JP2918910B2 - Watertight insulated wire core - Google Patents
Watertight insulated wire coreInfo
- Publication number
- JP2918910B2 JP2918910B2 JP1173548A JP17354889A JP2918910B2 JP 2918910 B2 JP2918910 B2 JP 2918910B2 JP 1173548 A JP1173548 A JP 1173548A JP 17354889 A JP17354889 A JP 17354889A JP 2918910 B2 JP2918910 B2 JP 2918910B2
- Authority
- JP
- Japan
- Prior art keywords
- watertight
- insulated wire
- wire core
- weight
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 11
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- -1 bisphenol compound Chemical class 0.000 claims description 6
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229920001897 terpolymer Polymers 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- OAWKUMDOADACKG-UHFFFAOYSA-N chloroethene;ethenyl acetate;prop-2-enoic acid Chemical compound ClC=C.OC(=O)C=C.CC(=O)OC=C OAWKUMDOADACKG-UHFFFAOYSA-N 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VJFPVACZAZLCCM-UAIGNFCESA-N (z)-but-2-enedioic acid;chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C.OC(=O)\C=C/C(O)=O VJFPVACZAZLCCM-UAIGNFCESA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、水密絶縁線心の改良に関する。Description: TECHNICAL FIELD The present invention relates to an improvement of a watertight insulated wire core.
（従来の技術） 従来より、複数本撚合わせた素線間に水密材料を充填
してなる水密絶縁線心においては、その水密材料として
導体との密着性を保持するためにエチレン−酢酸ビニル
共重合体（EVA）、エチレン−エチルアクリレート共重
合体等の極性基を有する樹脂が使用されている。特に近
年では塩化ビニル−酢酸ビニル−アクリル酸三元共重合
体がその密着性や水密材料として適度な硬さを有するこ
とからよく使用されている。しかしながら、これら従来
の水密材料は、導体との密着性が約50℃以上の高温にお
いては著しく低下してしまうという問題があった。ま
た、このような水密絶縁線心を用いた水密電線の端末接
続作業の際には、外側絶縁層の皮剥ぎ性が良好でなけれ
ばならないが、従来の水密材料においては前記高温密着
性と皮剥ぎ性とを同時に充分満足することができなかっ
た。(Prior Art) Conventionally, in a watertight insulated wire core in which a watertight material is filled between a plurality of twisted strands, ethylene-vinyl acetate is used as the watertight material in order to maintain adhesion with a conductor. A resin having a polar group such as a polymer (EVA) and an ethylene-ethyl acrylate copolymer is used. In particular, in recent years, a vinyl chloride-vinyl acetate-acrylic acid terpolymer has been frequently used because of its adhesiveness and moderate hardness as a watertight material. However, these conventional watertight materials have a problem that the adhesion to the conductor is significantly reduced at a high temperature of about 50 ° C. or higher. In addition, when performing the terminal connection work of a watertight electric wire using such a watertight insulated wire core, the peelability of the outer insulating layer must be good. At the same time, the peeling property could not be sufficiently satisfied.
（発明が解決しようとする課題） 以上の点に鑑みて、本発明は約50℃以上の温度におけ
る導体との密着性および外側絶縁層との皮剥ぎ性がとも
に良好な水密絶縁線心を提供することを目的とする。(Problems to be Solved by the Invention) In view of the above points, the present invention provides a watertight insulated core having good adhesion to a conductor and peelability to an outer insulating layer at a temperature of about 50 ° C. or more. The purpose is to do.
（課題を解決するための手段） 本発明は即ち、素線間に水密材料を充填してなる撚線
導体上に絶縁層を設けてなる水密絶縁線心において、前
記水密材料は極性基を有する樹脂100重量部とビスフェ
ノール類化合物0.05〜１重量部とジイソデシルアジペー
ト40〜60重量部との混合物を主成分とすることを特徴と
する水密絶縁線心に関する。(Means for Solving the Problems) According to the present invention, in a watertight insulated wire core in which an insulating layer is provided on a stranded conductor formed by filling a watertight material between wires, the watertight material has a polar group. The present invention relates to a watertight insulated wire characterized by comprising as a main component a mixture of 100 parts by weight of a resin, 0.05 to 1 part by weight of a bisphenol compound and 40 to 60 parts by weight of diisodecyl adipate.
