JP2919192B2 - Reticle cleaning equipment - Google Patents

Reticle cleaning equipment

Info

Publication number
JP2919192B2
JP2919192B2 JP23672292A JP23672292A JP2919192B2 JP 2919192 B2 JP2919192 B2 JP 2919192B2 JP 23672292 A JP23672292 A JP 23672292A JP 23672292 A JP23672292 A JP 23672292A JP 2919192 B2 JP2919192 B2 JP 2919192B2
Authority
JP
Japan
Prior art keywords
reticle
foreign matter
image
inspection
cleaning apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23672292A
Other languages
Japanese (ja)
Other versions
JPH0684869A (en
Inventor
陽彦 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAGUCHI NIPPON DENKI KK
Original Assignee
YAMAGUCHI NIPPON DENKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMAGUCHI NIPPON DENKI KK filed Critical YAMAGUCHI NIPPON DENKI KK
Priority to JP23672292A priority Critical patent/JP2919192B2/en
Publication of JPH0684869A publication Critical patent/JPH0684869A/en
Application granted granted Critical
Publication of JP2919192B2 publication Critical patent/JP2919192B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は半導体素子製造工程の露
光処理工程で使用されるレチクル洗浄装置に関し、特に
レチクルの異物検査機構を備えたレチクル洗浄装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reticle cleaning apparatus used in an exposure process in a semiconductor device manufacturing process, and more particularly to a reticle cleaning apparatus provided with a reticle foreign matter inspection mechanism.

【0002】[0002]

【従来の技術】従来、半導体素子製造分野で使用されて
いるレチクル洗浄装置は、一般にレチクルの洗浄面に純
水または帯電防止材混合水を噴出し、洗浄手段であるブ
ラシまたはスポンジ材により洗浄する洗浄機構と、この
洗浄機構により濡れたレチクルを乾燥手段であるIPA
(イソプロピルアルコール)のベーパー雰囲気中で乾燥
させる乾燥機構と、乾燥後のレチクル表面に付着した異
物の検査機構と、それらを連結するレチクル搬送機構と
から構成されている。
2. Description of the Related Art Conventionally, a reticle cleaning apparatus used in the field of manufacturing semiconductor devices generally jets pure water or mixed water of an antistatic material onto a cleaning surface of the reticle, and cleans the reticle with a brush or sponge material as cleaning means. A cleaning mechanism and a reticle wet by the cleaning mechanism are dried by IPA as a drying means.
It is composed of a drying mechanism for drying in a (isopropyl alcohol) vapor atmosphere, a mechanism for inspecting foreign matter adhering to the reticle surface after drying, and a reticle transport mechanism for connecting them.

【0003】この従来のレチクル異物検査機構は、図3
の説明図に示すように、検査レチクル4の表面上にレー
ザー光を一定の角度αで照射し走査を行うレーザー機構
13と、それによって生じたレチクル表面からの反射光
(散乱光)を受光検出する光電素子14とから構成さ
れ、このレチクル表面からの反射光(散乱光)の強度変
化により異物12か否かを検知し得るものである。
[0003] This conventional reticle foreign matter inspection mechanism is shown in FIG.
As shown in FIG. 1, a laser mechanism 13 for irradiating the surface of the inspection reticle 4 with a laser beam at a certain angle α for scanning, and detecting and detecting reflected light (scattered light) from the reticle surface generated by the laser mechanism 13. And a photoelectric element 14 which can detect the presence or absence of the foreign matter 12 based on a change in the intensity of the reflected light (scattered light) from the reticle surface.

【0004】[0004]

【発明が解決しようとする課題】従来のレチクル洗浄装
置は、洗浄手段であるブラシまたはスポンジ材の接触に
よる洗浄処理のため、ブラシまたはスポンジ材が磨耗し
その塵埃がレチクルに付着してしまう。また、IPAの
ベーパー雰囲気中でのレチクルの乾燥処理のため、ベー
パー温度が不安定な場合レチクルが未乾燥な状態とな
り、しみ等が発生してしまう。
In the conventional reticle cleaning apparatus, the brush or sponge material as a cleaning means is subjected to cleaning processing, so that the brush or sponge material wears and dust adheres to the reticle. Further, since the reticle is dried in a vapor atmosphere of IPA, when the vapor temperature is unstable, the reticle is in an undried state, and stains or the like occur.

