分が、成形時に動かないように
固定するためのリード線収容部を設けるための加工が金
型に必要であり、筺体樹脂や被覆電線の被覆部材の種類
によっては成形時の熱で電線の被覆が溶融し、特により
線からなる配線部材では損傷を受け易く、また保持部か
ら保持部までの間での電線の弛みが発生する場合が考え
られる。以上の理由でワイヤーハーネスを用いない回路
形成法が必要である。一方、ワイヤーハーネスを解消し
た例としてフレキシブルプリント基板の利用例がある。
しかし、フレキシブルプリント基板を一体成形する方法
により回路を得てもこれを筺体に搭載する場合、フレキ
シブルプリント基板と筺体との接着強度が問題となる。
多くの場合、フレキシブルプリント基板は、エポキシ樹
脂のような接着性の低い材質からなるため、高強度の接
着は難しく、コストがかかる。さらに、フレキシブルプ
リント基板では、例えば10A以上の大電流を通電する
ことは難しい。また、大電流用回路においては、放熱の
ための冷却水路やファンの取り付けに必要な面積や空間
を確保する必要があるために、これらが筺体の小型化の
妨げとなっていた。
However, the circuit forming method by such a method, particularly the above-mentioned known method, requires assembling of a wire harness, which requires not only a troublesome work but also a fixing of the wire harness. Clamps and protective protectors are required, and the number of parts increases. In recent years, high-density mounting has been further advanced, and it has become difficult to secure a wiring path for a wire harness. Further, according to the example of Japanese Patent Publication No. 3-52239, a lead wire is fixed to a required portion in a mold in advance, and a holding portion for holding the lead wire arranged in the mold at the time of molding the housing is integrally formed. Since the lead wire is partially held by the molding material, the lead wire portion other than the portion fixed by the holding portion is provided with a lead wire accommodating portion for fixing so as not to move during molding. Processing is necessary for the mold, and depending on the type of housing resin and the covering member of the covered electric wire, the heat of the molding melts the covering of the electric wire, and especially the wiring member made of stranded wire is easily damaged, and It is conceivable that the electric wire is loosened up to the holding portion. For the above reasons, a circuit forming method that does not use a wire harness is required. On the other hand, there is an example of using a flexible printed circuit board as an example of eliminating the wire harness.
However, even when a circuit is obtained by a method of integrally molding a flexible printed board, when the circuit is mounted on a housing, the adhesion strength between the flexible printed board and the housing becomes a problem.
In many cases, the flexible printed circuit board is made of a material having low adhesiveness such as epoxy resin, so that high-strength bonding is difficult and costly. Furthermore, it is difficult for a flexible printed circuit board to pass a large current of, for example, 10 A or more. Further, in the circuit for large current, it is necessary to secure an area and a space necessary for mounting a cooling water channel for radiation and a fan, and these hinder the miniaturization of the housing.

【0008】この発明は、上記のような問題を解消する
ためになされたもので、筺体の小型化、高密度実装化を
実現するために、最小限の配線路を確保し、安価でかつ
信頼性の高い電気回路及び電気回路の形成方法を提供す
ることを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and in order to realize a compact housing and high-density mounting, a minimum wiring path is secured, and it is inexpensive and reliable. It is an object to provide an electric circuit having high reliability and a method for forming the electric circuit.

【0009】[0009]

【課題を解決するための手段】本発明の請求項1の発明
に係る電気回路は、樹脂からなる筺体と、該筺体の内部
あるいは表層部に回路を形成する配線部材と、該配線部
材の外方に筺体を構成する樹脂よりも軟化温度が高くか
つ熱膨張係数が大きい樹脂層とを備え、上記筺体と上記
配線部材の外方の樹脂層との間に間隙を有するものであ
る。
According to a first aspect of the present invention, there is provided an electric circuit comprising: a housing made of resin; a wiring member for forming a circuit inside or on a surface layer of the housing ; softening temperature than the resin constituting the housing toward the high Cucamonga
And a resin layer having a large thermal expansion coefficient.
There is a gap between the wiring member and the resin layer outside the wiring member .

【0010】本発明の請求項2の発明に係る電気回路
形成方法は、筺体を構成する樹脂より軟化温度が高くか
つ熱膨張係数の大きい樹脂を被覆した配線部材をインサ
ートして筐体を成形し、上記筐体と上記配線部材の被覆
樹脂との間に間隙を形成して、上記筐体内に電気回路を
形成するようにしたものである。
[0010] The electric circuit according to claim 2 of the present invention .
Is the forming method higher in softening temperature than the resin that composes the housing?
Insulation of wiring members coated with resin with large thermal expansion coefficient
To form a housing and cover the housing and the wiring member.
Form a gap between the resin and the electric circuit inside the housing
Ru der those so as to form.

【0011】本発明の請求項3の発明に係る電気回路
形成方法は、筺体成形時に筺体樹脂より熱膨張係数が大
きい樹脂からなる棒材あるいは金属からなる棒材をイン
サートし、筺体成形後に上記棒材を除去することにより
配線部材を配置する溝または空洞を形成したものであ
る。
[0011]Claims of the inventionElectric circuit according to the third aspect of the inventionof
The molding method has a larger coefficient of thermal expansion than the casing resin when molding the casing.
Insert a bar made of resin or metal
By removing the bar material after molding the housing
Grooves or cavities in which wiring members are placed
You.

【0012】本発明の請求項4の発明に係る電気回路の
形成方法は、請求項3において、筺体成形時に、潤滑剤
の塗布された棒材を用いることを規定したものである。
According to a fourth aspect of the present invention, there is provided a method for forming an electric circuit according to the third aspect, wherein the lubricant is added when the housing is formed.
It is specified that a bar coated with is used .

【0013】本発明の請求項5の発明に係る電気回路の
形成方法は、請求項3において、筺体成形時に、潤滑膜
の形成された棒材を用いることを規定したものである。
According to a fifth aspect of the present invention, there is provided a method for forming an electric circuit , comprising the steps of:
Ru Der provided to define the use of the formed rod.

【0014】[0014]

【0015】[0015]

【0016】[0016]

【0017】[0017]

【0018】[0018]

【0019】[0019]

【0020】[0020]

【0021】[0021]

【0022】[0022]

【0023】[0023]

【0024】[0024]

【0025】[0025]

【0026】[0026]

【作用】本発明の請求項1の発明に係る電気回路では、
配線部材の外方に筺体樹脂より軟化温度が高い樹脂層が
配置されているため、筺体成形時に樹脂層が溶融するこ
となく配線部材を保護する。また、この樹脂層が筺体樹
脂より熱膨脹係数が大きいため、筺体成形後に筺体と樹
脂層の間に筺体樹脂の硬化収縮と配線部材の被覆樹脂の
収縮差による間隙が形成され、配線部材の自由度が向上
する。
In the electric circuit according to the first aspect of the present invention ,
Since the resin layer having a softening temperature higher than that of the housing resin is arranged outside the wiring member, the wiring member is protected without melting the resin layer at the time of molding the housing . Also, this resin layer is
Since the coefficient of thermal expansion is higher than that of fat,
The curing shrinkage of the housing resin and the resin
A gap is formed due to the difference in shrinkage, improving the flexibility of the wiring member
I do.

【0027】本発明の請求項2の発明に係る電気回路
形成方法では、筺体成形時に筺体樹脂より軟化温度が高
い樹脂を被覆した配線部材を、必要な回路としてインサ
ートしたので、成形中あるいは成形後に配線部材の被覆
が溶融しないで、筐体内に配線部材を埋め込むことがで
きる。また、配線部材の被覆樹脂がさらに筺体樹脂より
熱膨脹係数が大きいため、筐体内に配線部材を埋め込む
ことができるだけでなく、成形後筺体樹脂の硬化収縮
と、配線部材の被覆樹脂の収縮差で隙間が形成され、配
線部材が自由に動くことが可能となるので、部品等の取
り付けが容易となる。
According to the second aspect of the present invention ,
In the forming method, the softening temperature is higher than the housing resin during housing molding.
Insulate the wiring member coated with a new resin as a necessary circuit.
The wiring member is covered during or after molding.
Can be embedded in the housing without melting.
Wear. In addition, the coating resin of the wiring member is more
Embedding wiring members in housing due to high thermal expansion coefficient
As well as shrinkage of the housing resin after molding
A gap is formed due to the difference in shrinkage of the coating resin of the wiring member,
Since the wire members can move freely, parts can be collected.
Mounting is easy.

【0028】本発明の請求項3の発明に係る電気回路
形成方法では、筐体成形時に成形樹脂よりも熱膨張係数
の大きな樹脂からなる棒材あるいは金属からなる棒材を
筺体の任意の場所にインサートしたので、成形後筺体樹
脂の硬化収縮と、棒材樹脂の収縮差で間隙が発生し、簡
便に棒材を抜き去ることが可能となる。除去した棒材の
場所に形成された溝または空洞部に配線部材を配置し、
回路とするので、筐体内に配線部材を埋め込むことがで
きる。
According to a third aspect of the present invention, there is provided an electric circuit comprising :
In the forming method , the coefficient of thermal expansion is smaller than the molding resin when molding the housing.
Bars made of resin or metal bars
Since it is inserted anywhere in the housing,
A gap is created due to the difference between the hardening shrinkage of the fat and the shrinkage of the bar material resin.
The bar can be pulled out of the flight. Of the removed bar
Place the wiring member in the groove or cavity formed in the place,
Because it is a circuit, wiring members can be embedded in the housing.
Wear.

【0029】また、この発明の請求項4に係る電気回路
の形成方法では、請求項3において、筐体に配線部材の
配置する溝または空洞を形成する手段として用いる棒材
に潤滑剤を塗布しているので、成形時に棒材が成形樹脂
に凝着することなく、成形後に樹脂から容易に除去する
ことが可能となる。
[0029] In the method for forming the electrical circuit according to claim 4 of this invention, in claim 3, the wiring member to the housing
Bar used as a means for forming grooves or cavities to be placed
Since the lubricant is applied to the
Easily removed from resin after molding without sticking to
It becomes possible.

【0030】また、この発明の請求項5に係る電気回路
の形成方法は、請求項3において、筐体に配線部材の配
置する溝または空洞を形成する手段として用いる棒材に
潤滑膜が形成されているので、成形時に棒材が成形樹脂
に凝着することなく、成形後に樹脂から容易に除去する
ことが可能となる。
According to a fifth aspect of the present invention, there is provided a method of forming an electric circuit according to the third aspect, wherein the wiring member is provided on the housing.
For rods used as a means of forming grooves or cavities to be placed
Since the lubricating film is formed, the rod material is
Easily removed from resin after molding without sticking to
It becomes possible .

【0031】[0031]

【0032】[0032]

【0033】[0033]

【0034】[0034]

【0035】[0035]

【0036】[0036]

【0037】[0037]

【0038】[0038]

【0039】[0039]

【0040】[0040]

【0041】[0041]

【0042】[0042]

【実施例】実施例1. 以下、この発明の一実施例を図を用いて説明する。図1
にこの発明による電気回路を用いた筺体の一部を示す。
図中のA−Aの破線部の断面構造も併せて示す。図にお
いて、1は配線部材でここでは単芯銅線、3は電装部品
でここではパワーモジュール等のパワー部品、5は筺体
で例えば、ABS樹脂を主原料とする強化樹脂、具体例
としては三菱レイヨン製ダイヤアロイFBー930CP
等強化樹脂からなる、6は配線部材の外方に配置する樹
脂層でここではフッ素系のテフロン(登録商標)樹脂
例を示す。5の筺体材である例えば三菱レイヨン製ダイ
ヤアロイFBー930CP樹脂の軟化温度は約110
℃、熱膨張係数は1.3×10-5/℃で、6のフッ素系
テフロン(登録商標)樹脂の軟化温度は200℃以
上、熱膨張係数は8.5×10-5/℃である。
[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. FIG.
FIG. 1 shows a part of a housing using an electric circuit according to the present invention.
The cross-sectional structure of the broken line AA in the figure is also shown. In the drawing, 1 is a wiring member, here a single-core copper wire, 3 is an electrical component, here a power component such as a power module, 5 is a housing, for example, a reinforced resin mainly made of ABS resin, and a specific example is Mitsubishi. Rayon Diamond Alloy FB-930CP
Reference numeral 6 denotes a resin layer disposed outside the wiring member, which is made of an equal reinforced resin. Here, an example of a fluorine-based Teflon (registered trademark) resin is shown. 5, the softening temperature of the diamond alloy FB-930CP resin manufactured by Mitsubishi Rayon is about 110.
° C, the thermal expansion coefficient is 1.3 × 10 -5 / ° C, the softening temperature of the fluorine-based Teflon (registered trademark) resin of 6 is 200 ° C or more, and the thermal expansion coefficient is 8.5 × 10 -5 / ° C. is there.

【0043】図に示すように、単芯銅線からなる配線部
材1の外方に、筺体である三菱レイヨン製ダイヤアロイ
FBー930CP等強化樹脂5より軟化温度が高く、ま
た熱膨張係数が大きいフッ素系のテフロン(登録商標)
樹脂層6を配置したので、筺体成形時に樹脂層が溶融す
ることなく、配線部材を整然と筺体内部に収容すること
ができ、筺体の小型化が容易となる。さらに、樹脂層6
と筺体5との間に間隙を設けることができるので、配線
の自由度が向上し、作業能率が向上する。
As shown in the figure, outside the wiring member 1 made of a single-core copper wire, the softening temperature is higher and the thermal expansion coefficient is higher than a reinforced resin 5 such as a diamond alloy FB-930CP manufactured by Mitsubishi Rayon, which is a housing. Fluorine-based Teflon (registered trademark)
Since the resin layer 6 is disposed, the wiring member can be housed neatly inside the housing without melting the resin layer at the time of molding the housing, and the housing can be easily downsized. Further, the resin layer 6
Since a gap can be provided between the housing 5 and the housing 5, the degree of freedom of wiring is improved, and work efficiency is improved.

【0044】実施例2. 以下、この発明の一実施例を図を用いて説明する。図2
にこの発明による電気回路を用いた筺体の一部を示す。
図中のB−Bの破線部の断面構造も併せて示す。図にお
いて、1は配線部材でここでは単芯銅線、3は電装部品
でここではパワーモジュール等の部品、5は筺体で例え
ば三菱レイヨン製ダイヤアロイFBー930CP等強化
樹脂、6は配線部材の外方に配置する樹脂層でここでは
フッ素系のテフロン(登録商標)樹脂、7は信号回路で
ある。実施例1では筺体内に収容された配線部材が単層
に配置する例で示したが、図2に示すように繁雑な配線
を積層に配置すれば、実装密度が向上することはいうま
でもない。また、図2に示すようにパワー部品の取り付
けだけでなく、通常の信号用回路を筺体上に無電解めっ
きおよび電解めっきで形成した、筺体−回路一体型の筺
体を用いてもよい。
Embodiment 2 FIG. An embodiment of the present invention will be described below with reference to the drawings. FIG.
FIG. 1 shows a part of a housing using an electric circuit according to the present invention.
The sectional structure of the broken line BB in the figure is also shown. In the figure, 1 is a wiring member, here a single-core copper wire, 3 is an electrical component, here a component such as a power module, 5 is a housing, for example, a reinforced resin such as a diamond alloy FB-930CP manufactured by Mitsubishi Rayon, and 6 is a wiring member. The resin layer disposed outside is a fluorine-based Teflon (registered trademark) resin , and 7 is a signal circuit. In the first embodiment, an example is shown in which the wiring members housed in the housing are arranged in a single layer. However, if a complicated wiring is arranged in a stack as shown in FIG. 2, it goes without saying that the mounting density is improved. Absent. Further, as shown in FIG. 2, not only the mounting of the power components, but also a housing-circuit integrated housing in which a normal signal circuit is formed on the housing by electroless plating and electrolytic plating.

【0045】なお、実施例1、2とも配線部材が単芯銅
線の例を示したが、より線の配線部材を用いた場合に
も、樹脂層の配線部材の保護により配線部材の損傷を防
ぐことができ、電気回路としての信頼性が向上すること
はいうまでもない。
In the first and second embodiments, the wiring member is a single-core copper wire. However, even when a stranded wiring member is used, the wiring member is protected from damage by the protection of the resin member of the resin layer. Needless to say, it is possible to improve the reliability of the electric circuit.

【0046】実施例3. 以下、この発明の一実施例を図を用いて説明する。図3
はこの発明の実施例3の回路成形方法による筐体を示す
図で、Aは部分断面斜視図で、Bはこの発明の主要部を
示す説明図である。図において、1は配線部材でここで
は被覆電線の例で示す。その被覆材は例えば、ポリスル
ホン、ポリアセタール、ポリカーボネート、ポリイミ
ド、ポリアミド等軟化温度が高い樹脂やそれに加えて
フロン(登録商標)、ポリプロピレン等の耐熱性に優
れ、5の筺体樹脂よりも筐体熱膨張係数の大きな材料か
らなる。5は筐体で特に材料に限定を加えるものではな
く、以下に説明する実施例では、例えば三菱レイヨン製
ダイヤアロイFB−930CP等強化樹脂を使用した。
5−1は筺体中の配線部、8はスペーサで、筺体と同じ
樹脂からなる。
Embodiment 3 FIG. An embodiment of the present invention will be described below with reference to the drawings. FIG.
3A and 3B are views showing a housing by a circuit forming method according to a third embodiment of the present invention, wherein A is a partially sectional perspective view, and B is an explanatory view showing a main part of the present invention. In the figure, reference numeral 1 denotes a wiring member, which is shown here as an example of a covered electric wire. Te its dressing for example, polysulfones, polyacetals, polycarbonates, polyimides, polyamide softening temperature, in addition to a high resin or it
It is made of a material having excellent heat resistance, such as Freon (registered trademark) and polypropylene, and having a larger casing thermal expansion coefficient than the casing resin of No. 5. Reference numeral 5 denotes a housing, which does not particularly limit the material. In Examples described below, for example, a reinforced resin such as Mitsubishi Rayon Diamond Alloy FB-930CP was used.
5-1 is a wiring portion in the housing, 8 is a spacer, made of the same resin as the housing.

【0047】この実施例では、公知の射出成形法による
筐体の製造工程を進める際に、配線部5−1に相当する
金型内に、被覆電線1を、図3−Bに示したようにスペ
ーサ8に差し込んだ状態でセットし成形する。ここでス
ペーサ8は、被覆電線を筺体中の所望の箇所に位置決め
するために用いるもので、同時に成形後被覆電線1が配
線部5−1の表面に露出することを防ぐ目的で使用され
る。金型内に他の手法で配線部材が位置決めされるなら
ば、また、露出の発生がないことが確かな場合は本スペ
ーサを省略することは可能である。本実施例では便宜上
回路としての配線部材は電線になっているが、被覆され
ていれば、棒材等であってもよい。また、例では配線部
は直線部分について示したが、角部に適切なアールを取
るならば直線に限定されることはない。
In this embodiment, when the manufacturing process of the housing by the well-known injection molding method is advanced, the coated electric wire 1 is placed in a mold corresponding to the wiring portion 5-1 as shown in FIG. Is set in the state of being inserted into the spacer 8 and molded. Here, the spacer 8 is used for positioning the coated electric wire at a desired position in the housing, and is used for the purpose of simultaneously preventing the coated electric wire 1 from being exposed on the surface of the wiring portion 5-1 after molding. If the wiring member is positioned in the mold by another method, or if it is certain that no exposure will occur, the spacer can be omitted. In this embodiment, the wiring member as a circuit is an electric wire for convenience, but a bar or the like may be used as long as it is covered. Further, in the example, the wiring portion is shown as a straight line portion, but it is not limited to a straight line if an appropriate radius is provided at a corner.

【0048】この製造方法によると、筐体成形時に成形
樹脂より軟化温度が高い樹脂を被覆した配線部材を必要
な回路としてインサートするので、成形中あるいは成形
後に配線部材の被覆が溶融することなく、筐体内に配線
部材を埋め込むことができるため実装密度が高くなり、
筐体の小形化が可能となる。さらに、成形樹脂より熱膨
張係数の高い樹脂を被覆した配線部材を、必要な回路と
してインサート成形するので、成形後配線部材は樹脂の
硬化収縮と、配線部材の被覆材の収縮で隙間が発生し自
由に動くことが可能となり、部品等の取り付けが容易と
なる。
According to this manufacturing method, a wiring member coated with a resin having a higher softening temperature than the molding resin is inserted as a necessary circuit at the time of molding the housing, so that the coating of the wiring member does not melt during or after molding. Since the wiring member can be embedded in the housing, the mounting density is high,
The housing can be downsized. Furthermore, since a wiring member coated with a resin having a higher coefficient of thermal expansion than the molding resin is insert-molded as a necessary circuit, a gap is generated in the wiring member after molding due to the curing shrinkage of the resin and the shrinkage of the coating material of the wiring member. It is possible to move freely, and attachment of parts and the like becomes easy.

【0049】実施例4. 次に、この発明の一実施例を図に基づいて説明する。図
4は、本発明によって製造された回路を保有する筐体の
部分斜視図である。図において、1は配線部材である電
線、5は筐体、9は筺体中の配線取り付け枠である。こ
の実施例4は、例えば筐体5内に部品等を取り付ける取
り付け枠9を利用して回路を形成するもので、筐体成形
時に剛性のある配線部材1、例えばいわゆるエナメル線
やJISC3101(電気用硬銅線)に規定する硬銅線
を用いた単線(ここでは導体径0.,1.0,2.0,
3.2mmを用いた)またはこれにポリエチレンを被覆
したJIS C3326(ポリエチレン絶縁電線)等を
用い、インサート成形する。9のような配線取り付け枠
を用いた方が配線路として、高い位置決め精度を得るこ
とができるが、実施例1と同じく成形前に回路を取り付
け枠9の中心に位置するようにスペーサ等で位置決めし
てもよい。また、他の方法で成形用金型内に配線部材を
位置決めできれば、このような配線部材取り付け部品を
用いることはない。このような回路形成方法であれば、
筐体内に電線が埋め込まれるため実装密度が高くなり、
筐体の小形化が可能となる。
Embodiment 4 FIG. Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a partial perspective view of a housing holding a circuit manufactured according to the present invention. In the figure, 1 is an electric wire as a wiring member, 5 is a housing, and 9 is a wiring mounting frame in the housing. In the fourth embodiment, a circuit is formed using a mounting frame 9 for mounting components and the like in a housing 5, for example, and a rigid wiring member 1, for example, a so-called enameled wire or JISC3101 (for electric use) is formed at the time of forming the housing. Solid wire (here, conductor diameters of 0, 1.0, 2.0,
Insert molding is performed using JIS C3326 (polyethylene insulated wire) or the like coated with polyethylene or the like. The use of a wiring mounting frame such as 9 makes it possible to obtain high positioning accuracy as a wiring path. However, similarly to the first embodiment, the circuit is positioned with a spacer or the like so as to be positioned at the center of the mounting frame 9 before molding. May be. Further, if the wiring member can be positioned in the molding die by another method, such a wiring member mounting component is not used. With such a circuit forming method,
Since the wires are embedded in the housing, the mounting density increases,
The housing can be downsized.

【0050】実施例5. 次に、この発明の一実施例を図を用いて説明する。図5
は、本発明によって製造された回路を保有する筐体の部
分断面斜視図である。図において、5は筐体、10はイ
ンサート部材でここでは樹脂棒を示す。11は配線部材
1が配置される貫通穴である。この実施例5は実施例3
で配線部材をインサート成形したと同様に、成形時に成
形樹脂より熱膨脹係数の大きい樹脂からなるインサート
部材を成形し、成形後、筐体が十分に冷却した後これを
抜き取り、発生した貫通穴に別途配線部材を配置して回
路とするものである。
Embodiment 5 FIG. Next, an embodiment of the present invention will be described with reference to the drawings. FIG.
FIG. 2 is a partial cross-sectional perspective view of a housing holding a circuit manufactured according to the present invention. In the figure, reference numeral 5 denotes a housing, and 10 denotes an insert member. Reference numeral 11 denotes a through hole in which the wiring member 1 is arranged. The fifth embodiment is similar to the third embodiment.
In the same way as the insert molding of the wiring member in the above, an insert member made of a resin having a larger thermal expansion coefficient than the molding resin is molded at the time of molding, and after molding, the housing is sufficiently cooled and then removed, and separately formed in the generated through hole. A circuit is formed by arranging wiring members.

【0051】まず、この実施例では筐体成形前に3本の
テフロン(登録商標)棒を金型内に配置し、実施例1、
2、3、4と同じくABS樹脂を主原料とする熱膨張係
数の小さな強化樹脂を射出成形した。成形後、樹脂棒1
0を抜いて貫通穴11を形成し、その後ここに配線部材
を挿入して回路とした。
First, in this embodiment, before molding the housing, three
A Teflon (registered trademark) rod was placed in a mold, and Example 1,
As in 2, 3, and 4, a reinforced resin having a small thermal expansion coefficient and mainly made of ABS resin was injection molded. After molding, resin rod 1
0 was removed to form a through hole 11, and thereafter a wiring member was inserted into the circuit to form a circuit.

【0052】この製造方法による回路形成方法では、筐
体成形時に成形樹脂より熱膨張の大きい樹脂からなる棒
を筐体の任意の一部にインサートし、成形後樹脂棒を抜
いてその空洞に配線部材を通し、配線通路とするので、
筐体内に電線が埋め込まれるため実装密度が高くなり、
筐体の小形化が可能となる。また、貫通穴は直線にこだ
わることなく樹脂棒が除去できる程度の適当なアールを
持つものはさしつかえない。また、この例では空洞が形
成されたが、樹脂除去後は溝形状であってもよい。さら
に、この例ではインサート用の樹脂棒にテフロン(登録
商標)棒を用いたが、濡れ性が小さく、熱膨張係数の大
きなものであれば、例えばフッソ樹脂、ポリプロピレン
等からなる樹脂棒を使用してもよい。
In the circuit forming method according to this manufacturing method, a rod made of a resin having a larger thermal expansion than the molding resin is inserted into an arbitrary part of the housing at the time of molding the housing, and after molding, the resin rod is pulled out and wiring is formed in the cavity. Because it passes through the member and becomes a wiring passage,
Since the wires are embedded in the housing, the mounting density increases,
The housing can be downsized. In addition, the through hole having a suitable radius enough to remove the resin rod without sticking to a straight line may be used. Although a cavity is formed in this example, the groove may be formed after the resin is removed. Furthermore, in this example, Teflon (registered
Although a (trademark) rod was used, a resin rod made of, for example, a fluorine resin or polypropylene may be used as long as it has low wettability and a large coefficient of thermal expansion.

【0053】本実施例では、インサートする樹脂自身が
熱膨張係数の大きいものを用いた例について示したが、
樹脂部材の表面層のみ熱膨張係数の大きくするような多
層構造のものであってもよい。さらに、表面に例えば、
シリコングリースやテフロン(登録商標)系、フッ素系
のいわゆる離型剤とよばれるような潤滑剤を塗布したも
のでも良い。また、表面に例えば、BN(窒化ボロン)
やDLC(ダイヤモンドライクカーボン)、グラファイ
ト、MoS2(二硫化モリブデン)等の潤滑性の高い膜
を形成したものでもよい。このような例であれば、樹脂
部材自身の性質として熱膨張係数の大きいことで限定さ
れるものでない。
In this embodiment, an example is shown in which the resin to be inserted has a large thermal expansion coefficient.
It may have a multilayer structure in which only the surface layer of the resin member has a large thermal expansion coefficient. In addition, for example, on the surface
Silicone grease, Teflon (registered trademark) -based , or fluorine-based lubricants called so-called release agents may be applied. In addition, for example, BN (boron nitride)
Or a film having high lubricity such as DLC (diamond-like carbon), graphite, MoS 2 (molybdenum disulfide) or the like. In such an example, the nature of the resin member itself is not limited by a large thermal expansion coefficient.

【0054】実施例6. この発明の一実施例を図に基づいて説明する。図6にお
いて、5は筐体、12は円筒の一辺を切削した金属製か
らなるインサート材、13は配線部材が配置する溝であ
る。このインサート材12は筐体5の配線部材の埋め込
み溝となる壁面に図に示した通りインサート材12の平
らな面がくるように位置させてインサート成形する。成
形後インサート材12の平らな面の表面の方からインサ
ート材を取り除き、形成された溝13に配線部材を配置
する。筐体内に配線部材が埋め込まれるため実装密度が
高くなり、筐体の小形化が可能となる。本実施例では、
円筒の一辺を切削した金属部材を用いで溝形成をする例
について示したが、特に切削しない棒材を用いたり、実
施例5のように引き抜き方式により空洞(貫通穴)を形
成してもよい。
Embodiment 6 FIG. An embodiment of the present invention will be described with reference to the drawings. In FIG. 6, 5 is a housing, 12 is an insert material made of metal obtained by cutting one side of a cylinder, and 13 is a groove in which a wiring member is arranged. The insert material 12 is insert-molded so that the flat surface of the insert material 12 is positioned on the wall surface of the housing 5 serving as an embedding groove of the wiring member as shown in the figure. After the molding, the insert material is removed from the flat surface of the insert material 12, and the wiring member is arranged in the formed groove 13. Since the wiring member is embedded in the housing, the mounting density is increased, and the housing can be downsized. In this embodiment,
Although an example in which grooves are formed using a metal member having one side of a cylinder cut is described, a bar that is not particularly cut may be used, or a cavity (through hole) may be formed by a drawing method as in the fifth embodiment. .

【0055】本実施例では、金属部材をそのままインサ
ート成形する例について示したが、本金属部材の表面に
例えば、シリコングリースやテフロン(登録商標)系
フッ素系のいわゆる離型剤とよばれるような潤滑剤を塗
布したものや表面に例えば、BN(窒化ボロン)やDL
C(ダイヤモンドライクカーボン)、グラファイト、M
oS2(二硫化モリブデン)等の潤滑性の高い膜を形成
したものであれば、成形後インサート部材が除去しやす
くなり、作業性が向上する。また、このような潤滑剤や
潤滑膜を形用いる例であれば、金属部材と同様耐熱性の
い優れたセラミックス部材等を用いることも可能であ
る。
In this embodiment, an example in which a metal member is directly insert-molded has been described. However, for example, silicon grease, Teflon (registered trademark) ,
For example, BN (boron nitride), DL
C (diamond-like carbon), graphite, M
If a film having high lubricity such as oS 2 (molybdenum disulfide) is formed, the insert member can be easily removed after molding, and workability is improved. In addition, as long as such a lubricant or a lubricating film is used, it is also possible to use a ceramic member or the like having excellent heat resistance like a metal member.

【0056】実施例7. この発明の一実施例を図について説明する。図7は配線
部材を配置するための溝を形成する金型の断面図を示
す。図において、14−1、2は一対の金型を示し、1
4−3は溝を形成する部位を示している。このように金
型に配線部材を配置するための溝を形成すれば、高精度
に加工ができ、筐体内に電線が埋め込まれるため実装密
度が高くなり、筐体の小形化が可能となる。
Embodiment 7 FIG. One embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a sectional view of a mold for forming a groove for disposing a wiring member. In the figure, 14-1 and 2 indicate a pair of molds,
4-3 indicates a portion where a groove is formed. By forming the groove for disposing the wiring member in the mold in this manner, processing can be performed with high precision, and since the electric wires are embedded in the housing, the mounting density is increased, and the housing can be downsized.

【0057】本実施例においては、溝形状を形成する部
位14−3は本体金型を加工して得ていたが、図中の1
4−2から分離できるような構造にしておけば、設計変
更等に伴う回路構造の変化に対して、溝形状を形成する
部位14−3のみを作製し、他は共通の金型と使用すれ
ば、安価でかつ迅速に回路形成に対応することができ
る。
In the present embodiment, the portion 14-3 for forming the groove shape is obtained by processing the main body mold.
If the structure is such that it can be separated from 4-2, only the portion 14-3 that forms the groove shape is prepared in response to a change in the circuit structure due to a design change or the like, and the other portions are used with a common mold. If this is the case, it is possible to quickly and inexpensively respond to circuit formation.

【0058】実施例8. 本発明の一実施例を図8について説明する。図におい
て、Aは配線部材が配置された筐体の部分斜視図、Bは
配線部材を配置する溝部の詳細を示す断面図である。こ
の実施例では、筐体の一部に設けられた埋め込み溝13
に、配線部材1が押し込まれやすく、かつ容易に剥がれ
ない程度の挿入スペースを持つ溝が形成されている。ま
た、配線部材の断面が円状であれば、この溝の形状は円
孤であり、この溝と電線の関係は図に示したごとく12
0度程度の開口部の形成された溝が理想的と言える。し
たがって、この発明による回路形成方法は、筐体成形時
に配線部材の入る溝を同時に成形してそこに配線部材を
配置したので、筐体内に電線が埋め込まれるため実装密
度が高くなり、筐体の小形化が可能となる。なお、ここ
では配線部材の断面形状が円状の場合について、溝の形
状が円孤である場合について説明したが、配線部材の断
面形状が多角形等であっても、溝の形状がその配線部材
の断面形状の一部と相似形で適正化されたものであれば
よい。また、この溝形状は、上記実施例5、6、7で説
明された手法等により形成することが可能である。
Embodiment 8 FIG. One embodiment of the present invention will be described with reference to FIG. In the drawings, A is a partial perspective view of a housing in which a wiring member is disposed, and B is a cross-sectional view showing details of a groove in which the wiring member is disposed. In this embodiment, the buried groove 13 provided in a part of the housing is used.
In addition, a groove having an insertion space that allows the wiring member 1 to be easily pushed in and not easily peeled off is formed. If the cross section of the wiring member is circular, the shape of the groove is arcuate, and the relationship between the groove and the electric wire is 12 as shown in the figure.
A groove having an opening of about 0 degrees is ideal. Therefore, in the circuit forming method according to the present invention, since the groove in which the wiring member enters is formed at the same time when the housing is formed, and the wiring member is arranged therein, the electric wires are embedded in the housing, so that the mounting density is increased, and the housing density is increased. It is possible to reduce the size. Here, the case where the cross-sectional shape of the wiring member is circular and the case where the shape of the groove is arc is described, but even if the cross-sectional shape of the wiring member is polygonal or the like, the shape of the groove is What is necessary is just to optimize the shape similar to a part of the cross-sectional shape of the member. The groove shape can be formed by the method described in the fifth, sixth, and seventh embodiments.

【0059】実施例9. 本発明の一実施例を図9および図10に基づいて説明す
る。図9および図10において、5は筐体、15はター
ミナル、16はターミナル12にネジ等によって取り付
けられるに金属板でバスバーと呼ばれるもの、17は発
熱部品、18は信号用回路基板、19は発熱部、20は
信号回路部、21は隔離壁である。図9で示される本実
施例では、筐体5内に発熱部19と通常の信号回路を収
納する信号回路部20とを筐体樹脂を隔離壁21に用い
て隔離して配置している。発熱部にはターミナル15を
公知の方法でインサート成形する。インサート成形後そ
れぞれの必要に応じて、バスバー16および発熱部品1
7、あるいは信号用回路基板18を目的に応じて取り付
ける。バスバー16の取り付けの例を図10に示す。こ
の図ではターミナル部分を詳細に表わすためバスバーは
透視であるかのように表わし、バスバーとターミナルを
固定するネジは省略してある。この図の例では、ターミ
ナル15を公知の方法でインサート成形した後、バスバ
ーをネジ等の締結方法によって取り付けたもので、バス
バー16は通常の電気用銅材、アルミ材、等導電性配線
部材からなる。このようなバスバーの取り付けにより、
従来のようなワイヤーハーネスによる電線の引き回しが
なく、剛性なバスバーを使用しているので、例えば50
A以上の電流が流れる大電流回路として使用することが
できる。また、配線距離が固定されており、ノイズに対
しても安定な回路を構成することができる。このように
バスバーを用いて、特に発熱部は大電流回路として隔離
して使用するが、信号用回路部と隔離して形成されてい
るので、信号用回路には発熱部の熱による悪影響を無視
することができる。このように、発熱部を隔離する方法
を用いれば、放熱のための冷却水路やファンの取り付け
空間を削減でき、大電流用回路であっても高密度実装化
が可能となり、さらに筺体の小型化が可能となる。
Embodiment 9 FIG. One embodiment of the present invention will be described with reference to FIGS. 9 and 10, 5 is a housing, 15 is a terminal, 16 is a metal plate which is attached to the terminal 12 by a screw or the like and is called a bus bar, 17 is a heat generating component, 18 is a signal circuit board, and 19 is a heat generating board. , 20 is a signal circuit unit, and 21 is an isolation wall. In the present embodiment shown in FIG. 9, the heat generating portion 19 and the signal circuit portion 20 for housing a normal signal circuit are separated from each other by using a housing resin as an isolation wall 21 in the housing 5. The terminal 15 is insert-molded in the heat generating portion by a known method. After the insert molding, the bus bar 16 and the heat-generating component 1
7, or the signal circuit board 18 is attached according to the purpose. FIG. 10 shows an example of mounting the bus bar 16. In this figure, the bus bar is shown as if it is transparent so as to show the terminal portion in detail, and screws for fixing the bus bar and the terminal are omitted. In the example of this figure, after the terminal 15 is insert-molded by a known method, the bus bar is attached by a fastening method such as a screw, and the bus bar 16 is made of a normal electric copper material, an aluminum material, a conductive wiring member such as an aluminum material, or the like. Become. By installing such a bus bar,
Since there is no conventional wiring harness and the use of a rigid bus bar, there is no
It can be used as a large current circuit through which a current of A or more flows. Further, since the wiring distance is fixed, a circuit that is stable against noise can be configured. In this way, the bus bar is used, and especially the heat-generating part is used as a large current circuit, but it is formed separately from the signal circuit part. can do. In this way, by using a method of isolating the heat generating part, it is possible to reduce the space for mounting cooling water channels and fans for heat dissipation, to enable high-density mounting even for large current circuits, and to reduce the size of the housing. Becomes possible.

【0060】本実施例において、発熱部と信号用回路部
の隔離には筺体樹脂を隔離壁として用いたが、これは筺
体成形時に一体成形して形成してもよい。また、実装時
に組こんでもよい。さらに、絶縁部材で放熱効果の高い
ものであれば他の材料を用いてもよい。
In this embodiment, the housing resin is used as an isolation wall to separate the heat-generating portion from the signal circuit portion. However, this may be integrally formed at the time of molding the housing. Also, it may be incorporated at the time of mounting. Further, another material may be used as long as the insulating member has a high heat radiation effect.

【0061】[0061]

【発明の効果】以上のように、本発明の電気回路によれ
ば、配線部材の外方に筺体樹脂より軟化温度が高い樹脂
層が配置されているため、筺体成形時に配線部材の被覆
が溶融することがなく、配線部材を保護し、信頼性の高
い回路形成が可能で、実装密度を高くすることが可能と
なる。また、この樹脂層が筺体樹脂の熱膨脹係数より大
きいため、成形後筺体樹脂の硬化収縮と、配線部材の被
覆樹脂の収縮差で隙間が発生し、配線部材の自由度が向
上し、作業能率が向上する。
As described above, according to the electric circuit of the present invention, since the resin layer having a higher softening temperature than the housing resin is disposed outside the wiring member, the coating of the wiring member is melted at the time of molding the housing. The wiring member can be protected, a highly reliable circuit can be formed, and the mounting density can be increased . Also, this resin layer is larger than the thermal expansion coefficient of the housing resin.
Because of this, the shrinkage of the housing resin after molding and the
A gap is created due to the difference in shrinkage of the resin cover, which increases the degree of freedom of the wiring members.
And work efficiency is improved.

【0062】以上のように、本発明の第1の電気回路の
形成方法によれば、筺体成形時に筺体樹脂より軟化温度
が高い樹脂を被覆した配線部材を、必要な回路としてイ
ンサートしたので、成形中あるいは成形後に配線部材の
被覆が溶融することもない。そのため、筐体内に信頼性
の高い配線部材が埋め込まれるため、実装密度をさらに
高くすることが可能となる。さらに、配線部材の被覆樹
脂が筺体樹脂の熱膨脹係数より大きいため、成形後筺体
樹脂の硬化収縮と、配線部材の被覆樹脂の収縮差で隙間
が発生し、配線部材が自由に動くことが可能となるの
で、部品等の取り付けが容易となり、作業効率が向上
し、しかも筐体内に配線部材が埋め込まれるため実装密
度をさらに高くすることが可能となる。
As described above, the first electric circuit of the present invention
According to the forming method , when the housing is molded, the softening temperature is lower than that of the housing resin.
Wiring members coated with high-resin are used as necessary circuits.
The wiring member during or after molding.
The coating does not melt. Therefore, the reliability inside the housing
High density wiring members are embedded, further increasing the mounting density.
It becomes possible to raise it. Furthermore, the covering tree of the wiring member
Since the fat is larger than the thermal expansion coefficient of the housing resin,
Clearance due to resin shrinkage due to cure shrinkage and shrinkage difference
Occurs and the wiring members can move freely.
Makes it easier to attach parts and improve work efficiency
In addition, since the wiring members are embedded in the housing,
The degree can be further increased.

【0063】また、本発明の第2の電気回路の形成方法
によれば、筐体成形時に成形樹脂よりも熱膨張係数の大
きな樹脂からなる棒材あるいは金属からなる棒材を筺体
の任意の場所にインサートしたので、成形後筺体樹脂の
硬化収縮と、棒材樹脂の収縮差で間隙が発生し、簡便に
棒材を抜きさることが可能となる。除去した棒材の場所
に形成された溝または空洞部に配線部材を配置して回路
とするので、筐体内に配線部材が埋め込まれ、実装密度
をさらに高くすることが可能となる。また、この時、イ
ンサートする棒材に潤滑剤を塗布するあるいは、潤滑膜
を形成しているので、成形時に棒材が成形樹脂に凝着す
ることなく、成形後に樹脂から容易に除去することが可
能となる。
Further, according to the second method for forming an electric circuit of the present invention , the casing has a larger coefficient of thermal expansion than the molded resin at the time of molding the housing.
A bar made of kinin resin or a bar made of metal
Since it was inserted anywhere in the
A gap is created due to the difference between the curing shrinkage and the shrinkage of the bar material, making it easier
It is possible to remove the bar. Location of removed bar
Arrange wiring members in grooves or cavities formed in the circuit
Therefore, the wiring member is embedded in the housing,
Can be further increased. At this time,
Apply lubricant to the rod to be inserted
The bar material adheres to the molding resin during molding
Without removing the resin from the resin after molding .

【0064】[0064]

【0065】[0065]

【0066】[0066]

【0067】[0067]

【0068】[0068]

【0069】[0069]

【0070】[0070]

【0071】[0071]

【0072】[0072]

【0073】[0073]

【0074】[0074]

【0075】[0075]

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の実施例1による電気回路を示す図で
ある。
FIG. 1 is a diagram showing an electric circuit according to a first embodiment of the present invention.

【図2】この発明の実施例2による電気回路を示す図で
ある。
FIG. 2 is a diagram showing an electric circuit according to a second embodiment of the present invention.

【図3】この発明の実施例3による電気回路の形成方法
を示す図で、Aは製造方法によって得られた電気回路の
成形方法を示す筐体の部分断面斜視図。Bはこの発明の
主用部を示す説明図である。
FIG. 3 is a view showing a method of forming an electric circuit according to Embodiment 3 of the present invention, and FIG. 3A is a partial cross-sectional perspective view of a housing showing a method of forming an electric circuit obtained by a manufacturing method. B is an explanatory view showing a main part of the present invention.

【図4】この発明の実施例4による回路形成方法を示す
筐体の部分斜視図である。
FIG. 4 is a partial perspective view of a housing showing a circuit forming method according to Embodiment 4 of the present invention.

【図5】この発明の実施例5による回路形成方法を示す
筐体の部分断面斜視図である。
FIG. 5 is a partial sectional perspective view of a housing showing a circuit forming method according to Embodiment 5 of the present invention.

【図6】この発明の実施例6による回路形成方法を示す
部分斜視図である。
FIG. 6 is a partial perspective view illustrating a circuit forming method according to a sixth embodiment of the present invention.

【図7】この発明の実施例7による回路形成方法に使用
する金型の断面図である。
FIG. 7 is a sectional view of a mold used in a circuit forming method according to a seventh embodiment of the present invention.

【図8】この発明の実施例8による回路形成方法を示す
筐体の部分斜視図、および断面図である。
FIG. 8 is a partial perspective view and a sectional view of a housing showing a circuit forming method according to Embodiment 8 of the present invention.

【図9】この発明の実施例9による電気回路を示す断面
図である。
FIG. 9 is a sectional view showing an electric circuit according to Embodiment 9 of the present invention.

【図10】この発明の実施例10による電気回路を示す
斜視図である。
FIG. 10 is a perspective view showing an electric circuit according to Embodiment 10 of the present invention.

【図11】従来の配線方法を示す部分正面図である。FIG. 11 is a partial front view showing a conventional wiring method.

【図12】従来の配線方法を示す部分斜視図である。FIG. 12 is a partial perspective view showing a conventional wiring method.

【符号の説明】[Explanation of symbols]

1 配線部材(ワイヤーハーネス、被覆電線等) 2 クランプ 3 電装部品 4 電装部品組み付け窓 5 筺体 6 樹脂層 7 信号回路 8 スペーサ 9 配線部材取り付け枠 10 樹脂からなるインサート部材 11 空洞(貫通穴) 12 金属からなるインサート部材 13 配線部材埋め込み溝 14 金型 15 ターミナル 16 金属板(バスバー) 17 発熱部品 18 信号用回路基板 19 発熱部 20 信号回路部 21 隔離壁 DESCRIPTION OF SYMBOLS 1 Wiring member (wire harness, covered electric wire, etc.) 2 Clamp 3 Electrical component 4 Electrical component assembling window 5 Housing 6 Resin layer 7 Signal circuit 8 Spacer 9 Wiring member mounting frame 10 Resin insert member 11 Hollow (through hole) 12 Metal 13 Insertion member made of 13 Wiring member embedding groove 14 Mold 15 Terminal 16 Metal plate (bus bar) 17 Heating component 18 Signal circuit board 19 Heating section 20 Signal circuit section 21 Isolation wall

───────────────────────────────────────────────────── フロントページの続き (72)発明者 木村 敏文 尼崎市塚口本町8丁目1番1号 三菱電 機株式会社 生産技術研究所内 (56)参考文献 特公 昭54−6888(JP,B2) (58)調査した分野(Int.Cl.6,DB名) H05K 7/06 H05K 5/00 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Toshifumi Kimura 8-1-1, Tsukaguchi-Honmachi, Amagasaki-shi Mitsubishi Electric Corp. Production Engineering Research Laboratory (56) References JP-B-54-6888 (JP, B2) ( 58) Field surveyed (Int.Cl. 6 , DB name) H05K 7/06 H05K 5/00

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 樹脂からなる筺体と、該筺体の内部ある
いは表層部に回路を形成する配線部材と、配線部材の
外方に筺体を構成する樹脂よりも軟化温度が高くかつ熱
膨張係数が大きい樹脂層備え、上記筺体と上記配線
部材の外方の樹脂層との間に間隙を有することを特徴と
する電気回路。
1. A a housing made of resin, a wiring member for forming a circuit inside or the surface portion of the 該筺body, softening temperature than the resin forming the casing to the outside of the wiring member coincide with high heat
And a coefficient of expansion is large resin layer, said casing and said wire
An electric circuit having a gap between the member and a resin layer outside the member .
【請求項2】 筺体を構成する樹脂より軟化温度が高く
かつ熱膨張係数の大きい樹脂を被覆した配線部材をイン
サートして筐体を成形し、上記筐体と上記配線部材の被
覆樹脂との間に間隙を形成して、上記筐体内に電気回路
を形成する電気回路の形成方法。
2. The softening temperature is higher than the resin constituting the housing.
In addition, wiring members coated with resin with a large thermal expansion coefficient
Insert to form a housing, and cover the housing and the wiring member.
An electric circuit is formed in the housing by forming a gap between
Forming an electric circuit.
【請求項3】 筺体成形時に筺体樹脂より熱膨張係数が
大きい樹脂からなる棒材あるいは金属からなる棒材をイ
ンサートし、筺体成形後に上記棒材を除去することによ
り配線部材を配置する溝または空洞を形成することを特
徴とする電気回路の形成方法。
3. The thermal expansion coefficient of the housing is greater than that of the housing resin during molding.
Use a large resin bar or metal bar
Insert and remove the bar after molding the housing.
Forming grooves or cavities for wiring members.
A method for forming an electric circuit.
【請求項4】 筺体成形時に、潤滑剤の塗布された棒材
を用いることを特徴とする請求項3に記載の電気回路の
形成方法。
4. A rod material to which a lubricant is applied during molding of a housing.
4. The method for forming an electric circuit according to claim 3, wherein:
【請求項5】 筺体成形時に、潤滑膜の形成された棒材
を用いることを特徴とする請求項3に記載の電気回路の
形成方法
5. A rod material having a lubricating film formed thereon during housing molding.
Method of forming an electrical circuit according to claim 3, characterized in that use.
JP33618193A 1993-12-28 1993-12-28 Electric circuit and method of forming electric circuit Expired - Fee Related JP2931193B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33618193A JP2931193B2 (en) 1993-12-28 1993-12-28 Electric circuit and method of forming electric circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33618193A JP2931193B2 (en) 1993-12-28 1993-12-28 Electric circuit and method of forming electric circuit

Publications (2)

Publication Number Publication Date
JPH07202452A JPH07202452A (en) 1995-08-04
JP2931193B2 true JP2931193B2 (en) 1999-08-09

Family

ID=18296497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33618193A Expired - Fee Related JP2931193B2 (en) 1993-12-28 1993-12-28 Electric circuit and method of forming electric circuit

Country Status (1)

Country Link
JP (1) JP2931193B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1010513C2 (en) * 1998-11-09 2000-05-10 Iku Holding Montfoort Bv Electrically controlled mirror for a motor vehicle.
DE102017204949A1 (en) * 2017-03-23 2018-09-27 SUMIDA Components & Modules GmbH Inductive component and method for producing an inductive component

Also Published As

Publication number Publication date
JPH07202452A (en) 1995-08-04

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