JP2000180371A - Foreign matter inspecting apparatus and semiconductor process apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a foreign matter inspecting apparatus capable of accurately detecting only foreign matter. SOLUTION: A foreign matter inspecting apparatus 20 includes an inspection stage 3 provided in order to place a work, a luminaire 4 for applying light to the work from a lateral direction and an oblique upper direction, a high resolving power area sensor camera 5 for taking the image of the work, a housing 1 for covering the luminaire 4 and the camera 5 to cut off external light, the duct 7 connected to the opening part of the housing 1 to send purified air having a high clean degree into the housing and a control/processing part 2 receiving the image signal outputted from the high resolving power area sensor camera 5 to form image data and processing this image data to inspect foreign matter. If necessary, a reflection preventing plate 6 to which matte treatment is applied in the vicinity of the camera 5 is provided on the foreign matter inspecting apparatus 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foreign substance inspection apparatus and a semiconductor processing apparatus, and more particularly, to a foreign substance inspection apparatus and a semiconductor processing apparatus capable of accurately detecting only foreign substances, scratches, and unevenness.

[0002]

2. Description of the Related Art Referring to FIG. 4, a photolithography process apparatus, which is a kind of conventional semiconductor processing apparatus, includes a loader
, A cleaning unit 12, a resist coating unit 13, a peripheral resist removing unit 14, an exposing unit 15, a developing unit 16, an unloader 17, and a robot 18a for transporting a work between these processing units. 18b and the transfer robot 19
And

In such an in-line type photolithography process apparatus, dust invades from a driving system or the like, and if the dust adheres to a work before or after resist application or before exposure, it causes a resist pattern abnormality. After the completion of the resist patterning, the abnormalities of the resist pattern are discovered by an inspection unit (not shown) provided outside the apparatus.
After the sampling inspection or 100% inspection for foreign matter or pattern abnormalities. Because of this, the discovery of defects was delayed,
In the meantime, there is a problem that many similar defects occur. Further, in the case of performing the sampling inspection, there is a work that proceeds to the next process with the pattern being abnormal. For this reason, a disconnection defect occurs when performing the etching process in the next step, which causes a reduction in yield.

As a method for solving these problems, a foreign matter inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 8-250385 inspects foreign matter before and after each processing of resist coating or exposure.

[0005]

However, the conventional foreign substance inspection apparatus is incorporated in a semiconductor processing apparatus, and detects foreign substances, scratches, unevenness, and the like at an early stage from image data input by a camera, and takes measures to solve the problem. Despite the object of preventing defects from occurring and improving the yield, the foreign matter inspection apparatus itself does not have a function of removing dust. For this reason, dust has adhered to the work during inspection for foreign matter, scratches, unevenness, and the like, thereby causing a problem that a defect occurs and the yield is reduced.

In addition, the surface of a work to be inspected is a semiconductor wafer or an LCD (Liquid Crystal Display), a PDP.
(Plasma Display Panel) or FED (Field Emis)
In the case of a substrate for a flat panel display such as a sion display, the work surface has a mirror-like surface and tends to reflect light. For this reason, the surrounding scenery appears in the image data input to the camera, and the detection sensitivity for foreign matter, scratches, unevenness, and the like is reduced. For example, it is assumed that a metal screw used for fixing a ceiling plate of a foreign substance inspection device is reflected on a work to be inspected and is reflected on a camera. Referring to FIG. 5, in the image data obtained by the camera, the reflection of the screw looks as if it is a foreign substance. For this reason, erroneous detection is caused. Eventually, if the extra background is reflected in the camera, the noise component of the image data will increase, and the S / N ratio between the luminance of the foreign matter portion and the luminance of the other portions will relatively decrease, and the original foreign matter, The detection sensitivity for flaws and unevenness will be reduced.