【0005】この従来のレチクル洗浄装置に具備された
異物検査機構は、レーザー光の照射によりレチクル表面
からの反射光(散乱光)を検出する方式であるため、照
射レーザー光を吸収、透過してしまうようなしみや透明
物質等の異物を検出することが困難であり、そのため、
洗浄が終り異物検査後のレチクルを正常と判断して露光
処理に使用することによって、半導体素子に対し欠陥を
持つパターニング処理がなされるという問題があった。
[0005] The foreign matter inspection mechanism provided in this conventional reticle cleaning apparatus is a system that detects reflected light (scattered light) from the reticle surface by irradiating laser light, and therefore absorbs and transmits the irradiated laser light. It is difficult to detect stains or foreign substances such as transparent substances,
There is a problem that the semiconductor device is subjected to a patterning process having a defect by determining that the reticle after the foreign substance inspection is normal after the cleaning and using the reticle for the exposure process.

【0006】[0006]

【課題を解決するための手段】本発明のレチクル洗浄装
置は、洗浄後のレチクルの異物検査機構を備えている。
このレチクル異物検査機構は、レチクルの一方の面側よ
り露光処理工程で使用する波長の照明光をレチクル全面
に照射し走査する手段と、レチクルの他方面側に透過し
たレチクルパターンの透過像を撮像する手段と、その透
過像を画像処理する手段と、レチクルパターン画像の規
則性条件データを格納しておく手段と、前記透過画像に
対し予め設定したレチクルパターン画像の規則性条件デ
ータを照合比較し検査演算処理する手段とを備え、しみ
や透明物質等の異物の検出を可能にしている。
SUMMARY OF THE INVENTION A reticle cleaning apparatus of the present invention includes a mechanism for inspecting foreign substances on a reticle after cleaning.
The reticle foreign matter inspection mechanism irradiates the entire surface of the reticle with illumination light having a wavelength used in the exposure process from one side of the reticle and scans the reticle, and captures a transmission image of the reticle pattern transmitted to the other side of the reticle. Means for performing image processing of the transmitted image, means for storing regularity condition data of the reticle pattern image, and comparing and comparing regularity condition data of the reticle pattern image preset for the transparent image. A means for performing inspection calculation processing to enable detection of foreign substances such as stains and transparent substances.

【0007】[0007]

【実施例】次に本発明について図面を用いて説明する。
図1は本発明の実施例1に用いるレチクル異物検査機構
を説明するための光学系を付加したブロック図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
FIG. 1 is a block diagram to which an optical system for explaining a reticle foreign matter inspection mechanism used in Embodiment 1 of the present invention is added.

【0008】本実施例に用いるレチクル異物検査機構の
光学系は、ハーフミラー3により反射させレチクル保持
機構5に載せた検査レチクル4に照明光を照射させる照
明光光源1と、その光源1から照射された照明光の光路
上に設けられ露光工程で使用する波長のみを取り出すフ
ィルター2と、検査レチクル4に照射させた照明光の透
過した検査レチクルのパターン透過画像を取り込むため
の、例えばCCDカメラ等による画像検出部6とを有し
ている。
An optical system of a reticle foreign matter inspection mechanism used in the present embodiment includes an illumination light source 1 for irradiating an inspection reticle 4 reflected by a half mirror 3 on an inspection reticle 4 mounted on a reticle holding mechanism 5, and illumination from the light source 1. A filter 2 provided on the optical path of the irradiated illumination light for extracting only the wavelength used in the exposure step, and a CCD camera or the like for capturing a pattern transmission image of the inspection reticle transmitted through the illumination light irradiated on the inspection reticle 4 And an image detection unit 6.

【0009】また、画像検出部6の制御と取り込み及び
画像信号変換処理等を行う画像処理部7aと、予め検査
レチクルのパターンの規則性条件データを格納できるパ
ターンデータ部8と、そのパターンの規則性条件データ
の制御と取り込み及び画像信号変換処理等を行う画像処
理部7bと、画像処理部7aと7bからの信号により両
者のデータを照合、比較し検査演算を行う演算処理部9
aとにより構成されている。
An image processing section 7a for controlling and taking in the image detecting section 6 and performing image signal conversion processing, a pattern data section 8 for storing regularity condition data of a pattern of an inspection reticle in advance, and a rule for the pattern An image processing unit 7b for controlling and taking in sex condition data and performing image signal conversion processing, etc .; and an arithmetic processing unit 9 for comparing and comparing data of the two based on signals from the image processing units 7a and 7b and performing an inspection operation.
a.

