JP2928955B2 - Semiconductor device batch inspection method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for inspecting semiconductor devices at once, and more particularly, to a method for inspecting semiconductor devices by contacting inspection electrodes with all electrode pads of semiconductor devices provided on a semiconductor wafer. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for inspecting semiconductor devices at once for inspecting electrical characteristics of the devices .

[0002]

2. Description of the Related Art With the recent increase in the degree of integration and multifunctionality of semiconductor devices, the number of semiconductor elements (hereinafter, referred to as chips) provided on a semiconductor wafer (hereinafter, referred to as wafer) has been increased, and electrode pads have become more complicated.

In a conventional semiconductor manufacturing process, a probe of a prober is generally brought into contact with an electrode pad of a chip to inspect the electrical characteristics of the chip.
In this prober, after a wafer to be inspected is transported to an inspection stage, the wafer is aligned and transported to an inspection position, and at the inspection position, a prober arranged in advance to correspond to the electrode pads of the chips on the wafer is provided. The probe is brought into contact with the electrode tip to check the electrical properties of the tip.
This inspection is performed for each chip.

[0004] In recent years, mounting methods such as directly attaching a chip to a substrate without packaging have been developed. In this case as well, after mounting the chip on the substrate, for example, in a high temperature environment or a low temperature environment. Therefore, it is necessary to inspect a change in the electrical characteristics for a long time (for example, several tens of hours).

[0005]

However, in the conventional prober inspection method, since the inspection is performed for each chip having a complicated electrode pad, the inspection takes much time and the inspection efficiency is reduced. there were.
Further, the probe subjected to many inspections has to be replaced depending on the service life, and there is a problem in terms of cost.

Further, in an environmental test when the chip is not in a package state, it is impossible to use a probe such as a prober, so that there is a disadvantage that the environmental test cannot be performed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a method and apparatus for inspecting a semiconductor device collectively, in which electrical characteristics of all chips provided on a wafer can be collectively and easily and efficiently performed. The purpose is to provide.

[0008]

In order to achieve the above object, a first method for inspecting semiconductor devices at once comprises contacting an inspection electrode with each electrode pad of a semiconductor device provided on a semiconductor wafer. In a method for inspecting electrical characteristics of a semiconductor element, a support for supporting the semiconductor wafer and an inspection object having a plurality of inspection electrodes corresponding to respective electrode pads of the semiconductor element move forward and backward with respect to each other. A step of movably facing in a direction intersecting the direction and the retreating direction, and a step of aligning the electrode pads and the inspection electrodes with each other by an alignment means provided on the semiconductor wafer and the inspection body, between the semiconductor wafer and the inspection body, both when interposing a conductive member having elasticity, by pressurizing the test body and the support member proximally, the guide By the action of pressurized pressure conducting function of the member, is characterized in that it has a, a step of conducting all of the test electrodes and the electrode pads at the same time (claim 1).

In the invention according to claim 1, the position
The alignment process is performed by positioning the positioning
The mark and the mark on the transparent window provided on the specimen
It may be performed in accordance with
The energized state of the alignment electrodes provided on EHA and the test object
Detection may be performed, or
The alignment process is performed by positioning the positioning
The mark and the mark on the transparent window provided on the specimen
Along with semiconductor wafers and test pieces
Detection by detecting the energized state of the positioning electrode
(Claims 2 to 4).

Further, according to a second method for inspecting semiconductor devices at once, a semiconductor device for inspecting electrical characteristics of a semiconductor device by contacting an inspection electrode with each electrode pad of the semiconductor device provided on a semiconductor wafer. In the batch inspection method,
Removing the support for supporting the semiconductor wafer from the support accommodating portion; removing the semiconductor wafer from the cassette; placing the semiconductor wafer on the support; A step of movably facing a test object having a plurality of test electrodes corresponding to each electrode pad of the element in a reciprocating direction and a direction intersecting the reciprocating direction; and a positioning means provided on the semiconductor wafer and the test object. by a step of aligning made to match each other and the inspection electrode and the respective electrode pads, between the test body and the semiconductor wafer, both when interposing a conductive member having elasticity, and a test body and the support Pressurizing in the approaching direction; placing the pressurized support, semiconductor wafer, and test object in an environmental test oven;
Setting the temperature of the environmental test oven to a predetermined temperature, and energizing all of the electrode pads and the test electrodes simultaneously (claim 5).

Also, the present invention provides a semiconductor device batch inspection apparatus.
The electrodes are placed on each electrode pattern of the semiconductor element provided on the semiconductor wafer.
Contact the test electrode with the pad to check the electrical characteristics of the semiconductor device.
In the semiconductor device batch inspection apparatus for inspecting
A support for supporting a semiconductor wafer;
An inspection object having a plurality of inspection electrodes corresponding to each electrode pad
And the support and the test object are moved in and out of each other.
Means for moving in a direction intersecting the direction,
Each electrode pad and inspection electrode
Positioning means for positioning the semiconductor wafer with the pole;
Elastic conductive member interposed between c and the test object
And pressurizing the semiconductor wafer and the test object in the proximity direction.
And means for providing
Claim 6).

In the invention according to claim 6, the position
The positioning means is provided on a positioning eye provided on the semiconductor wafer.
The mark and the mark on the transparent window
A display means for displaying a match between the two marks;
Alternatively, provided on the semiconductor wafer and the test object, respectively.
And the energized state of the positioning electrode
And a means for electrically detecting
Further, the alignment means is provided on the semiconductor wafer.
The positioning mark provided and the transparent window provided on the test object
Display means for displaying a mark that has been given and a match between the two marks
And the positions provided on the semiconductor wafer and the test object, respectively.
The energizing state of the alignment electrode and the positioning electrodes
May be configured to include
(Claims 7 to 9).

In the present invention, the support may be of any type as long as it has rigidity to support a wafer. For example, a flat tray for mounting a wafer or a tray for supporting a wafer or the wafer And a mounting table that can be moved in the horizontal and vertical directions.

The test body has test electrodes corresponding to each electrode pad of the semiconductor element. For example, a printed board having a structure in which a large number of electrode films and insulating films are laminated on the surface of the substrate, that is, the surface facing the support, is used. Can be used. In this case, it is preferable that the inspection electrode be a bump that protrudes, and it is more preferable that the inspection electrode be plated with metal having excellent conductivity, such as gold.

The above-mentioned conductive member may be any member as long as it is an elastic member that conducts by pressurization. For example, a conductive rubber having a pressurization conductive function obtained by adding a metal particle filler to silicone rubber is used. Can be.

As the means for pressing the support and the test object in the approaching direction, any means such as a clamp or a cylinder can be used.

[0017]

According to the present invention configured as described above , the position
Inspection of each electrode pad of the semiconductor wafer by the alignment means
In a state where the test electrodes of the body are matched , a conductive member is interposed between the semiconductor wafer and the test body, and the support and the test body are pressed in the proximity direction, whereby the conductive member is elastically deformed, Electrical conduction between the electrode pad and the inspection electrode is caused by pressurization, so that electrical characteristics of the semiconductor element can be inspected.
Further, since all of the electrode pads and the inspection electrodes are simultaneously conducted, all the semiconductor elements provided on the semiconductor wafer can be inspected at once. In this case, even if a slight error occurs in the parallelism between the semiconductor wafer and the test object, the error can be absorbed by the elastic action of the conductive member, and the electrical characteristics of the semiconductor element can be accurately inspected.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a block diagram of a main part of an inspection apparatus for carrying out the inspection method of the present invention.

The inspection apparatus includes a support 2 formed by a flat rigid tray for supporting a semiconductor wafer 1 to be inspected, and a plurality of semiconductor devices 3 (chips) corresponding to the respective electrode pads 4. The inspection object 6 having the inspection electrode 5 is movable in the reciprocating direction and in a direction intersecting the reciprocating direction , and is pressed between the wafer 1 and the inspection object 6 by pressure. A conductive member 7 having elasticity for conduction is interposed (specifically, attached to the inspection body 6). Then, the clamp 9 is fastened to the support 2 and the pressing block 8 supported on the upper surface of the test body 6, that is, the side opposite to the support side, and the support 2 and the test body 6 are pressed in the approaching direction. It has become so.

In this case, the test body 6 is formed of a printed board in which a multilayer electrode film and an insulating film (not shown) are laminated on the surface of a glass substrate 10, for example, the surface facing the support. The inspection electrode 5 is provided at a position corresponding to each electrode pad 4 of the chip 3 provided in the device. Note that the inspection electrode 5 is formed by a bump that is raised. Further, the test body 6 is provided with an electrode terminal 11 arranged so as to be connected to the test electrode 5, and a tester 12 as an external electric characteristic measuring means is connected to the electrode terminal 11.