Further, a halogen lamp is generally used as an illumination light source in the foreign matter inspection device. Some halogen lamps bundle a plurality of optical fibers, connect one end of the optical fiber to a light source, and emit light from the other end. The other end of the optical fiber is lined up along the light guide. Referring to FIG. 6, in the case of such an illuminating device, streak-like illuminance unevenness may occur in the illuminating light applied to the work to be inspected. For this reason, detection of foreign matters, scratches, unevenness, and the like is hindered, and there has been a problem that the detection sensitivity is reduced. The light emitted from the halogen lamp has a wavelength range in which the resist is exposed. For this reason, when the work before development is irradiated with the light of a halogen lamp, the portion is exposed to light, which adversely affects the pattern after development.

Referring to FIG. 7, an LCD, PDP, or F
In the case of a transparent or translucent substrate, such as a flat panel display substrate such as an ED, the surface condition and scratches of the stage surface corresponding to the bottom of the foreign substance inspection device are reflected on the camera, and the original inspection target It becomes difficult to detect foreign matter, scratches and unevenness of a certain work. In general, a camera can shoot an object in a focused state with respect to an object within a range of a depth of focus. For this reason, even if the focus is set on the work to be inspected, if the stage surface is within the range of the depth of focus of the camera, the surface state of the stage surface, minute scratches, and the like will appear.

Further, when the foreign substance inspection apparatus is incorporated in a photolithographic process apparatus, it is difficult to mount a foreign substance inspection apparatus having an excessively large size due to restrictions on an installation space. For this reason, development of a smaller foreign substance inspection apparatus has been desired.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a foreign matter inspection apparatus capable of accurately detecting only foreign matter.

Another object of the present invention is to provide a foreign substance inspection apparatus which can accurately detect only a foreign substance and can be incorporated in a semiconductor processing apparatus.

It is still another object of the present invention to provide a semiconductor processing apparatus incorporating a foreign matter inspection device capable of accurately detecting only foreign matter.

It is still another object of the present invention to provide a semiconductor processing apparatus which incorporates a foreign substance inspection apparatus which can accurately detect only foreign substances and does not reduce the yield of products.

[0014]

According to a first aspect of the present invention, there is provided a foreign matter inspection apparatus for illuminating a workpiece with light, a camera for imaging the workpiece, and image data output from the camera. And an image processing unit for detecting foreign matter on the work, a housing having an opening for covering the camera, and a housing connected to the opening of the housing. And a duct for feeding clean air into the inside.

According to the first aspect of the present invention, purified clean air is sent into the foreign matter inspection device. The sent gas flows in the apparatus and increases the cleanliness in the apparatus. For this reason, the inside of the apparatus can always be kept in a dust-free state, and dust can adhere to the work. Therefore, it is possible to accurately detect only the foreign matter.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, the invention further includes an anti-reflection plate for illuminating light, and the inside of the housing is for absorbing light. Processing has been applied.

According to a second aspect of the present invention, in addition to the functions and effects of the first aspect, when the work to be inspected is a semiconductor wafer or a flat panel display substrate such as an LCD, PDP or FED, The surface of the work is mirror-like and easily reflects light. For this reason, the surrounding scenery is easily reflected in the image input by the camera. However, an antireflection plate for illuminating light is provided inside the housing, and a process for absorbing light is performed inside the housing. For this reason, reflection of the surrounding scenery on the camera can be reduced, and only foreign matter can be accurately detected.

According to a third aspect of the present invention, in addition to the configuration of the first aspect of the present invention, there is further provided a plate for scattering light provided on the illumination surface of the illumination.

According to a third aspect of the present invention, in addition to the functions and effects of the first aspect of the present invention, by providing a plate for scattering light on the irradiation surface of the illumination, a streaky work is formed on the work to be inspected. Irradiation unevenness does not occur. For this reason,
Image data of a portion other than the foreign matter has a gentle luminance distribution, and only the foreign matter can be accurately detected.