本発明は、水密材料にビスフェノール類化合物及びジ
イソデシルアジペートを所定量配合しているので、高温
密着性および皮剥ぎ性がともに良好である。In the present invention, since a predetermined amount of a bisphenol compound and diisodecyl adipate are added to the watertight material, both high-temperature adhesion and peeling properties are excellent.
本発明における極性基を有する樹脂としては、水密材
料に通常用いられる樹脂、例えばEVA、エチレン−エチ
ルアクリレート共重合体、塩化ビニル−酢酸ビニル−マ
レイン酸三元共重合体、塩化ビニル−酢酸ビニル−アク
リル酸三元共重合体等を使用できる。なお、塩化ビニル
−酢酸ビニル−アクリル酸三元共重合体は、密着性と水
密材料としての適度な硬さの双方を充分満足するのでよ
り好ましい。塩化ビニル−酢酸ビニル−アクリル酸三元
共重合体は、数平均重合度が700〜1200が望ましく、こ
れより小さいと引っ張り強度が少なく、これより大きい
と素線間への充填作業が困難になる。As the resin having a polar group in the present invention, resins commonly used for watertight materials, for example, EVA, ethylene-ethyl acrylate copolymer, vinyl chloride-vinyl acetate-maleic acid terpolymer, vinyl chloride-vinyl acetate- An acrylic acid terpolymer or the like can be used. In addition, a vinyl chloride-vinyl acetate-acrylic acid terpolymer is more preferable because it sufficiently satisfies both the adhesiveness and the appropriate hardness as a watertight material. The vinyl chloride-vinyl acetate-acrylic acid terpolymer preferably has a number average degree of polymerization of 700 to 1200. If it is smaller than this, the tensile strength is small, and if it is larger than this, it becomes difficult to fill the gap between the strands. .
また、前記の極性基を有する樹脂には、素線間への充
填作業性や密着性を向上させるために可塑剤としては、
ジイソデシルアジペート（DIDA）を添加する。ジイソデ
シルアジペート（DIDA）は低温脆化特性が良好であるの
でこれを用いれば幅広い温度範囲において特性の優れた
水密材料得られる。DIDAを添加する際には、前記の極性
基を有する樹脂100重量部に対して40〜60重量部の範囲
が望ましい。40重量部より少ないと低温脆化特性が小さ
く、また60重量部を越えると得られる水密材料の軟度が
増大し導体との密着性が悪くなる。なお、DIDAは加水分
解する性質があるが、本発明においてはビスフェノール
類化合物を併用するので加水分解を防止し、DIDAを安定
に存在させることができる。Further, in the resin having the polar group, as a plasticizer to improve the filling workability and adhesion between the strands,
Add diisodecyl adipate (DIDA). Since diisodecyl adipate (DIDA) has good low-temperature embrittlement properties, it can be used to obtain a watertight material having excellent properties over a wide temperature range. When DIDA is added, the amount is preferably in the range of 40 to 60 parts by weight based on 100 parts by weight of the resin having a polar group. If the amount is less than 40 parts by weight, the low-temperature embrittlement property is low, and if it exceeds 60 parts by weight, the obtained watertight material has increased softness and poor adhesion to the conductor. Although DIDA has the property of being hydrolyzed, in the present invention, the bisphenol compound is used in combination, so that hydrolysis can be prevented and DIDA can be stably present.
本発明におけるビスフェノール類化合物としては、ビ
スフェノールＡ（Ｃ（CH3C6H4OH）２）、あるいは４−
４チオビスフェノール（Ｓ（C6H4OH）２））等の公知の
ビスフェノール類化合物が使用できる。またその配合量
は、前記の極性基を有する樹脂100重量部に対して0.05
〜１重量部であり、これより少ないと約50℃以上の温度
における導体との密着性が小さく、またこれより多いと
外側絶縁層との皮剥ぎ性が悪くなる。As the bisphenol compound in the present invention, bisphenol A (C (CH 3 C 6 H 4 OH) 2 ) or 4-phenol
Known bisphenol compounds such as 4-thiobisphenol (S (C 6 H 4 OH) 2 )) can be used. The compounding amount is 0.05 parts with respect to 100 parts by weight of the resin having a polar group.