As shown in FIG. 2, the conductive member 7 is formed of, for example, a conductive rubber containing a metal particle filler 7b in a silicone rubber 7a. The conductive rubber 7 has a pressure conducting function in which the metal particle filler 7b conducts when pressurized. That is, when the pressure reaches a certain level (5% strain), the resistance of the conductive rubber 7 rapidly decreases,
In a strain range higher than that, the metal has a pressurized conductive function that has conductivity close to that of metal (see FIG. 3). FIG. 3 is a graph showing the pressurized conductive property of the conductive rubber 7, where t represents the conductive rubber 7.
, Δt indicates strain, and R indicates a resistance value. The conductive rubber 7 is used in a state of being adhered to the test body 6. If the conductive rubber 7 is deteriorated by a large number of tests, only the conductive rubber 7 needs to be replaced. In addition, the cost can be reduced.

Since it is necessary to accurately align the electrode pad 4 and the inspection electrode 5, it is necessary to provide a positioning means for the wafer 1 and the inspection body 6. As a positioning means, for example, as shown in FIG. 4, a positioning mark 13 provided on the peripheral portion of the wafer 1 and a mark 15 provided on a transparent window 14 provided on the inspection body 6 are provided by a microscope (not shown) or the like. It is possible to use a means for matching and positioning with image display means such as a TV camera . Also another position
As the aligning means, as shown in FIGS.
(Or the support 2) and the first alignment electrode 16 provided on the test body 6.
An electrical means for electrically detecting the energized state of the above and aligning the positions can be used. Furthermore, with using both of the alignment electrodes 16, 17 with these the metering marks 13 and 15, such as those to allow a coarse adjustment and fine adjustment
Can be In this case, the positioning electrodes 16 and 17
A plurality of sets (for example, three sets) are provided, and a swing mechanism 18 that controls rotation of the wafer 1 mounting table 2a in the vertical direction in response to an electric signal of disconnection of the positioning electrodes 16 and 17 of each set is provided. By controlling , the detection accuracy can be improved by adjusting the parallelism between the wafer 1 and the inspection object 6.
Kill (see Figure 5).

Next, an inspection procedure when the inspection method of the present invention is used for a prober will be described with reference to FIG. FIG. 7 illustrates a case where the support is formed on the wafer mounting table 2a.

First, the wafer 1 housed in the cassette 21 is taken out by the wafer transfer mechanism 20, and pre-alignment for detecting, for example, the position of an orientation flat (orientation flat) of the wafer is performed, and the wafer 1 is mounted on the wafer mounting table 2a. Place.

Next, the position of the wafer 1 on the wafer mounting table 2a is recognized by the position recognition unit 23 by taking an image with, for example, the CCD camera 22 or the like.
Is moved to the assembling position 24. Simultaneously with this operation, the test object 6 is taken out of the test object storage section 26 by the test object transport mechanism 25, and the position of the test object 6 is similarly recognized by the position recognition section 23, and the test object 6 is attached to the mounting position. Conveyed to 24.

After aligning the wafer 1 and the inspection body 6 by the position recognition result and the alignment means, the wafer mounting table 2a is raised to press the wafer mounting table 2a and the inspection object 6 in the approaching direction. Then, the wafer 1 and the test body 6 are pressed against each other with the conductive rubber 7 interposed therebetween. Then, as shown in FIG. 2, the metal particle filler 7b of the conductive rubber 7 between the electrode pad 4 provided on the chip 3 of the wafer 1 and the test electrode 5 provided on the test body 6 conducts by pressure. As a result, all the electrode pads 4 and the inspection electrodes 5 are brought into conduction, and the tester 12 and the electrode pads 4 are electrically connected via the electrode terminals 11, so that the electrical characteristics of the chip 3 can be inspected. .

In the above embodiment, the case where the electrical characteristics of the chips provided on the wafer are inspected by the prober has been described. However, the electrical characteristics of the wafer can be inspected in an environmental test in addition to the prober.

Next, an inspection procedure for inspecting electrical characteristics of a wafer in an environmental test will be described with reference to FIG. In FIG. 8, the same parts as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the environmental test, when inspecting the wafer 1, first, the tray 2 as a support is taken out from the tray accommodating section 29 (support accommodating section) by the tray transport mechanism 28, and the tray 2 is belted. It is placed at a predetermined position on the transport mechanism 27.

Next, the wafer 1 is taken out of the cassette 21 by the wafer transfer mechanism 20 and pre-aligned, and then the wafer 1 is placed at a predetermined position on the tray 2.

Next, similarly to the above embodiment, for example, a CCD
After the position of the wafer 1 on the tray 2 is recognized by the position recognition unit 23 by capturing an image with the camera 22 or the like, the belt transport mechanism 27 is moved by a predetermined distance to move the tray 2 and the wafer 1 to the assembly position 24. Moving. Simultaneously with this operation, the test object 6 is taken out of the test object storage unit 26 by the test object transport mechanism 25, and the position of the test object 6 is similarly recognized by the position recognition unit 23, and the test object 6 is attached to 24
Transport to

After aligning the wafer 1 and the test piece 6 by the position recognition result and the above-described positioning means, the tray 2 and the test piece 6 are fastened by the clamp 9 in a state where the tray 2 and the test piece 6 are pressed in the approaching direction. After the wafer 1 and the test piece 6 are pressed against each other with the conductive rubber 7 interposed therebetween, the belt transport mechanism 2
7 is moved by a predetermined distance, an assembly including the tray 2, the wafer 1, the conductive rubber 7 and the inspection body 6 is carried out from the clamp assembling mechanism 30, and the assembly is transported by the assembly transport mechanism 31 to perform an environmental test. Placed in the oven 32. A plurality of ovens 32 are arranged so as to accommodate a plurality of, for example, tens of assemblies in a shelf shape. In the oven 32, an electric connection mechanism (not shown) is provided corresponding to the electrode terminal 11 provided on the inspection body 6, and the electric connection mechanism and the electrode terminal 1 are provided.
The tester 12 and the electrode pad 4 of the chip 3 formed on the wafer 1 are electrically connected via the test electrode 1 and the test electrode 6 of the test body 6.

As described above, when a predetermined number of assemblies are disposed in the oven 32, the opening / closing mechanism (not shown) of the oven 32 is closed, and the inside of the oven is set to a predetermined environmental temperature. The electrical characteristics of the electrode pads 4 of all the chips 3 of the wafer 1 are inspected collectively.

In the above embodiment, the case where the tray 2 is used as the support in the environmental test has been described. However, the wafer mounting table 2a shown in the first embodiment can be used instead of the tray 2. It is.

[0036]

As described above , according to the present invention,
For example, each electrode pad of the semiconductor wafer is
Since the conductive member having elasticity is interposed between the semiconductor wafer and the test body in a state where the test electrodes of the test body are matched with each other, all the electrode pads and the test electrodes are simultaneously conducted and provided on the semiconductor wafer. The electrical characteristics of all the semiconductor elements can be inspected collectively. Moreover, even if a slight error occurs in the degree of parallelism between the semiconductor wafer and the test object, the error can be absorbed by the elastic action of the conductive member, so that the electrical characteristics of the semiconductor element can be accurately inspected and the reliability of the inspection can be improved. Can be enhanced. In addition, since only the conductive member needs to be replaced, the life of the test object is increased, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a main part of an inspection apparatus according to the present invention.

FIG. 2 is a sectional view showing a conductive state of a conductive member according to the present invention.

FIG. 3 is a graph showing a pressurized conductive property of a conductive member.

FIG. 4 is an exploded perspective view showing alignment between a semiconductor wafer and an inspection object.

FIG. 5 is a side view showing another alignment state.

FIG. 6 is an enlarged sectional view showing a portion A in FIG. 5;

FIG. 7 is a configuration diagram illustrating an example of an inspection apparatus that performs the inspection method of the present invention.

FIG. 8 is a configuration diagram showing another embodiment of the inspection apparatus.

[Explanation of symbols]

Reference Signs List 1 semiconductor wafer 2 tray (support) 2a wafer mounting table (support) 3 chip (semiconductor element) 4 electrode pad 5 test electrode 6 test body 7 conductive rubber (conductive member) 9 clamp 11 electrode terminal 12 tester 13 positioning Mark 14 Transparent window 15 Mark 16 First alignment electrode 17 Second alignment electrode 18 Swing mechanism 21 Cassette 26 Inspection body housing section 29 Tray housing section (support body housing section) 32 Oven for environmental test

Continuation of front page (56) References JP 1-2212448 (JP, A) JP 2-257071 (JP, A) JP 63-17971 (JP, A) JP 63-148575 (JP) JP-A-51-121267 (JP, A) JP-A-59-148345 (JP, A) JP-A-2-290035 (JP, A) JP-A-1-235344 (JP, A) 2-156650 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/66 G01R 31/28

Claims (9)

(57) [Claims] 1. A method of inspecting electrical characteristics of a semiconductor device by bringing an inspection electrode into contact with each electrode pad of the semiconductor device provided on the semiconductor wafer, wherein a support for supporting the semiconductor wafer is provided. And a step of movably facing a test object having a plurality of test electrodes corresponding to each electrode pad of the semiconductor element in a direction in which the test object moves forward and backward and a direction intersecting the forward and backward directions. a step of aligning made to match each other by aligning means and the respective electrode pads and the inspection electrode, between the test body and the semiconductor wafer, when interposing a conductive member having elasticity together with the support A step of pressing the test object in the proximity direction to cause the pressurizing and conducting function of the conductive member to act to simultaneously conduct all of the electrode pads and the test electrodes. A batch inspection method for a semiconductor device, comprising: 2. A method for batch inspection of a semiconductor device according to claim 1.
In the method, the above-mentioned alignment step is performed by positioning a semiconductor wafer.
Mark and mark on the transparent window provided on the test object
Is performed in accordance with each other.
A batch inspection method for semiconductor devices. 3. A method for batch inspection of a semiconductor device according to claim 1.
In the method, the alignment step is performed on a semiconductor wafer and an inspection object.
By detecting the energized state of the positioning electrode
A batch inspection method for a semiconductor device. 4. A batch inspection method for a semiconductor device according to claim 1.
In the law, The above positioning step is performed by positioning the semiconductor wafer.
Mark and mark on the transparent window provided on the test object
And the semiconductor wafer and the test object
Detection by detecting the energized state of the positioning electrode
Batch inspection method for semiconductor devices, characterized in that:
Law. 5. A method of inspecting electrical characteristics of a semiconductor device by bringing an inspection electrode into contact with each electrode pad of the semiconductor device provided on the semiconductor wafer, wherein the support for supporting the semiconductor wafer is provided. Removing the semiconductor wafer from the inside of the support accommodating portion, removing the semiconductor wafer from the cassette, placing the semiconductor wafer on the support, and supporting the support and the respective electrode pads of the semiconductor element. A step of movably opposing a test object having a plurality of test electrodes in a reciprocating direction and a direction intersecting the reciprocating direction; and the respective electrode pads and test electrodes by positioning means provided on the semiconductor wafer and the test object. preparative a step of aligning made to match one another, between the test body and the semiconductor wafer, when interposing a conductive member having elasticity both the supporting A step of pressing the body and the test object in the approaching direction; a step of placing the support, the semiconductor wafer, and the test object in a pressed state in an environmental test oven; and setting the environmental test oven to a predetermined temperature. And a step of energizing all of the electrode pads and the inspection electrodes at the same time. 6. A semiconductor device provided on a semiconductor wafer.
A test electrode is brought into contact with each electrode pad to
In a batch inspection system for semiconductor devices that inspects various characteristics
Te, a support for supporting the semiconductor wafer, a plurality of test collector corresponding to respective electrode pads of the semiconductor element
The test object having the pole, the support and the test object are moved in the retreating direction and the retreating direction with respect to each other.
Means for moving in an intersecting direction, and the electrode pads provided on the semiconductor wafer and the test piece.
Positioning means for positioning the semiconductor wafer and the inspection electrode, and elasticity interposed between the semiconductor wafer and the inspection body.
Conductive member, and means for pressing the semiconductor wafer and the test object in the proximity direction
And a batch inspection device for semiconductor devices, comprising:
Place. 7. A batch inspection apparatus for a semiconductor device according to claim 6.
In the apparatus, the positioning means is provided with a positioning device provided on the semiconductor wafer.
Mark and mark on the transparent window provided on the test object
And display means for displaying a match between the two marks.
A batch inspection apparatus for semiconductor devices. 8. A batch inspection apparatus for a semiconductor device according to claim 6.
In the apparatus, the alignment means may be provided on the semiconductor wafer and the test object, respectively.
The positioning electrode provided and the positioning electrode
Means for electrically detecting the energized state of the
Characteristic batch inspection equipment for semiconductor devices. 9. A batch inspection apparatus for a semiconductor device according to claim 6.
In the apparatus, the positioning means is provided with a positioning device provided on the semiconductor wafer.
Mark and mark on the transparent window provided on the test object
Display means for displaying a match between the two landmarks;
Alignment electrodes provided on EHA and test object respectively
And electrically detect the energized state of the two positioning electrodes.
Package of semiconductor elements characterized by comprising
Inspection equipment.