According to a fourth aspect of the present invention, there is provided a foreign matter inspection apparatus, comprising: an illumination for irradiating a workpiece with light; a stage;
A camera for imaging the workpiece, an image processing unit for processing image data output from the camera and detecting foreign matter on the workpiece, and provided on the stage, and the camera is focused on the workpiece, A holding member for holding the work at a position that does not match the stage.

According to the fourth aspect of the invention, when the camera is focused on the surface of the work, the focus is not on the surface of the stage. For this reason, the surface state of the stage, minute scratches, and the like do not appear on the camera. Therefore, only the foreign matter can be accurately detected.

According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, the light applied to the work from the illumination is light in a wavelength range that does not expose the resist. .

According to a fifth aspect of the present invention, in addition to the functions and effects of the first to fourth aspects, the resist is not exposed to illumination light. For this reason,
This foreign matter inspection apparatus can be used near an exposure apparatus and can be incorporated in a semiconductor processing apparatus.

According to a sixth aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a cleaning means for cleaning a work; a resist coating means for applying a resist to the work; Including peripheral resist removing means, exposing means for exposing a resist-coated work, developing means for developing the exposed work, and foreign matter detecting means for detecting foreign matter on the work. A foreign matter detection unit, illumination for irradiating the work with light, a camera for imaging the work, and an image processing unit for processing image data output from the camera and detecting foreign matter on the work. A housing having an opening for covering the camera, and a duct connected to the opening of the housing for sending clean air from the outside of the housing to the inside of the housing.

According to the sixth aspect of the present invention, purified clean air is sent into the foreign matter inspection device. The sent gas flows in the apparatus and increases the cleanliness in the apparatus. For this reason, the inside of the apparatus can always be kept in a dust-free state, and dust can adhere to the work. Therefore, the foreign matter inspection device can accurately detect only the foreign matter.

According to a seventh aspect of the present invention, in addition to the configuration of the sixth aspect, the foreign matter detection means further includes an antireflection plate for light emitted from illumination, and the inside of the housing has A process for absorbing light has been performed.

According to a seventh aspect of the present invention, in addition to the functions and effects of the sixth aspect of the invention, the work to be inspected by the foreign matter inspection apparatus is a semiconductor wafer or a flat panel display such as an LCD, PDP or FED. For a substrate,
The surface of the work is mirror-like and easily reflects light.
For this reason, the surrounding scenery is easily reflected in the image input by the camera. However, an antireflection plate for illuminating light is provided inside the housing, and a process for absorbing light is performed inside the housing. For this reason, reflection of the surrounding scenery on the camera can be reduced, and only foreign matter can be accurately detected.

According to an eighth aspect of the present invention, in addition to the configuration of the sixth aspect, the foreign matter detecting means further includes a plate provided on an illumination irradiation surface for scattering light.

According to an eighth aspect of the present invention, in addition to the functions and effects of the sixth aspect of the present invention, a work to be inspected is provided by providing a plate that scatters light on the illumination surface of the foreign matter inspection apparatus. No streak-like illuminance unevenness occurs. For this reason, the image data of the part other than the foreign matter has a gentle luminance distribution, and only the foreign matter can be accurately detected.

According to a ninth aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a cleaning unit for cleaning a work; a resist coating unit for applying a resist to the work; and a resist for removing a resist around the work. Including peripheral resist removing means, exposing means for exposing a resist-coated work, developing means for developing the exposed work, and foreign matter detecting means for detecting foreign matter on the work. , Foreign matter detection means, illumination for irradiating the work with light, a stage, a camera for imaging the work,
An image processing unit that processes image data output from the camera and detects foreign matter on the work, and is provided on the stage. The camera focuses on the work, but places the work in a position that does not fit on the stage. And a holding member for holding.

According to the ninth aspect, when the camera of the foreign matter inspection apparatus is focused on the surface of the work, the surface of the stage is not focused. For this reason, the surface state of the stage, minute scratches, and the like do not appear on the camera. Therefore, only the foreign matter can be accurately detected.

[0032] The invention according to claim 10 is the invention according to claims 6 to 9.
In addition to the configuration of the invention described in any one of the above, the light irradiated to the work from the illumination is light in a wavelength range that does not expose the resist.

The invention according to claim 10 is the invention according to claims 6 to 9
In addition to the functions and effects of the invention described in any one of the above, the resist is not exposed by the illumination light of the foreign matter inspection device. Therefore, even if this foreign matter inspection apparatus is used near the exposure means, it does not affect the work and does not lower the yield.

[0034]

Embodiments of the present invention will be described below with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Since their names and functions are the same, repetition of the description will be appropriately omitted.

Referring to FIG. 1, a photolithographic process apparatus, which is one type of semiconductor processing apparatus according to the embodiment of the present invention, includes a loader 11 which is an entrance of a work to the photolithographic process apparatus, and a cleaning for cleaning the work. Part 12;
Resist application section 13 for applying resist to work
A peripheral resist removing unit 14 for removing a resist in a peripheral portion of the work, an exposing unit 15 for exposing the work on which the resist is applied, and a developing unit 16 for developing the exposed work. An unloader 17 which is an exit of the work from the photolithography process device, a foreign matter inspection device 20 for detecting foreign matter on the work, and robots 18a and 18 for transporting the work between these processing units.
b and the transfer robot 19.

Each processing unit is provided with a hot plate for heating the work before and after the processing and a cool plate for cooling the work.

When the cassette containing the work is carried into the loader 11, the robot 18a removes the work from the cassette by one.
Each sheet is extracted and transferred to the transfer robot 19. The transfer robot 19 cleans the work in the cleaning unit 12 and the resist coating unit 1
3 and the peripheral portion resist removing section 14 in this order.

After completion of the processing in the peripheral resist removing section 14, the transfer robot 19 transfers the work to the robot 18b. The robot 18b transports the work to the exposure unit 15. After exposing the work, the robot 18 b takes out the work from the exposure unit 15 and introduces the work into the foreign matter inspection device 20. After inspecting the work for foreign matter, scratches, unevenness and the like by the foreign matter inspection device 20, the robot 18 b takes out the work from the foreign matter inspection device 20 and transfers it to the transport robot 19. The transfer robot 19 transfers the work to the developing unit 16. After the development, the transfer robot 19 takes out the work from the developing unit 16 and transfers the work to the robot 18a. The robot 18a stores the cassette in the unloader 17.

Referring to FIG. 2, foreign matter inspection apparatus 20 includes an inspection stage 3 provided for mounting a work, an illumination 4 for irradiating light from a lateral direction and an obliquely upward direction of the work, A high-resolution area sensor camera 5 for capturing an image of an object, an inspection stage 3 for refining a work to be inspected, a light 4 and a housing 1 for covering the camera 5 and blocking external light; Highly clean air (clean air) connected to the opening and purified inside the housing 1
And a control / processing unit 2 for receiving a video signal output from the high-resolution area sensor camera 5, generating image data, performing image processing, and inspecting for foreign matter. .

The foreign matter inspection device 20 is provided with an anti-reflection plate 6 subjected to a matting process in the vicinity of the camera 5 as required. The colors of the inside of the housing 1 and the components inside the housing 1 are unified to matte black or dark so that the illumination light is hardly reflected. For example, when the material is aluminum, alumite treatment for matting is performed. Thereby, it is possible to prevent the portion other than the workpiece from being reflected on the camera 5, reflecting the illumination light, and preventing leakage of the illumination light.

From the duct 7, purified air having a high degree of cleanliness is sent into the housing 1, and the sent air convects inside the apparatus. The higher the degree of cleanness of the air sent into the housing 1, the better. For example, if the degree of cleanness of the outside of the foreign matter inspection device 20 is class 1000,
If the class is less than or equal to one-tenth of class 100, a considerable effect can be expected. When a device that blocks the flow of air, such as the anti-reflection plate 6, is installed inside the device, a gap is provided between the anti-reflection plate 6 and the housing 1 to improve cleanliness. High air flows smoothly and does not stay in one place. At this time, in the case where the ceiling or the like of the housing 1 is reflected from the gap through which the air escapes, the anti-reflection plate 8 is installed at a different level from the anti-reflection plate 6 so that the air flow is not hindered. Reflection of a ceiling or the like can be prevented. Further, a structure in which dust or the like does not accumulate may be provided by adjusting the flow rate of the air sent from the duct or providing an inclined portion inside the main body.

The inspection stage 3 is a stage on which a work to be inspected is set. As a method for holding the work, a method by suction or a method of supporting the work with a support pin or the like can be considered.

In the present embodiment, the inspection stage 3
In order to prevent erroneous detection of foreign matter and scratches on the surface, when the high-resolution area sensor camera 5 is focused on the surface of the work, an appropriate height is set so that the surface of the inspection stage 3 is not focused. It is assumed that the work is supported by the support pins. In general, a camera can shoot an object in a focused state with respect to an object within a range of a depth of focus.
Therefore, even if the surface of the inspection stage 3 is within the range of the depth of focus, even if the surface of the inspection stage 3 is within the range of the depth of focus, the surface state of the surface of the inspection stage 3 and minute scratches may appear. become. However, as the distance from the camera focus to the object goes out of the range of the depth of focus,
The image gradually becomes blurred. Therefore, the focus of the high-resolution area sensor camera 5 shifts the inspection stage 3
It is necessary to make the distance to the surface sufficiently outside the range of the depth of focus.

For example, the length of the support pin may be adjusted so that the distance from the work to the inspection stage 3 is at least 10 times the depth of focus. For example, 1000x1000
Pixel high resolution area sensor camera 5 and focal length 20m
m using a single-lens reflex camera lens, 360 mm x 46
The distance between the high-resolution area sensor camera 5 and the work is about 750 mm to 780 mm when detecting foreign matter, scratches and unevenness on the surface of the 0 mm LCD substrate, and the height of the support pins at this time is 50 to 100 mm. About.

The work to be inspected is an LCD or PDP.
Alternatively, in the case of a flat panel substrate such as an FED, it may be necessary to adjust the depth of focus of the high-resolution area sensor camera 5 in order to remove the influence of bending on the captured image.

The illumination 4 is used to irradiate the work to be inspected with light from a lateral direction or an obliquely upward direction. The illumination 4 is a linear illumination using a halogen lamp and an optical fiber as in the related art. In the present embodiment, a filter in a wavelength range where the resist is not sensitive is provided at the light exit of the light source. One end of a plurality of optical fibers is connected to the exit of the light source, and a diffusion filter for diffusing light is attached to the other end of the optical fiber (near the exit of the illumination light). Thereby, the illumination light is diffused, and the illuminance unevenness of the illumination light is prevented. The illumination 4 may be configured not only to emit light to the work from one direction but also to emit light to the work from two or more directions. In addition, a configuration may be employed in which the height of the exit port and the illumination angle can be freely adjusted.

The high-resolution area sensor camera 5 is installed above the inspection stage 3 and captures an image of the entire surface of the work to be inspected under the control of the control / processing section 2. The configuration may be such that the installation height of the high-resolution area sensor camera 5 and the front, rear, left and right positions can be changed so as to be able to cope with a change in the size of the work and a change in the inspection target area.