【0010】次に本実施例に用いるレチクル異物検査機
構の動作を説明する。まず、照明光光源1によりフィル
ター2、ハーフミラー3を介して検査レチクル4に照明
光が照射され、XY方向動作機能を備えたレチクル保持
機構5により検査レチクル全面を走査する。この時、画
像処理部6は照明光の光路上の検査レチクル4の照射面
の反対面側に常に位置しているものとし、検査レチクル
4の照明光の透過した透過像を撮像する。この画像検出
部6で撮像された透過画像は画像処理部7aで信号処理
され、予めこの検査レチクル4のパターンの規則性条件
データを画像信号処理する画像処理部7bのデータと照
合比較して演算処理部9aで演算処理し、規則性条件か
ら外れたものを異常、すなわち異物と判断し、全て規則
性条件に適合している場合を正常と判断する。
Next, the operation of the reticle foreign matter inspection mechanism used in this embodiment will be described. First, the illumination light source 1 irradiates the inspection reticle 4 with illumination light via the filter 2 and the half mirror 3, and scans the entire inspection reticle by a reticle holding mechanism 5 having an XY direction operation function. At this time, it is assumed that the image processing unit 6 is always located on the side opposite to the irradiation surface of the inspection reticle 4 on the optical path of the illumination light, and captures a transmitted image of the inspection reticle 4 through which the illumination light has passed. The transmission image picked up by the image detection unit 6 is subjected to signal processing in an image processing unit 7a, and the pattern regularity condition data of the inspection reticle 4 is compared with data of an image processing unit 7b that performs image signal processing in advance and calculated. The processing unit 9a performs arithmetic processing, and determines that an item that is out of the regularity condition is abnormal, that is, a foreign object, and that all of the items satisfy the regularity condition are normal.

【0011】図2は本発明の実施例2に用いるレチクル
異物検査機構を説明するための光学系を付加したブロッ
ク図である。本実施例は、図1に示した実施例1と同一
のレチクル異物検査機能を有し、これに検査レチクル4
上の異物12の位置情報を取り込むためのレビュー機能
を付加したものである。
FIG. 2 is a block diagram to which an optical system for explaining a reticle foreign matter inspection mechanism used in a second embodiment of the present invention is added. This embodiment has the same reticle foreign matter inspection function as the first embodiment shown in FIG.
A review function for taking in position information of the foreign matter 12 above is added.

【0012】本実施例のレビュー機能の動作について説
明する。検査レチクル4を走査させるXY方向動作機能
を備えたレチクル保持機構5の駆動系モーター10の回
転量を回転量検出部11で検出し、検出された回転量と
画像処理部6での異物検出とを同期させることにより、
検査レチクル4上の異物12の位置情報を取り込んで演
算処理部9bで演算処理を行い、検査レチクル4上の異
物の位置をレビューすることが可能となる。
The operation of the review function of this embodiment will be described. The rotation amount of a drive system motor 10 of a reticle holding mechanism 5 having an XY direction operation function for scanning the inspection reticle 4 is detected by a rotation amount detection unit 11, and the detected rotation amount and foreign matter detection by an image processing unit 6 are detected. By synchronizing
The position information of the foreign matter 12 on the inspection reticle 4 is taken in, the arithmetic processing unit 9b performs an arithmetic processing, and the position of the foreign matter on the inspection reticle 4 can be reviewed.

【0013】[0013]

【発明の効果】以上説明したように本発明は、半導体素
子製造工程の露光工程で使用するレチクル洗浄装置に、
レチクル表面に付着した異物を検出する異物検査機構を
設けたことによって、従来の異物検査方式では検出し得
なかったレーザー光を吸収、透過するような異物を検出
することが可能となり、レチクルに付着した異物による
半導体素子へのパターニング時の転写による欠陥をなく
し、半導体素子の良品率を向上させるという効果があ
る。
As described above, the present invention relates to a reticle cleaning apparatus used in an exposure step of a semiconductor element manufacturing process.
By providing a foreign matter inspection mechanism that detects foreign matter adhering to the reticle surface, it is possible to detect foreign matter that absorbs and transmits laser light that could not be detected by the conventional foreign matter inspection method, and adheres to the reticle. This has the effect of eliminating defects due to transfer during patterning onto the semiconductor element due to foreign matter, thereby improving the yield of the semiconductor element.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1における異物検査機構の説明
図である。
FIG. 1 is an explanatory diagram of a foreign matter inspection mechanism according to a first embodiment of the present invention.

【図2】本発明の実施例2における異物検査機構の説明
図である。
FIG. 2 is an explanatory diagram of a foreign matter inspection mechanism according to a second embodiment of the present invention.

【図3】従来のレチクル洗浄装置における異物検査機構
の説明図である。
FIG. 3 is an explanatory diagram of a foreign matter inspection mechanism in a conventional reticle cleaning apparatus.

【符号の説明】[Explanation of symbols]

1 照明光光源 2 フィルター 3 ハーフミラー 4 検査レチクル 5 レチクル保持機構 6 画像検出部 7a、7b 画像処理部 8 パターンデータ部 9a、9b 演算処理部 10 モーター 11 回転量検出部 12 異物 13 レーザー機構 14 光電素子 DESCRIPTION OF SYMBOLS 1 Illumination light source 2 Filter 3 Half mirror 4 Inspection reticle 5 Reticle holding mechanism 6 Image detection part 7a, 7b Image processing part 8 Pattern data part 9a, 9b Arithmetic processing part 10 Motor 11 Rotation amount detection part 12 Foreign material 13 Laser mechanism 14 Photoelectric element

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01L 21/304 G01N 21/88 H01L 21/027 Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 21/304 G01N 21/88 H01L 21/027

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 半導体素子製造工程における露光処理工
程で使用し、レチクル洗浄後にレチクルの一方の面側よ
り露光処理工程で使用する波長の照明光を照射し、他方
の面側よりレチクルパターンの透過像を撮像し、その画
像情報を処理し、あらかじめ設定した画像のパターン規
則性条件データから外れた部分を異常として検出するレ
チクル異物検査機構を備えたレチクル洗浄装置におい
て、前記レチクルを走査させるXY方向動作機能を備え
たレチクル保持機構の駆動モーターの回転量を検出し、
検出された回転量と前記画像情報処理による異物検出と
を同期させてレチクル上の異物の位置情報を取り込んで
演算処理を行ない、レチクル上の異物の位置をレビュー
することを特徴とするレチクル洗浄装置。
An illuminating light having a wavelength used in an exposure processing step is irradiated from one surface side of a reticle after reticle cleaning, and transmitted through a reticle pattern from the other surface side. In a reticle cleaning apparatus equipped with a reticle foreign matter inspection mechanism for taking an image, processing the image information, and detecting a portion deviating from the pattern regularity condition data of a previously set image as an abnormality, scanning the reticle in the XY directions. Detects the amount of rotation of the drive motor of the reticle holding mechanism equipped with an operation function,
A reticle cleaning apparatus for synchronizing the detected amount of rotation with the foreign matter detection by the image information processing, taking in positional information of the foreign matter on the reticle, performing arithmetic processing, and reviewing the position of the foreign matter on the reticle; .
JP23672292A 1992-09-04 1992-09-04 Reticle cleaning equipment Expired - Fee Related JP2919192B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23672292A JP2919192B2 (en) 1992-09-04 1992-09-04 Reticle cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23672292A JP2919192B2 (en) 1992-09-04 1992-09-04 Reticle cleaning equipment

Publications (2)

Publication Number Publication Date
JPH0684869A JPH0684869A (en) 1994-03-25
JP2919192B2 true JP2919192B2 (en) 1999-07-12

Family

ID=17004817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23672292A Expired - Fee Related JP2919192B2 (en) 1992-09-04 1992-09-04 Reticle cleaning equipment

Country Status (1)

Country Link
JP (1) JP2919192B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100389133B1 (en) * 2001-05-24 2003-06-25 삼성전자주식회사 Exposure apparatus for manufacturing semiconductor device and method for operating its
KR20050063439A (en) 2003-12-22 2005-06-28 삼성전자주식회사 Method and system for managing a reticle

Also Published As

Publication number Publication date
JPH0684869A (en) 1994-03-25

Similar Documents

Publication Publication Date Title
JP4527205B2 (en) Optical inspection module and method for detecting particles and defects on a substrate in an integrated process tool
US6809809B2 (en) Optical method and apparatus for inspecting large area planar objects
US7161670B2 (en) Inspection systems using sensor array and double threshold arrangement
JP3101290B2 (en) Surface condition inspection device, exposure apparatus, and surface condition inspection method
JP2000180371A (en) Foreign matter inspecting apparatus and semiconductor process apparatus
JPS61100932A (en) Exposure equipment
JP2004525528A5 (en)
US7286697B2 (en) System for imaging an extended area
JP2919192B2 (en) Reticle cleaning equipment
JP2003282675A (en) Wafer mapping device
JPH09252035A (en) Visual inspection method and device of semiconductor wafer
JPH1070069A (en) Dust detecting system for semiconductor aligner
JPH045979B2 (en)
JP2000088760A (en) Work-inspecting device
JPH09106065A (en) Substrate cleaning device and method
JPH0979991A (en) Pattern inspection device, defect inspection device, and pattern inspection method
KR102592277B1 (en) Apparatus and method for performing internal defects inspection of an electronic component
JP2000111484A (en) Inspection apparatus for defect of wafer
JPH0587781B2 (en)
JP2830430B2 (en) Foreign matter inspection device
JP2801916B2 (en) Defect inspection equipment
JPH09218162A (en) Surface defect inspection device
JPH10170240A (en) Method and device for inspection of pattern flaw
JPH1019791A (en) Method and device for inspecting semiconductor material
JP2000131241A (en) Inspection device and inspecting method for optical element

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19990323

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees