JP2919140B2 - Semiconductor test method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for a semiconductor test system provided with a semiconductor test device, a probing device, and a probing card for performing a wafer check during a manufacturing process. In particular, the present invention relates to a semiconductor test method for managing the number of measurement of a probing card for electrically connecting a semiconductor element (hereinafter, referred to as a pellet) and a semiconductor test apparatus and stopping the probing apparatus.

[0002]

2. Description of the Related Art Since a probing card used in a semiconductor test system of this type is a consumable, the number of pellets to be measured or the number of wafers to be measured (hereinafter, these are collectively referred to as "number of measurements"). )
When a certain standard is reached, it is necessary to check the height of the needle of the probing card, the contact resistance of the needle tip, and the state of wear of the needle. However, conventionally, the management of the number of measurements of the probing card is manually performed, and when a certain standard is reached, the person stops the semiconductor test system.

[0003]

As described above, in the conventional semiconductor test system, there is no means for managing the number of probing card measurements. There was a drawback that it was difficult to construct an unmanned line.

[0004] In addition, when this management is not performed or is insufficiently performed, problems such as an increase in the contact resistance of the needle of the probing card or the needle not contacting the pellet to be measured occur. There is a drawback that the electrical connection of the semiconductor test device is lost and a normal test is not performed.

It is an object of the present invention to provide a semiconductor test method capable of automatically managing the number of probing card measurements by eliminating the above-mentioned drawbacks.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a method for measuring a number of measured objects.
Place the wafer on which the pellets are formed and the wafer
Wafer stage and the movement of the wafer stage
Connecting the measured pellet to a test device
Probing device equipped with a
-A counter that counts the number of wafers,
C Reference number of wafers and number of wafers measured by the counter
And the number of sheets measured by the counter is
The operation of the probing device when the reference number of sheets is reached
Controller that stops the alarm and generates an alarm
Test system control device comprising: a control device comprising:
A semiconductor test method using said from said memory
A step of reading the Measured number of wafers and the reference number, the step of setting said Measured number of wafers to the counter, and performing good number checking of wafers that constitute the batch one by one,該良number of articles checked 1
A step of counting by the counter each time a sheet is performed;
Wherein the controller stops the probing device when the value counted by the counter reaches the reference number
A step of generating an alarm with be, if good number checking of the lot before the value which the counter has counted reaches the reference number is finished and writing the Measured number of wafers to that point in the memory It is characterized by including.

Further, the present invention provides a method for manufacturing a large number of pellets to be measured.
The formed wafer and the wafer on which the wafer is placed
Stage and the wafer stage
A probing card to connect the constant pellet to the test equipment
And a probing device equipped with a
Counter to count, reference measurable pellet count and previous
Memory for storing the number of pellets measured by the counter
And the number of pellets measured by the counter is
When the number of let is reached, the operation of the probing device is started.
A controller that stops and generates an alarm
A test system control device comprising a control device comprising:
A semiconductor test method used, the group from said memory
A step of reading the number Measured pellets quasi pellets number, a step of setting the number Measured pellets to the counter, and performing good number check of lots one pellet every performed 1 pellets該良number of articles checked stop the step of counting, the controller at the time when the value counted by the counter reaches the reference number of pellets the probing device with the counter
Generating an alarm and writing the measured number of pellets up to the time when the number of non-defective products in the lot is completed before the value counted by the counter reaches the reference number of pellets. And characterized in that:

[0008]

The reference value of the number of measurements of the probing card is set in advance in the storage means, and when the number of measurements counted by the counting means reaches the reference value, the control means sets the reference value.
Stop the operation of the probing device and generate an alarm.

Therefore, it is possible to automatically manage the probing card without manual intervention.

Furthermore, by adding a network interface, information on the number of measurements can be shared among a plurality of control devices, and a plurality of semiconductor test systems can be commonly controlled.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing a semiconductor test system using the first embodiment of the present invention.

In the first embodiment, a semiconductor testing apparatus 1 for testing a pellet on a wafer 4, a probing apparatus 2 for moving a wafer 4 to a position of a measured pellet by a wafer stage 5, a semiconductor test apparatus A feature of the present invention is a semiconductor test system control device (hereinafter, simply referred to as “control device”) 6 including means for controlling a semiconductor test system including a probing card 3 for electrically connecting the device 1 to the device 1. Here, the counter 10 as counting means for counting the number of measurements on the probing card 3, the memory 9 as storage means for storing the number of measurements on the probing card 3, and the number of measurements on the probing card 3 are predetermined. Control means for stopping the operation of the probing device 2 and generating an alarm when the reference number is reached; A controller 8 of Te, and a probing device interface 7.

Next, the operation of the first embodiment will be described with reference to FIG.
This will be described with reference to the flowchart of FIG.

FIG. 2 is a flowchart when the number of measured wafers is set on the basis of the number of measured wafers.

First, the reference number n and the measured number N are read from the memory 9 (step S1), and the counter 1
The previously measured number N is set to 0 (step S
2). Check the number of good pellets in the wafer (hereinafter P
/ W check) is the same as the conventional semiconductor test apparatus 1
And the probing device 2 and the probing card 3. When the wafer P / W check is completed for each wafer (steps S4, S5, S6, S7), and the wafer ends, the controller 6 sends the wafer end signal from the probing device 2 via the probing device interface 7. Is received (step S8), and the counter 10 is counted up (step S9). When the counted number reaches the reference number n (step S1).
0), the control device 6 transmits a stop signal to the probing device 2 via the probing device interface 7 by the controller 8 (step S11), stops the probing device 2 (step S12), and issues an alarm (step S13). . If the P / W check is completed before reaching the reference number (steps S14 and S15), the measured number A is written into the memory 9 (step S17).
If the lot end is not reached in step S14, the measurement is continued (step S16). FIG. 3 is a flowchart in the case where the number of measured pellets is set as a reference as the number of measurements.

First, the reference pellet number m and the measured pellet number M are read from the memory 9 (step S2).
1), the number M of measured pellets so far is set in the counter 10 (step S22). And P /
A W check is performed (steps S23 and S24), a test end signal issued for each pellet is received (step S25), and the counter 10 is counted up (step S26). When the counted result reaches the reference pellet number m (step S27), the controller 8 stops the probing device 2 and generates an alarm (steps S28, S29, S30). When the count value B of the counter 10 does not reach the reference pellet number m in step S27, it is determined whether the wafer end or the lot end is reached (steps S31 and S32), and the measurement is performed until the wafer end and the lot end are reached (step S33). , S34), P /
The W check is completed, and the measured pellet number B is written into the memory 9 (steps S35 and S36).

FIG. 4 is a block diagram showing a semiconductor test system using the second embodiment of the present invention.

In the second embodiment, a control device 6a is provided by adding a network interface 11, which is a feature of the present invention, to the control device 6 of the first embodiment in FIG.

By connecting the control device 6a via a network, the control device 6a can share information on the reference number of probing cards and the number of measured wafers or the information on the number of reference pellets and the number of measured pellets. A plurality of semiconductor test systems can be commonly controlled.

[0021]

As described above, according to the present invention, by adding a control device for controlling a conventional semiconductor test system, the number of probing card measurements can be managed and the probing device can be controlled when a certain standard is reached. Stopping is performed automatically, so probing cards can be checked reliably.
Thus, there is an effect that the management of the probing card can be automated and labor can be saved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a semiconductor test system using a first embodiment of the present invention.

FIG. 2 is a flowchart showing the operation of the first embodiment when the number of measured wafers is set based on the number of measured wafers.

FIG. 3 is a flowchart showing the operation of the first embodiment when the number of measured pellets is set as the number of measurements.

FIG. 4 is a block diagram showing a semiconductor test system using a second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 semiconductor testing device 2 probing device 3 probing card 4 wafer 5 wafer stage 6, 6a control device 7 probing device interface 8 controller 9 memory 10 counter 11 network interface S1-S17, S21-S36 Step

Claims (2)

(57) [Claims] 1. A wafer having a large number of pellets to be measured.
Wafer, a wafer stage on which the wafer is mounted, and
Test the pellet under test by moving the wafer stage.
And a probing card connected to the testing device.
And a counting device for counting the number of measured wafers.
And the reference number of measurable wafers and the counter.
A memory for storing the number of wafers measured by the
When the number of sheets measured by the counter reaches the reference number
While stopping the operation of the probing device,
And a control device having a controller for generating a system.
Semiconductor test method using a test system controller equipped with
The reference number and the measured wafer are stored in the memory.
A step of reading Doha number, the measurement on the counter
And the step of setting a Teisumi number of wafers, the lot configuration
Said controller when performing a good number checking wafers one by one, the steps of counting in the counter every time performing one of該良number of articles checked, the value counted by the counter reaches the reference number of sheets to be formed But
A step of generating an alarm to stop the said probing device, if good number checking of the lot before the value which the counter has counted reaches the reference number is finished the said Measured number of wafers to that point Writing to a memory. 2. A wafer having a large number of pellets to be measured.
Wafer, a wafer stage on which the wafer is mounted, and
Test the pellet under test by moving the wafer stage.
And a probing card connected to the testing device.
And a counting device for counting the number of measured pellets.
Counter, the number of measurable reference pellets, and the counter.
Memory for storing the number of measured pellets to be measured, and the counter
The number of pellets measured by has reached the reference number of pellets
At the time, while stopping the operation of the probing device,
A control device having a controller for generating an alarm
Test using a test system controller with a device
The method, wherein the reference number of pellets and the
A step of reading the serial number Measured pellets, performs the a counter <br/> step of setting the number Measured pellet data and performing good number check of lots one pellet,該良number of articles checked 1 Pellets wherein the step of counting by the counter, said when counted value has reached the reference number of pellets in counter Con <br/> controller generates the a <br/> alarm stops the said probing device every And a step of writing the measured number of pellets up to that point in the memory when the check of the number of non-defective products in the lot is completed before the value counted by the counter reaches the reference number of pellets. Semiconductor test method.