As the high-resolution area sensor camera 5,
CCD (Charge) to reduce noise when improving camera sensitivity
A type that cools a coupled device may be used. A typical CCD camera has 256 gradations, whereas a CCD-cooling type camera can shoot with a resolution of about 16384 gradations and has a slight difference in light intensity. Can be detected. Therefore, in the case of a normal CCD camera, 50 μm
In order to detect a foreign substance having the above-mentioned size, the resolution of the camera must be at least about 50 μm per pixel at a minimum. On the other hand, when this high-sensitivity camera is used, about 500 μm per pixel is required. Even at the resolution, flaws and the like can be detected without any problem. Therefore, when the resolution of the high-resolution area sensor camera 5 is 1000 × 1000 pixels, the visual field size becomes about 500 × 500 mm, and LC
Images can be captured at a time even on a large substrate such as a D substrate. For this reason, in the foreign substance inspection device 20, by using such a high-resolution area sensor camera 5, it is not necessary to move the camera, attach a plurality of cameras, or move the work. Accordingly, the size of the foreign matter inspection device 20 can be reduced. In addition, since high-speed processing and a complicated mechanism are not required, the foreign substance inspection device 20 can be manufactured at low cost.

Such a high-resolution area sensor camera 5
Has a cooling fan for cooling the CCD. Therefore, in order to prevent dust from being generated from the exhaust hole of the fan, the exhaust hole of the fan is connected to the duct 7. The high-resolution area sensor camera 5 is controlled by the control / processing unit 2, but a dedicated controller (not shown) may be required depending on the model of the high-resolution area sensor camera 5. In such a case, the control / processing unit 2 controls the high-resolution area sensor camera 5 via the dedicated controller.
Control.

The control / processing section 2 has a built-in frame grabber board for taking in an image from the high-resolution area sensor camera 5 and has a built-in image processing board for performing image processing. The control / processing unit 2
Is installed with image processing software for performing image processing using the frame grabber board and the image processing board.

Next, a method for detecting foreign matter and flaws using the foreign matter inspection device 20 will be described. Reference image data of a work to be inspected is created. The reference image data may be image data of a non-defective sample without dust, or image data obtained by performing appropriate image processing on dust-containing image data to remove dust. Further, the reference image data may be created in advance before the inspection, or the image data under inspection or image data obtained by performing appropriate image processing on the image data under inspection may be used as the reference image.

When the work to be inspected is set on the inspection stage 3, the control / processing section 2 sends an image capture command to the high-resolution area sensor camera 5. The high-resolution area sensor camera 5, which has received the image capture command,
An image of the surface of the workpiece is captured, and the captured image signal is transmitted to the control / processing unit 2.

The control / processing section 2 receives an image signal from the high-resolution area sensor camera 5, creates image data from the received image signal, and subtracts the image data from the reference image. As a result, only the luminance difference value of a portion such as a foreign substance becomes large, and it becomes possible to detect a foreign substance, a scratch, and unevenness on the work surface.

FIG. 3 shows an example of image data captured by the high-resolution area sensor camera 5 of the foreign substance inspection device 20.

For example, if the surface of a workpiece to be inspected is a mirror-like body and easily reflects light, such as a semiconductor wafer or a glass substrate for LCD, the surrounding scene is included in the image input by the high-resolution area sensor camera 5. It becomes difficult to distinguish between foreign matters and scratches due to reflection. However, FIG. 3 does not show the scenery other than the work as shown in FIG.

If the illumination light is not uniform and uneven,
Illumination unevenness as shown in FIG. 6 also occurs in an image input by the camera, and it becomes difficult to distinguish foreign matter, scratches and unevenness. However, FIG. 3 does not show such illuminance unevenness.

Furthermore, since the surface of the inspection stage 3 is not focused when the workpiece to be inspected is focused, minute scratches on the surface of the inspection stage 3 as shown in FIG. Not even.

The work to be inspected set on the inspection stage 3 can be taken out when the image has been completely taken in by the high-resolution area sensor camera 5.

As described above, according to the defect inspection apparatus of the present invention, purified air with a high degree of cleanliness is sent from the upper part of the apparatus, and the sent air flows through the inside of the apparatus. Increase the degree. As a result, the inside of the apparatus can always be kept in a dust-free state, and it is possible to prevent new dust from adhering to the work under inspection for foreign matter, scratches and unevenness. Also foreign objects,
It is possible to prevent the occurrence of defects due to dust adhering during inspection for scratches, unevenness, and the like, thereby reducing the yield.