If the amount is less than about 1 part by weight, the adhesion to the conductor at a temperature of about 50 ° C. or more is small, and if it is more than this, the peeling property with the outer insulating layer is deteriorated.
本発明の水密絶縁線心は、上述した各成分を混練して
水密材料を製造し、これを加熱溶融して通常の方法で素
線間に充填して撚線導体とし、さらにその上に絶縁層を
被覆することにより製造される。The watertight insulated wire core of the present invention is obtained by kneading the above-described components to produce a watertight material, heating and melting the resulting material, filling the wire between the wires by a normal method to form a stranded conductor, and further insulated thereon. Manufactured by coating a layer.
（実施例） 本発明の実施例について説明する。(Example) An example of the present invention will be described.
実施例１〜２ 図面に示すように素線１間に、次表に示す配合を混練
して得た水密材料２を充填しながら撚合わせ、水密撚線
導体３を形成した。次いでこの上に2mm厚さのポリ塩化
ビニル絶縁層４を常法により設けて直径14mmの本発明の
水密絶縁線心を製造した。得られた絶縁線心を用いて室
温および50℃の温度における導体との密着力と、絶縁層
との皮剥ぎ性を試験した。なお、水密性はいずれも良好
であった。結果を表に示す。Examples 1 and 2 As shown in the drawing, the strands 1 were twisted while being filled with a watertight material 2 obtained by kneading the composition shown in the following table to form a watertight stranded wire conductor 3. Next, a polyvinyl chloride insulating layer 4 having a thickness of 2 mm was provided thereon by a conventional method to produce a watertight insulated core of the present invention having a diameter of 14 mm. Using the obtained insulated wire core, the adhesion to the conductor at room temperature and 50 ° C. and the peelability from the insulating layer were tested. In addition, the watertightness was all good. The results are shown in the table.
比較例１〜２ 表に示す配合の水密材料を用いて、後は実施例１と同
様にして試験片を製造し、同様に試験した。なお、水密
性はいずれも良好であった。結果を表に示す。Comparative Examples 1-2 Using a watertight material having the composition shown in the table, a test piece was manufactured in the same manner as in Example 1 and then tested in the same manner. In addition, the watertightness was all good. The results are shown in the table.
（発明の効果） 以上、本発明の水密絶縁線心は、約50℃以上の温度に
おける導体との密着性および外側絶縁層との皮剥ぎ性が
ともに良好である。 (Effects of the Invention) As described above, the watertight insulated wire core of the present invention has good adhesion to the conductor and peelability to the outer insulating layer at a temperature of about 50 ° C or more.
図面は、本発明の水密絶縁線心の一実施例の横断面図を
示す。 ２……水密材料The drawings show a cross-sectional view of one embodiment of the watertight insulated wire core of the present invention. 2. Watertight materials
Claims (1)
上に絶縁層を設けてなる水密絶縁線心において、前記水
密材料は極性基を有する樹脂100重量部とビスフェノー
ル類化合物0.05〜１重量部とジイソデシルアジペート40
〜60重量部との混合物を主成分とすることを特徴とする
水密絶縁線心。1. A watertight insulated wire core comprising an insulating layer provided on a stranded conductor filled with a watertight material between wires, wherein the watertight material comprises 100 parts by weight of a resin having a polar group and 0.05% of a bisphenol compound. ~ 1 part by weight and diisodecyl adipate 40
A watertight insulated wire core characterized by comprising a mixture of up to 60 parts by weight as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1173548A JP2918910B2 (en) | 1989-07-05 | 1989-07-05 | Watertight insulated wire core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1173548A JP2918910B2 (en) | 1989-07-05 | 1989-07-05 | Watertight insulated wire core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0340312A JPH0340312A (en) | 1991-02-21 |
| JP2918910B2 true JP2918910B2 (en) | 1999-07-12 |
Family
ID=15962577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1173548A Expired - Fee Related JP2918910B2 (en) | 1989-07-05 | 1989-07-05 | Watertight insulated wire core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2918910B2 (en) |
-
1989
- 1989-07-05 JP JP1173548A patent/JP2918910B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340312A (en) | 1991-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |