JP2931193B2 - Electric circuit and method of forming electric circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling connection structure of a housing, a wiring board, and an electric component in an electric device product.
In particular, the present invention relates to a high-current electric circuit mounted on a plastic mold housing or the like and a method for forming the electric circuit .

[0002]

2. Description of the Related Art In recent years, electronic devices have been significantly reduced in size and density with the advancement of the functions of the devices, and as a result, the mounting structure has become complicated, and extra steps have been required for assembly and maintenance. FIG. 11 is a plan view showing a known wiring method.
In the drawing, reference numeral 1 denotes a wiring member, which is an electric wire with a crimp terminal, which is called a wire harness here. 2 is a holder for fixing the wire harness 1 and is called a clamp here. 3 is an electrical component, 4 is an electrical component assembling window, and 5 is a housing on which these are mounted.

[0003] In the method of manufacturing a circuit incorporated in the housing, first, a wire harness 1 is arranged at a necessary portion of a housing 5 and fixed by a clamp 2. Next, the wire harness 1 is inserted into the electrical component assembling window 4. Finally, housing 5
The electrical component 3 is attached to the end of the wire harness 1 taken out on the surface where the wire harness 1 is not wired.

FIG. 12 is a partial configuration diagram showing a conventional wiring method disclosed in Japanese Patent Publication No. 3-52239, showing a method of holding a lead wire of an electric device. In the figure, reference numeral 1 denotes a wiring member made of a lead wire, 2 denotes a holder for fixing the lead wire so as not to be separated and 5 denotes a housing. The lead 1 is fixed to a required portion in the mold in advance, and at the time of molding the housing, the lead wire 1 and the holding portion 2 arranged in the mold are simultaneously molded integrally, and the lead wire is partially held by the molding material. Is the way.

The above-mentioned example is an example in which a covered wire such as a wire harness is mainly used as a wiring member. An example in which a wire harness is not used, for example, an example in which a flexible printed board is integrally formed as a wiring circuit at the time of molding a housing. Also, Japanese Utility Model Laid-Open Publication No. 1-112146,
98194.

In the case of a circuit that generates heat, such as a large current circuit, measures have been taken to dissipate heat by arranging a cooling water channel for heat dissipation and a cooling fan in the circuit portion.

[0007]

However, the circuit forming method by such a method, particularly the above-mentioned known method, requires assembling of a wire harness, which requires not only a troublesome work but also a fixing of the wire harness. Clamps and protective protectors are required, and the number of parts increases. In recent years, high-density mounting has been further advanced, and it has become difficult to secure a wiring path for a wire harness. Further, according to the example of Japanese Patent Publication No. 3-52239, a lead wire is fixed to a required portion in a mold in advance, and a holding portion for holding the lead wire arranged in the mold at the time of molding the housing is integrally formed. Since the lead wire is partially held by the molding material, the lead wire portion other than the portion fixed by the holding portion is provided with a lead wire accommodating portion for fixing so as not to move during molding. Processing is necessary for the mold, and depending on the type of housing resin and the covering member of the covered electric wire, the heat of the molding melts the covering of the electric wire, and especially the wiring member made of stranded wire is easily damaged, and It is conceivable that the electric wire is loosened up to the holding portion. For the above reasons, a circuit forming method that does not use a wire harness is required. On the other hand, there is an example of using a flexible printed circuit board as an example of eliminating the wire harness.
However, even when a circuit is obtained by a method of integrally molding a flexible printed board, when the circuit is mounted on a housing, the adhesion strength between the flexible printed board and the housing becomes a problem.
In many cases, the flexible printed circuit board is made of a material having low adhesiveness such as epoxy resin, so that high-strength bonding is difficult and costly. Furthermore, it is difficult for a flexible printed circuit board to pass a large current of, for example, 10 A or more. Further, in the circuit for large current, it is necessary to secure an area and a space necessary for mounting a cooling water channel for radiation and a fan, and these hinder the miniaturization of the housing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and in order to realize a compact housing and high-density mounting, a minimum wiring path is secured, and it is inexpensive and reliable. It is an object to provide an electric circuit having high reliability and a method for forming the electric circuit.

[0009]

According to a first aspect of the present invention, there is provided an electric circuit comprising: a housing made of resin; a wiring member for forming a circuit inside or on a surface layer of the housing ; softening temperature than the resin constituting the housing toward the high Cucamonga
And a resin layer having a large thermal expansion coefficient.
There is a gap between the wiring member and the resin layer outside the wiring member .

[0010] The electric circuit according to claim 2 of the present invention .
Is the forming method higher in softening temperature than the resin that composes the housing?
Insulation of wiring members coated with resin with large thermal expansion coefficient
To form a housing and cover the housing and the wiring member.
Form a gap between the resin and the electric circuit inside the housing
Ru der those so as to form.

[0011]Claims of the inventionElectric circuit according to the third aspect of the inventionof
The molding method has a larger coefficient of thermal expansion than the casing resin when molding the casing.
Insert a bar made of resin or metal
By removing the bar material after molding the housing
Grooves or cavities in which wiring members are placed
You.

According to a fourth aspect of the present invention, there is provided a method for forming an electric circuit according to the third aspect, wherein the lubricant is added when the housing is formed.
It is specified that a bar coated with is used .

According to a fifth aspect of the present invention, there is provided a method for forming an electric circuit , comprising the steps of:
Ru Der provided to define the use of the formed rod.

[0014]

[0015]

[0016]

[0017]

[0018]

[0019]

[0020]

[0021]

[0022]

[0023]

[0024]

[0025]

[0026]

In the electric circuit according to the first aspect of the present invention ,
Since the resin layer having a softening temperature higher than that of the housing resin is arranged outside the wiring member, the wiring member is protected without melting the resin layer at the time of molding the housing . Also, this resin layer is
Since the coefficient of thermal expansion is higher than that of fat,
The curing shrinkage of the housing resin and the resin
A gap is formed due to the difference in shrinkage, improving the flexibility of the wiring member
I do.

According to the second aspect of the present invention ,
In the forming method, the softening temperature is higher than the housing resin during housing molding.
Insulate the wiring member coated with a new resin as a necessary circuit.
The wiring member is covered during or after molding.
Can be embedded in the housing without melting.
Wear. In addition, the coating resin of the wiring member is more
Embedding wiring members in housing due to high thermal expansion coefficient
As well as shrinkage of the housing resin after molding
A gap is formed due to the difference in shrinkage of the coating resin of the wiring member,
Since the wire members can move freely, parts can be collected.
Mounting is easy.

According to a third aspect of the present invention, there is provided an electric circuit comprising :
In the forming method , the coefficient of thermal expansion is smaller than the molding resin when molding the housing.
Bars made of resin or metal bars
Since it is inserted anywhere in the housing,
A gap is created due to the difference between the hardening shrinkage of the fat and the shrinkage of the bar material resin.
The bar can be pulled out of the flight. Of the removed bar
Place the wiring member in the groove or cavity formed in the place,
Because it is a circuit, wiring members can be embedded in the housing.
Wear.

[0029] In the method for forming the electrical circuit according to claim 4 of this invention, in claim 3, the wiring member to the housing
Bar used as a means for forming grooves or cavities to be placed
Since the lubricant is applied to the
Easily removed from resin after molding without sticking to
It becomes possible.

According to a fifth aspect of the present invention, there is provided a method of forming an electric circuit according to the third aspect, wherein the wiring member is provided on the housing.
For rods used as a means of forming grooves or cavities to be placed
Since the lubricating film is formed, the rod material is
Easily removed from resin after molding without sticking to
It becomes possible .

[0031]

[0032]

[0033]

[0034]

[0035]

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. FIG.
FIG. 1 shows a part of a housing using an electric circuit according to the present invention.
The cross-sectional structure of the broken line AA in the figure is also shown. In the drawing, 1 is a wiring member, here a single-core copper wire, 3 is an electrical component, here a power component such as a power module, 5 is a housing, for example, a reinforced resin mainly made of ABS resin, and a specific example is Mitsubishi. Rayon Diamond Alloy FB-930CP
Reference numeral 6 denotes a resin layer disposed outside the wiring member, which is made of an equal reinforced resin. Here, an example of a fluorine-based Teflon (registered trademark) resin is shown. 5, the softening temperature of the diamond alloy FB-930CP resin manufactured by Mitsubishi Rayon is about 110.
° C, the thermal expansion coefficient is 1.3 × 10 ^-5 / ° C, the softening temperature of the fluorine-based Teflon (registered trademark) resin of 6 is 200 ° C or more, and the thermal expansion coefficient is 8.5 × 10 ^-5 / ° C. is there.

As shown in the figure, outside the wiring member 1 made of a single-core copper wire, the softening temperature is higher and the thermal expansion coefficient is higher than a reinforced resin 5 such as a diamond alloy FB-930CP manufactured by Mitsubishi Rayon, which is a housing. Fluorine-based Teflon (registered trademark)
Since the resin layer 6 is disposed, the wiring member can be housed neatly inside the housing without melting the resin layer at the time of molding the housing, and the housing can be easily downsized. Further, the resin layer 6
Since a gap can be provided between the housing 5 and the housing 5, the degree of freedom of wiring is improved, and work efficiency is improved.

Embodiment 2 FIG. An embodiment of the present invention will be described below with reference to the drawings. FIG.
FIG. 1 shows a part of a housing using an electric circuit according to the present invention.
The sectional structure of the broken line BB in the figure is also shown. In the figure, 1 is a wiring member, here a single-core copper wire, 3 is an electrical component, here a component such as a power module, 5 is a housing, for example, a reinforced resin such as a diamond alloy FB-930CP manufactured by Mitsubishi Rayon, and 6 is a wiring member. The resin layer disposed outside is a fluorine-based Teflon (registered trademark) resin , and 7 is a signal circuit. In the first embodiment, an example is shown in which the wiring members housed in the housing are arranged in a single layer. However, if a complicated wiring is arranged in a stack as shown in FIG. 2, it goes without saying that the mounting density is improved. Absent. Further, as shown in FIG. 2, not only the mounting of the power components, but also a housing-circuit integrated housing in which a normal signal circuit is formed on the housing by electroless plating and electrolytic plating.

In the first and second embodiments, the wiring member is a single-core copper wire. However, even when a stranded wiring member is used, the wiring member is protected from damage by the protection of the resin member of the resin layer. Needless to say, it is possible to improve the reliability of the electric circuit.

Embodiment 3 FIG. An embodiment of the present invention will be described below with reference to the drawings. FIG.
3A and 3B are views showing a housing by a circuit forming method according to a third embodiment of the present invention, wherein A is a partially sectional perspective view, and B is an explanatory view showing a main part of the present invention. In the figure, reference numeral 1 denotes a wiring member, which is shown here as an example of a covered electric wire. Te its dressing for example, polysulfones, polyacetals, polycarbonates, polyimides, polyamide softening temperature, in addition to a high resin or it
It is made of a material having excellent heat resistance, such as Freon (registered trademark) and polypropylene, and having a larger casing thermal expansion coefficient than the casing resin of No. 5. Reference numeral 5 denotes a housing, which does not particularly limit the material. In Examples described below, for example, a reinforced resin such as Mitsubishi Rayon Diamond Alloy FB-930CP was used.
5-1 is a wiring portion in the housing, 8 is a spacer, made of the same resin as the housing.

In this embodiment, when the manufacturing process of the housing by the well-known injection molding method is advanced, the coated electric wire 1 is placed in a mold corresponding to the wiring portion 5-1 as shown in FIG. Is set in the state of being inserted into the spacer 8 and molded. Here, the spacer 8 is used for positioning the coated electric wire at a desired position in the housing, and is used for the purpose of simultaneously preventing the coated electric wire 1 from being exposed on the surface of the wiring portion 5-1 after molding. If the wiring member is positioned in the mold by another method, or if it is certain that no exposure will occur, the spacer can be omitted. In this embodiment, the wiring member as a circuit is an electric wire for convenience, but a bar or the like may be used as long as it is covered. Further, in the example, the wiring portion is shown as a straight line portion, but it is not limited to a straight line if an appropriate radius is provided at a corner.

According to this manufacturing method, a wiring member coated with a resin having a higher softening temperature than the molding resin is inserted as a necessary circuit at the time of molding the housing, so that the coating of the wiring member does not melt during or after molding. Since the wiring member can be embedded in the housing, the mounting density is high,
The housing can be downsized. Furthermore, since a wiring member coated with a resin having a higher coefficient of thermal expansion than the molding resin is insert-molded as a necessary circuit, a gap is generated in the wiring member after molding due to the curing shrinkage of the resin and the shrinkage of the coating material of the wiring member. It is possible to move freely, and attachment of parts and the like becomes easy.

Embodiment 4 FIG. Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a partial perspective view of a housing holding a circuit manufactured according to the present invention. In the figure, 1 is an electric wire as a wiring member, 5 is a housing, and 9 is a wiring mounting frame in the housing. In the fourth embodiment, a circuit is formed using a mounting frame 9 for mounting components and the like in a housing 5, for example, and a rigid wiring member 1, for example, a so-called enameled wire or JISC3101 (for electric use) is formed at the time of forming the housing. Solid wire (here, conductor diameters of 0, 1.0, 2.0,
Insert molding is performed using JIS C3326 (polyethylene insulated wire) or the like coated with polyethylene or the like. The use of a wiring mounting frame such as 9 makes it possible to obtain high positioning accuracy as a wiring path. However, similarly to the first embodiment, the circuit is positioned with a spacer or the like so as to be positioned at the center of the mounting frame 9 before molding. May be. Further, if the wiring member can be positioned in the molding die by another method, such a wiring member mounting component is not used. With such a circuit forming method,
Since the wires are embedded in the housing, the mounting density increases,
The housing can be downsized.

Embodiment 5 FIG. Next, an embodiment of the present invention will be described with reference to the drawings. FIG.
FIG. 2 is a partial cross-sectional perspective view of a housing holding a circuit manufactured according to the present invention. In the figure, reference numeral 5 denotes a housing, and 10 denotes an insert member. Reference numeral 11 denotes a through hole in which the wiring member 1 is arranged. The fifth embodiment is similar to the third embodiment.
In the same way as the insert molding of the wiring member in the above, an insert member made of a resin having a larger thermal expansion coefficient than the molding resin is molded at the time of molding, and after molding, the housing is sufficiently cooled and then removed, and separately formed in the generated through hole. A circuit is formed by arranging wiring members.

First, in this embodiment, before molding the housing, three
A Teflon (registered trademark) rod was placed in a mold, and Example 1,
As in 2, 3, and 4, a reinforced resin having a small thermal expansion coefficient and mainly made of ABS resin was injection molded. After molding, resin rod 1
0 was removed to form a through hole 11, and thereafter a wiring member was inserted into the circuit to form a circuit.

In the circuit forming method according to this manufacturing method, a rod made of a resin having a larger thermal expansion than the molding resin is inserted into an arbitrary part of the housing at the time of molding the housing, and after molding, the resin rod is pulled out and wiring is formed in the cavity. Because it passes through the member and becomes a wiring passage,
Since the wires are embedded in the housing, the mounting density increases,
The housing can be downsized. In addition, the through hole having a suitable radius enough to remove the resin rod without sticking to a straight line may be used. Although a cavity is formed in this example, the groove may be formed after the resin is removed. Furthermore, in this example, Teflon (registered
Although a (trademark) rod was used, a resin rod made of, for example, a fluorine resin or polypropylene may be used as long as it has low wettability and a large coefficient of thermal expansion.

In this embodiment, an example is shown in which the resin to be inserted has a large thermal expansion coefficient.
It may have a multilayer structure in which only the surface layer of the resin member has a large thermal expansion coefficient. In addition, for example, on the surface
Silicone grease, Teflon (registered trademark) -based , or fluorine-based lubricants called so-called release agents may be applied. In addition, for example, BN (boron nitride)
Or a film having high lubricity such as DLC (diamond-like carbon), graphite, MoS ₂ (molybdenum disulfide) or the like. In such an example, the nature of the resin member itself is not limited by a large thermal expansion coefficient.

Embodiment 6 FIG. An embodiment of the present invention will be described with reference to the drawings. In FIG. 6, 5 is a housing, 12 is an insert material made of metal obtained by cutting one side of a cylinder, and 13 is a groove in which a wiring member is arranged. The insert material 12 is insert-molded so that the flat surface of the insert material 12 is positioned on the wall surface of the housing 5 serving as an embedding groove of the wiring member as shown in the figure. After the molding, the insert material is removed from the flat surface of the insert material 12, and the wiring member is arranged in the formed groove 13. Since the wiring member is embedded in the housing, the mounting density is increased, and the housing can be downsized. In this embodiment,
Although an example in which grooves are formed using a metal member having one side of a cylinder cut is described, a bar that is not particularly cut may be used, or a cavity (through hole) may be formed by a drawing method as in the fifth embodiment. .

In this embodiment, an example in which a metal member is directly insert-molded has been described. However, for example, silicon grease, Teflon (registered trademark) ,
For example, BN (boron nitride), DL
C (diamond-like carbon), graphite, M
If a film having high lubricity such as oS ₂ (molybdenum disulfide) is formed, the insert member can be easily removed after molding, and workability is improved. In addition, as long as such a lubricant or a lubricating film is used, it is also possible to use a ceramic member or the like having excellent heat resistance like a metal member.

Embodiment 7 FIG. One embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a sectional view of a mold for forming a groove for disposing a wiring member. In the figure, 14-1 and 2 indicate a pair of molds,
4-3 indicates a portion where a groove is formed. By forming the groove for disposing the wiring member in the mold in this manner, processing can be performed with high precision, and since the electric wires are embedded in the housing, the mounting density is increased, and the housing can be downsized.

In the present embodiment, the portion 14-3 for forming the groove shape is obtained by processing the main body mold.
If the structure is such that it can be separated from 4-2, only the portion 14-3 that forms the groove shape is prepared in response to a change in the circuit structure due to a design change or the like, and the other portions are used with a common mold. If this is the case, it is possible to quickly and inexpensively respond to circuit formation.

Embodiment 8 FIG. One embodiment of the present invention will be described with reference to FIG. In the drawings, A is a partial perspective view of a housing in which a wiring member is disposed, and B is a cross-sectional view showing details of a groove in which the wiring member is disposed. In this embodiment, the buried groove 13 provided in a part of the housing is used.
In addition, a groove having an insertion space that allows the wiring member 1 to be easily pushed in and not easily peeled off is formed. If the cross section of the wiring member is circular, the shape of the groove is arcuate, and the relationship between the groove and the electric wire is 12 as shown in the figure.
A groove having an opening of about 0 degrees is ideal. Therefore, in the circuit forming method according to the present invention, since the groove in which the wiring member enters is formed at the same time when the housing is formed, and the wiring member is arranged therein, the electric wires are embedded in the housing, so that the mounting density is increased, and the housing density is increased. It is possible to reduce the size. Here, the case where the cross-sectional shape of the wiring member is circular and the case where the shape of the groove is arc is described, but even if the cross-sectional shape of the wiring member is polygonal or the like, the shape of the groove is What is necessary is just to optimize the shape similar to a part of the cross-sectional shape of the member. The groove shape can be formed by the method described in the fifth, sixth, and seventh embodiments.

Embodiment 9 FIG. One embodiment of the present invention will be described with reference to FIGS. 9 and 10, 5 is a housing, 15 is a terminal, 16 is a metal plate which is attached to the terminal 12 by a screw or the like and is called a bus bar, 17 is a heat generating component, 18 is a signal circuit board, and 19 is a heat generating board. , 20 is a signal circuit unit, and 21 is an isolation wall. In the present embodiment shown in FIG. 9, the heat generating portion 19 and the signal circuit portion 20 for housing a normal signal circuit are separated from each other by using a housing resin as an isolation wall 21 in the housing 5. The terminal 15 is insert-molded in the heat generating portion by a known method. After the insert molding, the bus bar 16 and the heat-generating component 1
7, or the signal circuit board 18 is attached according to the purpose. FIG. 10 shows an example of mounting the bus bar 16. In this figure, the bus bar is shown as if it is transparent so as to show the terminal portion in detail, and screws for fixing the bus bar and the terminal are omitted. In the example of this figure, after the terminal 15 is insert-molded by a known method, the bus bar is attached by a fastening method such as a screw, and the bus bar 16 is made of a normal electric copper material, an aluminum material, a conductive wiring member such as an aluminum material, or the like. Become. By installing such a bus bar,
Since there is no conventional wiring harness and the use of a rigid bus bar, there is no
It can be used as a large current circuit through which a current of A or more flows. Further, since the wiring distance is fixed, a circuit that is stable against noise can be configured. In this way, the bus bar is used, and especially the heat-generating part is used as a large current circuit, but it is formed separately from the signal circuit part. can do. In this way, by using a method of isolating the heat generating part, it is possible to reduce the space for mounting cooling water channels and fans for heat dissipation, to enable high-density mounting even for large current circuits, and to reduce the size of the housing. Becomes possible.

In this embodiment, the housing resin is used as an isolation wall to separate the heat-generating portion from the signal circuit portion. However, this may be integrally formed at the time of molding the housing. Also, it may be incorporated at the time of mounting. Further, another material may be used as long as the insulating member has a high heat radiation effect.

[0061]

As described above, according to the electric circuit of the present invention, since the resin layer having a higher softening temperature than the housing resin is disposed outside the wiring member, the coating of the wiring member is melted at the time of molding the housing. The wiring member can be protected, a highly reliable circuit can be formed, and the mounting density can be increased . Also, this resin layer is larger than the thermal expansion coefficient of the housing resin.
Because of this, the shrinkage of the housing resin after molding and the
A gap is created due to the difference in shrinkage of the resin cover, which increases the degree of freedom of the wiring members.
And work efficiency is improved.

As described above, the first electric circuit of the present invention
According to the forming method , when the housing is molded, the softening temperature is lower than that of the housing resin.
Wiring members coated with high-resin are used as necessary circuits.
The wiring member during or after molding.
The coating does not melt. Therefore, the reliability inside the housing
High density wiring members are embedded, further increasing the mounting density.
It becomes possible to raise it. Furthermore, the covering tree of the wiring member
Since the fat is larger than the thermal expansion coefficient of the housing resin,
Clearance due to resin shrinkage due to cure shrinkage and shrinkage difference
Occurs and the wiring members can move freely.
Makes it easier to attach parts and improve work efficiency
In addition, since the wiring members are embedded in the housing,
The degree can be further increased.

Further, according to the second method for forming an electric circuit of the present invention , the casing has a larger coefficient of thermal expansion than the molded resin at the time of molding the housing.
A bar made of kinin resin or a bar made of metal
Since it was inserted anywhere in the
A gap is created due to the difference between the curing shrinkage and the shrinkage of the bar material, making it easier
It is possible to remove the bar. Location of removed bar
Arrange wiring members in grooves or cavities formed in the circuit
Therefore, the wiring member is embedded in the housing,
Can be further increased. At this time,
Apply lubricant to the rod to be inserted
The bar material adheres to the molding resin during molding
Without removing the resin from the resin after molding .

[0064]

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071]

[0072]

[0073]

[0074]

[0075]

[Brief description of the drawings]

FIG. 1 is a diagram showing an electric circuit according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an electric circuit according to a second embodiment of the present invention.

FIG. 3 is a view showing a method of forming an electric circuit according to Embodiment 3 of the present invention, and FIG. 3A is a partial cross-sectional perspective view of a housing showing a method of forming an electric circuit obtained by a manufacturing method. B is an explanatory view showing a main part of the present invention.

FIG. 4 is a partial perspective view of a housing showing a circuit forming method according to Embodiment 4 of the present invention.

FIG. 5 is a partial sectional perspective view of a housing showing a circuit forming method according to Embodiment 5 of the present invention.

FIG. 6 is a partial perspective view illustrating a circuit forming method according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view of a mold used in a circuit forming method according to a seventh embodiment of the present invention.

FIG. 8 is a partial perspective view and a sectional view of a housing showing a circuit forming method according to Embodiment 8 of the present invention.

FIG. 9 is a sectional view showing an electric circuit according to Embodiment 9 of the present invention.

FIG. 10 is a perspective view showing an electric circuit according to Embodiment 10 of the present invention.

FIG. 11 is a partial front view showing a conventional wiring method.

FIG. 12 is a partial perspective view showing a conventional wiring method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring member (wire harness, covered electric wire, etc.) 2 Clamp 3 Electrical component 4 Electrical component assembling window 5 Housing 6 Resin layer 7 Signal circuit 8 Spacer 9 Wiring member mounting frame 10 Resin insert member 11 Hollow (through hole) 12 Metal 13 Insertion member made of 13 Wiring member embedding groove 14 Mold 15 Terminal 16 Metal plate (bus bar) 17 Heating component 18 Signal circuit board 19 Heating section 20 Signal circuit section 21 Isolation wall

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Toshifumi Kimura 8-1-1, Tsukaguchi-Honmachi, Amagasaki-shi Mitsubishi Electric Corp. Production Engineering Research Laboratory (56) References JP-B-54-6888 (JP, B2) ( 58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 7/06 H05K 5/00

Claims (5)

(57) [Claims] 1. A a housing made of resin, a wiring member for forming a circuit inside or the surface portion of the 該筺body, softening temperature than the resin forming the casing to the outside of the wiring member coincide with high heat
And a coefficient of expansion is large resin layer, said casing and said wire
An electric circuit having a gap between the member and a resin layer outside the member . 2. The softening temperature is higher than the resin constituting the housing.
In addition, wiring members coated with resin with a large thermal expansion coefficient
Insert to form a housing, and cover the housing and the wiring member.
An electric circuit is formed in the housing by forming a gap between
Forming an electric circuit. 3. The thermal expansion coefficient of the housing is greater than that of the housing resin during molding.
Use a large resin bar or metal bar
Insert and remove the bar after molding the housing.
Forming grooves or cavities for wiring members.
A method for forming an electric circuit. 4. A rod material to which a lubricant is applied during molding of a housing.
4. The method for forming an electric circuit according to claim 3, wherein: 5. A rod material having a lubricating film formed thereon during housing molding.
Method of forming an electrical circuit according to claim 3, characterized in that use.