When the surface of the work to be inspected is a semiconductor wafer or a substrate for a flat panel display such as LCD, PDP or FED, the work has a mirror-like surface and tends to reflect light. For this reason, the surrounding scenery is easily reflected on the camera 5. However, the interior of the device is made matte dark and the antireflection plate 6 for the illumination light is provided to prevent the surrounding scenery from being reflected on the camera 5. it can. That is, it is possible to prevent the extra background from being reflected on the camera 5 and increasing the noise component of the image obtained by the camera 5 to thereby relatively lower the SN ratio. Therefore, it is possible to prevent the detection sensitivity of the original foreign matter, scratch, unevenness, and the like from being lowered.

Further, a halogen lamp is used as a light source for the illumination, and an optical fiber is connected from the light source to the emission port. A plate for scattering light is provided near the exit. For this reason, the illumination light applied to the work to be inspected has a gentle illuminance distribution, and it is possible to prevent the detection sensitivity from being lowered due to the uneven illuminance. Further, by using a filter in a wavelength range where the resist is not exposed, the resist of the work before development is not exposed.

Further, when the camera is focused on the surface of the work, the surface of the inspection stage 3 is not focused. Therefore, LCD, PDP or FED
Through a transparent or translucent substrate such as a flat panel display substrate, the surface state of the surface of the inspection stage 3 or minute scratches can be prevented from being reflected on the camera. Therefore, it is possible to stably detect foreign matters, scratches, unevenness, and the like of the original work.

Further, according to the foreign matter inspection apparatus 20, a single high-resolution area sensor camera 5 can capture an image of the surface of a work at a time. For this reason, there is no need for a mechanism for moving the stage or the camera back and forth, left and right, special processing at the boundary between images, and correction based on individual differences between cameras when a plurality of cameras are used. Therefore, it is possible to provide a low-cost, space-saving and high-speed inspection apparatus for foreign matter, scratches, unevenness, and the like.

According to our study, 360 mm × 460
Even when the LCD glass substrate of mm is used as a work to be inspected and illumination is installed in two directions, the size of the bottom surface of the apparatus is about 760 mm × 760 mm. Therefore,
A foreign matter inspection device 20 can be added to a semiconductor wafer or LCD glass substrate production device. The work can be carried into and out of the foreign matter inspection device 20 using the work transfer device of the production device, and foreign matter and dust can be detected immediately before and / or immediately after processing by the production device. By doing so, a sudden increase in dust can be detected at an early stage, and it is possible to minimize the spread of damage to subsequent works.

Further, by monitoring the change in the number of dusts, it is possible to prevent the occurrence of defects due to dusts in advance and to know an appropriate cleaning time for the production apparatus.

On the other hand, the foreign substance inspection device 20 can be installed in a small space between the production devices. In this case, the work to be inspected is carried in and carried out using a robot arm or the like or manually. In this method, foreign substances and scratches can be detected at an early stage after the processing by the production apparatus. For this reason, it is possible to detect a sudden failure early and prevent the damage from spreading.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a photolithography process apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a foreign matter inspection device according to an embodiment of the present invention.

FIG. 3 is a diagram illustrating a luminance distribution on a certain line of image data captured by the high-resolution area sensor camera 5 of the foreign substance inspection device 20.

FIG. 4 is a diagram showing a configuration of a conventional photolithography process apparatus.

FIG. 5 is a diagram showing a luminance distribution on a line passing through a portion where dust is present and a portion where a screw for fixing a ceiling plate is present in image data captured by a camera of a conventional foreign matter inspection device. It is.

FIG. 6 is a diagram showing a luminance distribution on a line passing through a portion where dust is present in image data captured by a camera of a conventional foreign matter inspection device using a lighting device that emits light from a plurality of optical fibers. is there.

FIG. 7 is a diagram showing a luminance distribution on a line passing through a portion where dust is present and a portion where a fine flaw is present on a stage in image data captured by a camera of a conventional foreign matter inspection device.

[Explanation of symbols]

 Reference Signs List 1 housing 2 control / processing unit 3 inspection stage 4 illumination 5 high-resolution area sensor camera 6,8 anti-reflection plate 7 duct 11 loader 12 washing unit 13 resist coating unit 14 peripheral resist removing unit 15 exposure unit 16 developing unit 17 unloader 18a, 18b Robot 19 Transport robot 20 Foreign matter inspection device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 21/30 502V F-term (Reference) 2F065 AA49 BB25 CC17 CC19 CC25 DD12 DD13 EE05 FF42 GG02 GG16 HH11 HH12 HH14 JJ03 JJ09 JJ26 LL02 LL03 LL21 LL22 LL49 PP11 QQ25 RR01 RR08 SS13 TT01 TT02 2G051 AA51 AA90 AB01 AB02 AC12 BB17 BB20 CA04 CA20 CB05 DA03 DA05 EA08 EA11 EA16 EA23 EB01 EB09 4M106 AA01 DB01 BA04

Claims (10)

[Claims] An illumination for irradiating the workpiece with light; a camera for capturing an image of the workpiece; and image processing for processing image data output from the camera and detecting foreign matter on the workpiece. And a housing for covering the camera, the housing having an opening, and a duct connected to the opening of the housing and for sending clean air from the outside of the housing to the inside of the housing. And a foreign matter inspection device. 2. The foreign matter inspection device according to claim 1, further comprising an anti-reflection plate for light emitted from the illumination, wherein the inside of the housing is subjected to a process for absorbing light. 3. The foreign matter inspection device according to claim 1, further comprising a plate provided on an irradiation surface of the illumination for scattering light. An illumination for irradiating the workpiece with light; a stage; a camera for imaging the workpiece; and processing of image data output from the camera to detect foreign matter on the workpiece. And a holding member for holding the work at a position where the camera focuses on the work but does not fit on the stage. 5. The foreign matter inspection apparatus according to claim 1, wherein the light irradiated on the work by the illumination is light in a wavelength range that does not expose a resist. 6. A cleaning means for cleaning a work, a resist coating means for applying a resist to the work, a peripheral part resist removing means for removing a resist in a peripheral part of the work, Exposure means for exposing the applied work, developing means for developing the exposed work, and foreign matter detection means for detecting foreign matter of the work, the foreign matter detection means, An illumination for irradiating the work with light; a camera for imaging the work; an image processing unit for processing image data output from the camera and detecting foreign matter on the work; A housing having an opening for covering the camera; and a housing connected to the opening of the housing for sending clean air from the outside of the housing to the inside of the housing. And a preparative, semiconductor processing equipment. 7. The apparatus according to claim 6, wherein said foreign matter detecting means further includes an antireflection plate for light emitted from said illumination, and wherein a process for absorbing light is performed inside said housing. A semiconductor processing apparatus according to any one of the preceding claims. 8. The semiconductor processing apparatus according to claim 6, wherein said foreign matter detecting means further includes a plate provided on an irradiation surface of said illumination for scattering light. 9. A cleaning means for cleaning a work, a resist coating means for applying a resist to the work, a peripheral resist removing means for removing a resist in a peripheral part of the work, Exposure means for exposing the applied work, developing means for developing the exposed work, and foreign matter detection means for detecting foreign matter of the work, the foreign matter detection means, An illumination for irradiating the work with light; a stage; a camera for imaging the work; and an image processing unit for processing image data output from the camera and detecting foreign matter on the work. A holding member provided on a stage for holding the work at a position where the camera focuses on the work but does not fit on the stage. , Semiconductor process equipment. 10. The semiconductor processing apparatus according to claim 6, wherein the light applied to the workpiece by the illumination is light in a wavelength range that does not expose the resist.